JP2911530B2 - PTC element using low-temperature PTC material - Google Patents
PTC element using low-temperature PTC materialInfo
- Publication number
- JP2911530B2 JP2911530B2 JP5059390A JP5059390A JP2911530B2 JP 2911530 B2 JP2911530 B2 JP 2911530B2 JP 5059390 A JP5059390 A JP 5059390A JP 5059390 A JP5059390 A JP 5059390A JP 2911530 B2 JP2911530 B2 JP 2911530B2
- Authority
- JP
- Japan
- Prior art keywords
- ptc
- temperature
- low
- parts
- ptc material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 25
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 6
- 230000007774 longterm Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は、有機PTC材料、特に自己温度制御型発熱体
や電子回路の過電流保護素子（サーミスタ等）として用
いられる低温型PTC材料からなるPTC素子の改良に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention comprises an organic PTC material, particularly a low-temperature PTC material used as a self-temperature control type heating element or an overcurrent protection element (such as a thermistor) for an electronic circuit. It relates to the improvement of PTC elements.
＜従来の技術＞ 従来、有機系のPTC材料には、導電性付与材としてカ
ーボンブラック、グラファイト、金属粒子等を使い、ま
たベース樹脂としては結晶性樹脂、例えばポリエチレン
に代表されるポリオレフィン、弗素樹脂等を使用し、こ
れらの混和物を目的の形状に成形した後、電極、リード
線等を取付けて、上記発熱体や保護素子などのPTC素子
を製造していた。<Prior art> Conventionally, organic PTC materials use carbon black, graphite, metal particles, etc. as a conductivity-imparting material, and as a base resin, a crystalline resin, for example, a polyolefin represented by polyethylene, a fluorine resin, etc. After forming these admixtures into a desired shape by using the above-mentioned method, PTC elements such as the above-mentioned heating elements and protection elements were manufactured by attaching electrodes, lead wires and the like.
＜発明が解決しようとする課題＞ しかし、これらの発熱体や保護素子などのPTC素子に
通電したとき、ベース樹脂材料によっては、成形体自体
がかなりの高温となる場合がある。<Problems to be Solved by the Invention> However, when power is applied to the PTC elements such as the heating elements and the protection elements, depending on the base resin material, the molded article itself may be at a considerably high temperature.
つまり、この成形体の昇温は、一般に、用いられる樹
脂の融点や軟化点と深く関係し、高融点の樹脂や軟化点
の高い樹脂にあっては、それだけ通電時の温度も高くな
る傾向にあるからである。In other words, the temperature rise of this molded body is generally closely related to the melting point and softening point of the resin used, and in the case of a resin having a high melting point or a resin having a high softening point, the temperature during energization tends to increase accordingly. Because there is.
ところが、これらの成形体からなるPTC素子は電気部
品等として用いられ、電気機器や電子製品等の内部等に
組み込まれることが多いため、あまり高温となると、周
囲の他の部品等に悪影響を与えたり、あるいはその部品
自体の破壊を招いたりする恐れがある。ときには発火の
危険もある。However, PTC elements made of these compacts are used as electrical components and are often incorporated into electrical equipment and electronic products, etc. Or the parts themselves may be destroyed. Sometimes there is a risk of fire.
また、これらのPTC素子の成形時、上述のように電極
を設けるわけであるが、この電極との密度（接着）が悪
いと、PTC材料と電極との間で接触抵抗が発生し、所望
の素子抵抗が得られ難いという問題もある。さらに、長
期間使用していると、この接触抵抗が徐々に上昇してい
くという問題があることも分かった。When molding these PTC elements, electrodes are provided as described above. However, if the density (adhesion) with the electrodes is poor, contact resistance occurs between the PTC material and the electrodes, and a desired resistance is obtained. There is also a problem that it is difficult to obtain element resistance. Further, it has been found that there is a problem that the contact resistance gradually increases when the device is used for a long time.
本発明は、このような従来の問題点に鑑みてなされた
もので、その目的とする点は、上昇温度が低く、電極と
の密着性が長期に亙って優れた低温型のPTC材料を用い
たPTC素子を提供するにある。The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a low-temperature PTC material that has a low rise temperature and excellent adhesion to electrodes over a long period of time. To provide the used PTC element.
＜課題を解決するための手段＞ かゝる本発明の要旨は、発熱部を、極性基を有すると
共にエポキシ基を有し、かつ融点が120℃以下である結
晶性ポリマー100重量部と導電性付与材５〜150重量部と
からなる低温型PTC材料の形成体で構成すると共に、当
該発熱部に金属製電極を密着させて設けたことを特徴と
するPTC素子にある。<Means for Solving the Problems> The gist of the present invention is as follows. The heat generating portion is composed of 100 parts by weight of a crystalline polymer having a polar group and an epoxy group, and having a melting point of 120 ° C. or less. A PTC element characterized by comprising a formed body of a low-temperature PTC material comprising 5 to 150 parts by weight of an application material, and a metal electrode provided in close contact with the heat generating portion.
ここで、用いられる、結晶性ポリマーの極性基とは、
例えば−OH、−COOH、−COOCH3、−COOC2H5、−OCH3等
で、エポキシ基とは のような構造を持った系を指し、また、その120℃以下
とする融点も、好ましくは100℃以下がよい。Here, the polar group of the crystalline polymer used is
For example -OH, -COOH, -COOCH 3, -COOC 2 H 5, with -OCH 3 or the like, and an epoxy group And a melting point of 120 ° C. or lower, preferably 100 ° C. or lower.
このようなポリマーとしては、例えば住友化学工業社
製、ボンドファースト等が挙げられる。Examples of such a polymer include Bond First manufactured by Sumitomo Chemical Co., Ltd.
このベースポリマーに添加される導電性付与材として
は、カーボンブラック、グラファイト、金属粒子等が挙
げられ、その配合量は、結晶性ポリマー100重量部に対
して５〜150重量部程度とするとよい。Examples of the conductivity-imparting material added to the base polymer include carbon black, graphite, metal particles, and the like, and the compounding amount is preferably about 5 to 150 parts by weight based on 100 parts by weight of the crystalline polymer.
その理由は、５重量部未満では所望の導電性が得られ
ず、また150重量部を越えると、好ましいPTC特性が得ら
れず、さらに樹脂の機械的特性が劣化する等の問題があ
るからである。The reason is that if the amount is less than 5 parts by weight, desired conductivity cannot be obtained, and if it exceeds 150 parts by weight, preferable PTC characteristics cannot be obtained, and furthermore, there are problems such as deterioration of mechanical characteristics of the resin. is there.
なお、この本発明で用いるPTC材料には、通常この種
の材料に添加される他の添加剤を必要により適宜添加す
ることができる。The PTC material used in the present invention may optionally contain other additives which are usually added to this type of material, if necessary.
このようにして得られたPTC材料を用いて製造したPTC
素子としての過電流保護素子（例えばサーミスタ）の一
例を示すと、第１図の如くで、図中、１はPTC材料層、2
a,2bはこのPTC材料層１の両面に密着（接着）して設け
た電極である。PTC manufactured using the PTC material thus obtained
An example of an overcurrent protection element (eg, a thermistor) as an element is as shown in FIG. 1, where 1 is a PTC material layer, 2
Reference numerals a and 2b denote electrodes provided in close contact (adhesion) on both surfaces of the PTC material layer 1.
＜作用＞ 例えば、この過電流保護素子において、先ず、ベース
樹脂の融点が120℃以下と低いため、通電時の昇温も、9
0℃程度と低く抑えられる。また、極性基を有するた
め、電極金属、例えば銅板等との接着性がよく、接触抵
抗が小さく抑えられる。さらに、エポキシ基をも有する
ため、長期的な使用後にあっても、接触抵抗の増大が効
果的に抑えられる。その理由としては、エポキシ基含有
樹脂は熱硬化型で、しかも耐熱性が高いことに起因する
と、推測される。<Operation> For example, in this overcurrent protection element, first, since the melting point of the base resin is as low as 120 ° C. or less, the temperature rise during energization is 9%.
It can be kept as low as about 0 ° C. In addition, since it has a polar group, it has good adhesion to an electrode metal, for example, a copper plate, and the contact resistance can be kept low. Furthermore, since it also has an epoxy group, an increase in contact resistance can be effectively suppressed even after long-term use. The reason is presumed to be that the epoxy group-containing resin is a thermosetting resin and has high heat resistance.
＜実施例＞ 第１表に示した配合のともで、本発明に係る低温型PT
C材料と、通常のPTC材料を用いて、夫々第１図に示した
如き過電流保護素子を製造した（実施例１〜２、比較例
１〜２）。<Example> A low-temperature PT according to the present invention with the composition shown in Table 1.
Using the C material and the ordinary PTC material, overcurrent protection elements as shown in FIG. 1 were manufactured (Examples 1 and 2 and Comparative Examples 1 and 2).
上記第１表から、本発明の実施例に係る過電流保護素
子は、発熱温度は低く、また電極との接触抵抗も小さ
く、かつ長期に亙って安定していることが分かる。これ
に対して、通常のPTC材料も用いた比較例では、発熱温
度が高く、かつ電極との接触抵抗も大きく、さらに長期
安定性に欠けることが分かる。 From Table 1 above, it can be seen that the overcurrent protection element according to the embodiment of the present invention has a low heat generation temperature, a small contact resistance with an electrode, and is stable for a long period of time. On the other hand, in the comparative example using the ordinary PTC material, the exothermic temperature is high, the contact resistance with the electrode is large, and the long-term stability is poor.
なお、上記実施例では、過電流保護素子について説明
したが、本発明の低温型PTC材料を用いたPTC素子は、こ
の用途に限定されるものではなく、自己温度制御型発熱
体や、その他の種々のものに使用できるものである。Although the overcurrent protection element has been described in the above embodiment, the PTC element using the low-temperature PTC material of the present invention is not limited to this application, and includes a self-temperature control heating element and other elements. It can be used for various things.
＜発明の効果＞ 以上の説明から明らかなように本発明によれば、通電
時の温度上昇が低く、また電極との接触抵抗が小さく、
さらにこの接触抵抗の長期安定性にも優れ、自己温度制
御型発熱体や過電流保護素子等に用いて有用な低温型PT
C材料を用いたPTC素子を提供することができる。<Effects of the Invention> As is clear from the above description, according to the present invention, the temperature rise during energization is low, the contact resistance with the electrode is small,
Furthermore, it has excellent long-term stability of this contact resistance, and is useful as a low-temperature type PT that is useful for self-temperature control type heating elements and overcurrent protection elements.
A PTC element using a C material can be provided.
第１図は本発明に係る低温型PTC材料を用いたPTC素子の
一実施例を示した縦断面図である。図中、 １……低温型PTC材料の成形体からなる発熱部、 2a,2b……電極、FIG. 1 is a longitudinal sectional view showing one embodiment of a PTC element using a low-temperature PTC material according to the present invention. In the figure, 1... A heating portion made of a molded body of a low-temperature PTC material, 2a, 2b.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−60701（ＪＰ，Ａ) 特開 平２−33881（ＪＰ，Ａ) 実開 昭63−187302（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01C 7/02 - 7/22 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-60-60701 (JP, A) JP-A-2-33881 (JP, A) JP-A-63-187302 (JP, U) (58) Field (Int.Cl. 6 , DB name) H01C 7/02-7/22
Claims (1)
基を有し、かつ融点が120℃以下である結晶性ポリマー1
00重量部と導電性付与材５〜150重量部とからなる低温
型PTC材料の形成体で構成すると共に、当該発熱部に金
属製電極を密着させて設けたことを特徴とするPTC素
子。1. A crystalline polymer having a heat generating portion, which has a polar group and an epoxy group, and has a melting point of 120 ° C. or less.
A PTC element comprising a formed body of a low-temperature PTC material comprising 00 parts by weight and 5 to 150 parts by weight of a conductivity-imparting material, and a metal electrode provided in close contact with the heat generating portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5059390A JP2911530B2 (en) | 1990-03-01 | 1990-03-01 | PTC element using low-temperature PTC material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5059390A JP2911530B2 (en) | 1990-03-01 | 1990-03-01 | PTC element using low-temperature PTC material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03252101A JPH03252101A (en) | 1991-11-11 |
| JP2911530B2 true JP2911530B2 (en) | 1999-06-23 |
Family
ID=12863271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5059390A Expired - Fee Related JP2911530B2 (en) | 1990-03-01 | 1990-03-01 | PTC element using low-temperature PTC material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2911530B2 (en) |
-
1990
- 1990-03-01 JP JP5059390A patent/JP2911530B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03252101A (en) | 1991-11-11 |
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