JP2890625B2 - Method for manufacturing multilayer wiring board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a multilayer wiring board used for electronic devices / electric devices, computers, communication devices, and the like.

[Conventional technology]

A conventional multilayer wiring board has a required number of circuit-formed inner layer materials each having a resin layer disposed on the upper surface and / or lower surface thereof, and a laminate having an outer layer material disposed on the outermost side in a molding prevention frame or a molding prevention container. They are stored and laminated and formed, or through holes are formed in the four corners of the laminated body, and pins for preventing displacement are inserted to prevent displacement during lamination. However, in the former case, it is necessary to change the frame and container each time the molding size and molding thickness are changed, and keeping the required number always reduces the work efficiency. It is necessary to prepare molding plates to be arranged above and below the laminate, and in addition, the molding plate used at this time needs to adjust the change in the thickness of the laminate before and after lamination molding with the plate thickness. There was a problem that it was necessary to be large and workability was reduced.

[Problems to be solved by the invention]

As described in the prior art, there is a problem that the working efficiency is poor in the conventional molding displacement prevention method.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a method for manufacturing a multilayer wiring board with high work efficiency and high interlayer position accuracy.

[Means for solving the problem]

The present invention provides a laminate having a resin layer disposed on each upper surface and / or lower surface of a required number of circuit-formed inner layer materials, and adding the respective thicknesses of the inner layer material and the resin layer with eyelets to a laminate thickness of ± 0.15 mm. After caulking so as to form a multilayer wiring board, which is characterized by arranging an outer layer material on the outermost side and performing lamination molding, the above object can be achieved. Will be described.

Examples of the inner layer material used in the present invention include phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfon, polyphenylene sulfide, polyphenylene oxide, and polybutylene. Terephthalate, polyethylene terephthalate, resin such as fluorinated resin alone, modified product, mixture and paper,
Substrates such as glass cloth, glass nonwoven fabric, synthetic fiber cloth, synthetic fiber nonwoven fabric, cotton, and copper, aluminum, iron, nickel,
An electric circuit is formed on a single-sided or double-sided metal foil-clad laminate made of a single, alloy, or composite foil of zinc or the like. As the resin layer disposed on the upper surface and / or the lower surface of the inner layer material, a coating layer of the above resin, a resin-impregnated base material layer, a resin sheet layer alone,
Although a composite layer is used, it is preferable to use a resin-impregnated base material that can easily make the resin layer thickness uniform. The eyelet pins are made of aluminum, copper, nickel, iron, zinc, lead, etc. alone, alloys, metals made of composite products or plastics made of polycarbonate, polypropylene, polyamide, polybutylene terephthalate, polyethylene terephthalate, polyphenylene sulfide, etc. An eyelet with a circular or rod-like shape or an inverted T-shape can be used, and the eyelet is fitted at a required position, preferably at four corners, of the laminated body composed of the inner layer material and the resin layer. It is necessary to caulk the body thickness to ± 0.15 mm in order to improve the interlayer position accuracy, more preferably 0.8 ± 0.05 mm when the laminate thickness is 0.8 mm, when it is 1.2 mm
It is desirable that the thickness be 1.2 ± 0.05 mm, 1.5 ± 0.05 mm for 1.6 mm, and 2.3 ± 0.05 mm for 2.4 mm. As the outer layer material, a single-sided metal foil-clad laminate or a metal foil is used, and as the lamination molding, any of press-forming, multi-stage pressing, multi-roll, lamination under pressure or non-pressure lamination may be used. It is not limited.

 Hereinafter, the present invention will be described based on examples.

Example 1 An electric circuit was formed on both sides of a double-sided copper-clad glass cloth-based epoxy resin laminate having a thickness of 0.8 mm to form an inner layer material, and a 0.1 mm-thick epoxy resin impregnated glass cloth was formed on the upper and lower surfaces of the inner layer material. Holes with a diameter of 3.1 mm were opened at the four corners of the laminated body arranged two by two.
After fitting a 5.2 mm high brass inverted T-shaped eyelet pin and caulking so that the thickness becomes 1.2 ± 0.05 mm, copper foil with a thickness of 35 microns is arranged on the outermost side and forming pressure 30 kg / cm ² , 16
Lamination molding was performed at 5 ° C. for 90 minutes to obtain a four-layer wiring board.

[Comparative Example 3] Except that the same eyelet pin as in Example 1 was fitted into the same laminate as in Example 1, and then caulked so as to have a thickness of 1.2 ± 0.25 mm, the same treatment as in Example 1 was performed to obtain four layers. A wiring board was obtained.

[Comparative Example 1] The same outer layer material as in Example 1 was provided on the outermost surface of a laminate in which two of the same resin-impregnated base materials as in Example 1 were respectively disposed on the upper and lower surfaces of the same inner layer material as in Example 1. A four-layer wiring board was obtained by performing the same treatment as in Example 1 except that the four-layer wiring board was stored in an iron-made container for preventing displacement.

[Comparative Example 2] A through hole was formed at each of the four corners of the same laminate as in Comparative Example 1, and a pin for preventing slippage was inserted. Except for the above, a four-layer wiring board was obtained in the same manner as in Example 1.

Table 1 shows the working efficiency and interlayer position accuracy of the four-layer wiring boards of Example 1 and Comparative Examples 1, 2, and 3.

Note The interlayer position accuracy is based on 100 boards (4 x 100) by measuring four points per board.

 The work efficiency is a ratio when Comparative Example 2 is set to 100.

〔The invention's effect〕

The present invention is configured as described above. The method for manufacturing a multilayer wiring board having the configuration described in the claims has the effects of improving work efficiency and interlayer position accuracy.

Claims (1)

(57) [Claims] 1. A laminated body having a required number of circuit-formed inner layer materials and a resin layer disposed on each of the upper surface and lower surface thereof is provided with a grommet pin to add a thickness of ± 0.15 of the total thickness of the laminated material obtained by summing the thicknesses of the inner layer material and the resin layer. A method for manufacturing a multilayer wiring board, comprising: crimping to a thickness of 0.1 mm;