JP2940628B2 - Pretreatment method for bonding ceramics - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for pretreating a bonding surface of ceramics used for bonding.

[Prior Art] As a high-strength bonding method between ceramics and ceramics or between ceramics and metal, a method called an active metal method has been conventionally known.

The active metal method includes a method of directly brazing ceramics and ceramics or metal using a brazing material containing an active metal such as Ti or Zr.

The bonding surface of ceramics used for these bondings is
It may be burned out, but usually with surface roughness
It is often used after finishing to about Rmax = 1 to 2S.

As a method of finishing to Rmax = 1 to 2S, generally, # 100
Usually, the size is adjusted by rough grinding with a grindstone of about # 200, and then the surface is prepared by finishing with a fine grindstone of # 600 or more.

[Problems to be Solved by the Invention] In the case of bonding using ceramics which have been subjected to the conventional pretreatment described above, there is a problem that the bonding strength varies greatly and the average value is low, resulting in a lack of reliability.

The present inventors have found that the above-mentioned variation in the bonding strength varies depending on the processing lot of the ceramics, and as a result of pursuing the cause, have found that the conditions of the finish processing (# 400 to # 1500) affect the variation in the bonding strength. And further repeated experiments to complete the present invention.

That is, the present invention is intended to solve the above problems, and provides a pretreatment method for a ceramic bonding surface in which the bonding strength of a ceramic bonded body is significantly improved and the variation thereof is also significantly improved. The purpose is to do.

Means for Solving the Problems In order to achieve the above object, the present invention provides a ceramic bonding surface, using a grindstone of # 400 to # 1500, suppressing the amount of one cut to 6 μm or less, and This is a pretreatment method for bonding ceramics, characterized by grinding at least 100 μm.

The present invention can be applied to all joining ceramics, regardless of the material. The grindstone to be used also uses what is conventionally used. Usually, a diamond wheel of resin (resin) bond is generally used. The grain size of the whetstone is # 400 ~
It is preferable to use # 1500. If it is coarser than # 400 (small numbers), the bonding strength will decrease and the variation will increase.
The same applies to the case of finer than # 1500 (large numbers).

It is important that the amount of one cut is 6 μm or less. If it is more than 6 μm, the effect of improving the bonding strength and the variation will be reduced.

Further, the total grinding amount (total cutting amount) under the conditions of a whetstone: # 400 to # 1500 and a cutting amount: 6 μm or less needs to be 100 μm or more. When the thickness is less than 100 μm, the effect of improving the bonding strength and the variation also decreases.

[Operation] It is said that when grinding ceramics with a grindstone, processing distortion and cracks remain in the depth direction. However, the joint surface of ceramics usually has a specified surface roughness (for example, Rmax ≦
1S) was considered to be good, so it was left to each worker on how to grind in the process.

Generally, for efficient grinding, use a grinding wheel of # 100 to # 200 to set the dimensions with a large depth of cut (about 20 μm), and finally, # 400 to # 1
It is said to be finished by grinding several tens of μm with 500 whetstones.

By the way, when the above-mentioned efficient grinding is performed, there is a high possibility that strains and cracks remain on the joint surface. In the present invention, it is considered that the removal of distortion and cracks caused by rough cutting leads to an improvement in connection strength and a reduction in variation. When a grindstone coarser than # 400 is used or when the depth of cut is more than 6 μm, the improvement effect is small because existing strains and cracks can be removed.
It is considered that new distortion and cracks are generated. # 15
In the case of a grindstone finer than 00, the occurrence of distortion and cracks was difficult to consider, but in actuality the grinding stones clogged before cutting down to 100 μm, and strain and cracks eventually occurred because an excessive load was applied Will be. The need for a total grinding amount of 100 μm or more is due to the strain generated during roughing,
It is considered that the crack depth reached almost 100 μm.

[Example] A large number of 3 × 4 × 17 mm (A) and 3 × 4 × 6 mm (B) chips cut from Sialon ceramic style (about 100 × 100 × 5 mm) manufactured by Nippon Ceratech Co., Ltd. As a test piece, a ceramic was used as a test piece, after processing with a 3 × 4 mm surface as a bonding surface, and bonding as shown in (A)-(B)-(A).

Bonding is made of Tanaka Kikinzoku's ceramic active solder (TKC
-710) with 3 × 4 × 0.05mm foil in between 1 × 10 ^-5 torr
The heating was performed by heating at 800 ° C. for 15 minutes in a vacuum.

Measurement of bonding strength is based on JIS-R1601, outer span 30mm
-It was performed by a four-point bending method with an inner span of 10 mm.

FIG. 1 shows the bonding strength and the variation when the finishing of the bonding surface is performed using various grindstones and changing the cutting depth.
The total finish grinding amount at this time is 150 μm.

Also, using a # 600 whetstone, setting the cutting depth to 3 μm and changing the total finishing grinding amount, the bonding strength and the dispersion
Shown in the figure.

In both cases shown in FIGS. 1 and 2, as rough cutting, 500 μm was cut with a # 100 grindstone at a cutting depth of 20 μm and then finished. The width of the vertical solid line at each point in FIGS. 1 and 2 indicates the maximum value and the minimum value (the magnitude of variation).

According to FIG. 1, when grindstones having a grain size of # 200 and # 2000 are used, the strength is reduced as compared with grindstones having a grain size of # 400, # 1000 and # 1500, and variations are observed. In addition, when the cut amount per operation is set to 6 μm or more, the strength is reduced and variation is observed as compared with the case where the cut amount is set to not more than 6 μm.

Further, according to FIG. 2, when the total grinding amount is 100 μm or less, the strength is similarly reduced and the variation is remarkable as compared with the case where the total grinding amount is more than 100 μm.

From the above experimental results, it is possible to increase the bonding strength by using a grindstone having a grain size of # 400 to # 1500, suppressing the amount of cut at one time to 6 μm or less, and setting the total grinding amount to 100 μm or more. It is remarkable, and it can be understood that the variation is improved.

[Effect] As described in detail above, the present invention uses a grindstone of # 400 to # 1500 to form a joint with a ceramic at a cutting depth of 6 times.
A pretreatment method that suppresses the thickness to less than μm and grinds more than 100 μm. This has the effect of significantly improving the bonding strength of the ceramic bonded body and also significantly reducing the variation, resulting in improved reliability. I do. This is expected to further expand the use of the ceramic joined body.

[Brief description of the drawings]

FIG. 1 is a diagram showing the bonding strength and the variation when finishing processing of the bonding surface is performed using various grindstones while changing the cutting depth. Fig. 2 shows the cutting depth of 3μm using # 600 whetstone.
It is a figure which shows the joining intensity | strength and dispersion | variation when performing finishing processing of a joining surface by changing the total finishing grinding amount.

Claims (1)

(57) [Claims] (1) The bonding surface of the ceramics is # 400 or more and # 150 or more.
A method for pre-treating ceramics for joining, characterized in that a grinding depth of 0 or less is used, a cutting depth per operation is reduced to 6 μm or less, and grinding is performed to 100 μm or more.