JP2901067B2 - Resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a resin sealing device used in a resin sealing step in a semiconductor assembling step.

(Prior Art) In general, after a semiconductor chip is subjected to wire bonding to a semiconductor chip, it is sealed with a resin to protect the semiconductor chip.

In recent years, a hybrid type in which a semiconductor chip (LSI chip) is mounted on a printed wiring board together with a resistor, a coil, a capacitor, and the like, and wired and wired, is widely used in recent years. After that, the semiconductor chip is attached, and then wire bonding is performed between the semiconductor chip and the lead portion in the circuit pattern of the substrate. Then, in order to protect the semiconductor chip and the wire by wire bonding, a resin is molded on these.

Conventionally, a resin sealing device for performing this type of mold processing is configured as shown in FIG. That is,
Work stage that holds the substrate 10 to be molded
The work stage 11 is provided with a mechanical clamp 12 for holding the substrate 10 or a vacuum controller 13 for performing a vacuum clamp. Then, the substrate 10 is held on the work stage 11 by the mechanical clamp 12 or the vacuum clamp 13.
Further, there is an XY table 1 for holding a dispenser head 2 for molding a resin on the substrate 10 on the work stage 11 and for positioning and moving the dispenser head 2. The dispenser head 2 is provided on the XY table 1. 2 is mounted. The dispenser head 2 has an arm extending in the direction of the work stage 11, and a temperature-adjustable syringe 3 is attached to the tip of the arm. The resin is stored in the syringe 3, and the resin is discharged while the temperature is adjusted. Will be. The vertical movement of the syringe 3 is performed by moving the arm part up and down by the cylinder 4. The dispenser controller 5 controls the amount of resin discharged from the syringe 3 whose temperature can be adjusted. The XY table 1 is driven by the XY table controller driver 7 for the X-axis direction and the Y-axis direction. Pulse motor
The driving of the cylinder 4 is controlled by a driver 8 for driving the cylinder, and the controllers 5, 13 and the controller / driver 7, the driver 8
Are controlled by a CPU (processor) 9.

In such a configuration, the work stage 11
The mechanical clamp 12 or vacuum clamp (vacuum controller) 13 provided on the substrate
10 is fixed, the XY table 1 is driven, and the position of the syringe 3 is manually set so that the position of the syringe 3 is located at the center position of the semiconductor chip 14 of the substrate 10. The resin is discharged from the nozzle 3a of the syringe 3 while moving the resin, and a predetermined area is automatically molded. Such discharge control and spiral scan control are performed by the CPU 9.
Is automatically controlled by software.

Incidentally, the semiconductor chip 14 on the substrate is attached and fixed to a substantially predetermined position by an adhesive or the like at the time of attachment. However, it is not only accurately mounted in a prescribed state with respect to the substrate, but also roughly mounted at that position. In addition, according to the conventional apparatus, since there is no position recognition function, it is impossible to apply the resin accurately from the central part to the peripheral part of the semiconductor chip 14 unless the positioning is manually performed in advance. Therefore, another chip near the semiconductor chip 14 which is not the object to be molded, or an element is connected later, resin enters into a through hole provided for connection wiring, or the like, or the center of the molding position is shifted. Problems such as exposure of the wire bonding wire without being sufficiently protected by resin sealing may occur. Therefore, to solve the problem, the operator manually sets the coordinate data of the semiconductor chip for each substrate by manual operation, obtains the center position of the semiconductor chip, and then performs resin sealing. In this case, it takes time to set the coordinates, resulting in a decrease in production efficiency.

(Problems to be Solved by the Invention) When performing resin molding of a semiconductor chip on a substrate in such a conventional hybrid device, a resin sealing device is used, but this device draws a predetermined spiral locus from a fixed position. To scan a predetermined range, and discharge resin from a syringe to perform resin molding of a semiconductor chip on a substrate. Therefore, depending on the holding position of the substrate on the work stage in the resin sealing device and the mounting state of the semiconductor chip on the substrate, molding may be performed out of the original resin molding position, which may cause unnecessary areas and subsequent processes. Inevitably, an area which should not be molded for use in the molding process is inevitably molded, and a defective product is produced in the molding process. In order to avoid this, it is necessary to manually position the mold before starting the mold work, but this takes too much time for the positioning work,
Poor work efficiency and poor productivity.

Therefore, an object of the present invention is to perform resin molding of a semiconductor chip on a hybrid element substrate, and to automatically mold a resin only in a necessary area even if the mounting state of the semiconductor chip is various. Moreover, it is an object of the present invention to provide a highly productive resin sealing device capable of covering and protecting a wire or a semiconductor chip with a resin in an ideal state.

[Configuration of the invention]

(Means for Solving the Problems) In order to achieve the above object, the present invention is configured as follows. That is, a semiconductor chip is mounted at a semiconductor chip mounting position on a wiring board, and the semiconductor chip and the wire are coated with a resin by applying a resin to the wiring board after wires are connected from electrodes of the semiconductor chip to lead terminals of the wiring board. Means for holding the wiring board as a device for sealing, position recognition means for capturing an image of the held wiring board and obtaining center position information of a semiconductor chip on the wiring board therefrom, A resin application unit for applying a controllable amount of resin, a movement control unit that relatively moves a positional relationship between the resin application unit and the wiring board, and the center position information obtained by the position recognition unit. The movement control means so that the resin coating means scans from the center position to a predetermined area where the semiconductor chip and the wire are located. In addition to controlling the amount of resin applied by the receiving and applying means, the thickness of the resin itself is increased in the region on the semiconductor chip and the thickness of the resin itself is increased in the region on the wiring board around the semiconductor chip. And control means for controlling the area to be thinner than the upper area.

(Operation) In such a configuration, when a semiconductor chip is mounted on a wiring board and a wiring board having wires connected from the electrodes of the semiconductor chip to the lead terminals of the wiring board is held by the holding means, the position recognition means An image of the held wiring board is captured to obtain center position information of the semiconductor chip on the wiring board. The control means controls the movement control means based on the center position information obtained from the position recognition means so that the resin coating means scans from the center position over a predetermined area where the semiconductor chip and the wire are located. The amount of the resin applied by the resin applying means is controlled so as to be thicker in the region of the semiconductor chip and thinner in the periphery. For this reason, the resin coating means is relatively moved and scanned over a predetermined region where the wire is located from the center position of the semiconductor chip, and the resin discharge amount is thick in the region of the semiconductor chip and thin in the periphery. And the resin is applied onto the wiring board. As described above, the present invention recognizes the position of the semiconductor chip on the wiring board from the image information of the semiconductor chip, and automatically positions the resin based on the recognized position to apply the resin from the center of the semiconductor chip. The resin is sprayed and applied over a predetermined region from the center of the semiconductor chip toward the periphery, and the resin is applied so as to be thicker at the center of the semiconductor chip and thinner toward the periphery. Even if the semiconductor chip is attached to the board at the time of its mounting, the part to be molded including the wire bonded around the semiconductor chip can be reliably molded, and in the case of a molding object near the semiconductor chip, The resin may not enter another chip or through holes provided for wiring, etc. Center deviation wire Bonn dengue wires location can prevent problems such as exposing without being sufficiently resin sealing protection.

Therefore, according to the present invention, when performing resin molding of a semiconductor chip on a hybrid element substrate, even if the mounting state of the semiconductor chip is various, resin can be automatically molded only in a necessary region, and It is possible to provide a highly productive resin sealing device in which wires and semiconductor chips can be covered and protected in an ideal state with resin.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing a configuration of a resin sealing device according to the present invention. That is, the wiring substrate 10 to be molded
(Hereinafter simply referred to as substrate) work stage 11
The work stage 11 is provided with a mechanical clamp 12 for mechanically holding the substrate 10 and a vacuum controller 13 for performing a vacuum clamp for holding the substrate 10 by suction. The work stage is controlled by the mechanical clamp 12 and the vacuum clamp 13.
The substrate 10 is held on 11. Further, there is an XY table 1 for holding a dispenser head 2 for molding a resin on the substrate 10 on the work stage 11 and for positioning and moving the dispenser head 2. The dispenser head 2 is provided on the XY table 1. 2 is mounted. The dispenser head 2 has an arm extending in the direction of the work stage 11, and a syringe 3 whose temperature can be adjusted is attached to the tip of the arm. The resin is stored in the syringe 3, and the tip of the syringe 3 is adjusted while the temperature is adjusted. The resin is discharged from the nozzle 3a. The vertical movement of the syringe 3 is performed by operating the arm part up and down by a cylinder 4. The control of the resin discharge amount from the temperature-adjustable syringe 3 is performed by the dispenser controller 5, and the driving of the XY table 1 is controlled by the XY table controller / driver 7 in the X-axis direction and the Y-axis. The driving control of the cylinder 4 is performed by a cylinder driving driver 8, and the controller 5, 13 and the controller /
Driver 7 and driver 8 operate according to the program
It is controlled by a U (processor) 9a. The basic configuration up to this point is no different from the conventional device.

In this apparatus, an image detection device 15 such as an ITV camera (industrial television camera) or a CCD camera (solid-state image pickup device television camera) is attached to the XY table 1 by attaching it to the XY table 1, for example. The substrate 10 is held on the work stage 11 by, for example, being supported by an arm (not shown) that is integrally movable so that the substrate can be imaged from above the work stage 11.
And the center position coordinates of the semiconductor chip 14 are detected based on the detected image information of the image detecting device 15,
A position recognition control unit 16 provided to the CPU 9a is provided. And CPU
9a, based on the coordinates of the center position of the semiconductor chip from the position recognition controller 16, a predetermined region extending from the coordinates of the center position to the wiring region of the wire by wire bonding is formed in a spiral, circular or rectangular shape. The XY table 1 is controlled so as to move and scan the temperature-adjustable syringe 3 by drawing a predetermined trajectory. At this time, in the temperature-adjustable syringe 3, the central region of the semiconductor chip 14 is made of resin. The difference from the related art is that a program is set to control the dispenser controller 5 so that the discharge amount is large and decreases toward the periphery.

The operation of the present apparatus having such a configuration will be described with reference to the flowchart of FIG. 2 and the state diagrams of FIGS. 3 and 4. First, the substrate 10 on which the wire-bonded semiconductor chip 14 is mounted is set on the work stage 11, and then the substrate 10 is sucked by a vacuum clamp (vacuum controller) 13 provided on the work stage 11. Eliminates warpage of substrate 10 and mechanical clamp 12
The substrate 10 is firmly fixed on the work stage 11 with.
When this process is completed, X is then controlled under the control of the CPU 9a.
-Drive the Y table 1 and determine in advance the CPU 9a
The image detection device 15 is moved to the predetermined area of the semiconductor chip 14 stored in the memory device. After that, the image of the semiconductor chip 14 is captured by the image detection device 15 (s30). This image information is sent to the position recognition control unit 16, which then reads the semiconductor chip 14 on the work stage 11.
CPU 9a analyzes the coordinate position of the center of the
Give to.

Next, the CPU 9a compares the reference coordinate data of the semiconductor chip created in advance with the coordinate data actually taken in from the position recognition control unit 16 (s31, s32). Next, the CPU 9a calculates a shift amount, performs a position correction calculation of the semiconductor chip 14, and determines an actual center position of the semiconductor chip 14 (s33). Here, a command is sent from the CPU 9a to the XY table 1 so that the position of the nozzle 3a in the syringe 3 of the dispenser head 2 is located at the center of the semiconductor chip 14.
Is driven to move (s34). When this operation is completed, the CPU
The resin discharge amount preset from the storage circuit in 9a,
The application conditions such as the speed of the XY table 1, the trajectory of the syringe nozzle 3a, etc. are called (s35), and command signals are sent to the dispenser controller 5, the XY table controller / driver 7, and the syringe drive driver 8, While driving the XY table 1 so that 3a moves relative to the semiconductor chip 14 while drawing the predetermined locus, the syringe 3 discharges an amount of resin according to the position on the locus, The resin is applied (s36).

The above operation is performed for each of the N semiconductor chips on one substrate (s37, s39). When all the substrates are completed, the suction is released, the mechanical clamp 12 is removed, and the substrate 10 is removed from the work stage 11 (s38).

As described above, the bare semiconductor chip 14 on the substrate is attached and fixed at a substantially predetermined position by an adhesive or the like at the time of attachment. However, as shown in FIG. 3, the semiconductor chip 14 is rarely accurately mounted in a prescribed direction with respect to the substrate, and is often mounted at an inclined position as shown in FIG. However, according to the above-described apparatus, the position of the semiconductor chip 14 is recognized, and the XY table 1 is controlled so that the nozzle 3a of the syringe 3 comes to the center c of the semiconductor chip based on the position thus recognized. After automatic positioning, while following a predetermined trajectory R from the center of the semiconductor chip 14 to the periphery, the resin is accurately made thicker toward the center of the semiconductor chip and thinner toward the periphery while scanning while scanning. Apply. In this way, the region (resin sealing region) M to be molded, including the wire W bonded to the semiconductor chip 14 at the center, is reliably molded. Because it is thin, even if the central resin flows to some extent, it does not erode the necessary area and flow. In addition, another chip that is not the object to be molded near the semiconductor chip, or an element is connected later, resin enters into the through-holes, etc. made for connection wiring, etc. Problems such as exposure of dengue wires without being sufficiently protected by resin sealing can be completely suppressed. The thickness of the resin is determined according to the viscosity of the resin used.

As described above, according to the present apparatus, the position of the semiconductor chip on the substrate is recognized by the position detecting means which recognizes the position of the semiconductor chip from the image information of the semiconductor chip, and the cylinder is positioned at the center of the semiconductor chip based on the recognized position. After automatic positioning so that comes, over a predetermined region from the central part of the semiconductor chip to the peripheral part, resin is applied by spraying,
In addition, since the resin is applied thicker toward the center of the semiconductor chip and becomes thinner toward the periphery, even if the semiconductor chip on the substrate is inclined and attached to the substrate at the time of the attachment, the wire around the semiconductor chip is centered. The part to be molded, including the bonded wire, can be molded reliably, and another chip that is not the object of molding near the semiconductor chip or a through hole provided for connecting elements later or connecting wiring etc. It is possible to prevent problems such as resin entering a hole or the like, or exposing the wire of wire bonding without being sufficiently protected by resin sealing due to the center of the mold position being shifted.

Therefore, according to the present apparatus, it is not necessary to manually set the coordinate data of the semiconductor chip by a worker's hand, and all of the syringes are automatically and accurately positioned so that the syringe comes to the center position of the semiconductor chip. As a result, the production efficiency can be dramatically improved, and the yield can be improved and the productivity can be dramatically improved.

The present invention is not limited to the embodiment described above and shown in the drawings, and can be carried out by appropriately modifying it without departing from the scope of the invention. The resin is ejected in a spiral or rectangular locus, and is moved on the syringe side to apply the resin to fix the wiring board. Alternatively, the syringe board may be fixed by moving the wiring board. .

〔The invention's effect〕

As described in detail above, according to the present invention, it is not necessary to manually set the coordinate data of the semiconductor chip by a worker's hand, and all the coordinates are automatically and accurately adjusted so that the syringe comes to the center position of the semiconductor chip. In addition, since the resin can be sealed in an ideal state, the production efficiency can be dramatically improved, and a resin sealing device with a high yield can be provided.

[Brief description of the drawings]

FIG. 1 is a block diagram showing one embodiment of the present invention, FIG. 2 is a flowchart showing the operation of the present apparatus, and FIGS.
FIG. 5 is a diagram for explaining an embodiment of the present invention, and FIG. 5 is a block diagram showing a conventional example. 1. XY table, 3. Temperature adjustable syringe, 5. Dispenser controller, 9a CPU, 10
... board, 11 ... work stage, 13 ... vacuum controller, 14 ... semiconductor chip, 15 ... image detection device, 16 ... position recognition control unit.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuhiko Sasahara 3-1-1 Asahigaoka, Hino-shi, Tokyo Inside the Toshiba Hino Plant (72) Inventor Mitsuru Mur Mitsuru 3-1-1 Asahigaoka, Hino-shi, Tokyo 1 share (56) References JP-A-58-110051 (JP, A) JP-A-59-2327 (JP, A) JP-A-62-110775 (JP, A) JP-A-53-68872 (JP JP, A) JP-A-61-194840 (JP, A)

Claims (1)

(57) [Claims] A semiconductor chip is mounted at a semiconductor chip mounting position on a wiring board, and the semiconductor chip and the wire are connected to a lead terminal of the wiring board by a wire from an electrode of the semiconductor chip. What is claimed is: 1. An apparatus for resin sealing by coating, comprising: means for holding said wiring board; and position recognition for capturing an image of said held wiring board and obtaining center position information of a semiconductor chip on said wiring board therefrom. Means, a resin application means for applying a resin in which a resin discharge amount is controllable, a movement control means for relatively moving a positional relationship between the resin application means and the wiring board, and the position recognition means. Based on the center position information, the resin coating means scans from the center position over a predetermined area where the semiconductor chip and the wire are located. While controlling the control means, the amount of the resin applied by the resin application means is increased in the region on the semiconductor chip and the thickness of the resin in the region on the wiring board around the semiconductor chip. And a control means for controlling the thickness of the resin sealing device so as to be thinner than the region on the semiconductor chip.