JP2915750B2 - Ceramic heater with electrostatic chuck - Google Patents
Ceramic heater with electrostatic chuckInfo
- Publication number
- JP2915750B2 JP2915750B2 JP15223293A JP15223293A JP2915750B2 JP 2915750 B2 JP2915750 B2 JP 2915750B2 JP 15223293 A JP15223293 A JP 15223293A JP 15223293 A JP15223293 A JP 15223293A JP 2915750 B2 JP2915750 B2 JP 2915750B2
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- graphite
- linear expansion
- boron nitride
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Ceramic Products (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は静電チャック付セラミッ
クスヒーター、特には半導体プロセスにおける昇降温工
程に使用される静電チャック付セラミックスヒーターに
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic heater with an electrostatic chuck, and more particularly to a ceramic heater with an electrostatic chuck used in a temperature raising / lowering step in a semiconductor process.
【0002】[0002]
【従来の技術】半導体デバイスの製造工程における半導
体ウエハの加熱には、従来金属線を巻いたヒーターが使
用されていたが、これについてはセラミックス薄膜を発
熱体として使用したセラミックス一体型ヒーターの使用
も提案されている(特開平4-124076号公報参照)。ま
た、この半導体ウエハの加熱に当ってはヒーター上に半
導体ウエハを固定するために減圧雰囲気では静電チャッ
クが使用されているが、プロセスの高温化に伴なってそ
の材質が樹脂からセラミックスに移行されており(特開
昭52-67353号公報、特開昭59-124140 号公報参照)、ま
た最近ではこれらのセラミックスヒーターとセラミック
ス静電チャックを合体した静電チャック付セラミックス
ヒーターも提案されている(特開平4-358074号公報参
照)。2. Description of the Related Art Conventionally, a heater wound with a metal wire has been used for heating a semiconductor wafer in a semiconductor device manufacturing process. However, a ceramic integrated heater using a ceramic thin film as a heating element has also been used. It has been proposed (see Japanese Patent Application Laid-Open No. 4-124076). In addition, when heating the semiconductor wafer, an electrostatic chuck is used in a reduced pressure atmosphere to fix the semiconductor wafer on the heater, but the material changes from resin to ceramic as the temperature of the process increases. (See JP-A-52-67353 and JP-A-59-124140). Recently, a ceramic heater with an electrostatic chuck in which these ceramic heaters and a ceramic electrostatic chuck are combined has been proposed. (See Japanese Patent Application Laid-Open No. 4-358074).
【0003】[0003]
【発明が解決しようとする課題】しかし、この静電チャ
ック付セラミックスヒーターは、基材に窒化ほう素焼結
体を使用しており、これが静電チャック用電極および発
熱層としての熱分解グラファイトと熱膨張率が異なるた
めに、昇降温をくり返しているうちに熱応力によって層
の剥離やクラックの発生が起るという問題点がある。However, this ceramic heater with an electrostatic chuck uses a sintered body of boron nitride as a base material, which is composed of an electrode for the electrostatic chuck and pyrolytic graphite as a heat generating layer. Since the expansion rates are different, there is a problem that the layer is separated or cracks are generated by thermal stress while the temperature is repeatedly raised and lowered.
【0004】[0004]
【課題を解決するための手段】本発明はこのような不
利、問題点を解決した静電チャック付セラミックスヒー
ターに関するものであり、これはグラファイトからなる
基材上に、熱分解窒化ほう素からなる緩衝層を設け、そ
の上に熱分解グラファイトからなる静電チャック用電極
と熱分解グラファイトからなる発熱層を設け、さらにそ
の上に熱分解窒化ほう素からなる絶縁層を設けてなり、
該緩衝層の線膨張係数は、該基材と該電極および発熱層
の線膨張係数との間で徐々に変化させたものであり、か
つ基材に接する面ではこの線膨張係数に近似し、電極お
よび発熱層に接する面ではこれらの線膨張係数に近似さ
せたものであることを特徴とするものである。SUMMARY OF THE INVENTION The present invention relates to a ceramic heater with an electrostatic chuck which solves such disadvantages and problems, and comprises a substrate made of graphite and a substrate made of pyrolytic boron nitride. A buffer layer is provided, an electrode for electrostatic chuck made of pyrolytic graphite and a heating layer made of pyrolytic graphite are provided thereon, and an insulating layer made of pyrolytic boron nitride is further provided thereon ,
The coefficient of linear expansion of the buffer layer depends on the substrate, the electrode, and the heating layer.
Between the linear expansion coefficient of
The coefficient of linear expansion approximates the coefficient of
And the surface in contact with the heating layer
It is characterized in that those allowed.
【0005】すなわち、本発明者らは従来公知の静電チ
ャック付セラミックスヒーターの問題点を解決する方法
について種々検討した結果、この基材をグラファイトか
らなるものとしてこの上に熱分解窒化ほう素からなる緩
衝体を設けたものとしたところ、この熱分解窒化ほう素
からなる緩衝体の線膨張係数α3 が、基材としてのグラ
ファイトの線膨張係数α1 (4.0 ×10-6/℃)と静電チ
ャック用電極および発熱層としての熱分解グラファイト
の線膨張係数α2 (1.2 ×10-6/℃)の中間値(α1 >
α3 >α2 )となり、この緩衝体が基材と静電チャック
用電極、発熱層の間の熱応力を緩和するようになるの
で、半導体プロセスにおいて昇降温をくり返してもここ
に剥離やクラック発生などの不具合が生じなくなること
を見出し、これによれば半導体製造装置維持費の低減、
メンテナンス時間の短縮が可能となり、半導体製造コス
トを削減できることを確認して本発明を完成させた。以
下にこれをさらに詳述する。That is, the inventors of the present invention have conducted various studies on a method of solving the problems of the conventionally known ceramic heater with an electrostatic chuck. As a result, the base material was made of graphite and the pyrolytic boron nitride was formed thereon. When the buffer made of pyrolytic boron nitride is used, the coefficient of linear expansion α 3 of the buffer made of pyrolytic boron nitride is equal to the coefficient of linear expansion α 1 of graphite as a base material (4.0 × 10 −6 / ° C.) Intermediate value (α 1 ) of linear expansion coefficient α 2 (1.2 × 10 -6 / ° C) of pyrolytic graphite as electrode for electrostatic chuck and heat generating layer
α 3 > α 2 ), and this buffer relaxes the thermal stress between the base material, the electrode for the electrostatic chuck, and the heat generating layer. It has been found that problems such as occurrence will not occur, and this will reduce the cost of maintaining semiconductor manufacturing equipment,
The present invention has been completed by confirming that the maintenance time can be reduced and the semiconductor manufacturing cost can be reduced. This is described in more detail below.
【0006】[0006]
【作用】本発明は静電チャック付セラミックスヒーター
に関するものであり、これは前記したようにグラファイ
トからなる基材上に、熱分解窒化ほう素からなる緩衝体
を設け、その上に熱分解グラファイトからなる静電チャ
ック電極と発熱層を設け、さらにその上に熱分解窒化ほ
う素からなる絶縁層を設けてなることを特徴とするもの
であるが、このものは半導体プロセスに使用したときに
昇降温をくり返しても剥離やクラック発生などの不具合
が生じないので、半導体プロセスなどに有用とされると
いう有利性をもつものである。The present invention relates to a ceramic heater with an electrostatic chuck, as described above, in which a buffer made of pyrolytic boron nitride is provided on a base material made of graphite, and a buffer made of pyrolytic graphite is formed thereon. It is characterized by providing an electrostatic chuck electrode and a heat generating layer, and further providing an insulating layer made of pyrolytic boron nitride thereon. Even if the process is repeated, there is no problem such as peeling or cracking, so that it has an advantage that it is useful for a semiconductor process or the like.
【0007】本発明の静電チャック付セラミックスヒー
ターは、熱分解グラファイト薄膜を発熱体として使用す
るものであるが、これはグラファイトからなる基材の上
に熱分解窒化ほう素を緩衝体として設け、さらにこの上
に公知の方法で熱分解グラファイトからなる静電チャッ
ク用電極と発熱層および熱分解窒化ほう素からなる絶縁
層を設けたものとされる。The ceramic heater with an electrostatic chuck according to the present invention uses a pyrolytic graphite thin film as a heating element. In this method, pyrolytic boron nitride is provided as a buffer on a graphite base material. Furthermore, an electrostatic chuck electrode made of pyrolytic graphite, a heat generating layer, and an insulating layer made of pyrolytic boron nitride are provided thereon by a known method.
【0008】しかして、従来公知の静電チャック付セラ
ミックスヒーターでは、基材としての窒化ほう素焼結体
の線膨張係数α1 が-0.6×10-6/℃であり、静電チャッ
ク用電極および発熱層としての熱分解グラファイトの線
膨張係数α2 が 1.2×10-6/℃であることから、このも
のは半導体プロセスの熱処理における、例えば10-5Torr
の圧力下での 100〜 1,000℃の間の昇降温時をくり返し
ていると、30回位のくり返しで熱応力によって層が剥離
したり、クラックが発生するという事故が起っていた。However, in the conventionally known ceramic heater with an electrostatic chuck, the linear expansion coefficient α 1 of the boron nitride sintered body as the base material is −0.6 × 10 −6 / ° C. Since the thermal expansion coefficient α 2 of the pyrolytic graphite as the heat generating layer is 1.2 × 10 −6 / ° C., it can be used for heat treatment in a semiconductor process, for example, at 10 −5 Torr.
When the temperature was repeatedly raised and lowered between 100 and 1,000 ° C under the pressure of, the layer was peeled off or cracked due to thermal stress after about 30 repetitions.
【0009】しかるに、本発明によってこのグラファイ
トからなる基材の上に、上記したように熱分解窒化ほう
素からなる緩衝体を設けると、この熱分解窒化ほう素か
らなる緩衝体の線膨張係数α3 が 2.6×10-6/℃であ
り、これが上記した基材としてのグラファイトの線膨張
係数α1 (4.0 ×10-6/℃)と、静電チャック用電極お
よび発熱層としての熱分解グラファイトの線膨張係数α
2 (1.2 ×10-6/℃)との中間値となるので、これを半
導体プロセスの熱処理工程における昇降温にくり返し使
用したときに発生する熱応力による層の剥離、クラック
の発生が緩和されて、このような不利が回避されるとい
う有利性が与えられる。また、熱分解窒化ほう素の線膨
張係数α3 は反応条件の操作により内側から外側に向っ
てα1 からα2 へと徐々に変化させることがより好まし
い。However, when the buffer made of pyrolytic boron nitride is provided on the graphite base material according to the present invention as described above, the linear expansion coefficient α of the buffer made of pyrolytic boron nitride can be improved. 3 is 2.6 × 10 −6 / ° C., which is the linear expansion coefficient α 1 (4.0 × 10 −6 / ° C.) of the graphite as the base material and the pyrolytic graphite as the electrode for the electrostatic chuck and the heat generating layer Coefficient of linear expansion α
2 (1.2 × 10 -6 / ° C), which reduces the occurrence of layer peeling and cracking due to thermal stress generated when this is repeatedly used for temperature rise and fall in the heat treatment step of a semiconductor process. Advantageously, such disadvantages are avoided. More preferably, the linear expansion coefficient α 3 of the pyrolytic boron nitride is gradually changed from α 1 to α 2 from the inside to the outside by manipulating the reaction conditions.
【0010】なお、この場合における緩衝層を形成する
物質はその線膨張係数が基材の線膨張係数と静電チャッ
ク用電極および発熱層を形成する物質の線膨張係数との
中間値であるものとすればよいが、これは純度、絶縁性
および基材としてのグラファイト、静電チャック用電極
および発熱層としての熱分解グラファイトとの親和性の
面から、上記した熱分解窒化ほう素とすることが最も望
ましいものとされる。In this case, the material forming the buffer layer has a coefficient of linear expansion that is an intermediate value between the coefficient of linear expansion of the substrate and the coefficient of linear expansion of the material forming the electrode for the electrostatic chuck and the heat generating layer. However, from the viewpoint of purity, insulating properties and affinity with graphite as a base material, pyrolytic graphite as an electrode for an electrostatic chuck and a heat generating layer, the above pyrolytic boron nitride should be used. Is the most desirable.
【0011】[0011]
【実施例】つぎに本発明の実施例、比較例をあげる。 実施例 直径 200mmφ、厚さ5mmのグラファイトからなる円板上
の基材(線膨張係数 4.0×10-6/℃)を熱CVD反応装
置内に設置し、原料としてのアンモニアと三塩化ほう素
を反応温度 1,830℃、圧力10Torrで熱分解して、この基
材上に厚さ1mmの熱分解窒化ほう素からなる緩衝層を形
成させた。この緩衝層の線膨張係数は 2.5×10-6/℃で
あった。Next, examples of the present invention and comparative examples will be described. EXAMPLE A base material (linear expansion coefficient: 4.0 × 10 −6 / ° C.) on a disk made of graphite having a diameter of 200 mmφ and a thickness of 5 mm was placed in a thermal CVD reactor, and ammonia and boron trichloride were used as raw materials. Thermal decomposition was performed at a reaction temperature of 1,830 ° C. and a pressure of 10 Torr to form a buffer layer made of pyrolytic boron nitride having a thickness of 1 mm on the substrate. The coefficient of linear expansion of this buffer layer was 2.5 × 10 −6 / ° C.
【0012】ついで、これらの基材を熱CVD反応装置
内に設置し、反応温度 1,900℃、圧力5Torrでプロパン
ガスを熱分解し、生成した熱分解グラファイトを基材上
に厚さ50μmに堆積したのち、機械加工でこれを静電チ
ャック用電極とヒーター用発熱体に形成し、さらにこれ
を再度熱CVD反応装置内に設置し、反応温度 1,750
℃、圧力10Torrでアンモニアと三塩化ほう素を熱分解さ
せ、この上に熱分解窒化ほう素を 100μmの厚さに被覆
して絶縁層を形成させて、静電チャック付セラミックス
ヒーターを作製した。Next, these substrates were placed in a thermal CVD reactor, and propane gas was pyrolyzed at a reaction temperature of 1,900 ° C. and a pressure of 5 Torr, and the generated pyrolytic graphite was deposited on the substrate to a thickness of 50 μm. After that, this was formed into an electrode for electrostatic chuck and a heating element for heater by machining, and this was installed again in the thermal CVD reactor, and the reaction temperature was 1,750.
Ammonia and boron trichloride were thermally decomposed at 10 ° C. and a pressure of 10 Torr, and pyrolytic boron nitride was coated thereon to a thickness of 100 μm to form an insulating layer, thereby producing a ceramic heater with an electrostatic chuck.
【0013】つぎにこのようにして作った静電チャック
付セラミックスヒーターを装置に装着し、10-5Torr下で
100℃と 1,000℃との間で昇降温をくり返したが、これ
らにはそのいずれにもこの昇降温を 100回くり返しても
剥離、クラック発生などの異常は認められなかった。Next, the ceramic heater with the electrostatic chuck produced in this manner is mounted on the apparatus, and the apparatus is operated at 10 -5 Torr.
The temperature was repeatedly raised and lowered between 100 ° C. and 1,000 ° C., and none of them showed any abnormality such as peeling or cracking even when the temperature was repeated 100 times.
【0014】直径 200mmφ、厚さ5mmのグラファイトか
らなる円板状の基材(線膨張係数 4.0×10-6/℃)を熱
CVD反応装置内に設置し、原料としてのアンモニアと
三塩化ほう素を反応温度 1,850℃から10℃/hrの勾配で
下げながら5時間反応させ、1,800℃まで下げ、圧力10T
orrで熱分解して、この基材上に厚さ1mmの熱分解窒化
ほう素からなる緩衝層を形成させた。この緩衝層の線膨
張係数はグラファイトに接する面で 3.9×10-6/℃であ
り、外側に向かって連続的に減少し、外面では1.3×10
-6/℃であった。ついで、以下実施例1と同様に10-5To
rr下で 100℃と 1,000℃との間で昇降温をくり返した
が、これにはこれを 100回くり返した後も剥離、クラッ
クなどの異常は認められなかった。A disk-shaped substrate (linear expansion coefficient: 4.0 × 10 −6 / ° C.) made of graphite having a diameter of 200 mmφ and a thickness of 5 mm was placed in a thermal CVD reactor, and ammonia and boron trichloride were used as raw materials. At a reaction temperature of 1,850 ° C with a gradient of 10 ° C / hr for 5 hours.
By pyrolysis with orr, a buffer layer made of pyrolytic boron nitride having a thickness of 1 mm was formed on the substrate. The coefficient of linear expansion of this buffer layer is 3.9 × 10 −6 / ° C. on the surface in contact with graphite, and decreases continuously toward the outside.
−6 / ° C. Subsequently, 10 −5 To
The temperature was repeatedly increased and decreased between 100 ° C. and 1,000 ° C. under rr, and no abnormalities such as peeling and cracks were observed even after repeating the cycle 100 times.
【0015】比較例 比較のために、窒化ほう素焼結体からなる基材を使用し
たほかは実施例と同じように処理して静電チャック付セ
ラミックスヒーターを作成し、これについて実施例と同
じ試験を行なったところ、このものは昇降温を30回くり
返した時点で絶縁性被膜にクラックが発生した。Comparative Example For comparison, a ceramic heater with an electrostatic chuck was prepared in the same manner as in the example except that a substrate made of a boron nitride sintered body was used. As a result, cracks occurred in the insulating film when the temperature was repeatedly increased and decreased 30 times.
【0016】[0016]
【発明の効果】本発明は静電チャック付セラミックスヒ
ーターに関するものであり、これは前記したようにグラ
ファイトからなる基材上に、熱分解窒化ほう素からなる
緩衝層を設け、その上に熱分解グラファイトからなる静
電チャック用電極と熱分解グラファイトからなる発熱層
を設け、さらにその上に熱分解窒化ほう素からなる絶縁
層を設けてなることを特徴とするものであるが、このも
のはグラファイトからなる基材の上に、熱分解窒化ほう
素からなる緩衝層を設けたもので、この熱分解窒化ほう
素からなる緩衝層の線膨張系数値がグラファイトからな
る基板の線膨張係数値と熱分解グラファイトからなる静
電チャック用電極、発熱層の線膨張係数値の中間になる
ので、これを半導体プロセスの熱処理に使用したときの
くり返しの昇降温により発生する熱応力が緩和され、こ
のものは数多くの昇降温のくり返しでも層が剥離した
り、クラックが発生するという不具合が解決されるとい
う有利性をもつものになる。The present invention relates to a ceramic heater with an electrostatic chuck, as described above, in which a buffer layer made of pyrolytic boron nitride is provided on a graphite base material, and a pyrolytic boron nitride is formed thereon. An electrode for graphite chuck made of graphite and a heating layer made of pyrolytic graphite are provided, and an insulating layer made of pyrolytic boron nitride is further provided on the heating layer. A buffer layer made of pyrolytic boron nitride is provided on a base material made of pyrolytic boron nitride. The linear expansion coefficient of the buffer layer made of pyrolytic boron nitride is Electrode for electrode for electrostatic chuck made of decomposed graphite and the coefficient of linear expansion of the heating layer are in the middle, so when this is used for heat treatment in semiconductor process, repeated temperature rise and fall Is thermal stress relieving to be more generated, this compound peeled off a number of repeated but the layer of heating and cooling, the one with the advantage that defect is resolved that cracks are generated.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01L 21/324 H01L 21/324 Q H02N 13/00 H02N 13/00 D (56)参考文献 特開 平5−129210(JP,A) 特開 平4−34953(JP,A) 特開 昭59−124140(JP,A) (58)調査した分野(Int.Cl.6,DB名) H01L 21/68 ──────────────────────────────────────────────────の Continuation of the front page (51) Int.Cl. 6 Identification symbol FI H01L 21/324 H01L 21/324 Q H02N 13/00 H02N 13/00 D (56) References JP-A-5-129210 (JP, A) JP-A-4-34953 (JP, A) JP-A-59-124140 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H01L 21/68
Claims (1)
窒化ほう素からなる緩衝層を設け、その上に熱分解グラ
ファイトからなる静電チャック用電極と熱分解グラファ
イトからなる発熱層を設け、さらにその上に熱分解窒化
ほう素からなる絶縁層を設けてなり、該緩衝層の線膨張
係数は、該基材と該電極および発熱層の線膨張係数との
間で徐々に変化させたものであり、かつ基材に接する面
ではこの線膨張係数に近似し、電極および発熱層に接す
る面ではこれらの線膨張係数に近似させたものであるこ
とを特徴とする静電チャック付セラミックスヒーター。A buffer layer made of pyrolytic boron nitride is provided on a graphite base material, and an electrostatic chuck electrode made of pyrolytic graphite and a heating layer made of pyrolytic graphite are provided thereon. An insulating layer made of pyrolytic boron nitride is provided thereon , and the buffer layer has a linear expansion.
The coefficient is the coefficient of linear expansion between the substrate, the electrode and the heat generating layer.
The surface that is gradually changed between and is in contact with the substrate
In this example, the coefficient of linear expansion is approximated,
A ceramic heater with an electrostatic chuck, characterized in that the coefficient of thermal expansion approximates these linear expansion coefficients .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15223293A JP2915750B2 (en) | 1993-06-23 | 1993-06-23 | Ceramic heater with electrostatic chuck |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15223293A JP2915750B2 (en) | 1993-06-23 | 1993-06-23 | Ceramic heater with electrostatic chuck |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07153824A JPH07153824A (en) | 1995-06-16 |
JP2915750B2 true JP2915750B2 (en) | 1999-07-05 |
Family
ID=15535979
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15223293A Expired - Fee Related JP2915750B2 (en) | 1993-06-23 | 1993-06-23 | Ceramic heater with electrostatic chuck |
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JP (1) | JP2915750B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2720381B2 (en) * | 1995-10-03 | 1998-03-04 | アドバンス・セラミックス・インターナショナル コーポレーション | Method for producing pyrolytic boron nitride molded article having arbitrary electric resistivity |
JP2016102232A (en) * | 2014-11-27 | 2016-06-02 | 信越化学工業株式会社 | Pyrolytic boron nitride coated substrate and production method thereof |
-
1993
- 1993-06-23 JP JP15223293A patent/JP2915750B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07153824A (en) | 1995-06-16 |
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