JP2821064B2 - Light emitting diode lamp and full color display panel using the same - Google Patents
Light emitting diode lamp and full color display panel using the sameInfo
- Publication number
- JP2821064B2 JP2821064B2 JP4193546A JP19354692A JP2821064B2 JP 2821064 B2 JP2821064 B2 JP 2821064B2 JP 4193546 A JP4193546 A JP 4193546A JP 19354692 A JP19354692 A JP 19354692A JP 2821064 B2 JP2821064 B2 JP 2821064B2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- light
- diode lamp
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は発光ダイオード素子をリ
ードフレームと共に矩形体でモールドした発光ダイオー
ドランプとこれを用いた表示板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode lamp in which a light emitting diode element is molded in a rectangular body together with a lead frame, and a display panel using the same.
【０００２】[0002]
【従来の技術】従来この種のものは、種々の改良が進
み、発光の多色化や発光ダイオード（ＬＥＤ）素子の発
光効率の向上がはかられ、種々の構造のものが製作され
ている。例えば、図７に示す発光ダイオードランプ１は
その一例であって、赤色発光用チップ２と緑色発光用素
子３とが同一のリードフレーム４上にマウントされ、前
記素子２と素子３の電極と外部回路へのリードフレーム
５，６とがそれぞれワイヤボンディングされ、これらを
光透過性の樹脂によりモールドされ、樹脂自体が矩形の
レンズ７に形成されている。2. Description of the Related Art Conventionally, this type has been improved in various ways, and it has been attempted to improve the luminescence efficiency of a light-emitting diode (LED) element by increasing the number of colors, and various structures have been manufactured. . For example, a light-emitting diode lamp 1 shown in FIG. 7 is one example of such a case, in which a red light-emitting chip 2 and a green light-emitting element 3 are mounted on the same lead frame 4, and the electrodes of the element 2 and the element 3 are connected to the outside. The lead frames 5 and 6 to the circuit are respectively wire-bonded, and these are molded with a light transmitting resin, and the resin itself is formed on the rectangular lens 7.
【０００３】図８は前記ランプ１の底面図であり、前記
リードフレーム４，５，６は矩形レンズの一辺に平行に
配設されている。FIG. 8 is a bottom view of the lamp 1, and the lead frames 4, 5, and 6 are arranged in parallel with one side of a rectangular lens.
【０００４】そして、上記２色発光ダイオードランプ
を、例えば赤色と青色ランプ７と青色と緑色ランプ８を
用いてのフルカラー表示用の表示板は、図９のようにラ
ンプをマトリクス状に並べて構成されている。A display panel for full-color display using the two-color light-emitting diode lamps, for example, a red and blue lamp 7 and a blue and green lamp 8, is constructed by arranging the lamps in a matrix as shown in FIG. ing.
【０００５】[0005]
【発明が解決しようとする課題】従来の発光ダイオード
ランプにあっては、リードフレーム間の距離を確保する
ために矩形レンズの長辺が長くなりランプそのものを小
型化に出来ず、これらのランプを用いてのマトリクス状
に配列した表示板にあっては、表示した画像上のドット
数が少なく鮮明な画像が得られない欠点があった。In the conventional light emitting diode lamps, the long side of the rectangular lens becomes long in order to secure the distance between the lead frames, and the lamp itself cannot be miniaturized. The display plates arranged in a matrix form have a drawback that the number of dots on the displayed image is so small that a clear image cannot be obtained.
【０００６】また、これらのランプを基板上にマトリク
ス状に配列したとき左右のランプのリード端子間の距離
が接近して配線しにくい欠点があった。Further, when these lamps are arranged in a matrix on a substrate, the distance between the lead terminals of the left and right lamps is so short that wiring is difficult.
【０００７】本発明は、矩形レンズを有したランプの端
子配設を改良して小型のランプを得ることを目的とし、
さらに前記ランプを基板上にマトリクス状に配列した表
示板の配線の作業性を向上するとともに色ムラの無い鮮
明な画像を得ることを目的としている。An object of the present invention is to improve the terminal arrangement of a lamp having a rectangular lens to obtain a small lamp.
It is another object of the present invention to improve the workability of wiring of a display panel in which the lamps are arranged in a matrix on a substrate and to obtain a clear image without color unevenness.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の発光ダイオードランプにおいては、リード
フレーム，リード端子を矩形レンズの対角線上に配設し
たものである。In order to achieve the above object, in a light emitting diode lamp according to the present invention, a lead frame and lead terminals are arranged on a diagonal line of a rectangular lens.
【０００９】また、本発明の発光ダイオードランプを用
いた表示板においては、発光ダイオードランプを行列で
互い違いに配列するとともに、矩形レンズのリード端子
の配設対角線が互いに平行になるように配列したもので
ある。Further, in the display panel using the light emitting diode lamp of the present invention, the light emitting diode lamps are arranged alternately in rows and columns, and the diagonal lines of the lead terminals of the rectangular lens are arranged parallel to each other. It is.
【００１０】[0010]
【作用】上記のように構成された発光ダイオードランプ
は小型になり、該発光ダイオードランプをプリント基板
上にマトリクス状に配線したときは、端子間の距離は十
分確保できる。The light emitting diode lamp constructed as described above is small in size, and when the light emitting diode lamps are wired in a matrix on a printed circuit board, the distance between the terminals can be sufficiently ensured.
【００１１】さらに、二種類の発光ダイオードランプ
を、行列で交互に配設したフルカラー表示板は鮮明な画
像が得られる。Further, a full-color display panel in which two types of light-emitting diode lamps are alternately arranged in a matrix provides a clear image.
【００１２】[0012]
【実施例】実施例について図面を参照して説明すると、
図１は、本発明の発光ダイオードランプの一例の斜視
図、図２は同じく図１の上面図で、該発光ダイオードラ
ンプ１１は、青色発光用チップ１２と緑色発光用チップ
１３とが同一のリードフレーム１４に取着され、これら
のチップ１２，１３の電極と外部回路へのリードフレー
ム１５，１６とかそれぞれ金糸線１７でワイヤボンディ
ングされ、これらを覆った透光性樹脂の矩形体１８とか
ら形成されている。Embodiments will be described with reference to the drawings.
FIG. 1 is a perspective view of an example of a light emitting diode lamp of the present invention, and FIG. 2 is a top view of FIG. 1 as well. The light emitting diode lamp 11 has a blue light emitting chip 12 and a green light emitting chip 13 having the same lead. It is attached to a frame 14 and is formed from electrodes of these chips 12 and 13 and lead frames 15 and 16 to an external circuit by wire bonding with gold wire 17 respectively, and a rectangular body 18 of a transparent resin covering these. Have been.
【００１３】また、前記リードフレーム１４，１５，１
６は、矩形体１８の対角線上に配列されている。The lead frames 14, 15, 1
6 are arranged on a diagonal line of the rectangular body 18.
【００１４】なお、上記緑色発光用チップ１３の代わり
に赤色発光チップ１９を用いると青色−赤色２色発光ダ
イオードランプ２０ができる。該ランプ２０の構成は図
３の斜視図に示されるものであるが、図１の青色−緑色
２色発光ダイオードランプ１１と同じであるので詳細な
説明は省略する。なお、図４はランプ２０の平面図であ
る。If a red light emitting chip 19 is used in place of the green light emitting chip 13, a blue-red two-color light emitting diode lamp 20 can be obtained. The structure of the lamp 20 is shown in the perspective view of FIG. 3, but is the same as that of the blue-green two-color light emitting diode lamp 11 of FIG. FIG. 4 is a plan view of the lamp 20.
【００１５】図５は本発明の発光ダイオードランプを製
作する場合の連続フレーム状の外観図である。リードフ
レーム基台２１に青−緑色２色発光ダイオードランプ１
１または青−赤色２色発光ダイオードランプ２０のリー
ドフレーム１４，１５，１６をそれぞれ一体的に立設
し、リードフレーム１４に青色発光チップ１２と緑色発
光チップ１３または、青色発光チップ２と赤色発光チッ
プ１９を取着し、各素の電極と外部回路へのリードフレ
ーム１５，１６とをそれぞれ金糸線１７でワイヤボンデ
ィングし、それらを透光性樹脂で矩形にモールドすると
本発明の発光ダイオードランプが連続製作される。FIG. 5 is an external view of a continuous frame when the light emitting diode lamp of the present invention is manufactured. Blue-green two-color light emitting diode lamp 1 on lead frame base 21
The lead frames 14, 15, and 16 of the one-color or blue-red two-color light-emitting diode lamps 20 are respectively erected, and the blue light-emitting chip 12 and the green light-emitting chip 13 or the blue light-emitting chip 2 and the red light are emitted on the lead frame 14. When the chip 19 is attached, the electrodes of each element and the lead frames 15 and 16 to the external circuit are wire-bonded with the gold thread 17, respectively, and they are molded into a rectangular shape with a translucent resin. It is manufactured continuously.
【００１６】そして、リードフレーム１４，１５，１６
を基台２１より所望の長さにカットすることにより発光
ダイオードランプ１１，２０が完成するものである。Then, the lead frames 14, 15, 16
Is cut to a desired length from the base 21 to complete the light emitting diode lamps 11 and 20.
【００１７】次に上記発光ダイオードランプ１１，２０
を用いたフルカラードットマトリクス表示装置について
説明する。Next, the light emitting diode lamps 11 and 20 will be described.
A full-color dot-matrix display device using the following will be described.
【００１８】青−緑色ランプ１１と青−赤色ランプ２０
を図６の如くプリント基板上に交互に配列することによ
りフルカラードットマトリクス表示装置２２を構成す
る。A blue-green lamp 11 and a blue-red lamp 20
Are alternately arranged on a printed circuit board as shown in FIG. 6 to constitute a full-color dot matrix display device 22.
【００１９】各ランプ１１，２０のリードフレーム１
４，１５，１６は前述した如く矩形体１８の対角線上に
配列してあるので、図６の如くランプ１１，２０のリー
ドフレーム１４，１５，１６の方向が同一方向になるよ
う配列することによりプリント基板の端子間の距離を十
分確保することができる。The lead frame 1 of each of the lamps 11 and 20
4, 15, 16 are arranged on the diagonal line of the rectangular body 18 as described above. Therefore, as shown in FIG. 6, by arranging the lead frames 14, 15, 16 of the lamps 11, 20 in the same direction. A sufficient distance between the terminals of the printed circuit board can be ensured.
【００２０】[0020]
【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載されるような効果を奏する。Since the present invention is configured as described above, it has the following effects.
【００２１】リードフレームを矩形体の略対角線上に配
列することにより、リードフレーム間の距離を十分確保
しながら小型の発光ダイオードランプを製作することが
できる。By arranging the lead frames on substantially diagonal lines of a rectangular body, it is possible to manufacture a small-sized light emitting diode lamp while ensuring a sufficient distance between the lead frames.
【００２２】また、上記発光ダイオードランプをプリン
ト基板上にマトリクス上に配列しても半田付けの作業が
容易におこなえる。Further, even if the light emitting diode lamps are arranged in a matrix on a printed circuit board, the soldering operation can be easily performed.
【００２３】さらに、フルカラードットマトリクス表示
装置に使用することによって高品位の解像度を得ること
ができる。Further, by using the present invention for a full-color dot matrix display device, a high-quality resolution can be obtained.
【図１】本発明の発光ダイオードランプの一実施例の外
観斜視図である。FIG. 1 is an external perspective view of one embodiment of a light emitting diode lamp of the present invention.
【図２】同じく図１の上面図である。FIG. 2 is a top view of FIG.
【図３】本発明の発光ダイオードランプの他の実施例の
外観斜視図である。FIG. 3 is an external perspective view of another embodiment of the light emitting diode lamp of the present invention.
【図４】同じく図３の上面図である。FIG. 4 is a top view of FIG. 3;
【図５】本発明の発光ダイオードランプの製作時の連続
フレーム状態の外観図である。FIG. 5 is an external view of a continuous frame when the light emitting diode lamp of the present invention is manufactured.
【図６】本発明の発光ダイオードランプを用いたフルカ
ラードットマトリクス表示装置の一実施例の平面図であ
る。FIG. 6 is a plan view of one embodiment of a full-color dot matrix display device using the light-emitting diode lamp of the present invention.
【図７】従来の発光ダイオードランプの外観斜視図であ
る。FIG. 7 is an external perspective view of a conventional light emitting diode lamp.
【図８】同じく図７の底面図である。FIG. 8 is a bottom view of FIG. 7;
【図９】従来の発光ダイオードランプを用いたフルカラ
ードットマトリクス表示装置の一実施例の平面図であ
る。FIG. 9 is a plan view of one embodiment of a conventional full-color dot matrix display device using a light-emitting diode lamp.
１１，２０ 発光ダイオードランプ １２，１３，１９ 発光チップ １４，１５，１６ リードフレーム １８ 矩形体 ２２ フルカラードットマトリクス表示装置 11,20 light-emitting diode lamp 12,13,19 light-emitting chip 14,15,16 lead frame 18 rectangular body 22 full-color dot matrix display device
Claims (2)
ぞれ異なる波長で発光する発光ダイオードチップを取着
するとともに配線し、 前記発光ダイオードチップとリードフレームを矩形体の
透光性樹脂で覆った発光ダイオードランプにおいて、前
記リードフレームを前記矩形体の略対角線上に設けたこ
とを特徴とする発光ダイオードランプ。1. A light emitting diode lamp in which at least two light emitting diode chips emitting at different wavelengths are attached to a lead frame and wired, and the light emitting diode chip and the lead frame are covered with a rectangular transparent resin. A light emitting diode lamp, wherein the lead frame is provided on a substantially diagonal line of the rectangular body.
上に、少なくとも２つのそれぞれ異なる波長で発光する
発光ダイオードチップを取着するとともに配線した発光
ダイオードランプであって、異なる色の組み合わせを変
える発光ダイオードランプを行列で互い違いに配列する
とともに、前記ランプの矩形体のリードフレームの配設
対角線が互いに平行になるように配列したことを特徴と
するフルカラー表示板。2. A light-emitting diode lamp in which at least two light-emitting diode chips that emit light of different wavelengths are attached and wired on a diagonal line of a rectangular body formed of a light-transmitting resin, wherein different color combinations are provided. A full-color display panel, wherein light-emitting diode lamps for changing the color are alternately arranged in rows and columns, and the diagonal lines of the rectangular lead frames of the lamps are arranged parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4193546A JP2821064B2 (en) | 1992-07-21 | 1992-07-21 | Light emitting diode lamp and full color display panel using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4193546A JP2821064B2 (en) | 1992-07-21 | 1992-07-21 | Light emitting diode lamp and full color display panel using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0645660A JPH0645660A (en) | 1994-02-18 |
| JP2821064B2 true JP2821064B2 (en) | 1998-11-05 |
Family
ID=16309869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4193546A Expired - Fee Related JP2821064B2 (en) | 1992-07-21 | 1992-07-21 | Light emitting diode lamp and full color display panel using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2821064B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4109756B2 (en) * | 1998-07-07 | 2008-07-02 | スタンレー電気株式会社 | Light emitting diode |
-
1992
- 1992-07-21 JP JP4193546A patent/JP2821064B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0645660A (en) | 1994-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |