JP2932760B2 - Observation device for semiconductor chips - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for observing a semiconductor chip, in which an outer lead extending from a semiconductor chip is landed on a transparent landing body and observed by a camera.

[0002]

2. Description of the Related Art It is known as a so-called TAB method that a semiconductor chip is formed by mounting a semiconductor on a film carrier made of a synthetic resin such as polyimide and then punching the film carrier with a punching device. I have.

[0003] Bonding such a semiconductor chip to a substrate is generally referred to as outer lead bonding. In this outer lead bonding, a very small number of outer leads extending from a semiconductor at a very small pitch are attached to the substrate. Since the outer lead must be matched with the formed very fine electrode portion, the outer lead is observed in advance by a camera, and the position of the outer lead is precisely detected.

[0004]

The above-mentioned film carrier is managed by being wound around a reel. Therefore, the outer lead formed by punching the film carrier is bent, for example, by being curled. There are many.

[0005] Bonding of a semiconductor to a film carrier is generally called inner lead bonding. In this inner lead bonding, the inner leads of the film carrier are thermo-compressed to an electrode portion formed on the circuit surface of the semiconductor. In this case, thermal stress is generated and the lead is easily deformed. Reeds made from a film carrier in this manner are easily bent and deformed for various reasons.

FIG. 5 shows a state in which the outer lead L of the semiconductor chip P bent and deformed in this way is observed by the camera 100. Since the outer lead L is bent and deformed, its correct position is determined. The observation cannot be performed, and therefore, even if the semiconductor chip P is mounted on the substrate 101 based on the observation result, the outer leads L cannot be accurately matched with the electrode portions 102 of the substrate 101. Reference numeral 103 denotes a nozzle of the transfer head that sucks the semiconductor chip P.

Accordingly, an object of the present invention is to provide means for correctly observing a bent outer lead.

[0008]

SUMMARY OF THE INVENTION For this purpose, the present invention provides a transparent landing body for landing an outer lead of a semiconductor chip, and an illuminating body disposed openably and closably above the outer lead landing on the landing body. And a pressing portion that presses the outer lead against the landing body, and a camera that observes the outer lead pressed by the landing body, constitute a semiconductor chip observation device.

[0009]

In the above construction, the outer lead of the semiconductor chip is landed on the transparent landing plate and the illuminator is illuminated to correct its bending deformation and observed by the camera.

In this case, by pressing the outer lead against the landing body by the pressing portion, the bending deformation of the outer lead can be more positively corrected, and the outer lead can be correctly observed.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an apparatus for observing a semiconductor chip, wherein 1 is an XY comprising an X table 2 and a Y table 3.
A camera 6 is mounted via a micrometer 5 on a support plate 4 which is a table and extends from the Y table 3. The micrometer 5 moves the camera 6 up and down to adjust the focal length. MX and MY are an X motor and a Y motor.

Reference numeral 10 denotes a table plate provided on the upper side of the XY table 1. A bracket 13 is slidably mounted in the X direction on an upper surface of the XY table 1 via an X rail 11 and a slider 12. 14 is a cylinder and 15 is its rod. The tip of the rod 15 is connected to the bracket 13, and the bracket 13 slides in the X direction when the rod 15 moves forward and backward.

Reference numeral 20 denotes a landing stage mounted on the upper part of the bracket 13, on which a transparent plate-like landing body 21 such as a glass plate is mounted. This landing object 21
As described above, the cylinder 14 slides in the X direction due to the operation of the cylinder 14, moves forward above the camera 6, and retreats to the side.

In FIG. 1, reference numeral 22 denotes a landing stage 20.
A plate-like openable and closable illuminating body provided with a pair of left and right at an interval t above and is rotatably supported by a pin 24. 31 is a cylinder whose rod 3
2 is coupled to the illumination body 22 (see also FIG. 2). The lighting body 22 is formed of a translucent body such as glass,
An optical fiber 34 is connected to the back surface. 35 is a light source.

As shown in FIG. 3, when the rod 32 of the cylinder 31 projects, the illuminating body 22 rotates downward, and the outer lead L is brought into contact with the landing body by a pressing portion 22a integrally protruding from the distal end thereof. Press 21. Reference numeral 22b denotes a light leakage prevention coating portion, which is coated on the surface of the lighting body 22 except for the lower surface of the pressing portion 22a which is a light leakage surface.

Reference numeral 28 denotes a movable stage which moves in the X direction and carries the semiconductor chip P mounted thereon under the illuminator 22. 26 is a transfer head, 27 is a nozzle, P
Denotes a semiconductor chip, L denotes an outer lead formed by punching a film carrier, and C denotes a semiconductor which is formed on the outer lead L by inner lead bonding.

This observation apparatus has the above-described configuration. Next, an observation method will be described with reference to FIGS. 4 (a) to 4 (e).

With the landing stage 20 retreated to the side and the illuminating body 22 opened upward as shown in FIG. 2, the movable stage 28 moves forward, and the semiconductor chip P mounted thereon is moved to the camera. 6 (FIG. 4A).

Next, the transfer head 26 is moved to the movable stage 2.
8 and picks up the semiconductor chip P on the movable stage 28 by suction.
Departs to the side (FIG. 9B).

Next, when the rod 15 of the cylinder 14 projects, the landing body 21 is connected to the camera 6 and the semiconductor chip P.
(FIG. 3C), and then the nozzle 27 descends to land the outer lead L on the landing body 21 (the dashed line in FIG. 3C). Next, as described with reference to FIG. 3, the rod 32 of the cylinder 31 protrudes, thereby closing the illumination body 22 and pressing the outer lead L against the landing body 21 by the pressing portion 22a (FIG. 3D). ). Here, when the outer lead L lands on the landing body 21, its bending deformation is considerably corrected. However, by further pressing the pressing portion 22a, the bending deformation is more positively corrected, and the outer lead L is brought into a correct posture. Can be retained.

Next, the light source 35 is turned on, the light passes through the optical fiber 34, further passes through the illuminating body 22, and the pressing portion 22
Light leaks from a. Therefore, the outer leads L extending from the four sides of the semiconductor C through the landing body 21 while operating the XY table 1 to move the camera 6 in the XY directions.
Is observed from below (FIG. 4D). In this case, if the level of the landing body 21 is the same as the level of the substrate (not shown) on which the semiconductor chip P is mounted, the semiconductor chip P
Can be observed by the camera 6 in the same state as when mounted on the substrate.

Next, after the lighting body 22 is opened, the nozzle 27
Rises, the semiconductor chip P is transferred to the next process, and the rod 15 of the cylinder 14 is retracted, so that the landing body 21 retreats to the side (FIG. 9E).

The present invention is not limited to the above-described embodiment. For example, the semiconductor chip P is sucked to the nozzle 27 of the transfer head 26 without the intervention of the movable stage 28 and is directly landed on the landing body 21. The observation may be performed by the camera 6, the illumination body may be a surface light source body, and the light source 35 and the optical fiber 34 may not be necessary, or the illumination body may be opened and closed by performing a sliding operation or a vertical operation. .

[0025]

As described above, the present invention relates to a transparent landing body for landing an outer lead of a semiconductor chip, and an illuminating body arranged to be openable and closable above the outer lead landing on the landing body. Since a semiconductor chip observation device is constituted by a pressing portion that presses the outer lead against the landing body and a camera that observes the outer lead pressed by the landing body, bending of the outer lead extending from the semiconductor is bent. The deformation can be corrected and observed with a camera.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor chip observation device according to the present invention.

FIG. 2 is a side view during mounting according to the present invention.

FIG. 3 is a side view of the semiconductor chip according to the present invention during observation.

FIG. 4 is a side view for explaining an observation process according to the present invention.

FIG. 5 is a perspective view during observation by conventional means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Camera 21 Landing body 22 Illumination body 22a Pressing part L Outer lead P Semiconductor chip

Claims (2)

(57) [Claims] 1. A transparent landing body for landing an outer lead of a semiconductor chip, an illuminating body disposed openably and closably above the outer lead landing on the landing body, and pressing the outer lead against the landing body. And a camera for observing an outer lead pressed by the landing body. 2. An apparatus according to claim 1, wherein said pressing portion is provided integrally with said illuminating body.