JP2973712B2 - Electrode mounting structure of parallel plate type capacitor - Google Patents
Electrode mounting structure of parallel plate type capacitorInfo
- Publication number
- JP2973712B2 JP2973712B2 JP4176350A JP17635092A JP2973712B2 JP 2973712 B2 JP2973712 B2 JP 2973712B2 JP 4176350 A JP4176350 A JP 4176350A JP 17635092 A JP17635092 A JP 17635092A JP 2973712 B2 JP2973712 B2 JP 2973712B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- parallel plate
- plate type
- type capacitor
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は平行平板型コンデンサの
電極取り付け構造に関し、特にチップコンデンサの電極
部における実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode mounting structure for a parallel plate type capacitor, and more particularly to a mounting structure for an electrode of a chip capacitor.
【０００２】[0002]
【従来の技術】従来技術について、図面を用いて説明す
る。図５（ａ）は、従来技術による平行平板型コンデン
サの電極取り付け構造を示す断面図である。平行平板型
コンデンサ１の片側の電極２ａは、基板４に設けられた
電極６（ここでは接地電位とする）に金属ロウ材８ａ
（例えばＡｕ−Ｓｉ，Ａｕ−Ｓｎ，Ｐｂ−Ｓｎ等）を介
して取り付けられる。一方、平行平板型コンデンサ１の
他方の電極２ｂと、基板４に設けられた電極７（ここで
は電源電位とする）とは、ワイヤー１４によって電気的
に接続される構造をとる。2. Description of the Related Art The prior art will be described with reference to the drawings. FIG. 5A is a cross-sectional view showing an electrode mounting structure of a conventional parallel plate type capacitor. The electrode 2a on one side of the parallel plate type capacitor 1 is connected to an electrode 6 (here, a ground potential) provided on the substrate 4 by a metal brazing material 8a.
(For example, Au-Si, Au-Sn, Pb-Sn, etc.). On the other hand, the other electrode 2b of the parallel plate type capacitor 1 and an electrode 7 (here, a power supply potential) provided on the substrate 4 have a structure in which the electrode 7 is electrically connected by a wire 14.
【０００３】図５（ｂ）は、平行平板型コンデンサを半
導体容器（パッケージ）内部にＬＳＩとともに搭載した
場合の斜視図である。この例では、ＬＳＩを搭載するダ
イアタッチ部１５の特定部位に接地電位用電極と電源電
位用電極の２つを設け、平行平板型コンデンサの一方の
電極を接地電位用電極にロウ付けし、他方を電源電位用
電極とワイヤーで電気的に接続している。FIG. 5B is a perspective view showing a case where a parallel plate type capacitor is mounted together with an LSI inside a semiconductor container (package). In this example, two electrodes, a ground potential electrode and a power supply potential electrode, are provided at specific portions of the die attach unit 15 on which the LSI is mounted, and one electrode of the parallel plate type capacitor is soldered to the ground potential electrode, and Is electrically connected to a power supply potential electrode by a wire.
【０００４】この例以外にも、図示していないが、例え
ばダイアタッチ部全てを接地電位用電極とし、電源電位
用電極をＬＳＩのワイヤーボンディングステッチ部１６
の一領域に設けて、平行平板型コンデンサを実装する事
も可能である。In addition to this example, although not shown, for example, the entire die attach portion is used as a ground potential electrode, and the power supply potential electrode is used as a wire bonding stitch portion 16 of an LSI.
It is also possible to mount a parallel plate type capacitor in one area.
【０００５】[0005]
【発明が解決しようとする課題】この従来の平行平板型
コンデンサの電極取り付け構造は、まず一方の電極を基
板に設けた電極（例えば接地電位用電極）に、Ａｕ−Ｓ
ｉ，Ａｕ−Ｓｎ，Ｐｂ−Ｓｎ等の金属ロウ材によって接
続し、その後コンデンサの他方の電極と基板に設けた電
極（例えば電源電位用電極）とをワイヤーで接続する構
造をとっている為、以下の問題点があった。 （１）平行平板型コンデンサを実装する場合、ロウ付け
工程とワイヤーボンディング工程の２工程を必要とす
る。 （２）ワイヤー自身、外部からの応力によって損傷を受
け易いので、ワイヤー保護の為に平行平板型コンデンサ
を、パッケージ内部に搭載する必要がある。通常平行平
板型コンデンサの寸法は３ｍｍ□程度なので、接続面積
を考慮すると、これ以上の領域を余分にパッケージ内部
に確保しなければならなくなる。 （３）ワイヤーを用いることによって、自己インダクタ
ンスが約２ｎＨ余分に付くので特性が劣化する。In the conventional electrode mounting structure of a parallel plate type capacitor, first, one electrode is provided on a substrate (for example, a ground potential electrode) with an Au-S electrode.
i, Au-Sn, Pb-Sn, etc. are connected by a metal brazing material, and then the other electrode of the capacitor is connected to an electrode (for example, a power supply potential electrode) provided on the substrate by a wire. There were the following problems. (1) When mounting a parallel plate type capacitor, two steps of a brazing step and a wire bonding step are required. (2) Since the wire itself is easily damaged by external stress, it is necessary to mount a parallel plate type capacitor inside the package to protect the wire. Usually, the size of the parallel plate type capacitor is about 3 mm square, so that considering the connection area, an extra area must be secured inside the package. (3) By using a wire, self-inductance is added by about 2 nH, so that the characteristics are deteriorated.
【０００６】本発明の目的は、従来構造による取付の問
題点を解決し、実装する際に、Ｐｂ−Ｓｎ系半田等低融
点金属ロウ材の一括リフローにて接続できる平行平板型
コンデンサの電極取り付け構造を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the problem of mounting by a conventional structure, and to mount electrodes of a parallel plate type capacitor which can be connected by batch reflow of a low melting point metal brazing material such as Pb-Sn solder when mounting. It is to provide a structure.
【０００７】[0007]
【課題を解決するための手段】本発明の平行平板型コン
デンサの電極取り付け構造は、平行平板型コンデンサの
一方の電極部に、この電極部よりも広い面積を持ちかつ
電気伝導性を有する金属板を取り付ける構造を有してい
る。According to the present invention, there is provided an electrode mounting structure for a parallel plate type capacitor in which a metal plate having a larger area than the electrode portion and having electrical conductivity is provided on one electrode portion of the parallel plate type capacitor. Is attached.
【０００８】この金属板は、平行平板型コンデンサの電
極部と接続している領域の外側部分を曲げて、金属板端
部と平行平板型コンデンサの他方の電極部とを同一平面
上になる様な加工を施している。本発明では、平行平板
コンデンサの一方の電極部に予め金属板を溶接等で接続
しておき、該金属板の両端をを該コンデンサの他方の電
極部と同じ高さになるように折り曲げた電極取り付け構
造とすることにより、表面実装ができる。 In this metal plate , an outer portion of a region connected to the electrode portion of the parallel plate type capacitor is bent so that an end portion of the metal plate and the other electrode portion of the parallel plate type capacitor are on the same plane. Processing . In the present invention, a parallel plate
A metal plate is connected to one electrode of the capacitor in advance by welding, etc.
Then, connect both ends of the metal plate to the other side of the capacitor.
Electrode mounting structure bent to the same height as the pole
By making the structure, surface mounting can be performed.
【０００９】[0009]
【実施例】次に本発明について図面を参照して説明す
る。図１は、本発明の参考例による、平行平板型コンデ
ンサの電極取り付け構造を示す斜視図及び断面図並びに
実装状態を示す断面図である。平行平板型コンデンサ１
の表裏二面には電極２が設けられている。金属板３は、
平行平板型コンデンサの電極２よりも面積が大きく、か
つ良好な電気伝導性を具備している。この平行平板型コ
ンデンサと金属板とを接続する（図の矢印方向）。接続
は金属ロウ材（Ａｕ−Ｓｉ，Ａｕ−Ｓｎ，Ｐｂ−Ｓｎ
等）や溶接で行われる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view, a sectional view, and a sectional view showing a mounting state of an electrode mounting structure of a parallel plate type capacitor according to a reference example of the present invention. Parallel plate type capacitor 1
The electrodes 2 are provided on the front and back surfaces of the device. The metal plate 3
It has a larger area than the electrode 2 of the parallel plate type capacitor and has good electric conductivity. The parallel plate type capacitor and the metal plate are connected (in the direction of the arrow in the figure). The connection is made of a metal brazing material (Au-Si, Au-Sn, Pb-Sn
It is carried out in the etc.) and welding.
【００１０】図１（ｃ）は、平行平板型コンデンサを基
板に実装した場合の断面図である。基板４には、平行平
板型コンデンサ１の外形寸法よりも若干大きく、かつコ
ンデンサの厚みに相当する深さの開孔部５を有する。開
孔部の底と周囲には、接地電位並びに電源電位用の電極
を設ける。ここでは底部を接地電位用電極６，周囲を電
源電位用電極７とする。接地電位用電極と平行平板型コ
ンデンサの電極２，及び電源電位用電極と金属板との接
続は、Ｐｂ−Ｓｎ系等の半田８を介して同時に接続す
る。FIG. 1C is a cross-sectional view when a parallel plate type capacitor is mounted on a substrate. The substrate 4 has an opening 5 slightly larger than the external dimensions of the parallel plate type capacitor 1 and having a depth corresponding to the thickness of the capacitor. Electrodes for the ground potential and the power supply potential are provided on the bottom and periphery of the opening. Here, the bottom portion is a ground potential electrode 6 and the periphery is a power supply potential electrode 7. The connection between the ground potential electrode and the electrode 2 of the parallel plate type capacitor, and the connection between the power supply potential electrode and the metal plate are made simultaneously via a Pb-Sn type solder 8 or the like.
【００１１】図２は、実際のセラミックパッケージに、
上記参考例の平行平板型コンデンサの電極取り付け構造
の断面図である。図２（ａ）はＣＣＢ技術（Ｃｏｎｔｒ
ｏｌｌｅｄ Ｃｏｌｌａｐｓｅ Ｂｏｎｄｉｎｇ）を用
いたセラミックフェイスダウン型ＰＧＡ（Ｐｉｎ Ｇｒ
ｉｄ Ａｒｒａｙ）パッケージへの搭載例である。ＬＳ
Ｉ９を搭載しているのがベース基板１０，接続の為の半
田バンプ１１及び外部リード１２を有しているのがリー
ド基板１３である。リード基板１３の中央部には、空領
域がある為、ここに図１（ｃ）で説明した開孔部５及び
接地電位用電極６と電源電位用電極７を設け、平行平板
型コンデンサが搭載される。この時、半田８は、半田バ
ンプ１１と同一組成の材料を選択すれば、バンプ接続と
コンデンサ接続を一回の加熱リフローで行う事が可能で
ある。FIG. 2 shows an actual ceramic package.
Electrode mounting structure of the parallel plate type capacitor of the above reference example
FIG . FIG. 2A shows the CCB technology (Contr
Ceramic Face-Down Type PGA (Pin Gr) Using an Old Collage Bonding
This is an example of mounting on an (Array) package. LS
The lead substrate 13 has the base substrate 10, the solder bumps 11 for connection, and the external leads 12 on which I9 is mounted. The central portion of the lead substrate 13, because there is a free space, here the provided opening 5 and the ground potential electrode 6 and the power supply potential electrode 7 described in FIG. 1 (c), the mounted parallel plate capacitor Is done . At this time, if a material having the same composition as that of the solder bump 11 is selected as the solder 8, the bump connection and the capacitor connection can be performed by one heating reflow.
【００１２】図２（ｂ）はセラミックフェイスアップ型
ＰＧＡパッケージへの搭載例である。外部リード１２を
設けたパッケージ底部中央部の空領域を用いて開孔部５
並びに接地電位電極６，電源電位電極７を形成し、平行
平板型コンデンサ１の電極部２及び金属板３を接続して
いる。FIG. 2B shows an example of mounting on a ceramic face-up type PGA package. The opening 5 is formed by using an empty area at the center of the bottom of the package where the external leads 12 are provided.
In addition, a ground potential electrode 6 and a power potential electrode 7 are formed, and the electrode portion 2 of the parallel plate type capacitor 1 and the metal plate 3 are connected.
【００１３】図３は、本発明の実施例による、平行平板
型コンデンサの電極取り付け構造を示す斜視図ならびに
断面図である。上記参考例と基本的構成は同じであるの
で、ここでは相違点を中心に述べる。本実施例では、図
３（ａ）に示す通り、金属板３の平行平板型コンデンサ
１の電極と接続される部分の外側に曲げ加工部３ａを設
け、図３（ｂ）に示す様に、金属板の曲げ加工端部３ｂ
と、金属板を取り付けていない平行平板型コンデンサの
電極部２とが同一平面上となる構造とする。図３（ｃ）
はその断面図である。[0013] Figure 3, according to the actual施例of the present invention, a perspective view and a cross-sectional view showing the electrode mounting structure of a parallel plate capacitor. Since the basic configuration is the same as that of the above-described reference example , the description here will focus on the differences. In this embodiment, as shown in FIG. 3A, a bent portion 3a is provided outside a portion of the metal plate 3 connected to the electrode of the parallel plate type capacitor 1, and as shown in FIG. Bending end 3b of metal plate
And the electrode portion 2 of the parallel plate type capacitor to which the metal plate is not attached is on the same plane. FIG. 3 (c)
Is a sectional view thereof.
【００１４】図３（ｄ）は、平行平板型コンデンサを基
板に実装した場合の断面図である。本実施例では金属板
に曲げ加工を施したことにより、基板４に開孔部を設け
る必要が無く、上記参考例に比較して低価格化が可能と
なる。FIG. 3D is a cross-sectional view when a parallel plate type capacitor is mounted on a substrate. In the present embodiment, since the metal plate is bent, there is no need to provide a hole in the substrate 4, and the price can be reduced as compared with the above-described reference example .
【００１５】図４は、本発明の実施例の平行平板型コン
デンサの電極取り付け構造をセラミックフェイスダウン
ＰＧＡパッケージに適用した場合の断面図である。基本
構成は、開孔部が不要となった点以外は、図２と同様で
あるので説明は省略する。図４のように、本発明の平行
平板型コンデンサの電極取り付け構造は、表面実装がで
きる構造であり、高密度実装化と量産性に優れている構
造といえる。 FIG. 4 is a cross-sectional view when the electrode mounting structure of the parallel plate type capacitor according to the embodiment of the present invention is applied to a ceramic face-down PGA package. The basic configuration is the same as that of FIG. 2 except that the opening is not required, and thus the description is omitted. As shown in FIG.
The electrode mounting structure of the flat type capacitor is surface mounting.
The structure is excellent in high-density mounting and mass productivity.
It can be said that it is made.
【００１６】[0016]
【発明の効果】以上説明した様に、本発明の平行平板型
コンデンサの電極取り付け構造は、平行平板型コンデン
サの一方の電極部に、この電極部よりも広い面積を有し
かつ電気伝導性を併せ持った金属板を取り付けるととも
に、該金属板の両端を平行平板型コンデンサの他方の電
極部の高さと同一になるように折り曲げた構造を有して
いる。これによって以下の効果が生じる。 （１）ワイヤーを用いない為に、用いていた場合に比べ
て自己インダクタンスが約２ｎＨ減少できる。 （２）表面実装ができ、高密度化実装ができる。 （３）半田等による一括加熱接続が可能な為、接続工程
が１工程減少する。As described above, according to the electrode mounting structure of the parallel plate type capacitor of the present invention, one of the electrode portions of the parallel plate type capacitor has a larger area than the electrode portion and has an electric conductivity. Tomo If you install a combines a metal plate
Then, both ends of the metal plate are connected to the other side of the
It has a structure that is bent to be the same as the height of the pole part . This produces the following effects. (1) Since no wire is used, the self-inductance can be reduced by about 2 nH as compared with the case where the wire is used. (2) Surface mounting and high density mounting are possible. (3) Since batch heating connection using solder or the like is possible, the number of connection steps is reduced by one.
【図１】本発明の参考例の斜視図と断面図並びに実装状
態の断面図である。FIG. 1 is a perspective view and a sectional view of a reference example of the present invention, and a sectional view of a mounted state.
【図２】本発明の参考例をセラミックパッケージに適用
した場合の断面図である。FIG. 2 is a cross-sectional view when a reference example of the present invention is applied to a ceramic package.
【図３】本発明の実施例を示す斜視図及び断面図並びに
実装状態を示す断面図である。3 is a perspective view and a cross-sectional view and sectional view showing a mounting state indicating the actual施例of the present invention.
【図４】本発明の実施例をセラミックパッケージに適用
した場合の断面図である。It is a cross-sectional view of the application of the actual施例in a ceramic package of the present invention; FIG.
【図５】従来技術の平行平板型コンデンサ及び取付状態
を示す断面図並びに従来技術をパッケージに適用した場
合の斜視図である。FIG. 5 is a cross-sectional view showing a conventional parallel plate type capacitor and a mounting state, and a perspective view when the conventional technique is applied to a package.
１ 平行平板型コンデンサ ２ 電極 ２ａ 電極 ２ｂ 電極 ３ 金属板 ３ａ 曲げ加工部 ３ｂ 曲げ加工端部 ４ 基板 ５ 開孔部 ６ 接地電位用電極 ７ 電源電位用電極 ８ 半田 ８−ａ 金属ロウ材 ９ ＬＳＩ １０ ベース基板 １１ 半田バンプ １２ 外部リード １３ リード基板 １４ ワイヤー １５ ダイアタッチ部 １６ ワイヤーボンディングステッチ部 DESCRIPTION OF SYMBOLS 1 Parallel plate type capacitor 2 electrode 2a electrode 2b electrode 3 Metal plate 3a Bending part 3b Bending end part 4 Substrate 5 Opening part 6 Ground potential electrode 7 Power supply potential electrode 8 Solder 8-a Metal brazing material 9 LSI 10 Base substrate 11 Solder bump 12 External lead 13 Lead substrate 14 Wire 15 Die attach part 16 Wire bonding stitch part
Claims (1)
に、該電極部よりも広い面積を有し、かつ電気伝導性を
もつ金属板を接続した平行平板型コンデンサの電極取り
付け構造において、前記金属板が前記平行平板型コンデ
ンサの電極部と接続される領域の外側部分を曲げた構造
を有し、前記金属板の曲げた部位の外側領域の表面が金
属板を接続しない前記平行平板型コンデンサの電極部表
面と同一平面に配置されている構造を有することを特徴
とする、平行平板型コンデンサの電極取り付け構造。1. An electrode arrangement for a parallel plate type capacitor in which a metal plate having an area larger than the electrode portion and having electrical conductivity is connected to one electrode portion of the parallel plate type capacitor.
In the mounting structure, the metal plate may be the parallel plate type condenser.
Structure in which the outer part of the area connected to the electrode part of the sensor is bent
Wherein the surface of the outer region of the bent portion of the metal plate is made of gold.
Electrode section of the parallel plate type capacitor without connecting the metal plate
An electrode mounting structure for a parallel plate type capacitor, having a structure arranged on the same plane as a surface .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176350A JP2973712B2 (en) | 1992-07-03 | 1992-07-03 | Electrode mounting structure of parallel plate type capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176350A JP2973712B2 (en) | 1992-07-03 | 1992-07-03 | Electrode mounting structure of parallel plate type capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0620863A JPH0620863A (en) | 1994-01-28 |
| JP2973712B2 true JP2973712B2 (en) | 1999-11-08 |
Family
ID=16012070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4176350A Expired - Lifetime JP2973712B2 (en) | 1992-07-03 | 1992-07-03 | Electrode mounting structure of parallel plate type capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2973712B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260182A (en) * | 1996-03-19 | 1997-10-03 | Murata Mfg Co Ltd | Chip electronic part and mounting thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54116658A (en) * | 1978-03-03 | 1979-09-11 | Nippon Electric Co | Package with ceramic capacitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919424Y2 (en) * | 1979-06-07 | 1984-06-05 | 日本電気株式会社 | Package with magnetic capacitor |
-
1992
- 1992-07-03 JP JP4176350A patent/JP2973712B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54116658A (en) * | 1978-03-03 | 1979-09-11 | Nippon Electric Co | Package with ceramic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0620863A (en) | 1994-01-28 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990803 |