JP2929934B2 - Lead thermocompression head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead thermocompression head for bonding a lead by pressing the lead against an electrode of a work.

[0002]

2. Description of the Related Art An electronic component mounting apparatus for mounting an electronic component on a substrate by bonding an outer lead of the electronic component to an electrode of a substrate, and bonding a lead adhered to a film carrier to a bump (protruding electrode) of a chip. In a lead bonding apparatus such as an inner lead bonding apparatus, a thermocompression bonding head is known as a bonding head for bonding leads such as an inner lead and an outer lead to electrodes of a work such as a substrate and a chip. Hereinafter, a conventional thermocompression bonding head will be described.

[0003] Figure 3 is a perspective view of the thermo-compression tool provided in the thermocompression bonding head of a conventional lead, 4 (a) is a front sectional view of the thermocompression bonding head of a conventional lead, FIG. 4 (b) the side section FIG. In FIG. 3 , the thermocompression bonding tool 1 is mainly composed of a box 3, and is provided with a flange 4 having a key-shaped cross section extending upward from the upper surface of two opposing sides of the box 3. Reference numeral 5 denotes a screw hole opened in the flange 4. The flange 4 is connected to the upper surface of the box body 3 through the neck detail 6, and both sides of the neck detail 6 are recessed portions 7.

[0004] In FIG. 4 (a), the thermocompression bonding head 8,
An insulator 10 is mounted on the lower surface of the main body 9, and the thermocompression bonding tool 1 shown in FIG. 3 is mounted on the lower surface of the insulator 10. The thermocompression bonding tool 1 is mounted by screwing a screw 11 into a screw hole 5. In FIG. 4 (b), the flange 4 is connected to a lead wire 17, the current supplied from the power source 18, flows through the thermo-compression tool 1 through the lead wire 17, the thermocompression bonding tool 1 is self by the internal resistance Fever. Reference numeral 12 denotes a chip, and bumps 13 are provided on the upper surface thereof. Reference numeral 14 denotes a table on which the chips 12 are placed. Reference numeral 15 denotes a film carrier, on the upper surface of which an inner lead 16 is adhered. Fig. 4 (a)
(B) shows a state in which the thermocompression bonding head 8 is lowered and the inner lead 16 is pressed against the bump 13 by the lower surface of the thermocompression bonding tool 1 for bonding. At this time, the thermocompression bonding tool 1 generates heat due to internal resistance.

[0005]

However, the conventional thermocompression bonding tool 1 has the following problems. That is, in FIG. 4 (a), the pressing force is applied to the vicinity of the center of the box 3 through the neck detail 6, so that both sides of the box 3 bend upward and rise as shown by the broken lines,
For this reason, a large pressing force F is applied to the center just below the neck detail 6.
1 is applied, but the pressing force F2 on both sides is reduced.

[0006] Similarly, in FIG. 4 (b), on both sides of the box 3 to be directly connected to the flange 4 and neck detail 6 A large pressing force F3 is applied, the upward convex so that the central portion is indicated by a broken line The pressing force F4 is reduced due to the curved shape.

As described above, in the conventional thermocompression bonding tool 1,
The pressing force varies in size between the center and both sides,
For this reason, all the inner leads 16 were not bonded to the bumps 13 with a uniform force, and bonding failure was likely to occur. 4 (a) and 4 (b),
The curved shape indicated by the broken line is exaggerated for easy understanding.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a thermocompression bonding head for a lead which can bond all leads to a work electrode with a uniform pressing force.

[0009]

SUMMARY OF THE INVENTION To this end, the present invention provides a thermocompression bonding method for a lead having a main body and a thermocompression bonding tool mounted on the lower surface of the main body and self-heating by a current supplied from a power supply. In the head, insert the thermocompression bonding tool into the box
Extending upward from the upper surface of the body and two opposing sides of the box.
With the flange attached to the lower surface of the
Extending upward from the center of the upper surface of the two opposite sides
The support portion is configured such that the end portion is in contact with the lower surface on the main body portion side .

[0010]

[0011]

In the above construction, the thermocompression bonding head is lowered,
The leads are pressed against the electrodes of the work for bonding. In this case, the pressing force applied to the leads from the lower surface of the box does not vary with location, the lower surface of the box maintains flatness, and all the leads are connected to one another. Bonding to the work electrode is possible with such a pressing force.

[0012]

Next, an embodiment of the present invention will be described with reference to the drawings. Figure 1 is a perspective view of the thermo-compression tool provided in the thermocompression bonding head of the real施例lead of the present invention, FIG. 2 Ru der side sectional view of the thermocompression bonding head of the lead.

[0013] In FIG. 2, the thermocompression bonding head 32, an insulator 10 is attached to the lower surface of the main body portion 9, a screw 11 the thermocompression bonding tool 30 shown in FIG. 1 to the lower surface of the insulator 10 to the screw hole of the flange 4 that it has been constructed by mounting screwed. Flange
4 is connected to a power supply 18 via a lead wire 17. When the current supplied from the power source 18 flows through the thermo-compression tool 30, the thermocompression bonding tool 30 is self-heated by the internal resistance. 12 is a chip, 13 is a bump, 14 is a table,
15 is a film carrier and 16 is an inner lead.
You.

[0014]

The shape structure of the thermo-compression tool 30, in that it has two struts 31 extending upward from the upper center portion of the two sides of the other opposing flange 4 is not provided, differs from the conventional thermal bonding tool 1 shown in FIG. The upper end surface of the support 31 contacts the lower surface of the insulator 10. The other configuration is the same as that of the conventional thermocompression bonding tool 1, and the description is omitted by attaching the same reference numerals.

In the above configuration, as shown in FIG. 2 , the thermocompression bonding head 32 is lowered, the lower surface of the thermocompression bonding tool 30 lands on the inner leads 16, and the inner leads 16 are pressed against the bumps 13 for bonding. In this case, since the column 31 is provided at the center of the other side where the flange 4 is not provided, the pressing force F on the main body 9 side is applied through the column 31. Therefore, the pressing force of the main body 9 is applied evenly to the four sides of the box 3 via the neck detail 6 and the column 31, and therefore, the box 3 does not bend, and the lower surface thereof is not bent. Since flat flatness is maintained, the pressing force F applied to the inner leads 16 from the four sides of the box body 3 is equal without any positional variation, and the inner leads 16 are bonded to the bumps 13 with the uniform pressing force F. Is done.

Although the above embodiment has been described by taking as an example the inner lead bonding in which the inner leads 16 are thermocompressed to the bumps 13 of the chip 12, the present invention is applicable to the thermocompression bonding of the outer leads of the electronic component to the electrodes of the substrate. It can also be applied to other thermocompression bonding heads.

[0018]

As described above, according to the lead thermocompression bonding head of the present invention, the bending of the thermocompression bonding tool when the thermocompression bonding tool is pressed against the lead is prevented, and the flatness of the lower surface of the thermocompression bonding tool is reduced. , And the leads can be bonded by thermocompression bonding to the electrodes of the work with a uniform pressing force without any positional variation.

[Brief description of the drawings]

1 is a perspective view of a thermocompression bonding tool provided in the thermocompression bonding head of the real施例lead of the present invention

Figure 2 is a side cross-sectional view of the thermocompression bonding head of the real施例lead of the present invention

FIG. 3 is a perspective view of a thermocompression bonding tool provided in a conventional thermocompression bonding head of a lead.

4A is a front sectional view of a conventional lead thermocompression bonding head, and FIG. 4B is a side sectional view of a conventional lead thermocompression bonding head.

[Description of Signs ] 3 Box 4 Flange 9 Body 12 Chip 13 Bump 16 Inner lead 18 Power supply 30 Thermo-compression tool 32 Thermo-compression head 31 Column

Claims (1)

(57) [Claims] 1. A lead thermocompression bonding head for bonding a lead by pressing the lead against an electrode of a work, comprising : a main body;
A thermocompression tool attached to the lower surface of the main body and self-heating by an electric current supplied from a power source, wherein the thermocompression tool moves upward from an upper surface of two opposite sides of the box; A flange extending from the flange attached to the lower surface of the main body, and a column extending upward from the center of the upper surface of the other two opposing sides and having an upper end abutting against the lower surface of the main body. A thermocompression bonding head for a lead.