JP2904899B2 - Adhesive sheet supply device for IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to an adhesive sheet supply device for an IC card used for producing an IC card.

(Prior Art) In recent years, various studies have been made on chip cards, memory cards, microcomputer cards, or IC cards called electronic cards on which IC chips such as microcomputers and memories are mounted.

Such an IC card, compared to a conventional magnetic card,
Because of its large storage capacity, it is planned to store the history of savings and deposits instead of the bankbook in the case of banks and the history of transactions such as shopping in the case of credits.

As shown in FIG. 9, the IC card 1 has an IC module 3 on which an IC chip is mounted and a concave portion for mounting the IC module.
2a is formed with the card 2. Also IC
A primer 4 is applied to the back surface of the module 3, and an adhesive sheet 5 is disposed in the recess 2 a of the card 2. In addition, the shape of the adhesive sheet 5 has a size such that the adhesive sheet 5 is arranged on the intermediate step portion 7 in the concave portion 2a.

By the way, in the IC card 1 as shown in FIG. 9, first, a primer is applied to the back surface of the IC module 3, the adhesive sheet 5 is mounted in the recess 2a formed in the card 2, and then the recess is formed.
The IC module 3 is mounted on the adhesive sheet 5 of 2a, and the IC module 3 is assembled by heating and pressing.

However, it is a fact that such an IC card assembling process is conventionally performed manually by a human.

(Problems to be Solved by the Invention) As described above, the assembling of the IC card is manually performed, and it takes a long time.

Therefore, it is conceivable to automatically assemble the IC card.

When automatically assembling an IC card, it is conceivable to arrange the cards in which recesses have been formed in advance on the assembly table, and to automatically perform the assembly work conventionally performed manually while the assembly table is rotating. Have been. In particular, in the assembling work, it is important to quickly and accurately mount an adhesive sheet of a predetermined shape in the recess of the card in assembling a highly accurate IC card.

The present invention has been made in view of such a point, and an object of the present invention is to provide an adhesive sheet supply device that can quickly and accurately mount an adhesive sheet having a predetermined shape in a card recess.

[Configuration of the invention]

(Means for Solving the Problems) The present invention includes a punching device for punching an adhesive sheet material sent from a supply roll to a take-up roll, wherein the punching device includes a punching female blade, a punching male blade, And an adsorbent provided on the punching female blade side and in contact with the adhesive sheet material. The adsorbent adsorbs the punched adhesive sheet and attaches the adhesive sheet to an IC.
An IC card adhesive sheet supply device which is mounted in a recess of a card for card assembly.

(Operation) The adhesive sheet material sent from the supply roll to the take-up roll is punched into a predetermined shape between a punching female blade and a punching male blade, and the punched adhesive sheet is adsorbed by an adsorbent. The adhesive sheet is attached to the recess of the IC card assembling card by the body.

(Example) Hereinafter, an example of the present invention is described with reference to drawings.

1 to 9 show an embodiment of the present invention.

First, the entire IC card assembling apparatus will be described with reference to FIGS.

1 and 6, an IC card assembling apparatus 10 includes a module table 12 in which IC modules 3 each having a rear surface facing upward are sequentially arranged and rotated, and an assembly table 14 in which cards 2 are sequentially arranged and rotated. It has.

On the right side of the module table 12, a tray 18 in which a large number of IC modules 3 are stored in advance is provided.
Between the module 18 and the module table 12, a module take-out device 20 for taking out the IC module 3 in the tray 18 and placing it on the module table 12 is provided. The module table 12 is provided with a primer coating device 22 for coating a primer on the back surface of the IC module 3.

Further, between the module table 12 and the assembly table 14, the IC modules 3 are sequentially nested (mounting table) 62a, 62b.
b, 62c, a module transfer device 26 for drying the primer applied to the module 3, a reversing device 24 for reversing the IC module 3 transferred by the module transfer device 26 by 180 °, and an IC module 3 is an assembly table
Module supply devices 25 for supplying the card 2 on the card 14 and mounting the IC module 3 in the recess 2a of the card 2 are provided.

On the other hand, on the left side of the assembly table 14, a card stocker 38
Supplies the stored card 2 to the assembly table 14 side, and discharges the IC card 1 assembled by the assembly table 14 to the discharge conveyor 40 side.
Are arranged.

Further, the assembly table 14 includes an adhesive sheet supply device 28 according to the present invention for mounting the adhesive sheet 5 having a predetermined shape in the recess 2a of the card 2 on the downstream side (downstream in the rotational direction) of the card supply / discharge device 36. It is arranged. The adhesive sheet supply device 28 will be described later.

Further, on the downstream side of the adhesive sheet supply device 28, a concave portion is provided.
A module supply device 25 for mounting the IC module 3 on the adhesive sheet 5 in the inside 2a, a heating device 30 for heating and pressing the IC module 3 provided in the recess 2a from above, and a cooling device for cooling the IC module 3 In addition to performing a peeling inspection of the IC module 3 from the card 2 and the defective IC card 1
And an NG discharging device 34 for sequentially discharging the gas to the outside. Among them, the peeling inspection device 34 is for inspecting whether the terminal surface of the IC module 3 is attracted and peeled with a constant force to obtain a predetermined adhesive strength.

Next, an IC card adhesive sheet supply apparatus according to the present invention will be described in detail with reference to FIGS.

As shown in FIG. 7, the adhesive sheet supply device 28
An opening device 70 for previously forming a small opening is provided in the belt-like adhesive sheet material 85 sent from the supply roll 58 to the take-up roll 52 shown in FIG. 6 and FIG. Further, the adhesive sheet supply device 28 is provided with a punching device 80 for punching around the opening of the belt-shaped adhesive sheet material 85 on the downstream side of the opening device 70.

Subsequently, the opening device 70 will be further described with reference to FIG.

The opening device 70 has an opening female blade 71 disposed above the adhesive sheet material 85 and an opening male blade 72 disposed below the adhesive sheet 85 so as to be movable in the vertical direction.

A suction pipe 73 is fixed to the upper part of the open female blade 71. The suction pipe 73 is for sucking an opening residue (not shown) generated when an opening is formed in the adhesive sheet material 85 and discharging the same to the outside.

On the other hand, the punching device 80 has a punching female blade 81 disposed above the adhesive sheet material 85 and a punching male blade 82 movably disposed vertically below the adhesive sheet material 85. doing.

In addition, the punching female blade 81 has an adsorbent body having an adsorbing surface at a lower end.
56 is provided so as to be movable vertically. This adsorbent
Reference numeral 56 denotes a device for adsorbing the adhesive sheet 5 punched in a predetermined shape from the adhesive sheet material 85 on the adsorbing surface, and thereafter mounting the adhesive sheet 5 in the recess 2a of the card 2 on the assembly table 12.

The outer periphery of the opening male blade 72 and the punching male blade 82 has an adhesive sheet material between the opening female blade 71 and the lower end surface of the punching female blade 81.
A pressing body 75 that presses and holds 85 is provided.

The opening male blade 72 and the punching male blade 82 described above are both fixed to the drive base 90, and the pressing body 75 is attached to the drive base 90 via a spring 76.

Next, the operation of the present embodiment having such a configuration will be described.

First, many IC modules 3 stored in the tray 18
Are picked up and taken out by the module take-out device 20, and then the IC modules 3 are sequentially arranged on the module table 12. In this case, the IC module 3 is arranged with the back side (the side to which the primer is applied) facing upward, and when the four directions of the IC module 3 are A, B, C, and D directions, the D direction is outward. It is arranged toward.

Subsequently, the primer 4 is applied to the part of the IC module 3 that is in contact with the adhesive sheet 5 on the back side of the IC module 3 by the primer applying device 22. The primer 4 is made of a polyurethane resin or the like as described above, and improves the adhesion state between the IC module 3 and the adhesive sheet 5 made of unsaturated polyester or the like.

Next, the IC module 3 reaches the position of the module transfer device 26 (FIG. 1). And this module transfer device
26, IC module 3 on module table 12
Are sequentially transferred to the nests 62a, 62b, 62c on the side of the module table 12. As described above, the primer 4 applied to the IC module 3 can be dried while being sequentially transferred to the nests 62a, 62b, 62c.

Next, the IC module 3 that has reached the final nest 62c is inverted by 180 ° by the reversing device 24, and sent to the module supply device 25 side with the front side facing upward. Subsequently, the IC module 3 with the front side facing upward is supplied to the module supply device 25.
Is held by suction. Then, in this state, the IC module 3 is mounted in the recess 2a of the card 2 on the assembly table 14 (FIGS. 1 and 4).

On the other hand, the card 2 housed in the card stocker 38 and having the concave portion 2a formed in advance is arranged on the assembly table 14 by the card supply / discharge device 36.

Next, the card 2 placed on the card placement table 52 reaches the adhesive sheet supply device 28, in which the adhesive sheet 5 having the central opening 5a is arranged in the concave portion 2a of the card 2. You.

The operation of the adhesive sheet supply device 28 will be described in detail below.

First, the adhesive sheet material 85 is sent from the supply roll 58 to the adhesive sheet supply device 28, and then stopped. Subsequently, the drive base 90 is raised, and the adhesive sheet material 85 is sandwiched between the lower surface of the opening female blade 71 and the lower surface of the punching female blade 81 and the pressing body 75.

Next, the open male blade 72 and the punching male blade 82 enter the open female blade 71 and the inner female 81, respectively.

 The operation in this case is shown in FIG.

In the opening device 70, when the opening male blade 72 enters the opening female blade 71, a small opening 86 is formed in the adhesive sheet material 85. The opening 86 is a portion corresponding to the central opening 5a of the adhesive sheet 5. In addition, the opening waste generated when forming the opening 86 is sucked by the suction pipe 73 and discharged to the outside.

Also, in the punching device 80, a punching male blade is provided in the punching female blade 81.
When the 82 enters, the periphery 87 of the opening 86 of the adhesive sheet material 85 is punched out as shown in FIG. 8 to form the adhesive sheet 5 having the central opening 5a. The adsorbent 56 also rises in accordance with the rise of the punching male blade 82.

A plurality of suction holes (not shown) are formed on the lower end surface of the adsorbent 56, and the lower end surface of the adsorbent 56 is an adsorbing surface for adsorbing and holding the adhesive sheet 5 punched into a predetermined shape. For this reason, the punched adhesive sheet 5 is suction-held by the suction surface of the suction body 56. Subsequently, the adsorbent 56 rises, and thereafter moves to a predetermined position on the concave portion 2a of the card 2 placed on the assembly table 12. Subsequently, the adsorption action of the adsorbent 56 is stopped, and the adhesive sheet 5 is mounted in the recess from the adsorption surface of the adsorbent 56.

A hot air hole may be provided on the suction surface separately from the suction hole, and hot air may be blown from the hot air hole to mount the adhesive sheet 5 in the recess 2a.

The adhesive sheet material 85 from which the adhesive sheet 5 has been punched is then wound up by the take-up roll 52.

Next, the card 2 having the adhesive sheet 5 disposed in the recess 2a
Is sent to the module feeder 25, and the IC module 3 with the surface facing upward is mounted on the adhesive sheet 5 in the recess 2a by the module feeder 25 as described above (FIGS. 1 and 4). .

Next, the card 2 on which the IC module 3 is mounted is transferred to the heat deposition device 30. Then, the IC is heated by the heat deposition device 30.
Module 3 is heated and pressed from above (150 ° C, 5
Seconds). In this case, the adhesive sheet 5 is melted, and the IC module 3 is fixed in the recess 2a of the card 2, and thus the IC
The card is assembled.

Subsequently, the IC module 3 fixed in the concave portion 2a is cooled by the cooling device 32. At the same time, the cooling device 32 determines whether the height of the surface of the card 2 matches the height of the surface of the IC module 3. Next, the IC card 1 is subjected to a peeling inspection and
The IC module 3 is transported to the NG discharge device 34, where the IC module 3 is inspected for peeling from the card 2, that is, whether or not the IC module 3 is securely fixed in the recess 2a. At the same time, the IC card 1 determined to be defective by various inspection results, for example, a surface height inspection in the cooling device 32 or a peeling inspection is discharged to the outside by the peeling inspection and NG discharging device. Next, IC card 1 determined to be good
Is discharged toward the discharge conveyor 40 by the card supply / discharge device 36.

In the above embodiment, the example in which the adhesive sheet supply device has the opening device and the opening is formed in the adhesive sheet material in advance is shown, but the opening device is not necessarily provided. If no opening device is provided, an adhesive sheet having no central opening will be formed.

〔The invention's effect〕

As described above, according to the present invention, an adhesive sheet punched into a predetermined shape between a punching female blade and a punching male blade is adsorbed to an adsorbent, and the adhesive sheet is assembled by the adsorbent into an IC card. It can be mounted in the recess of the card. In this manner, the adhesive sheet can be quickly and reliably mounted in the recess as compared with the conventional manual mounting method.

[Brief description of the drawings]

FIG. 1 is an overall schematic system diagram of an IC card assembling apparatus in which an IC card adhesive sheet supply apparatus according to the present invention is incorporated.
FIG. 2 is a sectional view taken along the line II-II of FIG. 1, and FIG.
FIG. 4 is a sectional view taken along the line IV-IV in FIG. 1, FIG. 5 is a sectional view taken along the line VV in FIG.
The figure is an overall plan view of the IC card assembly device.
FIG. 8 is a side sectional view of the adhesive sheet supply device for a card, FIG. 8 is a plan view showing an adhesive sheet material having an opening formed and punched out, and FIG. 9 is an exploded side view of the IC card. 1 IC card, 2 card, 2a recess, 3 IC
Module, 4 ... Primer, 5 ... Adhesive sheet, 12 ...
... Module table, 14 ... Assembly table, 28 ... Adhesive sheet supply device, 52 ... Winding roll, 56 ... Adsorbent,
58 ... supply roll, 70 ... opening device, 71 ... opening female blade,
72 ... Open male blade, 73 ... Suction pipe, 80 ... Punching device, 81 ...
… Punched female blade, 82 …… Punched male blade, 85 …… Adhesive sheet material.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B42D 15/10 521 G06K 19/077

Claims (2)

(57) [Claims] 1. A punching device for punching an adhesive sheet material sent from a supply roll to a take-up roll, wherein said punching device is provided on a punching female blade, a punching male blade, and a punching female blade side. Having an adsorbent in contact with the adhesive sheet material, the adsorbent adsorbs the punched adhesive sheet, and attaches the adhesive sheet to an IC.
An adhesive sheet supply device for an IC card, which is mounted in a concave portion of a card for card assembly. 2. An opening device is further provided upstream of the punching device,
The opening device has an opening female blade, an opening male blade, and a suction pipe provided on the opening female blade side, and the suction pipe sucks an opening residue generated when an opening is formed in the adhesive sheet material. The adhesive sheet supply device for an IC card according to claim 1, wherein