JP2853645B2 - Polishing tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polishing tape used for high-precision polishing.

[0002]

2. Description of the Related Art Conventionally, this type of polishing tape is shown in FIG.
As shown in (B), the particles 6 are attached to the surface of the
It is fixed and formed. In order to polish the end face of the workpiece using the polishing tape 31 thus formed, as shown in FIG. 5A, the polishing tape 31 is rotated while rotating the workpiece 2 around a vertical axis. The polishing tape 31 is vertically pressed to the polishing table 3 and wound up by a take-up roll 35 while sending the polishing tape 31 from a supply roll 34, during which the polishing liquid 33 is dropped just before the workpiece 2 on the surface of the polishing tape 31. Supply, promote the discharge of polishing debris and cooling of the polishing processing point,
Polishing is performed while suppressing clogging of the polishing tape 31 and generation of polishing heat, and the polished end face 12 is finished to a high-precision surface free of scratches and scratches. Polishing liquid 33
In general, a liquid selected from water and the like is used.

[0003]

As described above, in order to carry out polishing using a conventional polishing tape, it is necessary to provide a polishing liquid supply device and a polishing liquid storage tank associated with the polishing apparatus. Therefore, there is a disadvantage that the entire polishing apparatus cannot be downsized, and when the polishing apparatus is tilted, the polishing liquid is dripped, so that the apparatus cannot be easily carried. There is a drawback that it must be installed horizontally.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a highly polished surface free of scratches and scratches during polishing, to make the entire polishing apparatus compact, to be easily carried, and to cause dripping even when inclined. It is an object of the present invention to provide a polishing tape suitable for a polishing apparatus. Further, it is assumed that the polishing tape can always obtain stable polishing performance even if the polishing process is interrupted or stored for a long time in an unused state.

[0005]

A polishing tape according to a first aspect of the present invention is obtained by winding a thin strip-shaped base material having particles fixed on the surface thereof in a cylindrical shape with a binder selected from a resin or the like. In such a polishing tape, the surface of the substrate to which the grains are fixed has fine droplet-like or thin layer-like polishing liquid, and is wound in a cylindrical shape so as to be in close contact with the back surface of the substrate.

[0006] The minimum amount of polishing liquid required for polishing is applied to the surface of the base material without dripping. When the polishing tape is not used, the polishing liquid on the surface of the substrate hardly evaporates because the polishing liquid on the surface of the substrate and the back surface of the substrate are closely wound. Therefore, it is not necessary to newly supply a polishing liquid during the polishing process, so that the entire polishing apparatus can be reduced in size and can be easily transported.

A polishing tape according to a second aspect of the present invention is a polishing tape obtained by winding a thin strip-shaped base material having grains formed on a surface thereof with a binder selected from a resin or the like in a cylindrical shape. The surface of the substrate on which the grains are fixed has a fine droplet-like or thin layer-like polishing liquid and a film that is in close contact with the upper surface of the polishing liquid, and the upper surface of the film is in contact with the back surface of the substrate. , Wound in a cylindrical shape.

In the present invention, as in the first invention, a minimum amount of polishing liquid required for polishing is applied to the surface of the substrate. In addition, in a state where no dripping occurs and the polishing tape is not used, the polishing liquid hardly evaporates because the surface of the base material is in close contact with the film. When performing the polishing process, since the polishing tape is used by peeling the film immediately before the polishing point, the amount of the polishing liquid that evaporates can be minimized before reaching the polishing point. For this reason, the present invention does not require a new supply of a polishing liquid during polishing, as in the first invention.
Therefore, the entire polishing apparatus can be reduced in size and can be easily transported.

According to a third aspect of the present invention, in the polishing tapes of the first and second aspects, disk-shaped plates are provided at both ends in the axial direction wound in a cylindrical shape, and the plates are attached to both ends of the base material. It is to adhere to the part.

In the present invention, the polishing liquid previously applied to the surface of the substrate is sealed not only on the front and back sides of the substrate, but also on both ends in the axial direction of the cylindrical tape. Therefore, even if the polishing tape is stored in an unused state for a long period of time, the polishing liquid is not dried and stable polishing performance is always obtained.

According to a fourth aspect of the present invention, there is provided the polishing tape according to the first, second and third aspects, wherein an adhesive is applied in advance near both side edges of the surface of the base material, and the tape is formed into a cylindrical shape. When the tape is wound, the both ends of the tape are sealed with an adhesive.

When the polishing tape of the present invention is pulled out from the supply roll for polishing, the adhesive provided near both side edges of the substrate is peeled off. Similarly to the third invention, when the polishing tape is not used, the polishing liquid previously provided on the surface of the base material is not only applied to the front side and the back side of the base material, but also to both ends in the axial direction of the cylindrical tape. But it is sealed. Therefore, even if the polishing tape is stored in an unused state for a long time, the polishing liquid does not dry, and stable polishing performance is always obtained.

[0013]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a schematic view showing a polishing apparatus using the polishing tape of the first invention according to the present invention, and a configuration of the polishing tape. FIG. 1 (A) is a side view of the polishing apparatus, and FIG. FIG. 2 is a partially enlarged cross-sectional view of a polishing tape wound in a shape.

The polishing tape 1 has a thin belt-like shape and flexibility and is hardly permeable to a polishing liquid or air. The polishing liquid 13 is formed by applying a fine droplet or thin layer of the polishing liquid 13 on the surface, and is wound into a cylindrical shape before the polishing liquid 13 evaporates to form the supply roll 4.
Before the polishing tape 1 is pulled out from the supply roll 4,
In a cylindrical unused state before being attached to the supply roll 4, the surface of the base material 7 is in close contact with the back surface.

Therefore, in this state, since the base material 7 blocks penetration of the polishing liquid 13 and passage of air, the polishing liquid 13 applied to the surface of the base material 7 hardly evaporates. Since the amount of the applied polishing liquid 13 is so small that polishing can be performed, even if the polishing apparatus is tilted, the problem of dripping does not occur.

FIG. 1A is a schematic side view of a polishing apparatus using the polishing tape 1 thus formed. The supply roll 4 is a supply roll on which the polishing tape 1 is wound and mounted. The polishing tape 1 is pulled out from the supply roll 4 by rotating the take-up roll 5, and is sent between the polishing table 3 and the workpiece 2. A predetermined vertical load and rotation about an axis are applied to the workpiece 2, and the end face 12 is polished. The polishing liquid required for polishing is a polishing tape 1
The required minimum amount is given by the polishing liquid 13 applied in advance to the surface of the substrate, and the discharge of polishing debris and the cooling of polishing heat are performed.

FIG. 2 is a schematic view showing a polishing apparatus using a polishing tape according to the second invention of the present invention, and a configuration of the polishing tape. FIG. 2A is a side view of the polishing apparatus, and FIG. )
FIG. 3 is a partially enlarged sectional view of a polishing tape.

The polishing tape 1a is one in which a film 9 is further provided in close contact with the upper surface of the polishing liquid 13 applied to the polishing tape 1 according to the first invention to prevent the polishing liquid 13 from evaporating. Supply roll 4 wound in a cylindrical shape
Is formed.

When the polishing tape 1a is in a cylindrical unused state before the film 9 is peeled off or mounted on the supply roll 4, the polishing tape 1a keeps the surface of the substrate 7 and the film 9 in close contact with each other. Since the penetration of 13 and the passage of air can be blocked, the polishing liquid 13 on the surface of the base material 7 does not evaporate.

The polishing tape 1a is transported between the polishing table 3 and the workpiece 2 after the film 9 is peeled off from the substrate 7 using the guide roller 15 immediately before the polishing point, and is subjected to polishing. Used. The peeled film 9 is collected by a film take-up roll 11.

The difference between the second invention and the first invention is that
The point is that the film 9 is peeled off immediately before the polishing process to expose the surface of the substrate 7. For this reason, the distance from the surface of the base member 7 to the outside air to the polishing point is short. During this time, the amount of the polishing liquid 13 evaporating could be minimized as compared with the first invention.

In this embodiment, the amount of the polishing liquid 13
Even if the polishing tape 1a is reduced to a half of the
Clogging and generation of polishing heat can be prevented, and the end surface 12 of the workpiece 2 can be polished to a highly accurate surface. There was no need to newly supply the polishing liquid 13, and there was no problem of dripping of the polishing liquid 13.

Further, when the workpiece 2 is replaced or the polishing is temporarily interrupted, the polishing tape 1 of the first aspect of the present invention uses the polishing liquid 13 previously applied to the surface between the supply roll 4 and the polishing point. Evaporation proceeds. On the other hand, in the present invention, the polishing liquid 13 evaporates only slightly due to the effect of the film 9, and the polishing liquid 1
As a result, it is possible to reduce the waste of sending the portion of the polishing tape 1a which has become unusable due to evaporation of the tape 3.

The supply roll 4 and the take-up roll 5 in FIG.
Rotation direction is opposite to that shown in FIG. 1,
The two rolls can be arranged in the same manner as in FIG. 1 and have the same rotational direction as in FIG.

FIG. 3 is a schematic view illustrating a third embodiment of the present invention. FIG. 3 (A) is a perspective view of a supply roll, and FIG. 3 (B) is a supply roll of FIG. 3 (A). It is an axial direction partial enlarged sectional view of a roll.

A feature of the third aspect of the present invention is that disc-shaped plates 10 provided on both ends in the axial direction of the tape are brought into close contact with both ends of the polishing tape 1 or 1a wound in a cylindrical shape. . The polishing tape 1 shown in FIG. 3 is such that the polishing liquid 13 is applied to the surface of the base material 7 in a thin layer, and the base material 7 is wound into a cylindrical shape before the polishing liquid 13 evaporates. And fixed firmly to both ends of the tape.

In the third aspect of the invention, as in the first and second aspects, the polishing tape 1 is pulled out from the supply roll 4a and fed between the polishing table 3 and the workpiece 2 for polishing. Clogging of the polishing tape 1 and generation of polishing heat were prevented, and the end surface 12 of the workpiece 2 was polished to a highly accurate surface. It is not necessary to newly supply the polishing liquid 13 and the polishing liquid 1
No problem of dripping of No. 3 occurred.

In FIG. 3, the polishing tape is connected to the first
Although the polishing tape 1 described in the second invention is shown, it can be replaced with the polishing tape 1a according to the second invention.

The polishing tapes 1, 1 of the first and second inventions
In the case of “a”, the front side and the back side of the substrate 7 are in close contact with each other in an unused state wound in a cylindrical shape, but the both ends in the axial direction of the supply roll 4 are not sealed. For this reason, when the polishing tapes 1 and 1a are stored in an unused state for a long period of 6 months or more, the polishing liquid 13 evaporates little by little from both ends,
Polishing performance decreased. On the other hand, in the third aspect of the present invention, since the disk-shaped plate 10 is provided at both ends in the axial direction of the roll, not only the front and back sides of the base material 7 but also the both ends can be sealed. Therefore, even if the polishing tapes 1 and 1a were stored for 6 months or more, the polishing liquid 13 did not evaporate, and stable polishing performance was always obtained.

FIG. 4 is a schematic view for explaining a fourth embodiment of the present invention. FIG. 4 (A) is a perspective view of a supply roll, and FIG. 4 (B) is a view of the supply roll of FIG. 4 (A). It is an axial direction partial enlarged sectional view.

The polishing tape 1b shown in FIG. 4 is formed by applying an adhesive 14 to both ends of the surface of the substrate 7 to which the grains 6 are fixed, and applying a polishing liquid 13 to the surface of the substrate 7. Is done.
Before the adhesive 14 and the polishing liquid 13 are dried and evaporated,
The polishing tape 1b is wound into a cylindrical shape to form a supply roll 4b.

Also in the present invention, the polishing tape 1b is pulled out from the supply roll 4b, and the polishing tape 1b is sent between the polishing table 3 and the workpiece 2 as in the first and second inventions.
Polishing was performed. Clogging of the polishing tape 1b and generation of polishing heat were prevented, and the end surface 12 of the workpiece 2 was polished to a highly accurate surface. There was no need to newly supply the polishing liquid 13, and there was no problem of dripping of the polishing liquid 13.

When the polishing tape 1b of the present invention is pulled out from the supply roll 4b for polishing, the base material 7
The adhesive 14 provided at both ends of the substrate 7 is peeled off, and the surface of the substrate 7 is exposed. As in the third invention, the base material 7 when not in use is used.
The polishing liquid 13 can be sealed not only on the front side and the back side but also on both sides, so that even when the polishing tape 1b is stored for 6 months or more, the polishing liquid 13 did not evaporate and stable polishing performance was always obtained.

[0034]

Next, an embodiment of the first invention will be described in detail with reference to FIG. In this embodiment, the material of the polishing table 3 is Teflon, and the winding length of the polishing tape 1 is 150 m.
The base material 7 was made of polyester and had a thickness of 25 μm, a width of 25 mm, and a 1.5 μm diameter diamond and particles 6 attached thereto. Pure water is used for the polishing liquid 13 and the layer thickness is about 10
After spraying and applying mist-like pure water until μm,
It was wound around the supply roll 4.

As the workpiece 2, a glass ferrule optical connector having a diameter of 2.5 mm into which an optical fiber having a diameter of 125 μm was inserted was used. The workpiece 2 was subjected to a vertical load of 150 gf, rotated at 200 rpm, and polished for 2.5 minutes. The polishing tape 1 is fed at a speed of 100 mm / min.
Was replaced.

In this embodiment, even if the polishing liquid 13 is not newly supplied, the end face 12 of the workpiece 2 is polished to a smooth mirror surface having a surface roughness of 0.03 μm Rmax or less and a distortion equal to or less than that of the prior art. did it.

In the embodiment of the second invention, as shown in FIG. 2, the winding length and width of the polishing table 3 and the polishing tape 1a, the thickness and the grain 6 of the base material 7 are different from those of the first embodiment of the invention. The same conditions were used. Film 9 is made of polyester and has a thickness of 25
8m, width of 25mm, 8m before polishing point
At point m, the substrate was peeled off from the substrate 7 using a cylindrical guide roller 15 having a diameter of 3 mm.

In this embodiment, since the evaporation amount of the polishing liquid 13 during the polishing process can be reduced as compared with the case of the first invention,
Pure water used as the polishing liquid 13 is sprayed and applied in the form of a mist until the layer thickness becomes about 5 μm, and before the polishing liquid 13 is dried, it is covered with a film 9 to produce a polishing tape 1a. Wound up. As in the case of the first invention, an optical connector made of a glass ferrule having a diameter of 2.5 mm into which an optical fiber having a diameter of 125 μm was inserted was used as the workpiece 2, the load was 150 gf, the rotation speed was 200 rpm, and the polishing tape 1a was used.
The polishing process was performed for 2.5 minutes at a feed speed of 100 mm / min.

Also in this embodiment, the end face 12 of the workpiece 2 can be polished to a smooth mirror surface having a surface roughness of 0.03 μm Rmax or less and a distortion of equal to or less than that of the prior art without newly supplying the polishing liquid 13. Was. In addition, the effect of the film 9 can eliminate wasteful feeding of the polishing tape 1a in which the polishing liquid 13 evaporates due to processing interruption or the like. Therefore, 550 workpieces 2 are formed by the polishing tape 1a having a winding length of 150 m.
Could be processed.

Next, an embodiment of the third invention will be described with reference to FIGS. In the present embodiment, the winding length and width of the polishing table 3 and the polishing tape 1, the thickness and the grain 6 of the substrate 7,
Polishing liquid 1 was used under the same conditions as in the embodiment of the invention.
Mist-like pure water was sprayed until the layer thickness of No. 3 became about 10 μm to produce the polishing tape 1.

Before the polishing liquid 13 dries, the polishing tape 1 is wound around a supply roll, and is made of polyester and has a thickness of 0.2 mm.
The plate 10 was fixed to both ends of the supply roll and adhered tightly to form the supply roll 4a. Due to the sealing effect of the plate 10, the polishing liquid 13 did not dry even when stored for 6 months or more after the production of the polishing tape 1. The end face 12 of the workpiece 2 could be polished to a smooth mirror surface having a surface roughness of 0.03 μmRmax or less and a distortion equal to or less than that of the conventional technique without newly supplying the polishing liquid 13.

Next, an embodiment of the fourth invention will be described with reference to FIGS. In the present embodiment, the winding length and width of the polishing table 3 and the polishing tape 1b, the thickness and the grain 6 of the substrate 7, and the same conditions as those in the embodiment of the first invention were used. First, the base material 7
After applying an adhesive 14 in a band shape with a width of 15 μm and a thickness of 20 μm on both side edges of the surface of
It was applied by spraying in a mist until it became 0 μm. Before the polishing liquid 13 and the adhesive 14 were evaporated and dried, the substrate 7 was wound into a cylindrical shape to produce a supply roll 4b of the polishing tape 1b.

Also in this embodiment, the end face 12 of the workpiece 2 is polished to a smooth mirror surface having a surface roughness of 0.03 μm Rmax or less and a distortion of equal to or less than that of the conventional technique without newly supplying the polishing liquid 13. did it. Further, since both ends of the base material 7 are sealed by the adhesive 14, the polishing tape 1b
After the production, the polishing liquid 13 was not dried even when stored for 6 months or more, and the polishing surface could be polished to the same mirror surface as immediately after the production.

In the above embodiment, the base material 7 is made of polyester and has a thickness of 25 μm and a width of 25 mm.
Although 1a and 1b were used, the same effect can be obtained by using Al ₂ O ₃ or SiC as the particle 6 and using a particle having a particle diameter different from that of the present embodiment.

Even if the base material is a round or square sheet, a polishing sheet having the same effect can be obtained by applying a polishing liquid on the surface of the base material in advance.

Although pure water was used as the polishing liquid in this embodiment, the same effect can be obtained by using tap water or a solvent.

[0047]

As described above, in the polishing tape of the present invention, a fine drop-like or thin layer-like polishing liquid is applied to the surface of the substrate on which the particles are fixed, so that another polishing liquid is applied during polishing. There is no need to apply it, and since the removal of polishing debris and the cooling of the polishing processing point are performed, a processed surface free of scratches and scratches can be obtained, and the entire polishing processing device can be miniaturized and can be easily carried, and polishing can be performed. There is an effect that no dripping occurs even if the device is tilted.

Since the polishing tape is wound into a roll, the upper and lower surfaces of the polishing liquid are in close contact with the substrate, so that evaporation of the polishing liquid can be prevented. If the surface of the polishing liquid is covered with a film and then wound around a roll and the film is removed immediately before the polishing point, the polishing liquid is more effectively prevented from evaporating.

If a disc-shaped plate is brought into close contact with both ends of the roll, or an adhesive is applied to both ends of the surface of the base material and wound up, both ends of the polishing liquid on the polishing tape are also sealed. Therefore, there is an effect that the polishing liquid does not evaporate even when stored for a long period of time and stable polishing performance can always be obtained.

[Brief description of the drawings]

FIG. 1 is a view showing an embodiment of a polishing tape according to the first invention of the present invention, wherein FIG. 1 (A) is a schematic diagram of a side surface of a polishing apparatus, and FIG. It is a partial enlarged sectional schematic diagram.

FIG. 2 is a view showing an embodiment of a polishing tape according to the second invention of the present invention, wherein FIG. 2 (A) is a schematic diagram of a side surface of a polishing apparatus, and FIG. It is a partial enlarged sectional schematic diagram.

FIG. 3 is a view showing an embodiment of the polishing tape of the third invention of the present invention, and FIG. 3 (A) is a perspective view of a supply roll,
FIG. 3B is an enlarged partial sectional view in the axial direction of FIG.

FIG. 4 is a view showing an embodiment of the polishing tape of the fourth invention of the present invention, wherein FIG. 4 (A) is a perspective view of a supply roll,
FIG. 4B is an enlarged partial sectional view in the axial direction of FIG.

5A and 5B are schematic views of an embodiment of a polishing tape according to the prior art, wherein FIG. 5A is a side view of a polishing apparatus, and FIG. 5B is a partially enlarged cross-sectional view of the polishing tape.

[Explanation of symbols]

 1, 1a, 1b, 31 Polishing tape 2 Workpiece 3 Polishing table 4, 4a, 34 Supply roll 5, 35 Take-up roll 6 and grains 7 Base material 8 Binder 9 Film 10 Plate 11 Film take-up roll 12 End face 13, 33 Polishing liquid 14 Adhesive 15 Guide roller

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-278038 (JP, A) JP-A-6-47677 (JP, A) JP-A-5-277958 (JP, A) JP-A-6-27958 254772 (JP, A) JP-A-4-129660 (JP, A) Japanese Utility Model Application Laid-open No. 53-161390 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) B24D 11/00 B24B 55 / 02 B24D 3/28

Claims (4)

(57) [Claims] 1. A binder selected from a resin or the like,
In a polishing tape in which a thin band-shaped substrate having particles fixed to the surface thereof is wound in a cylindrical shape, the surface of the substrate to which the particles are fixed is formed into a fine droplet or thin layer in advance. Having a layered polishing liquid, and the polishing liquid
The surface having the polishing liquid of the substrate so that the evaporation does not occur ,
A polishing tape, wherein the polishing tape is wound in a cylindrical shape in close contact with the back surface of the substrate . 2. A binder selected from a resin or the like,
In a polishing tape in which a thin band-shaped substrate having particles fixed to the surface thereof is wound in a cylindrical shape, the surface of the substrate to which the particles are fixed is formed into a fine droplet or thin layer in advance. The layered polishing liquid and the polishing liquid evaporate
No way and a film in close contact with the upper surface of the polishing liquid, and so that the upper surface of the film comes into contact with the back surface of the substrate, the polishing tape, wherein the wound cylindrically. 3. The polishing tape according to claim 1, wherein the polishing tape wound in a cylindrical shape has a disk-shaped plate that is in close contact with both cylindrical side surfaces of the tape. 4. An adhesive previously applied to both side edges of the surface of the base material is adhered to the back surface of the base material of the polishing tape wound in a cylindrical shape, and the polishing tape is attached to both side edges. The polishing tape according to any one of claims 1 to 3, which is sealed.