JP2847759B2 - Semiconductor substrate storage container - Google Patents

Description

The present invention relates to a container (hereinafter, referred to as a cassette) for storing a semiconductor substrate (hereinafter, referred to as a wafer) used in a semiconductor device manufacturing process.

[Conventional technology]

Conventionally, as shown in the perspective view of FIG. 9, a cassette of this type includes a pair of opposed wafer storage guides 1 each having a wafer storage groove 2 for storing a wafer 10, and And a reinforcing column 4 for supporting the opposing wafer storage guide 1.
The wafer removal direction 11 was the direction of the wafer storage groove 2.

Further, as shown in the explanatory views of FIGS. 10 and 11, the wafer 10 could only be placed either vertically (FIG. 10) or parallel (FIG. 11) with respect to the cassette mounting surface 12. .

In the wafer storage groove of the cassette, there is a space for taking in and out the wafer in the groove width. Therefore, when the cassette is transported with the wafer kept vertical, the wafer swings into the groove and the wafer is damaged. Also, when transporting wafers horizontally,
The wafer comes out of the cassette. In order to solve this, a method of placing the cassette on an inclined support table has been adopted.

Further, when processing wafers in a manufacturing apparatus or the like, it is often necessary to take out the wafers from a cassette. At that time, since the wafer is taken out vertically or horizontally,
It is necessary to change the attitude of the cassette. for that purpose,
The posture can be changed by lifting the cassette once and changing the direction, and then repositioning the cassette, or by using a mechanism that changes the direction of the support base itself.

[Problems to be solved by the invention]

The conventional cassette described above has a drawback that the angle of the wafer take-out direction with respect to the horizontal plane is uniquely determined by the inclination of the support table and cannot be set arbitrarily.

Another disadvantage is that a new mechanical mechanism is required to change the manner in which the cassette is placed. as a result,
The disadvantage is that the need to transfer cassettes is increased.

[Means for solving the problem]

The present invention relates to a semiconductor substrate storage container in which a storage guide portion having a groove for storing a semiconductor substrate on an inner surface thereof is disposed opposite to a semiconductor substrate storage container in which the semiconductor substrate storage container is tilted by its own weight in order to change the storage posture of the semiconductor substrate. A semiconductor substrate storage container provided with at least one pair of cylindrical projections serving as rotation support shafts at symmetrical positions on outer surfaces of both storage guide portions.

〔Example〕

Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment of the present invention, in which a pair of cylindrical convex portions (cassette support portions 5) are provided on both outer side surfaces of a wafer storage guide portion 1 opposed to the convex portions. The line segment connecting the cassette support portions 5 is provided at a position such that the line segment does not pass through a minimum region including the center of gravity of the entire cassette which may occur when the cassette is used.

2 and 3 are side views showing an operation procedure for installing the cassette of this embodiment. When placing a cassette, first, the cassette is supported by a fixed cassette receiving base 6 of the cassette support portion 5.
When the cassette is further lowered, the center of gravity of the cassette is not on the line connecting the cassette supporting portions 5, and the cassette rotates around the line connecting the pair of cassette supporting portions 5.
When the horizontal plane and the wafer take-out direction are at an arbitrary angle, the cassette is supported by a movable cassette receiving stand 7 so as to stop the rotation of the cassette, and the cassette can be stabilized to be movable.

Also, as shown in the side view of another operation procedure in FIG.
Even after the cassette has been once supported, the angle of the take-out direction with respect to the horizontal plane can be arbitrarily changed by moving the cassette receiving base 7 so that a force other than rotation is not newly applied to the cassette supporting portion 5. ing.

FIG. 5 is a side view showing a second embodiment of the present invention, in which a pair of cylindrical projections (cassette support portions 5 and 8) are provided on both outer side surfaces of a wafer storage guide portion 1 facing each other. The symmetry similar to that of the first embodiment is provided at such a position that the line connecting the pair of cassette support portions does not pass through the minimum area including the center of gravity of the entire cassette which may occur when the cassette is used. There are a total of two pairs of cassette supports.

6 and 7 are side views showing an operation procedure for installing the cassette of this embodiment. When placing a cassette, first, a pair of lower cassette supporting portions 5 is supported by a fixed cassette receiving base 6. The rest is the same as in the first embodiment, and the movable cassette receiver 9 plays the role of the cassette receiver 7.

FIG. 8 is a side view of the cassette showing another operation procedure. By moving the cassette receiving table 9, it is possible to arbitrarily change the wafer take-out angle with respect to the horizontal plane after the cassette is once supported.

〔The invention's effect〕

As described above, the present invention makes it possible to arbitrarily set the wafer unloading direction only by placing a cassette and to cope with a demand for a change in the wafer unloading direction, thereby making it possible to swing This has the effect of preventing and facilitating the loading of the wafer into the manufacturing apparatus, and at the same time reducing the cassette transfer operation.

In addition, a mechanism for moving the cassette receiving table up and down or moving is simple enough to incline the cassette, and the manufacturing apparatus does not have a complicated structure.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention, and FIGS.
Fig. 4 is a side view showing the operation procedure, Fig. 5 is a side view of the second embodiment of the present invention, Figs. 6, 7 and 8 are side views showing the operation procedure, FIG. 9 is a perspective view of a conventional cassette, and FIGS. 10 and 11 are explanatory views showing the removal of the wafer. 1... Wafer storage guide section 2... Wafer storage groove 3
...... Wafer receiving part, 4 ... reinforcing column, 5 ... cassette supporting part, 6 ... fixed cassette receiving base, 7 ... movable cassette receiving base, 8 ... cassette supporting part, 9 ... movable cassette receiving base , 10 ... wafer, 11 ... wafer unloading direction, 12 ...
... the installation surface.

Claims (1)

(57) [Claims] In a semiconductor substrate storage container having a storage guide portion having a groove for storing a semiconductor substrate on an inner surface thereof, the semiconductor substrate storage container is tilted by its own weight in order to change a storage posture of a semiconductor substrate. A semiconductor substrate storage container, wherein at least one pair of cylindrical projections serving as rotation support shafts are provided at symmetrical positions on outer surfaces of both storage guide portions.