JP2956379B2 - Epoxy resin composition, epoxy resin prepreg and epoxy resin laminate - Google Patents
Epoxy resin composition, epoxy resin prepreg and epoxy resin laminateInfo
- Publication number
- JP2956379B2 JP2956379B2 JP25031792A JP25031792A JP2956379B2 JP 2956379 B2 JP2956379 B2 JP 2956379B2 JP 25031792 A JP25031792 A JP 25031792A JP 25031792 A JP25031792 A JP 25031792A JP 2956379 B2 JP2956379 B2 JP 2956379B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- group
- resin composition
- prepreg
- imidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 30
- 229920000647 polyepoxide Polymers 0.000 title claims description 30
- 239000000203 mixture Substances 0.000 title claims description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 17
- 239000002966 varnish Substances 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- -1 imidazole compound Chemical class 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 125000002883 imidazolyl group Chemical group 0.000 claims description 2
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【産業上の利用分野】本発明はプリント回路基板等に有
用なエポキシ樹脂組成物、エポキシ樹脂プリプレグ及び
エポキシ樹脂積層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition, an epoxy resin prepreg and an epoxy resin laminate useful for printed circuit boards and the like.
【０００２】[0002]
【従来の技術】エポキシ樹脂積層板は、一般にエポキシ
樹脂、ジシアンジアミド、イミダゾール及び必要により
充填剤からなる樹脂組成物を溶剤に溶解してワニスと
し、このワニスを例えばガラス布のような繊維基材に含
浸し、加熱して樹脂をＢステージ化してプリプレグを
得、このプリプレグを所定枚数重ねて加熱加圧すること
によって製造されている。2. Description of the Related Art In general, epoxy resin laminates are prepared by dissolving a resin composition comprising epoxy resin, dicyandiamide, imidazole and, if necessary, a filler in a solvent to form a varnish. It is manufactured by impregnating and heating to make the resin into a B-stage to obtain a prepreg, stacking a predetermined number of the prepregs, and pressing and heating.
【０００３】[0003]
【発明が解決しようとする課題】この材料中のジシアン
ジアミドは比較的安価で潜在性の高い硬化剤として幅広
く使用されている。しかしながらその反面として吸水性
が高い（水への溶解度が高い）、有機溶剤への溶解性が
悪い等の欠点も有している。吸水性が高いことは製造さ
れたプリント配線板の特性中、吸湿はんだ耐熱性、耐電
食性を悪化させ、信頼性をおとす原因となる。また、有
機溶剤への溶解性が悪く、ワニスにするために多量の溶
剤を必要とする。これは効率及び価格的に大きな問題で
あり、加えて、乾燥工程で気化する溶剤の回収が困難で
あり、作業環境を悪くする。The dicyandiamide in this material is widely used as a relatively inexpensive and highly potential curing agent. However, on the other hand, it has disadvantages such as high water absorption (high solubility in water) and poor solubility in organic solvents. The high water absorption deteriorates the heat resistance of the moisture-absorbing solder and the corrosion resistance among the characteristics of the manufactured printed wiring board, and causes the reliability to be lowered. In addition, it has poor solubility in organic solvents, and requires a large amount of solvent to form a varnish. This is a major problem in terms of efficiency and cost. In addition, it is difficult to recover the solvent that evaporates in the drying step, and the working environment is deteriorated.
【０００４】これらのことからジシアンジアミドを使用
しない配合が検討されており、フェノール硬化系、芳香
族アミン硬化系等が導入されているが、硬化促進剤とし
てイミダゾール系化合物を配合することについては、ジ
シアンジアミドと併用されていた従来のイミダゾールで
は保存安定性が悪く、この分野での導入は不可能と考え
られていた。[0004] For these reasons, a formulation not using dicyandiamide has been studied, and a phenol-curing system, an aromatic amine-curing system, and the like have been introduced. The conventional imidazole used in combination with is poor in storage stability and was considered impossible to introduce in this field.
【０００５】本発明は、塩素イオン等に影響をうけない
硬化促進剤を用い、潜在性の高いエポキシ樹脂組成物並
びにこの樹脂組成物を用いたエポキシ樹脂プリプレグ及
びエポキシ樹脂積層板を提供することを目的とするもの
である。An object of the present invention is to provide an epoxy resin composition having a high potential using a curing accelerator which is not affected by chloride ions and the like, and an epoxy resin prepreg and an epoxy resin laminate using the resin composition. It is the purpose.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、従来のイ
ミダゾール類を使用したときに何故潜在性向上が難しい
かについて考察し、問題を解決出来るイミダゾールを見
出した。本発明は、一般式化２で表されるイミダ−ル化
合物をエポキシ樹脂に配合してなるエポキシ樹脂組成物
である。Means for Solving the Problems The present inventors have studied why it is difficult to improve the potential when using conventional imidazoles, and have found an imidazole that can solve the problem. The present invention is an epoxy resin composition obtained by mixing an imidal compound represented by the general formula 2 into an epoxy resin.
【０００７】[0007]
【化２】 （化２中Ｒ1は水素、ハロゲン又はアルキル基、Ｒ2及び
Ｒ3は水素、炭素数１〜２０のアルキル基又はフェニル
基である。Ｒ 4 は、メチレン基、イソプロピリデン基で
ある。但し、イミダゾール基の４位にメチル基があって
もよい。）Embedded image Wherein R 1 is hydrogen, halogen or an alkyl group, R 2 and R 3 are hydrogen, an alkyl group having 1 to 20 carbon atoms or a phenyl group. R 4 is a methylene group or an isopropylidene group
is there. However, there is a methyl group at the 4-position of the imidazole group.
Is also good. )
【０００８】本発明のイミダゾール化合物は、ビスフェ
ノールＦ型エポキシ樹脂、ビスフェノールＡ型エポキシ
樹脂、テトラブロモビスフェノールＡ型エポキシ樹脂な
どと２−メチルイミダゾール、２−フェニイルイミダゾ
ール、２−エチル−４−メチルイミダゾールなどとを反
応させて得られる。The imidazole compound of the present invention comprises bisphenol F type epoxy resin, bisphenol A type epoxy resin, tetrabromobisphenol A type epoxy resin and the like, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole. And the like.
【０００９】[0009]
【作用】このイミダゾール化合物は構造からも判るよう
に活性水素を保持していないので、塩素イオン、塩化水
素に影響されることも少ない。また、示差熱分析装置等
による反応性確認でも、１００〜１２０℃で反応を開始
する等の高い潜在性を示している。さらに、熱重量分析
装置を用いて熱分解温度を測定したところ３５０℃近辺
より分解が始まることが確認された。Since the imidazole compound does not retain active hydrogen as can be seen from the structure, it is less affected by chloride ions and hydrogen chloride. Also, reactivity confirmation by a differential thermal analyzer or the like shows high potential such as starting the reaction at 100 to 120 ° C. Further, when the pyrolysis temperature was measured using a thermogravimetric analyzer, it was confirmed that decomposition started at around 350 ° C.
【００１０】すなはち、本発明で用いているイミダゾー
ル化合物は、４−メチルイミダゾール、２−エチル−４
−メチルイミダゾール、２−ウンデシルイミダゾールの
他イミダゾールの各錯体と比べて非常に良好な熱安定性
を示す。従って仮りに未反応で残存したとしても樹脂や
成形体の耐熱性に及ぼす影響は極めて少ない。又溶剤に
対する溶解性もトルエン、キシレン、メチルエチルケト
ン、アセトン、２−メトキシエタノール等に容易に溶解
し作業性も優れている。That is, the imidazole compound used in the present invention is 4-methylimidazole, 2-ethyl-4
-Methyl imidazole, 2-undecyl imidazole and very good thermal stability as compared with imidazole complexes. Therefore, even if it remains unreacted, the effect on the heat resistance of the resin and the molded article is extremely small. Also, the solubility in a solvent is easily dissolved in toluene, xylene, methyl ethyl ketone, acetone, 2-methoxyethanol and the like, and the workability is excellent.
【００１１】これによりジシアンジアミドを配合しない
系で所定のゲルタイムを得るため配合してもワニス状態
で従来ワニスと同等の安定性を示し、溶剤量も大幅に低
減できる。As a result, even if dicyandiamide is blended in order to obtain a predetermined gel time in a system without dicyandiamide, the varnish exhibits the same stability as a conventional varnish, and the amount of solvent can be greatly reduced.
【００１２】[0012]
実施例 臭素化率２１％、エポキシ当量４７５の臭素化ビスフェ
ノールＡ型エポキシ樹脂（エピコート５０４６、油化シ
ェルエポキシ株式会社商品名）９０部（重量部以下同
じ）、エポキシ当量２０５の多官能エポキシ樹脂（エピ
コート１８０Ｓ、油化シェルエポキシ株式会社商品名）
１０部、ビスフェノールＡ型エポキシ樹脂と２−フェニ
ルイミダゾールとを反応させて得られた化合物０．６部
をメチルエチルケトンとＮ、Ｎジメチルホルムアミドの
混合溶剤に溶解し、樹脂分７２％の樹脂ワニスとした。Example A brominated bisphenol A type epoxy resin having a bromination ratio of 21% and an epoxy equivalent of 475 (Epicoat 5046, trade name of Yuka Shell Epoxy Co., Ltd.) 90 parts (the same applies to parts by weight or less), a polyfunctional epoxy resin having an epoxy equivalent of 205 ( Epicoat 180S, Yuka Shell Epoxy Co., Ltd.)
Ten parts, 0.6 part of a compound obtained by reacting bisphenol A type epoxy resin with 2-phenylimidazole was dissolved in a mixed solvent of methyl ethyl ketone and N, N dimethylformamide to obtain a resin varnish having a resin content of 72%. .
【００１３】比較例１ 硬化剤としてジシアンジアミドを３．０部を配合し、ビ
スフェノールＡ型エポキシ樹脂と２−フェニルイミダゾ
ールとを反応させて得られた化合物に代えて２−エチル
−４−メチルイミダゾールを０．２部使用した他は実施
例と同様にして樹脂分６０％の樹脂ワニスを得た。Comparative Example 1 3.0 parts of dicyandiamide was blended as a curing agent, and 2-ethyl-4-methylimidazole was used instead of the compound obtained by reacting bisphenol A type epoxy resin with 2-phenylimidazole. A resin varnish having a resin content of 60% was obtained in the same manner as in Example except that 0.2 part was used.
【００１４】比較例２ ビスフェノールＡ型エポキシ樹脂と２−フェニルイミダ
ゾールとを反応させて得られた化合物に代えて２−エチ
ル−４−メチルイミダゾールを０．４部使用した以外は
実施例と同様にして樹脂分７２％の樹脂ワニスを得た。Comparative Example 2 The procedure of Example was repeated except that 0.4 parts of 2-ethyl-4-methylimidazole was used instead of the compound obtained by reacting bisphenol A type epoxy resin with 2-phenylimidazole. Thus, a resin varnish having a resin content of 72% was obtained.
【００１５】比較例３ ビスフェノールＡ型エポキシ樹脂と２−フェニルイミダ
ゾールとを反応させて得られた化合物に代えて２−ウン
デシルイミダゾールを０．６部使用した以外は実施例と
同様にして樹脂分７２％の樹脂ワニスを得た。Comparative Example 3 A resin component was prepared in the same manner as in the Example except that 0.6 parts of 2-undecylimidazole was used in place of the compound obtained by reacting bisphenol A type epoxy resin with 2-phenylimidazole. A 72% resin varnish was obtained.
【００１６】これらのワニスを３０℃の保管庫中でゲル
タイムの径時変化を測定した。又樹脂ワニスを厚さ０．
１ｍｍのカチオニックシラン処理を施した平織ガラス布
に含浸した後１７０℃、で５分間乾燥して樹脂分４５％
のプリプレグを得た。このプリプレグを４枚重ね上下に
厚さ３５μｍの銅はくを重ね４ＭＰａ、１７０℃で８０
分間加熱加圧して、銅張り積層板を得た。この銅張り積
層板の試験をＪＩＳ法に基づいて行った。These varnishes were measured for the time-dependent change of gel time in a storage at 30 ° C. In addition, a resin varnish having a thickness of 0.
After impregnating in 1 mm cationic silane treated plain woven glass cloth, it is dried at 170 ° C. for 5 minutes to obtain a resin content of 45%.
Prepreg was obtained. Four prepregs are stacked on top of each other and copper foil of 35 μm thickness is stacked on top and bottom at 4 MPa and 170 ° C.
Heating and pressurizing for minutes, a copper-clad laminate was obtained. This copper-clad laminate was tested based on the JIS method.
【００１７】さらに、銅はくを０．１ｍｍ幅の櫛型パタ
ーンにエッチングし、表面の粗化処理を施し、前記プリ
プレグを上下に１枚配しプレスしたものについて耐電食
性試験を行った。試験条件は８５℃、８５％ＲＨで１０
０Ｖ／ｍｍの直流電圧を印加し、抵抗値が１０8Ω以下
となる迄の時間を測定した。Further, the copper foil was etched into a comb pattern having a width of 0.1 mm, the surface was roughened, and the above prepregs, which were arranged one above the other and pressed, were subjected to an electrolytic corrosion resistance test. The test conditions were 10 at 85 ° C and 85% RH.
A DC voltage of 0 V / mm was applied, and the time until the resistance value became 10 8 Ω or less was measured.
【００１８】ワニス特性及び積層板、配線板の試験結果
を表１に示す。Table 1 shows the varnish characteristics and the test results of the laminates and wiring boards.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【発明の効果】本発明のエポキシ樹脂組成物は、ワニス
中での安定性もよく高樹脂分化も可能である。また、本
発明のエポキシ樹脂組成物を使用して、ジシアンジアミ
ド硬化系にない良好な特性の積層板を得ることができ
る。The epoxy resin composition of the present invention has good stability in varnish and is capable of high resin differentiation. Further, using the epoxy resin composition of the present invention, it is possible to obtain a laminate having good properties not found in dicyandiamide curing systems.
フロントページの続き (56)参考文献 特開 昭59−38235（ＪＰ，Ａ) 特開 昭61−9439（ＪＰ，Ａ) 特開 昭62−18421（ＪＰ，Ａ) 特開 昭61−268721（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C08G 59/40 - 59/60 C08J 5/24 B32B 27/38 Continuation of the front page (56) References JP-A-59-38235 (JP, A) JP-A-61-9439 (JP, A) JP-A-62-18421 (JP, A) JP-A-61-268721 (JP) , A) (58) Field surveyed (Int. Cl. 6 , DB name) C08G 59/40-59/60 C08J 5/24 B32B 27/38
Claims (3)
をエポキシ樹脂に配合してなるエポキシ樹脂組成物。 【化１】 （化１中Ｒ1は水素、ハロゲン又はアルキル基、Ｒ2及び
Ｒ3は水素、炭素数１〜２０のアルキル基又はフェニル
基である。Ｒ 4 は、メチレン基、イソプロピリデン基で
ある。但し、イミダゾール基の４位にメチル基があって
もよい。）An epoxy resin composition comprising an imidazole compound represented by the general formula (1) and an epoxy resin. Embedded image (Wherein R 1 is hydrogen, a halogen or an alkyl group, R 2 and R 3 are hydrogen, an alkyl group having 1 to 20 carbon atoms or a phenyl group. R 4 is a methylene group or an isopropylidene group.
is there. However, there is a methyl group at the 4-position of the imidazole group.
Is also good. )
機溶剤に溶解したワニスを基材に含浸し、乾燥してなる
エポキシ樹脂プリプレグ。2. An epoxy resin prepreg obtained by impregnating a base material with a varnish obtained by dissolving the epoxy resin composition according to claim 1 in an organic solvent and drying.
を所要枚数重ね、加熱加圧してなるエポキシ樹脂積層
板。3. An epoxy resin laminate obtained by laminating a required number of the epoxy resin prepregs according to claim 2 and applying heat and pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25031792A JP2956379B2 (en) | 1992-09-21 | 1992-09-21 | Epoxy resin composition, epoxy resin prepreg and epoxy resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25031792A JP2956379B2 (en) | 1992-09-21 | 1992-09-21 | Epoxy resin composition, epoxy resin prepreg and epoxy resin laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06100764A JPH06100764A (en) | 1994-04-12 |
| JP2956379B2 true JP2956379B2 (en) | 1999-10-04 |
Family
ID=17206114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25031792A Expired - Fee Related JP2956379B2 (en) | 1992-09-21 | 1992-09-21 | Epoxy resin composition, epoxy resin prepreg and epoxy resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2956379B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1239559C (en) | 2000-12-14 | 2006-02-01 | 日立化成工业株式会社 | Varnish for laminate or preprey, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| JP4517699B2 (en) * | 2004-03-30 | 2010-08-04 | 住友ベークライト株式会社 | Resin composition, prepreg and laminate |
| EP2412743B1 (en) * | 2009-03-27 | 2020-08-19 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same |
-
1992
- 1992-09-21 JP JP25031792A patent/JP2956379B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06100764A (en) | 1994-04-12 |
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