JP2908329B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly, to an IC socket to which a pin grid array (PGA) type IC is attached and detached.

[0002]

2. Description of the Related Art A conventional IC socket will be described in detail with reference to the drawings.

FIG. 4 is an exploded perspective view showing an example of the related art. The IC socket shown in FIG. 4 mounts a pin grid array type IC 10 on a plate 11 (inserting pins of the IC into holes of the plate 11), and mounts the IC 10 on a socket 12. In order to remove the IC 10 from the socket 12, the arm 13 is pulled up while the arm 13 is tilted, the hemispherical piece 14 in the socket 12 is rotated, and the plate 11 is pushed up.
Pull C10 out of socket 12. (See, for example, Japanese Utility Model Laid-Open No. 4-27594)

In the above-mentioned conventional IC socket, the pins of the IC are directly inserted into the contacts of the socket.
Since it is in close contact so as not to cause poor contact, a large force is required for insertion and removal, especially when pulling out, there is a drawback that an arm using the principle of leverage must be attached to the socket. .

[0004]

According to a first aspect of the present invention, there is provided an IC socket having a structure in which the mechanical resistance of a contact to an IC pin is reduced to zero when the IC socket is inserted or removed.
A lower plate having a recess at a location corresponding to the pin of the IC; a spring fitted into the bottom of the recess; a contact inserted into the spring and normally open due to its own elasticity; An upper plate having a convex portion for compressing the spring and having a space for accommodating the contact at the center of the convex portion.
An IC socket characterized in that:

[0005]

[0006]

Next, the present invention will be described in detail with reference to the drawings.

FIGS. 1 and 2 are sectional views showing a first embodiment of the present invention. FIG. 1 shows the state when the IC is inserted and removed, and FIG.
Indicates a state of use in which electrical contact has been achieved after IC insertion. The IC socket shown in FIG. 1 has a lower plate 5 provided with a concave portion 5a at a position corresponding to the IC pin, in an IC socket having a structure in which the mechanical resistance of a contact to the pin of the IC during insertion and removal is zero. A spring 8 fitted into the bottom of the recess 5a, a contact 9 inserted into the spring 8 and normally open due to its own elasticity;
An upper plate 3 having a convex portion 3a for entering the concave portion 5a and compressing the spring 8 and having a space for accommodating the contact 9 at the center of the convex portion 3a.

When the upper plate 3 is pushed down and is in contact with the lower plate 5, the spring 8 is compressed, so that the upper portion of the contact 9 is fully opened and the pin of the IC can be received without resistance. When the force pushing down the upper plate 3 is removed, the spring 8 expands as shown in FIG. 2, the protrusion 3a rises, closes the upper part of the contact 9, and grips the pin 2 of the IC1. When the upper plate 3 is pushed down, the IC 1 can be easily removed.

FIG. 3 is a sectional view showing a second embodiment of the present invention. A spring 81 is set horizontally on the lower plate 51, and the upper part of the contact 91 is closed by the spring 81 so that the pin 2 is gripped. When the upper plate 3 is moved in the direction of arrow A, the spring 81 is compressed, the force applied to the contact 91 is eliminated, and the upper portion of the contact 91 is opened by its own elasticity, so that the IC 1 can be easily inserted and removed. That is, the contact 9 shown in FIG.
Contact for contacts 91 with similar characteristics
If you do not give the act (power) of closing to
The tact 91 is in an open state. Contact 9
The upper plate 3 closes the contact 9 as shown in FIG.
However, in FIG. 3, the spring 81 is directly connected to the contact 9.
The act of closing (power) is given by 1.

[0010]

According to the IC socket of the present invention, a spring for applying a force for closing a contact and an upper plate capable of moving in the direction of compressing the spring are added, so that a pull-out arm is not necessary, and a machine for inserting and removing the IC socket is provided. This has the effect of reducing the mechanical resistance to zero.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a first embodiment (at the time of insertion and removal) of the present invention.

FIG. 2 is a cross-sectional view showing the first embodiment (when used) of the present invention.

FIG. 3 is a sectional view showing a second embodiment (in use) of the present invention.

FIG. 4 is an exploded perspective view showing an example of the related art.

[Explanation of symbols]

 1 IC 2 pin 3 upper plate 4 hole 5 lower plate 7 lead 8 spring 9 contact

Claims (1)

(57) [Claims] 1. An IC socket having a structure in which the mechanical resistance of a contact to an IC pin is reduced to zero when the IC is inserted and removed, a lower plate having a recess at a location corresponding to the IC pin, and a bottom portion of the recess. A spring inserted therein, a contact inserted into the spring, which is normally open due to its own elasticity, and a space for receiving the contact in the center of the protrusion having a protrusion which enters the recess and compresses the spring. And an upper plate having: