JP2952622B2 - Processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for supplying a processing liquid such as a resist liquid to a surface of an object to be processed such as a semiconductor wafer.

[0002]

2. Description of the Related Art As a conventional processing apparatus of this type, an object to be processed such as a semiconductor wafer is held on a spin chuck, a processing liquid is dropped on a central portion of the object to be processed, and then the spin chuck is rotated at a high speed. There is known an apparatus for uniformly applying a processing liquid to a peripheral portion of an object to be processed by the centrifugal force.

[0003] In this type of apparatus, the periphery of the spin chuck is surrounded by a cup (a container having an open top), and the processing liquid shaken off from the peripheral portion of the object rotating at high speed scatters to the outside. I was trying not to.

[0004] However, if the processing liquid is prevented from scattering to the outside by the cup, the inner surface of the cup is contaminated by the adhesion of the processing liquid. If this is left as it is, solutes that have been deposited from the processing solution will accumulate on the inner surface of the cup,
The processing liquid rebounds on the roughened cup inner surface and re-adheres to the surface of the object to be processed, or solute fragments fly up due to convection in the device and adhere to the coating film on the semiconductor wafer. , Resulting in lower product yield.

Conventionally, an operator regularly removes the cup from the apparatus body and cleans the residue of the processing liquid adhered to the inner surface of the cup with a cleaning liquid. Recently, however, various methods for automatically cleaning the inside of the cup have been used. For example, there has been proposed a method in which a cleaning liquid is supplied to a cup itself, discharged from a number of holes at the top of the cup, and dropped along the inner peripheral surface of the cup (Japanese Patent Laid-Open No. 59-212226). The spin chuck is detached from the rotating shaft, and instead, a cleaning chuck having a cleaning spray is attached, and a cleaning liquid is sprayed from the cleaning spray onto the inner surface of the cup while rotating the cleaning chuck (Japanese Utility Model Laid-Open No. 2-132932). )
Etc. are known.

[0006]

However, in the case of the cup cleaning system in which the cleaning liquid is supplied to the cup itself and discharged onto the inner surface, the cup shape and structure tend to be complicated.
In addition, as a result of giving priority to the cleaning property, the processing performance inherent in the processing apparatus (uniformity of the coating film, airflow state in the cup, etc.) is often not sufficiently considered.

In the case of a method in which the spin chuck is replaced with a cleaning chuck to perform cleaning, there is a problem that the chuck replacing operation must rely on an operator and the cup cleaning operation cannot be completely automated. Was.

The present invention has been made in view of the above circumstances, and provides a processing apparatus having means for automatically cleaning the inside of a cup without making any structural change for cleaning the cup itself. The purpose is to provide.

[0009]

According to a first aspect of the present invention, there is provided a processing apparatus, comprising: a rotation holding means for rotating and holding an object to be processed; and a processing liquid dropping onto the object to be processed. In a processing apparatus having a processing cup surrounding the rotation holding means to prevent scattering, the cleaning liquid is injected into the processing cup while rotating in parallel with the rotation holding means. A cleaning liquid injection nozzle is provided.

Further, the processing apparatus according to the present invention surrounds the rotation holding means for rotating and holding the object to be processed, and the rotation holding means for preventing the processing liquid dropped on the object to be scattered. In a processing apparatus having a processing cup, a nozzle arm provided vertically and horizontally movably outside the processing cup, a cleaning liquid injection nozzle provided rotatably at the tip of the nozzle arm, and a nozzle positioning means for positioning the cleaning solution spray nozzle
Then, the nozzle positioning means is placed below the nozzle arm.
A member that protrudes so as to be able to protrude and retract to hold the cleaning liquid injection nozzle
It is formed by mating pins.

According to a third aspect of the present invention, there is provided a processing apparatus similar to the first and second aspects of the present invention, wherein a rotation holding means for rotating and holding the object to be processed, and a processing device which is dropped on the object to be processed. Assuming a processing apparatus having a processing cup surrounding the rotation holding means in order to prevent the liquid from scattering, a nozzle arm provided vertically and horizontally movable outside the processing cup, and the nozzle arm And a driving means for horizontally rotating and stopping the cleaning liquid injection nozzle, which is provided at the front end of the cleaning liquid injection nozzle so as to be horizontally rotatable.

In the processing apparatus according to the third aspect, the driving means may be any means as long as the cleaning liquid injection nozzle is horizontally rotated and stopped, and may be, for example, a motor for directly transmitting the rotation drive or a cylinder. It can be formed by a device that converts a linear motion into a rotary motion.

Further, the processing apparatus according to claim 4, wherein, in the cleaning liquid injection nozzles, characterized in that a injection port for injecting a cleaning liquid to a plurality of locations other than the rotating holding means.

[0014]

According to the processing apparatus of the present invention configured as described above, after the cleaning liquid injection nozzle enters the processing cup, the processing liquid is injected from the tip while rotating the cleaning liquid injection nozzle. The inside of the processing cup can be automatically cleaned over the entire circumference. After cleaning, the nozzle arm can be moved to the original position by storing the cleaning liquid jet nozzle again below the nozzle arm by the positioning means or the driving means.

As described above, if the nozzle arm provided with the cleaning liquid injection nozzle is arranged outside the processing cup and the cleaning liquid injection nozzle enters the processing cup only at the time of cleaning, the processing cup itself can be provided. Since there is no need to make any structural changes for cleaning, a processing apparatus that emphasizes process performance can be realized.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is applied to a resist coating and developing apparatus.

As shown in FIG. 1, the resist coating and developing apparatus includes a processing mechanism unit 10 in which processing mechanisms for performing various processes on a processing target, for example, a semiconductor wafer (hereinafter, simply referred to as a wafer) W, are provided. The loading / unloading mechanism 1 for automatically loading / unloading the wafer W into / from the mechanism unit 10 constitutes a main part.

The loading / unloading mechanism 1 includes a wafer carrier 2 for storing the unprocessed wafer W, a wafer carrier 3 for storing the processed wafer W, and an arm for holding the wafer W by suction.
A moving mechanism 5 for moving the arm 4 in X, Y (horizontal), Z (vertical) and θ (rotation) directions;
Stage 6 on which wafers are aligned and wafers W are transferred to and from processing mechanism unit 10
And

The processing mechanism unit 10 is provided with a transport mechanism 12 movably along a transport path 11 formed in the X direction from the alignment stage 6. Transport mechanism 1
2 has a main arm 13 movably in the Y, Z and θ directions.
Is provided. On one side of the transfer path 11, an adhesion processing mechanism 14 for performing an adhesion process for improving the adhesion between the wafer W and the resist liquid film, and a solvent remaining in the resist applied to the wafer W are heated and evaporated. A pre-bake mechanism 15 for cooling the wafer W and a cooling mechanism 16 for cooling the overheated wafer W are arranged.
On the other side of the transfer path 11, a processing liquid application mechanism 17 for applying a resist on the surface of the wafer W (processing apparatus of the present invention)
In order to prevent diffused light reflection during the exposure process,
And a surface coating layer coating mechanism 18 for coating and forming a CEL film or the like on the resist.

In the resist coating and developing apparatus configured as described above, first, the unprocessed wafer W is unloaded from the wafer carrier 2 by the arm 4 of the loading / unloading mechanism 1 and placed on the alignment stage 6. Is done. Then
The wafer W on the alignment stage 6 is transferred to the transfer mechanism 12
Of each of the processing mechanisms 14 to 1
8. Then, the processed wafer W is returned to the alignment stage 6 by the main arm 13, and
Further, the wafer is transported by the arm 4 and stored in the wafer carrier 3.

Next, a first embodiment of the processing apparatus 17 of the present invention will be described with reference to FIGS. As shown in FIGS. 2 and 3, the processing apparatus 17 of the present invention includes a processing unit 19 that performs a coating process on the wafer W,
And a nozzle transport arm 21 for moving the processing liquid supply nozzle 20 to a position above the processing section 19 and to a standby position. The main part is constituted by the moving mechanism 22 and the processing unit cleaning device 23 disposed near the processing unit 19.

As shown in FIG. 3, the processing section 19 comprises a spin chuck 24 as a rotation holding means for sucking and holding the wafer W and horizontally rotating the wafer W, and a processing cup for accommodating the wafer holding section 24a of the spin chuck 24. 26. The lower end of the spin chuck 24 is fixed to a rotating shaft of a motor (not shown) for rotating the spin chuck 24 and the wafer W at a predetermined rotation speed at a high speed. The processing cup 26 is connected to the wafer holder 2 of the spin chuck 24.
4a, an annular inner cup 27 concentrically arranged so as to surround the periphery of the spin chuck 24 and the inner cup 2.
And an outer cup 28 that accommodates the container 7 and forms a processing space 25.

The inner cup 27 has a horizontal portion 29 having an outer diameter substantially equal to the outer diameter of the wafer W, and a conical inclined portion extending downward and outward from a peripheral portion of the horizontal portion 29. A portion 30 is formed. The inclination angle .theta.1 of the upper surface 30a of the inclined portion 30 is set at about 15 DEG to 30 DEG.

The outer cup 28 is composed of an upper cup 31 and a lower cup 32. The upper cup 31 has an opening 33 having a diameter slightly larger than that of the wafer W at the center, and a side wall from the vicinity of the opening 33 to the vicinity of the joint with the lower cup 32 is formed to be conically inclined. The inclination angle .theta.2 of the inclined portion inner surface 31a of the upper cup 31 is set at about 30 DEG to 45 DEG. The inside of the lower cup 32 is partitioned into an inside and an outside by an annular wall 34, and an exhaust port 35 is provided on an inner bottom portion, and a drain port 36 is provided on an outer bottom portion. Exhaust port 3
A vacuum apparatus (not shown) is connected to the exhaust port 35 so that the resist solution and the particles scattered when the spin coating process is performed on the wafer W are discharged together with the atmosphere in the apparatus 17.
It can be discharged more. Further, a drainage storage tank (not shown) is connected to the drainage port 36, and the outer cup inner surfaces 31a and 32a and the inner cup outer surface 27a
, And the resist liquid accumulated on the bottom of the lower cup 32 can be discharged and stored from the drain port 36.

As shown in FIG. 4, the processing unit cleaning device 23 includes a nozzle arm 39, one end of which is fixed to a distal end of a rotating shaft 38 projecting vertically upward from the processing device main body 37 and horizontally supported. The support shaft 40, which projects vertically downward from the back surface (lower surface) of the tip of the nozzle arm 39, is lowered.
A nozzle beam 42 (nozzle support member) mounted rotatably via a tally joint 41, and a cleaning liquid injection nozzle 43 provided at the tip of the nozzle beam 42
The main part is constituted by an engagement pin 44 which is a nozzle positioning means protruding downward from the back surface of the intermediate portion of the nozzle arm 39.

The lower end of the rotating shaft 38 is connected to a gear mechanism (not shown).
Numeral 8 can move up and down in addition to the rotation of the shaft. Therefore, the nozzle arm 39 fixed to the rotating shaft 38 is configured to be vertically movable and horizontally rotatable.

As shown in FIG. 5 and FIG.
Is provided at the bottom of the nozzle arm 39 in a penetrating manner, and its upper end flange portion 40a is engaged with and supported by the bottom inner wall of the nozzle arm 39. At the axis of the support shaft 40,
A cleaning liquid channel 45 extending from the upper end to the vicinity of the lower end is formed. A cleaning liquid supply pipe 58 is connected to an inlet of the cleaning liquid flow path 45. The cleaning liquid flow channel 45 is branched in four directions from the lower end thereof, and four outlets 46 are opened on the side of the support shaft 40.

The rotary joint 41 is provided so as to surround the four outlets 46, and is supported by the lower end flange 47 of the support shaft 40 in a mounted state. B
The tally joint 41 has upper and lower ends and a support shaft 40.
And a bearing 52 interposed between the support shaft 40
Can be rotated with almost no frictional resistance. An annular groove 48 is formed on the inner peripheral wall of the rotary joint 41 in accordance with the position of the outlet 46, and an annular flow path 49 is formed by the inner surface of the annular groove 48 and the side surface of the support shaft 40. . This annular channel 49
Seal members (O-rings) 53 are provided on both the upper and lower sides so that the annular flow path 49 can be kept liquid-tight even when the rotary joint 41 rotates. An opening 50 is formed in the side wall of the rotary joint 41 so as to communicate with the annular flow path 49, and the nozzle bead is formed in the opening 50.
The system 42 is connected.

The nozzle beam 42 is formed of a stainless steel tube, and the cleaning liquid inlet 43a of the cleaning liquid injection nozzle 43 is connected to the opening at the tip thereof. The length between the axis of the support shaft 40 and the tip of the cleaning liquid injection nozzle 43, that is, the radius of rotation of the cleaning liquid injection nozzle 43 is determined by the upper cup 28.
Is set to be slightly shorter than the radius of the upper opening 33. The in-nozzle flow path 54 extending from the cleaning liquid inlet 43a to the vicinity of the nozzle tip is branched into three directions, and the first tip 55, the second jet 56 horizontally and Three downwardly directed third injection ports 57 are formed. The cleaning liquid spray direction of the first, second and third spray ports 55, 56, 57 is set in the same vertical plane, and the spray angle in the vertical direction is determined in consideration of the inner surface shape of the processing cup 26. The first injection port 55 is 30
The third injection port 57 is set at 60 degrees.

The horizontal discharge angles of the first, second and third injection ports 55, 56 and 57 are 45 ° with respect to the axial direction of the nozzle beam 42 as shown in FIG. Is set to This is a structure adopted in order to use the jetting force of the cleaning liquid jetted from the cleaning liquid jet nozzle 43 for the rotational force of the cleaning liquid jet nozzle 43. That is, in FIG. 7, assuming that the resultant force of the horizontal components of the jetting force of the cleaning liquid from the three jet ports 55, 56, 57 is F1,
The orthogonal component F2 (= F1 sin 45 °) of the reaction force -F1 with respect to the axial direction of the nozzle beam 42 is generated by the nozzle beam 42.
And the nozzle beam 42 is rotated by the torque based on the force F2.

On the other hand, the locking pin 44 is connected to the nozzle arm 39.
Projecting downward from a long hole 60 formed at the bottom of the lower surface of
An intermediate portion is pivotally supported by a fixing bracket 59 provided on both sides of the elongated hole 60 so as to be vertically rotatable, and can protrude below the nozzle arm 39 so as to be able to protrude and retract. An air cylinder 61 for rotating the locking pin 44 is fixed in the nozzle arm 39, and the upper end of the locking pin 44 is fixed to the tip of a cylinder rod 62 of the air cylinder 61. Hinge 63 to the bracket 63. Then, the engagement pin 44 which is rotated in the vertical direction by extending and contracting the air cylinder 61.
The turning radius is set such that the lower tip end portion 64 is located below the rotation surface of the nozzle beam 42 when it is in a substantially vertical posture. The stroke length of the air cylinder 61 is set such that the engagement pin 44 is in a vertical posture when the cylinder rod 62 is extended to the maximum length. That is, when the locking pin 44 is rotated by the longest stroke length of the air cylinder 61, the nozzle beam 42 comes into contact with the lower end portion 64 of the air cylinder 61, and the rotation of the nozzle beam 42 is controlled by the nozzle arm. -It can be stopped below the drum 39. In this embodiment, the lower end portion 64 of the locking pin 44 is made of a permanent magnet, and an iron collar member 51 is provided at a position where the lower end portion 64 contacts the lower end portion 64 of the nozzle beam 42. . Therefore, the nozzle arm 39 abutting on the lower end portion 64 of the locking pin 44 is magnetically attracted and held by the locking pin 44 and positioned and stored below the nozzle arm 39.

In the processing apparatus 17 of the present invention configured as described above, while the spin coating process is performed on the surface of the wafer W, the nozzle arm 39 of the processing section cleaning device 23 is shown by a solid line in FIG. Then, it is made to stand by at a predetermined position near the processing cup 26. At this time, the nozzle beam 42
It is sucked and held by the locking pin 44 and is stored below the nozzle arm 39.

When the coating process is performed on a predetermined number of wafers W and it is necessary to clean the inside of the cup, the mounting of the next wafer W on the spin chuck 24 is interrupted, and the processing unit cleaning device 23 is operated. Activate to clean the inside of the device.

At the time of cleaning, first, the nozzle arm 39 is rotated above the processing cup 26, and the position is adjusted so that the center of rotation of the cleaning liquid injection nozzle 43 and the center of the processing cup 26 (the center of the spin chuck 24) coincide. I do. After this position adjustment,
The nozzle arm 39 is lowered, and as shown in FIG. 8, the nozzle beam 42 and the cleaning liquid jet nozzle 43 are set to enter the processing cup 26. Then, the air cylinder 61 is driven to release the locking pin 44 that sucks and holds the nozzle beam 42, and the cleaning liquid is supplied from the cleaning liquid supply pipe 58 into the support shaft 40. The cleaning liquid flows through the cleaning liquid flow path 45 in the cleaning liquid supply pipe 58 to the annular flow path 49 of the rotary joint 41, and further flows through the nozzle beam 42.
The cleaning liquid is supplied to the cleaning liquid injection nozzle 43 through the inside, and the first, second, and third injection ports 55, 56,
Injected from 57. These injection ports 55, 56, 57
The cleaning liquids A, B, and C that have been sprayed are sprayed on the inner surface 31a of the upper cup, which is most likely to be contaminated in the processing cup 26, and the upper surface 30a of the inclined portion of the inner cup 27. Since the cleaning liquid injection nozzle 43 rotates in parallel with the spin chuck 24 along the inner circumference of the cup by its own injection force, the processing cup 28
The inner surface is thoroughly cleaned.

At the end of washing, the air cylinder 61 is driven to project the locking pin 44, and the lower end 64
To lock the nozzle beam 42, magnetically attract and hold it, and store it below the nozzle arm 39.
In this case, even if the nozzle beam 42 is not close to the locking pin 44 when the locking pin 44 is protruded, if the discharge of the cleaning liquid is continued for a certain period of time, the nozzle beam 42 rotates while the nozzle beam 42 rotates. It returns to the position and is held by suction. Thereafter, the nozzle arm 39 is raised to move the nozzle beam 42 and the cleaning liquid injection nozzle 43 out of the processing cup 26, and then the nozzle arm 39 is rotated to return to the standby position. If a sensor capable of confirming that the nozzle beam 42 is held at the position of the locking pin 44 is provided in the nozzle arm 39, the nozzle beam 42 and the cleaning liquid injection nozzle 43 can be taken in and out of the processing cup 26. It can be performed more reliably.

As described above, the nozzle arm 39 provided with the cleaning liquid injection nozzle 43 is made to stand by outside the processing cup 28, and the nozzle arm 39 is moved only during cleaning to move the cleaning liquid injection nozzle 43 into the processing cup 28. If the approach is adopted, there is no need to make any structural changes to the processing cup 28 itself for cleaning, so that a processing apparatus emphasizing process performance can be realized.

In the first embodiment described above, the processing unit cleaning apparatus 23 having the self-rotating nozzle that rotates and moves by its own cleaning liquid spraying power has been described. However, the nozzle rotation method is not limited to this. For example, FIG. 9 and FIG.
As shown in FIG. 0, a pair of pulleys 66, 67 having an endless timing belt 65 stretched over and a motor 68 are used, and one pulley 66 is attached to a rotating shaft 68a of the motor 68. The nozzle beam 42 is fixed and the other pulley 67 is rotatably supported by the rotary joint 41.
The cleaning liquid injection nozzle 43 may be rotated by driving the motor 68.
In this case, a sensor (sensor slit) 69 capable of detecting the position of the nozzle beam 42 is connected to the motor rotation shaft 68.
a, and use a pulse motor or the like to
By controlling the rotation of No. 2, it is possible to reliably stop or store the nozzle beam 42 at a position below the nozzle arm 39.

In this case, as shown in FIG. 11, the use of a motor 68 capable of normal and reverse rotation allows the driven pulley 67 and the support shaft 40 to be integrally formed. Can be rotatably supported by a bearing 70, and the cleaning liquid supply pipe 58 can be directly connected to the cleaning liquid channel 45 provided on the support shaft 40. Therefore, the rotary joint 41 becomes unnecessary, the structure is simple, and the cleaning liquid can be supplied reliably.

In the second embodiment shown in FIGS. 9 to 11, the other parts are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

In the second embodiment, the cleaning liquid injection nozzle 4
Although the case where the horizontal rotation of the nozzle 3 and the positioning of the nozzle arm 39 below are performed by the rotation of the motor 68 has been described, the horizontal rotation of the cleaning liquid injection nozzle 43 is not necessarily performed by the motor 68, And the like may be converted into a rotary motion. That is, as shown in FIGS. 12 and 13, the nozzle beam 4 rotatably supported by the bearing 70.
The pulley 71 is fixed to the second support shaft 40, and the pulley 71
An air cylinder 73 is connected to one end of the timing belt 72 stretched via the air cylinder, and a spring 74 is connected to the other end to connect the timing belt 72 to the air cylinder 7.
3, the nozzle beam 42 may be rotated by expanding and contracting the air cylinder 73.
In this case, the stroke length of the air cylinder 73 is such that when the cylinder rod 75 is extended to its maximum length,
Is retracted below the nozzle arm 39, and from this state, the cylinder rod 75 is contracted to the shortest length so that the pulley 71 is set to rotate more than 360 ° (one rotation). . In this way, by expanding and contracting the air cylinder 73, the cleaning liquid injection nozzle 43
Can be rotated around the entire circumference of the processing cup 28, and the return of the cleaning liquid injection nozzle 43 and the nozzle beam 42 to the position below the nozzle arm 39 is automatically achieved by the urging force of the spring 74. .

In the third embodiment shown in FIGS. 12 and 13, the other parts are the same as those in the first and second embodiments.
The description is omitted.

In the above embodiment, the case where the processing apparatus is applied to a resist coating / developing apparatus has been described. However, it is needless to say that the present invention can also be applied to an apparatus for performing an etching liquid coating processing, a magnetic liquid coating processing and a cleaning processing. It is.

[0043]

As described above, according to the processing apparatus of the present invention, since the configuration is as described above, the following effects can be obtained.

1) According to the processing apparatus of the first and second aspects, the cleaning liquid injection nozzle can be made to enter the processing cup only at the time of cleaning, and the cleaning liquid injection nozzle can be rotated to uniformly clean the inner surface of the processing cup. There is no need to make any structural changes to the processing cup itself for cleaning, and a processing apparatus that emphasizes process performance can be realized.

2) According to the processing apparatus of the second aspect , the nozzle positioning means is formed by the engagement pin which protrudes below the nozzle arm so as to be able to protrude and retract so as to abut and hold the cleaning liquid jet nozzle. The cleaning liquid injection nozzle can be easily stored below the nozzle arm, and the cleaning injection nozzle can be smoothly taken in and out of the processing cup.

3) According to the processing apparatus of the third aspect, the cleaning liquid injection nozzle can be forcibly rotated horizontally by the driving means and can be stored below the nozzle arm. In addition, the efficiency of the cleaning operation can be further improved. 4) According to the processing apparatus of the fourth aspect , the cleaning liquid injection nozzle is provided with injection ports for injecting the cleaning liquid to a plurality of locations other than the rotation holding means, so that the cleaning efficiency is further improved in addition to the above 1) and 3). Can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an embodiment in which a processing apparatus of the present invention is applied to a resist liquid coating and developing apparatus.

FIG. 2 is a schematic plan view of the processing apparatus of the present invention.

FIG. 3 is a sectional view showing a processing unit of the processing apparatus of the present invention.

FIG. 4 is a schematic perspective view showing a first embodiment of the processing apparatus of the present invention.

FIG. 5 is a sectional perspective view showing a main part of the first embodiment.

FIG. 6 is a sectional view showing a main part of the first embodiment.

FIG. 7 is a schematic plan view showing an operation state of the first embodiment.

FIG. 8 is a schematic sectional view showing an operation state of the first embodiment.

FIG. 9 is a schematic perspective view showing a second embodiment of the processing apparatus of the present invention.

FIG. 10 is a schematic cross-sectional view showing a main part of the second embodiment and a cross-sectional view thereof along line XX.

FIG. 11 is a schematic sectional view showing another embodiment of the main part of the second embodiment.

FIG. 12 is a schematic perspective view showing a third embodiment of the processing apparatus of the present invention.

FIG. 13 is a schematic sectional view showing a main part of the third embodiment and a plan view of the main part.

[Explanation of symbols]

 24 Spin chuck (rotation holding means) 26 Processing cup 39 Nozzle arm 43 Cleaning liquid injection nozzle 44 Engagement pin (nozzle positioning means) 55, 56, 57 Injection port 68 Motor (drive means) 73 Cylinder (drive means)

Claims (4)

(57) [Claims] 1. A processing apparatus comprising: a rotation holding means for rotating and holding an object to be processed; and a processing cup surrounding the rotation holding means to prevent scattering of a processing liquid dropped on the object to be processed. A processing apparatus, comprising: a cleaning liquid injection nozzle configured to be capable of entering the processing cup and injecting a cleaning liquid into the processing cup while rotating in parallel with the rotation holding means. 2. A processing apparatus comprising: a rotation holding means for rotating and holding an object to be processed; and a processing cup surrounding the rotation holding means to prevent scattering of a processing liquid dropped on the object to be processed. A nozzle arm provided vertically and horizontally movable outside the processing cup, a cleaning liquid injection nozzle provided at the tip of the nozzle arm so as to be horizontally rotatable, and a nozzle for positioning the cleaning liquid injection nozzle. Nozzle positioning means , wherein the nozzle positioning means is protruded and retracted below the nozzle arm.
An engagement pin that protrudes as much as possible
A processing device characterized by being formed by a component. 3. A processing apparatus comprising: rotation holding means for rotating and holding an object to be processed; and a processing cup surrounding the rotation holding means for preventing scattering of a processing liquid dropped on the object to be processed. A nozzle arm provided vertically and horizontally movable outside the processing cup, a cleaning liquid injection nozzle provided rotatably at the tip of the nozzle arm, and a cleaning liquid injection nozzle which is horizontally rotated. A processing device, comprising: a driving unit for stopping. 4. A cleaning solution spray nozzle, the processing apparatus according to any one of claims 1, characterized in that a injection port for injecting a cleaning liquid to a plurality of locations other than the rotary holding unit 3.