JP2877034B2 - Acceleration detection device and acceleration sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an acceleration sensor for detecting an acceleration by a cantilever formed on a silicon substrate if example embodiment is displaced by an acceleration, and the acceleration Se
The present invention relates to an acceleration detection device having a sensor mounted on a circuit board .

[0002]

2. Description of the Related Art The structure of a conventional acceleration detecting device is shown in FIG. FIG. 13A is a side cross-sectional view of the housing 100. The housing 100 has a lid 100a and forms a hollow inside. A sensor chip for detecting acceleration, a processing circuit, and the like are housed in the hollow portion. The housing 100 has a fixing cover 100b having a screw hole.
And is fixed to the fixing plate 103 by screws 102. The fixing plate 103 is L-shaped, and the screw 103
It is fixed to the circuit board 104 by a. Therefore, the housing 100 is mechanically fixed substantially vertically to the circuit board 104 via the fixing plate 103.

[0003] The housing 100 has terminals 101 connected to an electric circuit provided inside the housing. The terminal 101 is connected to an extraction terminal 105, and the extraction terminal 105 is connected to a circuit board 104.
And is electrically connected to the wiring on the circuit board 104. The position of the take-out terminal 105 is fixed by a resin mold part 106.

FIG. 13B shows a plan view of the housing 100 with the cover 100a removed. As shown in the figure, a processing circuit 109 including a chip component such as a sensor chip 108, a processing chip, a resistor, and a capacitor is formed on a ceramic substrate 107 in a housing 100. The processing circuit 109 detects a displacement due to the acceleration of the sensor chip 108 and outputs an acceleration signal. This acceleration signal is sent to an ECU (not shown) on the circuit board 104 via the terminal 101 and the extraction terminal 105,
It is used for controlling airbags and the like.

FIG. 14 shows a schematic cross-sectional structure of the housing 100. Ceramic substrate 107 on stem 110
Are bonded and fixed, and a sensor chip 108 and a processing circuit 109 are formed on the ceramic substrate 107. A metal lid 1 is provided on the front side of the stem 110.
00a is attached by welding to hermetically seal the hollow portion 111. A metal fixing cover 100b is attached to the back side by welding. These constitute a sensor assembly.

Also, the terminal 101 and the sensor chip 108,
The processing circuit 109 is wire-bonded with a wire 112 and is electrically connected to the outside. The terminal 101 is
The stem 110 is hermetically sealed with low-melting glass 113, and the lid 100a is welded to the stem 110 to hermetically seal the inside of the housing 100.

The circuit board 104 shown in FIG.
Is mounted on a plane parallel to the floor in the cabin,
The housing 100 is attached to the circuit board 104 via the fixing plate 103 substantially vertically so that the sensor chip 108 is substantially perpendicular to the circuit board 104.

[0008]

As described above, the conventional acceleration detecting device has a problem that the number of parts is large, the structure is complicated and large, and the number of manufacturing steps is also large. That is, according to the above-described conventional configuration, the lid 100a, the stem 110, the terminal 101
Is provided. Further, in order to mechanically connect the housing 100 to the circuit board 104 substantially vertically, a fixing plate 103 fixed substantially vertically to the circuit board 104 is provided, and a fixing cover 1 for fixing the screw to the fixing plate 103.
00b and the screw 102 are required. Further, in order to electrically connect the circuit board 104 and the acceleration detecting device, a lead-out terminal 105 and a through hole for soldering the circuit board 104 are required.

[0009] The present invention has been made in view of the above problems, Oyo acceleration sensor structure capable easy easy in and downsizing
And an acceleration detecting device .

[0010]

In order to achieve the above object, according to the first aspect of the present invention, a hollow portion is provided inside.
Form having (5) and flat end face (B side)
Shape, and is displaced by receiving acceleration in the hollow portion.
Housing on which the sensor chip (3) is mounted
(21, 41) and the inside of the housing and the end face
An electric signal formed and indicating a displacement state of the sensor chip
An electrical wiring for taking out (81,9), said electrical signal
Circuit board on which a circuit element that operates based on a signal is formed
(10), the end face on which the electric wiring is formed is
Electrically and mechanically connected to the circuit board,
Connection means (12) for fixing the connector to the circuit board substantially vertically
And the housing is provided with the sensor chip.
Plated substrate (21) attached and shape with recess
And attached to one surface side of the substrate,
Lid that forms a hollow part and hermetically seals this hollow part
(41) .

According to the second aspect of the present invention, the sensor has a hollow portion (5) inside and a flat end surface (B surface), and is displaced by receiving acceleration in the hollow portion. A housing (2, 42) to which a chip (3) is attached, within said housing and at said end face
And an electric signal indicating a displacement state of the sensor chip.
No. and electrical wiring (82,9) for taking out the electric
Circuit board on which circuit elements that operate based on signals are formed
(10), the end face on which the electric wiring is formed is
Electrically and mechanically connected to the circuit board,
Connection means (12) for fixing the connector to the circuit board substantially vertically
With the door, wherein the housing accommodating the sensor chip
A box-shaped housing body having a recess (2), this
Attached to the front of the recess in the housing body,
Form the hollow part and hermetically seal this hollow part
And a lid (41), wherein the lid is
Same as the first part attached to the entire surface of the recess and the end face
L-shape having a second portion formed on the surface
Thus, the connecting means is provided between the end face of the housing and the
2 is connected to the circuit board .

[0012]

[0013]

[0014]

According to a third aspect of the present invention, there is provided a housing body (2) having a box-like shape having a recess, wherein a sensor chip (3) which is displaced by acceleration is mounted in the recess. A lid (4) attached to the front surface of the concave portion of the housing main body to form a hollow portion for accommodating the sensor chip and hermetically sealing the hollow portion; An electric wiring (84, 84) formed on one surface of the outer periphery (the upper surface of the housing body 2) and the other surface (the back surface of the housing body 2) orthogonal to the one surface and for extracting electric signals indicating the displacement state of the sensor chip. 93), a circuit board (10) on which a circuit element that operates based on the electric signal is formed, and one of the one surface and the other surface is electrically connected to the circuit board. And mechanically connected, is characterized in acceleration detecting device and a connection means (12) for fixing said housing body to the circuit board.

According to the fourth aspect of the present invention, the second aspect or the second aspect
3. The acceleration detecting device according to 3 , wherein the housing main body is formed by laminating a plurality of insulating substrates. In the invention described in claim 5, in the acceleration detection device according to any one of claims 1 to 4, wherein the connecting means is characterized in that a conductive bonding agent.

In the invention according to claim 6 , the first,
A housing (2, 4) having a second outer wall (an outer wall on the upper surface and a rear surface of the housing body 2) and having a hollow portion (5); A sensor chip (3) for outputting an electric signal indicating a state; and an electric wiring means (7, 84, having a pad area (93) formed on the first and second outer walls for extracting the electric signal). 93), and one of the pad regions formed on the first and second outer walls is electrically and mechanically connected to the circuit board (10), and the housing is fixed to the circuit board. hand
There is characterized in Rukoto.

According to a seventh aspect of the present invention, in the acceleration detecting device according to any one of the second to ninth aspects, the acceleration detecting device is electrically connected to the sensor chip to detect acceleration by displacement of the sensor chip. A processing circuit for outputting a signal is provided in the hollow portion.
You.

According to the invention described in claim 8 , the inside
It has a hollow part (5) and a flat end face on the outside
Having an acceleration shape in the hollow portion.
Housing with displaced sensor chip (3)
(2, 4) and inside and of this housing
It is formed on the outer periphery and indicates the displacement state of the sensor chip.
Electric wiring (83, 92) for extracting electric signals;
Having a circuit element that operates based on the electric signal
A circuit wiring (11) connected to the circuit element is formed.
Circuit board (10), the electric wiring and the circuit arrangement
And wire means (19) for electrically connecting the line, the c
The end of the housing is connected to the circuit board, and the housing is
Connecting means (12) for fixing the ring substantially vertically, and a step
And a case (18) to the the upper part of the step
The circuit board is attached, and the housing is fixed to the lower part.
And the housing and the circuit board are substantially flush with each other.
It is characterized in that it is formed in a plane. Claim 9
In the invention described in (1) , the circuit board is mounted on a circuit board (10).
A box-shaped acceleration sensor having a concave portion.
Therefore, the sensor chip (3) displaced by the acceleration
A housing body (2) mounted in the recess;
Attached to the front of the recess of the housing body,
Forming a hollow portion for accommodating the sensor chip;
Lid for hermetically sealing the hollow portion (4), said housings
Inside the housing body, one side of the outer periphery of the housing body (housing
Upper surface of the main body 2) and the other surface orthogonal to one surface thereof
(The back surface of the housing body 2) and the sensor
Electricity for extracting an electric signal indicating the displacement state of the chip
Wiring (84, 93), and is formed on the one surface and the other surface.
The circuit board using any one of the formed electric wires.
Electrical and mechanical connections to the
It is characterized by. In the invention according to claim 10,
Is a acceleration sensor mounted on the circuit board, the
1, the second outer wall (on the upper and lower surfaces of the housing body 2)
Having a hollow portion (5) and a hollow portion (5)
(2, 4) , installed in the hollow part and accelerated
And outputs an electric signal indicating the displacement state
Sensor chip (3) and the first and second outer walls
A pad area (93) is formed and the electrical signal is received.
Electrical wiring means (7, 84, 93)
And pad regions formed on the first and second outer walls.
Electrically or mechanically to the circuit board using any one of
The feature is that it can be connected mechanically
You. The reference numerals in parentheses of the above means indicate the correspondence with specific means described in the embodiments described later.

[0020]

According to the first to seventh aspects of the present invention, the sensor chip is mounted in the hollow portion of the housing. An electric signal indicating the displacement state of the sensor chip is taken out to the outside by electric wiring formed inside the housing and on the flat end surface. The end face of the housing is electrically and mechanically connected to the circuit board,
As a result, the housing is fixed substantially vertically to the circuit board, and the electric signal is transmitted to the circuit board.

Therefore, the housing having the flat end face is electrically and mechanically connected and fixed to the circuit board.
No ze require conventional such fixed plate, and because the electrical and mechanical connection is made at one location, Ru can be a simple structure as compared with the prior art.

According to the third and sixth aspects of the present invention, in such an acceleration detecting device, the housing can be fixed to the circuit board in both the vertical direction and the horizontal direction, and can be freely mounted. The degree can be increased. In the invention according to claim 8 , electric wiring for extracting an electric signal indicating the displacement state of the sensor chip is formed in the housing and on the outer peripheral portion of the housing, and the electric wiring and the circuit wiring on the circuit board are formed. Connection is made by wire means. Further, the flat end surface of the housing is fixed substantially vertically to the circuit board.

Therefore, also in the present invention, the acceleration detecting device can be configured with a simple configuration without requiring the conventional fixing plate. The invention according to claims 9 and 10
In the acceleration detecting device according to the third and sixth aspects.
The acceleration sensor which can be provided can be provided.

[0024]

【Example】

(First Embodiment) FIG. 1 shows a cross-sectional side view of an acceleration sensor (hereinafter referred to as a G sensor) 1 in an acceleration detecting device. The G sensor 1 includes a housing body 2, a sensor chip 3, a lid 4, and the like.
It is mounted substantially perpendicular to the circuit board 10. The housing is composed of the housing body 2 and the lid 4.

The housing body 2 is a box having a concave portion formed by laminating a plurality of insulating substrates such as ceramics and glass, and has a hollow portion 5 for accommodating the sensor chip 3 and the like. I have. The hollow portion 5 is hermetically sealed by bonding the lid portion 4 made of a ceramic material to the housing main body portion 2 with solder, low melting point glass, an adhesive, or the like. The lid 4 is provided to protect the sensor chip 3 from external water vapor and the like. The lid 4 can be made of an insulator such as glass or a metal other than the ceramic material.

The sensor chip 3 is bonded and fixed to the inner surface of the housing main body 2 by a die bonding agent 6. The sensor chip 3 has a cantilever composed of a weight 3a and a thin portion 3b formed on a single crystal silicon substrate, and detects the displacement of the weight 3a with a strain gauge provided on the thin portion 3b. This strain gauge is bridge-structured in a known manner, and acceleration is detected by a processing circuit. In addition,
Although not shown in FIG. 1, the processing circuit is formed on the surface of the housing main body 2 on which the sensor chip 3 is formed.

The housing body 2 is provided with wirings 8 and 9 for electrical connection with the outside. The wires 8 are electrically connected to wire pick-up pads provided on the sensor chip 3 and a processing circuit (not shown) by wire bonding using wires 7 of Al, Au, or the like. It is electrically connected to a wiring 9 that forms a pad region and is formed on the end face, upper face, and lower face of the portion 2. Here, the wires 7 and the wirings 8 and 9 constitute electric wiring means for extracting electric signals from the sensor chip 3.
The wiring 8 may be formed by forming a via hole in the substrate as in the embodiment of FIG. 7 described later.

The G sensor 1 is fixed substantially vertically on a circuit board 10 on which circuit elements such as an ECU are mounted by a bonding agent 12 such as solder or Ag paste. Here, the wiring 9 formed on the housing body 2 and the wiring 11 (circuit wiring connected to the circuit element) formed on the circuit board 10 are electrically connected via the bonding agent 12. Therefore, the G sensor 1 is electrically and mechanically connected to the circuit board 10 by the bonding agent 12.

With the above configuration, the G sensor 1 can be mounted substantially perpendicular to the circuit board 10. In the above embodiment, the housing body 2 and the lid 4 are made of a ceramic material or the like, unlike the conventional one. Even in such a configuration,
By providing an amplifier for noise suppression in the processing circuit in the G sensor 1 and providing a filter for noise removal in the circuit on the circuit board 10 side, sufficient noise suppression can be taken.

FIG. 2 shows the structure of the housing body 2. 2A to 2E show the upper surface, the front surface, the lower surface, the side surface, and the rear surface of the housing body 2, respectively.
As shown in FIG.
Are formed, and the sensor chip 3 and the like are formed on the A surface of the hollow portion 5. In addition, a wiring 8 is formed in the housing main body 2, and an upper surface of the housing main body 2 shown in FIG.
The wiring 9 is formed on a part of the front and back surfaces. The B side is connected to the circuit board 10 via the bonding agent 12, and the wiring 9 is electrically connected to the wiring 11 on the circuit board 10.

The housing body 2 is formed by stacking punched substrates. A method of manufacturing the same will be described with reference to FIG. ceramic,
Prepare six substrates made of an insulator such as glass (the number of layers is determined by the size of the housing, circuit scale, etc.)
The upper three sheets are punched as shown in FIG. In these six substrates, a large number of punched holes are formed in one substrate as shown in FIG. 4 in order to form a large number of housing main bodies at one time.

Then, as shown in FIG. 3 (B), a conductive paste 13 is printed and formed at a predetermined position, and they are laminated and pressed (FIG. 3 (C)). Next, as shown in FIG. This cutting is performed in the vertical direction of FIG. 4, that is, in the direction indicated by the dotted line in the figure. Thereafter, as shown in FIG. 3E, a conductive paste 14 is printed and formed on the side surface to be the B surface so as to be connected to the conductive paste 13 formed earlier. Thereafter, baking is performed, Cu or Ni or Au plating is applied (FIG. 3F), and further cut laterally with a cutter or the like to form one housing body 2.

It should be noted that the conductor pastes 13 and 14 are
9 is formed. The sensor chip 3 and the like are bonded and fixed to the housing main body 2 in the hollow portion 5, and the lid 4 is bonded and fixed to the front surface of the housing main body 2. Thereafter, as shown in FIG. 1, the end surface of the housing body 2 is fixed to the circuit board 10 by a bonding agent 12 substantially vertically.

The verticality between the G sensor 1 and the circuit board 10 is determined by the dimensional accuracy of the housing body 2. The parallelism of the surface A can be formed at 0.5 ° or less, and the perpendicularity of the surface B is determined by the accuracy of a cutter or the like that cuts the surface B and can be processed with an accuracy of 0.5 ° or less. Therefore, as a whole, 1 °
The G sensor 1 can be fixed substantially vertically to the circuit board 10 with the following inclination.

In the above embodiment, FIGS. 3D and 3E
As shown in the figure, the conductor paste 14 is printed and formed on the end face after cutting the laminated substrate, but the conductor paste is formed in advance using via holes,
The substrate may be cut in the same vertical and horizontal steps.
That is, as shown in FIG. 5A, a via hole 15 is formed in each substrate together with the punching of the substrate.
In the step (B), the conductive paste 1 is applied to the substrate as in FIG.
3 is printed, and a conductive paste is embedded in the via hole 15 at the same time.

Thereafter, as shown in FIG. 5 (C), the respective substrates are laminated, pressed, and baked, and then plated as shown in FIG. 5 (D). Finally, a via hole 15 is formed. One housing body 2 is cut in the vertical direction (the direction of the dotted line in FIG. 4) with a cutter or the like, and also in the horizontal direction. By forming the wiring 9 using the via holes 15 in this manner, the vertical and horizontal directions can be performed in the same process, so that a large amount of the housing main body 2 can be manufactured at once. (Second Embodiment) This embodiment is a modification of the first embodiment in which the structure of the housing is modified. In this embodiment, as shown in FIG. 6, a flat substrate 21 is used, and a hollow portion is provided on the lid 41 side. Lid 4
Reference numeral 1 denotes a metallic member having a concave shape,
Adhesively fixed to one side. Thus, a hollow portion 5 for housing the sensor chip 3 is formed, and the inside of the hollow portion 5 is hermetically sealed. In addition, a recessed lid 4
1, the thickness in the width direction can be increased, and the stability when bonded to the circuit board 10 can be improved.

In this embodiment, a via hole is provided in the substrate 21, a wiring 81 is formed in the via hole, and connected to the wiring 9 formed on the end face. Note that the lid 41 may be made of ceramic, glass, or the like in addition to the metallic one. (Third Embodiment) In this embodiment, as shown in FIG. 7, a metal L-shaped lid 42 is used. By using such an L-shaped lid 42, G
The stability when fixing the sensor 1 to the circuit board 10 is improved, and as a result, the thickness of the housing body 2 can be reduced.

As in the first embodiment, the housing main body 2 is formed by laminating a plurality of insulating substrates, and the wiring 8 is formed in the housing main body 2 via a via hole.
2 is formed, and the wiring 82 is formed on the end face of the wiring 9
Connected to The L-shaped lid 42 may be made of ceramic, glass, or the like, instead of metal. (Fourth Embodiment) In this embodiment, as shown in FIG. 8, the housing body 2 is formed by molding a resin without using a laminated substrate. As this resin, a liquid crystal polymer or the like having a low moisture permeability can be used. The lid 43 is also made of resin in consideration of the coefficient of thermal expansion with the resinous housing body 22.

FIG. 9 shows a method of manufacturing the above. First,
As shown in FIG. 9A, a resin using a liquid crystal polymer is insert-molded, and then a via hole 16 is formed. As shown in FIG. 9B, Cu or Ni
Alternatively, plating with Au or the like is performed, and then, as shown in FIG.
After forming a resist on the entire surface as shown in FIG. Finally, as shown in FIG. 9D, etching is performed to obtain a wiring pattern 91 having a desired shape.

In order to increase the airtightness in the hollow portion 5 with respect to the formation of the via hole 16, the bonding agent 1 is added to the via hole 16.
7 is provided for hermetic sealing. The lid 4
3 may be made of metal other than resin as long as it has a thermal expansion coefficient close to that of the housing body 22. (Fifth Embodiment) In this embodiment, as shown in FIG. 10, a resin case 18 is used, a step is provided in the resin case 18, and the G sensor 1 is bonded and fixed to a lower part of the step. It was made. The circuit board 10 is fixed to an upper portion of the resin case 18.

The G sensor 1 has wirings 83 and 92
Are formed, and are electrically connected to the circuit board 10 by wire bonding with the wires 19. With such a configuration, the G sensor 1 and the circuit board 10 can be formed in substantially the same plane. Note that the third
In the fifth to fifth embodiments, the lid is made of metal, resin, or the like, but may be made of ceramic or the like. (Sixth Embodiment) This embodiment is shown in FIGS. The G sensor 1 is fixed on a circuit board 10 on which circuit elements a and b, such as ECUs, are mounted, at the same time as the circuit elements a, b, by a bonding agent 12 such as solder or Ag paste, for example, by reflow. In addition, not only in the sixth embodiment but also in the first embodiment and the like, the circuit elements a and b are mounted on the circuit board 10 and the G sensor 1 is
At the same time, it is fixed on the circuit board 10.

Here, the wirings 93, 95 or 94, 95 formed on the housing body 2 and the wirings 11 formed on the circuit board 10 (circuit wiring connected to the above-mentioned circuit elements)
Are electrically connected via the bonding agent 12. Therefore, G
The sensor 1 is attached to the circuit board 10 by the bonding agent 12.
It will be electrically and mechanically connected. Since the circuit board 10 on which the G sensor 1 is mounted is mounted on a surface parallel to the floor in the vehicle cabin, the above-described various embodiments show the case where the G sensor 1 is fixed to the circuit board 10 only in the vertical direction. Is the circuit board 1 on which the G sensor 1 is mounted
In a case where 0 is mounted in the handle, the G sensor 1 is fixed to the circuit board 10 in the horizontal direction.

Therefore, in this embodiment, the G sensor 1 can be selectively fixed to the circuit board 10 not only in the vertical direction but also in the horizontal direction, so that the degree of freedom in mounting the G sensor 1 is increased. . For this reason, as shown in FIG. 11, wirings 93 to 95 are formed on the outer peripheral surface of the housing main body 2, and the wirings 93 are electrically connected to the wirings 11 on the circuit board 10. In this case, since the wiring 93 is formed on the upper surface (the bottom surface in the mounted state of FIG. 11A) and the rear surface of the housing main body 2, the wiring 93 is formed as shown in FIG.
(B) As shown respectively, the wiring 93 and the wiring 11 on the circuit board 10 can be electrically connected regardless of whether the wiring 93 is fixed vertically or horizontally with respect to the circuit board 10.

In this embodiment, the wiring 84 is formed by forming a via hole in the housing body 2. Other configurations are the same as those shown in the first embodiment. FIG. 12 shows a configuration of the housing body 2 in the present embodiment. (A) to (E) show the upper surface, the front surface, the lower surface, the side surface, and the rear surface of the housing body 2, respectively. As shown in FIG.
Are formed separately from the wiring 93. Wiring 93-9
5 can be formed without separation, but it is preferable to separate them in consideration of the durability of the bonding agent 12.

Although the wirings 94 and 95 are dummy wirings that are not related to signal transmission, wirings 84 and the like may be provided for these wirings as signal wirings.
In the various embodiments described above, the processing circuit is not limited to being formed on the same surface as the sensor chip 3 in the housing main body 2, and may be formed integrally with the sensor chip 3. It may be provided on the outer peripheral surface of the main body 2. Further, the signal from the sensor chip 3 may be received and the signal processing may be performed on the circuit board 10 side. In any case, the electric signal taken out of the housing body 2 is an electric signal indicating the displacement state of the sensor chip described in the claims.

Further, in the above embodiment, the one using the strain gauge type acceleration sensor using single crystal silicon is shown, but the present invention can also be applied to a thin film capacitive type acceleration sensor using polycrystalline silicon or the like .

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

2 (A) is a top view, FIG. 2 (B) is a front view, FIG. 2 (C) is a bottom view, FIG. 2 (D) is a side view, and FIG. Is a rear view.

FIG. 3 is a process diagram showing a manufacturing process of the housing body 2.

FIG. 4 is a perspective view showing six substrates constituting the housing body 2.

FIG. 5 is a process diagram showing another manufacturing process of the housing body 2.

FIG. 6 is a sectional view showing a second embodiment of the present invention.

FIG. 7 is a sectional view showing a third embodiment of the present invention.

FIG. 8 is a sectional view showing a fourth embodiment of the present invention.

FIG. 9 is a process diagram showing a manufacturing process of the housing body 22 in FIG.

FIG. 10 is a sectional view showing a fifth embodiment of the present invention.

FIG. 11 is a sectional view showing a sixth embodiment of the present invention;
(A) is a state in which the G sensor is vertically fixed to the circuit board,
(B) shows a state where the G sensor is horizontally fixed to the circuit board.

12 (A) is a top view, FIG. 12 (B) is a front view, FIG. 12 (C) is a bottom view, FIG. 12 (D) is a side view, and FIG. Is a rear view.

FIG. 13 shows a configuration of a conventional acceleration detection device.
(A) is a side cross-sectional view, and (B) is a plan view of the housing 100 with the lid 100a removed.

14 is a schematic sectional configuration diagram of a housing 100 in FIG.

[Description of Signs] 1 ... G sensor, 2 ... housing body, 3 ... sensor chip, 4 ... cover, 5 ... hollow, 8, 9 ... wiring, 10 ... circuit board, 12 ... bonding agent.

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Yasuki Shimoyama 1-1-1, Showa-cho, Kariya-shi, Aichi Japan Inside Denso Co., Ltd. (56) References JP-A-8-94663 (JP, A) JP-A-5-946 322915 (JP, A) JP-A-5-72227 (JP, A) JP-A-5-223839 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G01P 15/08

Claims (10)

(57) [Claims] 1. A housing having a hollow portion inside and a flat end surface, wherein a housing in which a sensor chip displaced by receiving an acceleration is mounted in the hollow portion is provided. An electric wiring formed to take out an electric signal indicating a displacement state of the sensor chip, a circuit board on which a circuit element operating based on the electric signal is formed, and an end face on which the electric wiring is formed, Connecting means for electrically and mechanically connecting to the circuit board to fix the housing substantially vertically to the circuit board , wherein the housing has a flat substrate on which the sensor chip is mounted, and a concave portion. Having a shape having
To form the hollow portion and
And a lid that hermetically seals the lid . 2. A flat end having a hollow portion therein.
Surface having an acceleration in the hollow portion.
Housing with a sensor chip displaced by receiving
And a housing formed in the housing and on the end face,
For extracting an electric signal indicating the displacement state of the sub chip.
A wiring element and a circuit element that operates based on the electric signal are formed.
The circuit board and the end face on which the electric wiring is formed are electrically connected to the circuit board.
And mechanically connect the housing to the circuit
A connection means for fixing the sensor chip substantially vertically to the substrate, wherein the housing has a recess for accommodating the sensor chip.
A main body, and attached to the front surface of the recess of the housing main body,
Forming the hollow part and hermetically sealing this hollow part
And a first portion attached to the entire surface of the concave portion.
And a second portion formed on the same plane as the end face.
An L-shape, wherein the connecting means comprises an end face of the housing and the second portion
And an acceleration connected to the circuit board.
Detection device. 3. A housing body having a recess having a concave shape, wherein a sensor chip displaced by receiving an acceleration is mounted in the recess, and a sensor body mounted on a front surface of the recess of the housing body.
A lid portion that forms a hollow portion in which the sensor chip is housed and hermetically seals the hollow portion; and a housing body portion, formed on one surface of the outer periphery of the housing body portion and another surface orthogonal to the one surface, An electric wiring for extracting an electric signal indicating a displacement state of the sensor chip; a circuit board on which a circuit element operating based on the electric signal is formed; and one of the one surface and the other surface, the circuit A connection means electrically and mechanically connected to the board to fix the housing body to the circuit board. 4. The acceleration detecting device according to claim 2 , wherein the housing main body is formed by laminating a plurality of insulating substrates. Wherein said connecting means, the acceleration detecting device according to any one of claims 1 to 4, characterized in that a conductive bonding agent. 6. A housing having first and second outer walls and having a hollow portion, a sensor chip mounted in the hollow portion, the sensor chip being displaced by receiving an acceleration, and outputting an electric signal indicating the displaced state; Electric wiring means for extracting the electric signal having a pad region formed on the first and second outer walls, wherein one of the pad regions formed on the first and second outer walls is a circuit substrate is electrically and mechanically connected, the acceleration detecting device, wherein the housing is characterized in Tei Rukoto fixed to the circuit board. 7. The method of claim 1, wherein the processing circuit for outputting the electrical signal to detect the acceleration by the displacement of electrically connected to the sensor chip the sensor chip is provided in the hollow portion The acceleration detection device according to any one of the above. 8. A housing having a hollow portion inside and a flat end surface outside, wherein a housing is provided with a sensor chip which is displaced by receiving acceleration in the hollow portion. An electric wiring formed on an outer peripheral portion of the sensor chip for extracting an electric signal indicating a displacement state of the sensor chip; and a circuit wiring having a circuit element operated based on the electric signal and connected to the circuit element. A circuit board, a wire means for electrically connecting the electric wiring and the circuit wiring, a connecting means for connecting an end face of the housing to the circuit board, and fixing the housing substantially vertically, and a step. Having a case , wherein the circuit board is attached to an upper portion of the step,
The housing is fixed to the part, and the housing and the front
An acceleration detecting device, wherein the circuit board and the circuit board are formed in substantially the same plane . 9. An acceleration sensor mounted on a circuit board.
Therefore, it is a box-shaped one having a concave portion, and is displaced by acceleration.
Housing having a sensor chip to be mounted in the recess
A main body, and attached to the front surface of the recess of the housing main body,
Forming a hollow portion for accommodating the sensor chip;
A cover portion for hermetically sealing the hollow portion, and an outer periphery of the housing body portion inside the housing body portion.
Surface and another surface orthogonal to one surface thereof,
For extracting an electric signal indicating the displacement state of the sub chip.
And electrical wiring formed on the one surface and the other surface.
Electrically and mechanically connected to the circuit board using
An acceleration sensor characterized in that it can be used. 10. An acceleration sensor mounted on a circuit board.
And a housing having first and second outer walls and having a hollow portion.
Jing and mounted inside the hollow portion, and displaced by acceleration.
And a pad area formed on the first and second outer walls.
Electrical wiring means for extracting the electrical signal.
The pad regions formed on the first and second outer walls
Electrical or mechanical to the circuit board using either
Acceleration that can be connected to
Sensor.