JP2895796B2 - Method for producing high-strength conductive high-chromium-containing copper alloy - Google Patents
Method for producing high-strength conductive high-chromium-containing copper alloyInfo
- Publication number
- JP2895796B2 JP2895796B2 JP5929296A JP5929296A JP2895796B2 JP 2895796 B2 JP2895796 B2 JP 2895796B2 JP 5929296 A JP5929296 A JP 5929296A JP 5929296 A JP5929296 A JP 5929296A JP 2895796 B2 JP2895796 B2 JP 2895796B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- containing copper
- strength
- alloy
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Conductive Materials (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、高強度導電性高C
r含有銅合金の製造方法に関する。The present invention relates to a high-strength conductive high-C
The present invention relates to a method for producing an r-containing copper alloy.
【0002】[0002]
【従来の技術】図5はCu−15重量%Cr合金の溶製
材を示す顕微鏡写真である。図5から分かるように、こ
のCu−15重量%Cr合金の溶製材は、第二相である
Cr晶が不均一に分布している。また、Cr晶の形状が
等軸晶である。Cr等軸晶的形状は、冷間加工を施して
もファイバ状に成形し難く、ファイバが均一分布を持つ
複合材料となりにくい。このため、高強度化が阻害され
ていた。したがって、図5に示すCu−15重量%Cr
合金の溶製材は、CuとCrの二元合金であるために、
最高強度で引張強度1000MPaに達しない。2. Description of the Related Art FIG. 5 is a photomicrograph showing an ingot of a Cu-15% by weight Cr alloy. As can be seen from FIG. 5, in the ingot material of the Cu-15% by weight Cr alloy, the Cr crystals as the second phase are unevenly distributed. Further, the shape of the Cr crystal is equiaxed. The Cr equiaxed crystal shape is difficult to be formed into a fiber shape even after cold working, and the fiber is unlikely to be a composite material having a uniform distribution. For this reason, high strength was hindered. Therefore, as shown in FIG.
Since the ingot of the alloy is a binary alloy of Cu and Cr,
At the maximum strength, the tensile strength does not reach 1000 MPa.
【0003】[0003]
【発明が解決しようとする課題】本発明はかかる点に鑑
みてなされたものであり、引張強度1000MPa以
上、導電率65%IACS以上を有する高強度導電性高
Cr含有銅合金を得ることができる方法を提供すること
を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the foregoing, and it is possible to obtain a high-strength conductive high-Cr-containing copper alloy having a tensile strength of 1000 MPa or more and a conductivity of 65% IACS or more. The aim is to provide a method.
【0004】[0004]
【課題を解決するための手段】本発明は、Crを10〜
20重量%含有する良導電性銅合金において、凝固時並
びに固相中でのCr相の晶出ないし析出特性を制御する
ために、C,N,またはB中の少なくとも1種を0.0
1〜1重量%の範囲内で添加することを特徴とする高強
度導電性高Cr含有銅合金の製造方法を提供する。SUMMARY OF THE INVENTION According to the present invention, Cr is reduced to 10 to 10%.
In a highly conductive copper alloy containing 20% by weight, at least one of C, N, and B is added in an amount of 0.0 to control the crystallization or precipitation characteristics of the Cr phase during solidification and in the solid phase.
Provided is a method for producing a high-strength conductive high-Cr-containing copper alloy, characterized by being added in the range of 1 to 1% by weight.
【0005】本発明の方法において、Sn,Zn,P,
Ti,またはZrの少なくとも1種を添加してさらなる
高強度化を達成することが好ましい。また、鋳塊溶製時
において、C,N,Bの添加方法として、Cr炭化物、
Cr窒化物、Crホウ化物の粉末を添加することが好ま
しい。In the method of the present invention, Sn, Zn, P,
It is preferable to add at least one of Ti and Zr to achieve further higher strength. In addition, at the time of ingot smelting, C, N, and B are added as Cr carbide,
It is preferable to add a powder of Cr nitride or Cr boride.
【0006】[0006]
【発明の実施の形態】以下、本発明の高強度導電性高C
r含有銅合金の製造方法について、具体的に説明する。
C,N,B元素は、純Cu系およびCu合金系中の添加
元素として取り上げられたこともなく、さらに、第二相
であるCrのスキャベンジング効果(Crを第三元素と
結合させることにより、固溶Crを減少させる作用を呼
ぶ)としての着眼は存在しない。特に、Cはその効果が
最も有効であり、Cu中へその元素自身の溶解度が限り
なく低く、導電率への影響もない。本発明は、前記着眼
のもとになされたものである。BEST MODE FOR CARRYING OUT THE INVENTION The high strength conductive high C of the present invention is described below.
The method for producing the r-containing copper alloy will be specifically described.
The C, N, and B elements have not been taken up as an additive element in pure Cu and Cu alloy systems, and further have a scavenging effect of Cr as the second phase (to combine Cr with a third element). Does not exist). In particular, C has the most effective effect, the solubility of the element itself in Cu is extremely low, and there is no influence on the conductivity. The present invention has been made based on the above viewpoint.
【0007】図5に示すCu−Cr二相合金は、Cuへ
の固溶度が小さい第二相であるCrを晶出させるが、二
相分離合金の場合、強度増加と電気的特性に着目したと
き、第二相のCr晶が均一に分散していることが好まし
い。そこで、本発明は、この第二相Cr晶の形態と分布
を制御する技術を提供するものである。The Cu--Cr two-phase alloy shown in FIG. 5 crystallizes Cr, which is a second phase having a low solid solubility in Cu. In the case of a two-phase separated alloy, attention is paid to an increase in strength and electrical characteristics. Then, it is preferable that the Cr crystals of the second phase are uniformly dispersed. Therefore, the present invention provides a technique for controlling the form and distribution of the second phase Cr crystal.
【0008】また、本発明においては、第二相の形態と
分布を制御することに加えて置換型元素の添加によりさ
らなる高強度化を達成する技術を提供する。この場合、
C,N,Bの添加に加えて添加物の歩留まりを向上させ
るために、Crとの金属間化合物の粉末を母合金として
添加することを特徴とする。The present invention also provides a technique for controlling the morphology and distribution of the second phase and further increasing the strength by adding a substitutional element. in this case,
In order to improve the yield of the additive in addition to the addition of C, N, and B, a powder of an intermetallic compound with Cr is added as a mother alloy.
【0009】Cu相とCr相との融点差が大きく凝固時
において第二相のCr晶を制御する手段はこれまでな
く、本発明においてこの制御をC,N,B元素を用いて
行うものである。また、当初その添加方法もこれらの元
素とCrとの金属間化合物(粒状)を準備し、Cu−C
r溶湯中に添加したが、例えばC添加を試みた場合に、
図1に示すように、溶け残りを生じた。よって、これら
元素とCrとの金属間化合物の粉末を用いることによ
り、Cu溶湯中にほどよく均一分散し、図2に示すよう
な良好な鋳造組織を得ることが可能となった。The melting point difference between the Cu phase and the Cr phase is large, and there is no means for controlling the Cr crystals in the second phase during solidification. In the present invention, this control is performed using C, N and B elements. is there. Initially, the addition method is also to prepare an intermetallic compound (granular) of these elements and Cr, and to prepare Cu-C
rIn the molten metal, for example, if you try to add C,
As shown in FIG. 1, unmelted residue occurred. Therefore, by using the powder of the intermetallic compound of these elements and Cr, the powder is moderately and uniformly dispersed in the molten Cu and a good cast structure as shown in FIG. 2 can be obtained.
【0010】図3はCu−15重量%Cr合金と、Cu
−15重量%Cr−C合金の初晶Crの加工による厚さ
の変化である。これにより、本発明を用いて溶解を行っ
たCu−15重量%Cr−C合金は、Cr晶が針状化し
ているため、ファイバ状になり易い。FIG. 3 shows a Cu-15% by weight Cr alloy and Cu
This is a change in thickness due to processing of primary Cr of a -15% by weight Cr-C alloy. As a result, the Cu-15 wt% Cr-C alloy melted by using the present invention tends to have a fiber shape because the Cr crystal is acicularized.
【0011】図4はCu−15重量%Cr合金(比較
例)とCu−15重量%Cr−C合金(実施例)の加工
率99%のCrファイバを示す。図4から明らかなよう
に、本発明を用いて溶解を行ったCu−15重量%Cr
−C合金はファイバ状となるのが早い。FIG. 4 shows a Cr fiber having a working rate of 99% of a Cu-15% by weight Cr alloy (Comparative Example) and a Cu-15% by weight Cr-C alloy (Example). As is clear from FIG. 4, Cu-15% by weight Cr dissolved by using the present invention is used.
The -C alloy quickly becomes a fiber.
【0012】本発明の方法により製造した高Cr含有銅
合金と従来の方法により製造した高Cr含有銅合金につ
いて導電率および引張強度を調べた。その結果を下記表
1に示す。The conductivity and tensile strength of the high Cr-containing copper alloy produced by the method of the present invention and the high Cr-containing copper alloy produced by the conventional method were examined. The results are shown in Table 1 below.
【0013】[0013]
【表1】 [Table 1]
【0014】表1から分かるように、本発明の方法によ
り得られた高Cr含有銅合金は、引張強度1000MP
a以上、導電率65%IACS以上を満足するものであ
った。これは、Cr晶が針状化しており、Cr晶が均一
化されたことによると考えられる。一方、従来の方法に
より得られた高Cr含有銅合金は、引張強度1000M
Pa以上を満足できないものであった。As can be seen from Table 1, the high Cr-containing copper alloy obtained by the method of the present invention has a tensile strength of 1000 MPa.
a or more, and a conductivity of 65% IACS or more was satisfied. This is considered to be because the Cr crystal was acicularized and the Cr crystal was homogenized. On the other hand, the high Cr-containing copper alloy obtained by the conventional method has a tensile strength of 1000M.
Pa or more could not be satisfied.
【0015】[0015]
【発明の効果】以上説明したように本発明の高強度導電
性高Cr含有銅合金の製造方法は、Crを10〜20重
量%含有する良導電性銅合金において、凝固時並びに固
相中でのCr相の晶出ないし析出特性を制御するため
に、C,N,またはB中の少なくとも1種を0.01〜
1重量%の範囲内で添加するので、高導電性を損なうこ
となく、高強度化を図った高Cr含有銅合金を安価で効
率良く得ることができるものである。本発明により、C
u基合金の用途全般にわたって有用な高強度導電性高C
r含有銅合金を提供することができる。As described above, the method for producing a high-strength conductive high-Cr-containing copper alloy according to the present invention can be applied to a well-conductive copper alloy containing 10 to 20% by weight of Cr, at the time of solidification and in the solid phase. In order to control the crystallization or precipitation characteristics of the Cr phase, at least one of C, N and
Since it is added within the range of 1% by weight, a high Cr-containing copper alloy with high strength can be obtained efficiently at low cost without impairing high conductivity. According to the present invention, C
High strength conductive high C useful for all uses of u-base alloys
An r-containing copper alloy can be provided.
【図1】Cr−C金属間化合物(粒状)添加による溶製
材中の溶け残りを示す顕微鏡写真。FIG. 1 is a micrograph showing undissolved material in a smelting material due to addition of a Cr—C intermetallic compound (granular).
【図2】本発明により作製したCu−15重量%Cr−
C溶製材を示す顕微鏡写真。FIG. 2 shows Cu-15% by weight Cr— produced according to the present invention.
C is a micrograph showing the ingot.
【図3】Cr晶の加工による厚さの変化を示す特性図。FIG. 3 is a characteristic diagram showing a change in thickness due to processing of a Cr crystal.
【図4】加工率99%におけるCrファイバ(Cu−1
5重量%Cr−CとCu−15重量%Cr(比較例))
を示す顕微鏡写真。FIG. 4 shows a Cr fiber (Cu-1) at a processing rate of 99%.
5 wt% Cr-C and Cu-15 wt% Cr (Comparative Example)
Is a micrograph showing.
【図5】Cu−15重量%Cr溶製材を示す顕微鏡写
真。FIG. 5 is a micrograph showing a Cu-15 wt% Cr ingot.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐久間 信夫 茨城県つくば市千現1−2−1 科学技 術庁金属材料技術研究所内 (72)発明者 鈴木 洋夫 茨城県つくば市千現1−2−1 科学技 術庁金属材料技術研究所内 (72)発明者 宮内 理夫 東京都千代田区丸の内2丁目6番1号 古河電気工業株式会社内 (56)参考文献 特開 昭58−197241(JP,A) 特公 昭55−12086(JP,B2) (58)調査した分野(Int.Cl.6,DB名) C22C 9/00 - 9/10 C22C 1/02 503 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Nobuo Sakuma 1-2-1 Sengen, Tsukuba City, Ibaraki Prefectural Institute of Science and Technology (72) Inventor Hiroo Suzuki 1-2-1 Sengen, Tsukuba City, Ibaraki Prefecture (72) Inventor: Rio Miyauchi 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (56) References JP-A-58-197241 (JP, A) No. 55-12086 (JP, B2) (58) Field surveyed (Int. Cl. 6 , DB name) C22C 9/00-9/10 C22C 1/02 503
Claims (3)
性銅合金において、凝固時並びに固相中でのCr相の晶
出ないし析出特性を制御するために、CおよびNの少な
くとも1種を0.01〜1重量%の範囲内で添加するこ
とを特徴とする高強度導電性高Cr含有銅合金の製造方
法。In a highly conductive copper alloy containing 10 to 20% by weight of Cr, in order to control the crystallization or precipitation characteristics of a Cr phase during solidification and in a solid phase, a small amount of C and N is used. A method for producing a high-strength conductive high-Cr-containing copper alloy, characterized in that at least one kind is added within a range of 0.01 to 1% by weight.
なくとも1種を添加してさらなる高強度化を達成する請
求項1記載の高強度導電性高Cr含有銅合金の製造方
法。2. The method according to claim 1, wherein at least one of Sn, Zn, P, Ti, and Zr is added to achieve higher strength.
くとも1種の添加方法として、Cr炭化物およびCr窒
化物の少なくとも1種の粉末を添加する請求項1または
2のいずれか1項記載の高強度導電性高Cr含有銅合金
の製造方法。3. The method according to claim 1, wherein a low content of C and N
The method for producing a high-strength conductive high-Cr-containing copper alloy according to any one of claims 1 and 2, wherein at least one powder of Cr carbide and Cr nitride is added as at least one addition method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5929296A JP2895796B2 (en) | 1996-03-15 | 1996-03-15 | Method for producing high-strength conductive high-chromium-containing copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5929296A JP2895796B2 (en) | 1996-03-15 | 1996-03-15 | Method for producing high-strength conductive high-chromium-containing copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09249925A JPH09249925A (en) | 1997-09-22 |
| JP2895796B2 true JP2895796B2 (en) | 1999-05-24 |
Family
ID=13109169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5929296A Expired - Fee Related JP2895796B2 (en) | 1996-03-15 | 1996-03-15 | Method for producing high-strength conductive high-chromium-containing copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2895796B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108165814A (en) * | 2017-12-08 | 2018-06-15 | 江西省科学院应用物理研究所 | A kind of carbon microalloy Cu-Cr based materials and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5512086B2 (en) | 2007-02-02 | 2014-06-04 | エムコア ソーラー パワー インコーポレイテッド | Inverted modified solar cell structure with vias for backside contact |
-
1996
- 1996-03-15 JP JP5929296A patent/JP2895796B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5512086B2 (en) | 2007-02-02 | 2014-06-04 | エムコア ソーラー パワー インコーポレイテッド | Inverted modified solar cell structure with vias for backside contact |
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| Publication number | Publication date |
|---|---|
| JPH09249925A (en) | 1997-09-22 |
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