JP2830235B2 - Inspection device and inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in the following order.

A. Industrial application fields B. Summary of the invention C. Prior art D. Problems to be solved by the invention E. Means to solve the problems F. Function G. Embodiment [FIGS. 1 to 4 Figure] a. Configuration [Fig. 1, Fig. 2, Fig. 4] b. Operation [Fig. 3] H. Effects of the Invention (A. Industrial Application Field) The present invention relates to an inspection apparatus, particularly an object to be inspected. The present invention relates to an inspection apparatus that moves an object to be inspected placed on a placement unit to an inspection unit using an object to be inspected, performs inspection, and classifies the inspected object that has been inspected into a non-defective product or a defective product.

(B. Summary of the Invention) In the above-described inspection, the present invention provides a defective product arranging unit in order to enable two inspections performed at different locations to be performed at a higher speed and to reduce the size of the apparatus. And a placement part also serving as a non-defective placement part,
Inspection unit, a second inspection unit, a holder moving means for moving above each of these parts, a rotating body rotatably held by the holder moving means, and both of the rotating body Using an inspection apparatus provided with a pair of inspection object holders held at a rotating end, the inspection object placement section of the inspection object, the inspection section, and the inspection object arrangement by the holder moving means. The inspection object is moved in the Y direction between the first inspection unit and the defective product placement unit, and the inspection object is moved between the first and second inspection units by rotating the rotating body.

(C. Prior Art) As the demand for ICs increases, the supply amount of ICs has been increased. However, it is necessary to conduct a large number of inspections of ICs that have been manufactured. Needless to say, the inspection of the electrical characteristics is of high importance, but the importance of the appearance inspection for checking the presence or absence of IC lead deformation and package mark defects is increasing. In particular, the importance of inspections to check for lead deformation of ICs is increasing.

The reason is that the number of leads increases and the pitch of the leads tends to decrease with the increase in integration of the IC, and the slight deviation of the leads and the ups and downs between the IC and the wiring film of the printed wiring board to which it is connected. This is because it causes a problem in consistency. Therefore, it is necessary to perform very precise and large-scale inspection, and it is virtually impossible to meet the need by visual inspection.

Therefore, the image processing method or Japanese Patent Laid-Open No. 1-2721
No. 26, JP-A-63-278345, etc., a lead bending inspection device using an optical displacement sensor has been developed.

(D. Problems to be Solved by the Invention) By the way, in the lead bending inspection apparatus, the image processing method can shorten the time required for the inspection as compared with the one using the optical displacement meter. Whether using an optical displacement meter or not, the problem is that the cycle time is lengthened by the time required to transport the IC under test.

In addition to the inspection of lead bending as an inspection of the external appearance of the IC, it is necessary to perform a mark inspection to determine whether the mark indicating the product name etc. printed on the package is properly printed. Since the inspection was performed by a mark inspection device different from the bending inspection device, it was necessary to transport the IC after the lead bending inspection or before the lead bending inspection to the mark inspection device, which also required the time required for the inspection. It was a factor that hindered the shortening of the work.

In order to effectively use the inside of a factory having a limited size, the inspection apparatus is required to be as small as possible.

Therefore, an object of the present invention is to make it possible to perform two inspections performed at different places at a higher speed, and to reduce the size of the apparatus.

(E. Means for Solving the Problems) In order to solve the above problems, the inspection apparatus of the present invention arranges a defective product placement section in which a defective product is placed and moved in the X direction by X direction driving means, A large number of objects are arranged, and the inspection object arrangement portion also serving as a non-defective product arrangement portion, which is moved in the X direction by the X direction driving means, the first inspection portion, and the second inspection portion are arranged in the Y direction. A holder moving means is provided which is moved in the Y direction by a Y direction driving means above the respective parts, and a rotatable body is rotatably held by the holder moving means, and a center of rotation of the rotating body is provided. A pair of inspection object holders are provided at positions opposite to each other so as to be separated from each other by a distance equal to the distance between the first inspection unit and the second inspection unit.

According to the inspection method of the present invention, a defective product placement unit, an inspection object placement unit also serving as a good product placement unit, a first inspection unit, and a second inspection unit are placed in the Y direction. A holder moving means is provided so as to be movable in the Y direction, the holder moving means rotatably holds the rotating body, and a pair of inspection objects are held at positions opposite to each other with respect to the center of rotation of the rotating body. Tools are provided so as to be separated from each other by a distance equal to the distance between the first inspection unit and the second inspection unit, and the holder moving unit is configured to dispose the inspection object on the inspection object, the inspection unit, The inspection object is moved in the Y direction between the inspection object placement portion and the defective product placement portion, and the rotation of the rotating body causes the inspection object to move between the first and second inspection portions or the inspection object corresponding thereto. It is characterized by moving.

(F. Operation) According to the present invention, since the holder moving means can be moved and the rotating body can be rotated, the defective product placement section, the inspection object placement section, the first inspection section, When the inspection object is transported to and from the second inspection unit by the inspection object holder, the moving stroke required for the holder moving means is set to a distance corresponding to the distance between the pair of inspection object holders of the rotating body. It can be shorter. That is, the object to be inspected is held by the holder in a state where the rotating body is rotated so that one of the holders is located inside the tip of the holder moving means by a rotation radius, and the holder is used. When the moving means is moved and the rotating body is rotated by 180 degrees, the moving amount of the inspection object held by the holder is equal to the moving amount of the holder moving means and the rotation radius of the holding tool of the rotating body by two. This is because the length is obtained by adding the double amount.

Therefore, the moving stroll required for the holder moving means can be further reduced, and the holder moving means can be further reduced in size.

Further, by rotating the rotating body at the same time as the movement of the holder moving means, it is possible to shorten the transport time of the inspection object held by the holder, and to improve the inspection efficiency.

The conveyance of the object to be inspected, which has been inspected by one of the first inspection unit and the second inspection unit, to the other simply involves rotating the rotating body by 180 degrees without moving the holder moving means. This can be done quickly. Therefore, two different types of inspections can be performed very quickly with one inspection device.

(G. Embodiment) [FIGS. 1 to 4] Hereinafter, the present invention will be described in detail with reference to illustrated embodiments.

1 to 4 are views for explaining one embodiment of the inspection apparatus of the present invention. FIG. 1 is an overall perspective view, and FIG. 2 is a perspective view showing two displacement sensors. is there.

(A. Configuration) [FIGS. 1, 2 and 4] Reference numeral 1 denotes a base of an inspection apparatus, on which a first base 2, a mark inspection machine 3 and a second base 4 are fixed. ing.
Reference numeral 5 denotes a tray stage provided on the first table 2 so as to be movable in the X direction indicated by an arrow 6, and is adapted to be moved in the X direction by driving means not shown in the drawing.

Reference numeral 7 denotes one half of the tray stage 5, specifically, the first
In the figure, a tray for IC to be inspected disposed in the lower right half of the tray, and a defective tray 8 disposed in the other half of the tray stage 5.

A large number of ICs 9, 9,... To be inspected from now on are stored in the inspected IC tray 7, which is placed on the above-mentioned half of the tray stage 5. And IC
Although the ICs 9 are inspected one by one, the ICs 9 which have been inspected and determined to be non-defective are returned to the original positions of the tray 7 for ICs to be inspected. Therefore, the inspected IC tray 7 also serves as a non-defective IC tray. On the other hand, the IC 9 determined to be defective is placed on the other half of the tray stage 5, specifically, on the defective tray 8 arranged on the upper left half in FIG.

Reference numerals 10 and 10 denote a pair of columns erected on the first table 2 and attached to the table 2 so as to be separated from each other in the Y direction indicated by the arrow 11. A stage 12 extending in the Y direction is fixed between the upper halves of the columns 10, 10. Reference numeral 13 denotes a movable plate mounted on the stage 12 so as to be movable in the Y direction on the side surface of the trays 7 and 8 (front), and is vertically oriented. Numeral 14 denotes a Z drive block mounted on the surface of the moving plate 13 for moving a lower vertical plate 15 in the Z direction (vertical direction) indicated by an arrow 16. Is the Z
The drive block 14 allows the height to be changed to a first height, a second height several centimeters lower than that, and a third height lower than that by about 2 mm.

17 is a holding rod 18, 18, 1 on the lower surface of the tip of the vertical moving plate 15.
An arm having one end attached via 8, 18 extends in the Y direction, and a vacuum chuck rotating mechanism 19 is attached to the other end of the arm 17. Reference numeral 20 denotes a mounting bracket for fixing the vacuum chuck rotation mechanism 19 to the end of the arm 17, and a rotary actuator 22 is mounted on a horizontal piece 21 of the bracket 20 with the rotation axis directed downward. The rotary actuator 22 rotates by 180 degrees, and the center of a rotating body 23 is fixed to a rotating shaft thereof.

Reference numerals 24a and 24b denote vacuum chucks vertically attached to both ends of the rotating body 23.

The IC 9 to be inspected on the tray 7 for IC to be inspected is vacuum-chucked by the IC transport mechanism including the members 12 to 24 and the like.
It is transported while being held at 24a and 24b. That is, the vacuum chucks 24a and 24b are moved in the Y direction by the moving plate 13, and are moved in the Z direction (that is, the height direction) by the Z drive block.

On the other hand, the inspection target IC tray 7 and the defective IC tray 8 are located below the moving path of the vacuum chuck rotating mechanism 19 in the Y direction, and can be moved in the X direction by the tray stage 5. Accordingly, one IC on the tray 7 is formed by a combination of these movements in the X, Y, and Z directions.
A vacuum chuck, for example, 24a, is positioned above 9 and the vacuum chucks 24a, 24b are lowered from the first height to a third height to cause the vacuum chuck 24a to vacuum-adsorb the IC9, and then the vacuum chucks 24a, 24b Is raised to the first height, and then the movable plate 13 is moved in the Y direction, whereby the IC 9 can be transported to the inspection section side.

In addition, the IC 9 that has been inspected on the inspection unit side can be returned to the tray 7 or 8 by a combination of the moving operations in the X, Y, and Z directions. In this inspection apparatus, in addition to the operation in the X, Y, and Z directions, a rotation operation of rotating the vacuum chucks 24a and 24b by 180 degrees in the rotation direction indicated by the arrow 25 by the operation of the vacuum chuck rotation mechanism 19 is performed. As a result, the transporting operation of the IC becomes considerably complicated, but this operation will be described later in detail with reference to FIG.

26 is a mark inspection IC cradle, which receives the mark inspection
9 is the IC cradle 26 by the vacuum chuck 24a or 24b.
Put on top. Reference numeral 27 denotes a mark inspection camera located above the IC receiver 26. Then, the quality of the mark printed by the camera 27 and printed on the package of the IC 9 is determined.

Reference numeral 28 denotes a lead bending inspection mechanism provided on the second table 4, and includes an IC positioning unit 29, two displacement sensors 30a and 30b arranged orthogonally to each other as shown in FIG.
The XY drive mechanism 31 drives the a and 30b in the X and Y directions.

The IC positioning part 29 positions the IC 9 by pushing the end faces of the leads projecting from the four side faces of the QFPIC 9 from four sides by four positioning claws not shown in the drawing due to the function of the cylinder 32.

The principle of the positioning mechanism is substantially the same as that of the handling chuck positioning mechanism introduced as an embodiment of the invention according to Japanese Patent Application No. 63-270522 filed by the present applicant. However, it goes without saying that the positioning mechanism is not necessarily required to be such a mechanism.

The displacement sensors 30a and 30b are moved in the X and Y directions above the IC positioning unit 29 so that the displacement sensors 30a and 30b can be moved in the X and Y directions.
, And includes at least a laser light source and a light position detecting element (PSD) that receives the laser light emitted from the laser light source and reflected by the leads of the IC 9. Each of the displacement sensors 30a and 30b can detect the deviation and ups and downs of the lead of the QFPIC9. The principle of the detection is, for example, that of a lead bending inspection device for a semiconductor device introduced in Japanese Patent Application Laid-Open No. 1-2272126. It is the same as the detection principle. In this inspection device, two displacement sensors are used.
a, 30b are arranged in directions orthogonal to each other. this is,
If only one displacement sensor 30 is used, as shown in FIG.
The three sides of the leads 33b, 33b, ... and 33c, 33c, 33c, ...
And the leads on the side opposite to the side having the leads 33b, 33b,... And not appearing in FIG. 4 can be measured without any problem, but the measurement of the leads 33a, 33a,. Is a problem.

Explaining the reason specifically, the displacement sensor 30
Is to detect the bending of the lead by emitting the laser light from the laser 34 to the lower side and receiving the reflected light from the lead 33 by the light position detecting element (PSD) 35. The light reflected by the lead 33a when measuring the lead 33a in a direction parallel to the plane to which the optical path of the light reflected by the lead and received by the light position detecting element belongs, in other words, the vertical plane to which the light source and the light position detecting element belong, is measured. Light leads
The curved portion 33a may not be incident on the light position detecting element (PSD) 35 (see the displacement sensor 30 shown by a solid line in FIG. 4). Therefore, two displacement sensors 30
a, 30b, the laser light is emitted and the plane to which the optical path reflected by the lead belongs is provided in a direction orthogonal to each other, and one of the displacement sensors 30a measures the leads of a pair of sides on the reflection side of the QFPIC9, It is necessary to measure the leads on the remaining pair of sides by the other displacement sensor 30b.

Reference numeral 36 denotes a Y stage constituting the XY drive mechanism 31, which is moved on the table 4 in the Y direction by a motor 37. Reference numeral 38 denotes an X stage.
Moved in the direction. Reference numeral 40 denotes an arm fixed to the X stage 38, and the pair of displacement sensors 30
a and 30b are fixed.

The position (the second inspection unit) 41 of the IC 9 to be subjected to the lead bending inspection by the displacement sensors 30a and 30b and the position (the first inspection unit) 26 to be subjected to the mark inspection are directly below the path through which the vacuum chuck rotating mechanism 19 passes. Located on the side.

(B. Description of Operation) [FIG. 3] The operation of the present inspection apparatus will be described below with reference to (1) to (21) of FIG. In the drawing, A to E indicate positions on a path through which the vacuum chuck rotating mechanism 19 passes. The position A is an intermediate point between the lead bending inspection position (41) and the mark inspection position (26), and the position B is viewed from the front by the rotation radius of the vacuum chucks 24a and 24b of the rotating body 23 from the mark inspection position. Position C is a position closer to the left side, and position C is more appropriate from position B (for example, about the turning radius of the vacuum chucks 24a and 24b).
Position to the left, and position D
Indicates the position on the tray for the IC to be inspected, and position E indicates the position on the tray for the defective IC. The positions A, B and C indicate one point, but the positions D and E have the same width (range) as the tray 7 for the IC to be inspected and the tray 8 for the defective IC.

(1) The rotating body 23 has a direction in which one vacuum chuck 24a is located on the left side and the other vacuum chuck 24b is located on the right side, and the vacuum chuck 24a remains in that state.
A movement operation in the X direction (movement operation of the tray stage) and a movement operation in the Y direction (movement operation of the movable plate 13) so as to be located above the IC (indicated by a circle in FIG. 3 for convenience) to be inspected. Let it do.

(2) Then, the IC 9 to be inspected by the vacuum chuck 24a
When located above, the first height (Y
From the height when moving in the direction) to the third height (the height when releasing the IC 9 sucked from the vacuum chuck 24) through the second height (the height when releasing the IC 9 from the vacuum chuck 24). (Z), and causes the Z drive block 14 to perform a descending operation. Then, when the vacuum chuck 24a reaches the third height, the IC 9 is sucked by the vacuum chuck 24a.

(3) Next, the vacuum chuck 24a is moved up to the first height integrally with the vacuum chuck 24b, and then is conveyed to the position where the rotation center of the rotating body 23 is located at the position B. Of the vacuum chucks 24a and 24b
Rotated 0 degrees. Then, the vacuum chuck 24a is located above the mark inspection position (26).

(4) Next, the vacuum chucks 24a and 24b are lowered from the first height to the second height, and the vacuum chuck 24a stops vacuum suction. Then, the IC 9 is placed on the mark inspection position (26). Next, the vacuum chucks 24a and 24b are raised to the first height.

(5) Next, the IC 9 is moved to the standby position C, and the mark inspection is performed on the IC 9 at the mark inspection position (26). In FIG. 3, the IC after the mark inspection is hatched diagonally to the left for convenience.

(6) Next, the vacuum chucks 24a and 24b are moved until their rotation axes are at the position A. Then, the vacuum chuck 24
a is the vacuum chuck 2 above the lead bending inspection position (41).
4b is located above the mark inspection position (26).

(7) Next, the vacuum chucks 24a and 24b are lowered from the first height to the third height to bring the vacuum chuck 24b into a vacuum suction state. Then, the IC 9 after the mark inspection is vacuum-adsorbed to the vacuum chuck 24b. Next, the vacuum chucks 24a and 24b are raised to the first height.

(8) Next, the rotating body 23 is rotated 180 degrees there. Then, the vacuum chucks 24a and 24b are lowered to the second height to stop the vacuum suction by the vacuum chuck 24b. Then, the IC 9 that has been vacuum-sucked by the vacuum chuck 24b is placed at the lead bending inspection position (41).

(9) Then, the vacuum chucks 24a and 24b are moved to a position D above the IC tray 7 to be inspected.

After the mark inspection, the lead bending inspection is performed on the IC 9 placed at the lead bending inspection position. In FIG. 3, the IC 9 having undergone the lead bending inspection is hatched in a diagonally lower right direction for convenience.

(10) Vacuum chuck 24a above tray 7 for IC to be inspected
Then, the next IC 9 to be measured is vacuum-adsorbed.

(11) Next, the vacuum chucks 24a and 24b are moved until the rotation center reaches the position B and rotated 180 degrees. Then, the vacuum chuck 24a is located above the mark inspection position (26).

(12) After that, the untested IC 9 that is vacuum-sucked on the vacuum chuck 24a is placed on the mark inspection position (26). Next, the vacuum chucks 24a and 24b are moved to the standby position C with the first height. After a while, the IC on the mark inspection position (26)
9 Mark inspection.

The operations (1) to (12) are performed at the beginning of use of the inspection apparatus, and thereafter, the operations (13) to (21) are repeated.

(13) Next, the center of rotation of the vacuum chucks 24a and 24b is
Move to the position. Then, the vacuum chuck 24a is positioned above the IC 9 (the mark inspection and the lead bending inspection have been completed) on the lead bending inspection position (41), and the vacuum chuck 24b is positioned above the mark inspection position (26).

(14) Next, the vacuum chucks 24a and 24b are lowered to the third height, and the two ICs 9 are sucked by vacuum.

(15) Next, the vacuum chucks 24a and 24b are raised to the first height, and then the vacuum chucks 24a and 24b are rotated by 180 degrees.

(16) Next, the vacuum chucks 24a and 24b are lowered to the second height, and the vacuum suction is stopped. Then, the IC (the lead bending inspection and the mark inspection have been completed) located on the lead bending inspection position (41) is changed to the mark inspection position (26).
IC placed on top and positioned above mark inspection position (26)
(The mark inspection has been completed but the lead bending inspection has not yet been completed.) Is placed on the lead bending inspection position (41). That is, two ICs are replaced.

Thereafter, the vacuum chucks 24a and 24b are raised to the third height, and further moved to a position D above the tray for IC to be inspected 7. Then, the IC 9 at the lead bending inspection position (41) is inspected for lead bending.

(17) Next, the IC 9 to be inspected next on the inspected IC tray 7 is vacuum-sucked to the vacuum chuck 24a, and then the vacuum chucks 24a and 24b are moved until the rotation center is located at the position B. Then, the vacuum chuck 24b is at the mark inspection position (26)
It is located above IC9 where both tests have been completed.

(18) Next, the vacuum chucks 24a, 24b are lowered to the third height, and the vacuum chuck 24b is moved to the mark inspection position (26).
C9 is vacuum adsorbed and then raised to a first level.

(19) Next, the vacuum chucks 24a and 24b are rotated by 180 degrees.

(20) Next, the vacuum chucks 24b and 24a are moved onto the inspected IC tray 7 or the defective IC tray 8 while the IC 9 is vacuum-adsorbed on the vacuum chuck 24b. Specifically, if the IC 9 adsorbed by the vacuum chuck 24b is a good product, the vacuum chuck 24b is positioned above the vacant portion of the IC tray 7 to be inspected. 24b
Is positioned above the empty portion of the defective IC tray 8.

(21) Then, the IC 9 adsorbed by the vacuum chuck 24b is placed on an empty portion of the tray 7 or 8. Specifically, when the vacuum chuck 24b is positioned at the second height and the vacuum suction is stopped, the IC 9 is placed in a vacant portion of the tray 7 or 8.

Thereafter, by repeating the series of operations of the steps (13) to (21), the mark inspection and the lead bending inspection of the IC 9 are sequentially performed.

In this inspection device, the vacuum chucks 24a, 2
In addition to moving the 4b between the tray 7 and the inspection positions 26 and 41, by rotating the rotating body 23 attached to the arm 17 by 180 degrees, the movement of the vacuum chucks 24a and 24b The IC 9 can be moved twice as long as the turning radius (so-called diameter). Therefore, the mechanism for moving the arm 17 in the Y direction can be made relatively small with respect to the required IC transport distance, and the size can be reduced.

By simultaneously moving the arm 17 in the Y direction and rotating the rotating body 23, the transport speed of the IC 9 can be substantially increased. Also, two inspection positions are provided on a pair of vacuum chucks 24a and 24b attached to both ends of the rotating body 23.
After the ICs 9 and 9 on 26 and 41 are vacuum-sucked, the rotating body 23
Is rotated by 180 degrees and the ICs 9 and 9 are placed on the inspection positions 26 and 41, thereby easily and quickly replacing the ICs. Therefore, the time per IC required for two inspections that must be performed at different locations can be shortened.

(H. Effects of the Invention) As described above, in the inspection apparatus of the present invention, a defective product is arranged, a defective product placement section moved in the X direction by the X direction driving means, and a large number of inspection objects are disposed. A first inspection unit and a second inspection unit, which also serve as a non-defective product arrangement unit to be moved in the X direction by the X direction driving means, are arranged in the Y direction; Is provided in the Y-direction by the Y-direction driving means, and the rotating body is rotatably held by the holding-movement means. The invention is characterized in that a pair of inspection object holders are provided at positions so as to be separated from each other by a distance equal to the distance between the first inspection unit and the second inspection unit. The inspection method includes a defective product placement unit, an inspection object placement unit also serving as a good product placement unit, and a first inspection unit. , A second inspection unit is disposed in the Y direction, a holder moving unit is provided above each of the parts so as to be movable in the Y direction, and the holder moving unit is rotatably held by the holder moving unit. A pair of inspection object holders are provided at positions opposite to each other with respect to the center of rotation of the rotating body so as to be separated from each other by a distance equal to the distance between the first inspection unit and the second inspection unit; An inspection object placement part of the inspection object by the holder moving means, an inspection part,
The inspection object is moved in the Y direction between the inspection object placement portion and the defective product placement portion, and the rotation of the rotating body causes the inspection object to move between the first and second inspection portions or the inspection object corresponding thereto. It is characterized by moving.

Therefore, according to the present invention, since the holder moving means can be moved and the rotating body can be rotated, the position between the defective product placement section, the inspection object placement section, and the first and second inspection sections can be reduced. In transporting the inspected object by the inspected object holder in the moving stroke required for the holder moving means,
It is possible to shorten the rotating body by an interval between the pair of inspection object holders. This is because the object to be inspected is held by the holding tool in a state where the rotating body is rotated so that one holding tool is located inside the tip of the holding tool moving means by the rotation radius, and the holding tool moving means is moved. When the rotating body is rotated by 180 degrees while being moved, the moving amount of the inspection object held by the holder is added to the moving amount of the holder moving means by twice the rotating radius of the holder of the rotating body. This is because

Therefore, the required moving stroke of the holder moving means can be further reduced, and the means can be reduced in size.

Further, by rotating the rotating body at the same time as the movement of the holder moving means, it is possible to shorten the transport time of the inspection object held by the holder, and to improve the inspection efficiency.

Then, the transport of the inspection object, which has been inspected by one of the first inspection unit and the second inspection unit, to the other can be quickly performed by rotating the rotating body by 180 degrees. Therefore, different kinds of inspections can be performed very quickly by one inspection apparatus.

[Brief description of the drawings]

1 to 4 are views for explaining one embodiment of the inspection apparatus of the present invention. FIG. 1 is an overall perspective view, FIG. 2 is a perspective view showing a displacement sensor, and FIG. FIG. 4 is an explanatory view of the reason why two displacement sensors are required. DESCRIPTION OF SYMBOLS 7 ... test object placement part 8 ... defective product placement part 9 ... test object 12-17 ... holder moving means 23 ... rotating body 24a, 24b ... test Object holder 26 First inspection unit 41 Second inspection unit

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/66 H01L 21/68 G01R 31/26

Claims (2)

(57) [Claims] 1. A defective product placement section on which defective products are placed and moved in the X direction by X direction driving means, and where a large number of inspected objects are placed and moved in the X direction by the X direction driving means. The inspection object placement part also serving as a non-defective part placement part, the first inspection part, and the second inspection part are arranged in the Y direction, and the upper part of each part is moved in the Y direction by the Y direction driving means. Tool moving means, a rotating body is rotatably held by the holding tool moving means, and the pair of inspection object holding tools are mutually positioned at positions opposite to each other with respect to the center of rotation of the rotating body. An inspection apparatus provided so as to be separated by a distance equal to a distance between an inspection unit and a second inspection unit. 2. A defective product disposition section in which defective products are disposed and moved in the X direction by X direction driving means, and a plurality of inspected objects are disposed and moved in the X direction by the X direction driving means. The inspection object placement part also serving as a non-defective product placement part, the first inspection part, and the second inspection part are arranged in the Y direction, and a holder moving means is provided above each part so as to be movable in the Y direction. A rotating body rotatably held by the holder moving means, and a pair of inspected object holders at a position opposite to each other with respect to a center of rotation of the rotating body; And a distance equal to the distance between the inspection unit and the inspection unit. The object to be inspected is moved in the Y direction between the first and second objects by rotating the rotating body. Inspection method and performing the movement of the or the inspection object corresponding thereto between the inspection unit.