JP2819775B2 - Hybrid integrated circuit device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device having active elements mounted on an insulating substrate and used in strong electromagnetic waves.

[Conventional technology]

A wiring pattern is formed on an insulating substrate, for example, a printed circuit board, on which electronic components such as ICs, transistors, resistors, and capacitors are mounted, and lead terminals for connection to external circuits are provided on the outer periphery of the insulating substrate. In a hybrid integrated circuit device that realizes a specific circuit function, it is necessary to supply power to the mounted active components from the outside via lead terminals.

In a conventional hybrid integrated circuit device of this type, as shown in FIG. 2, the ground wiring 6 is thickened and arranged on the outer periphery of the insulating substrate 1 to stabilize the operation, and the power supply wiring 5 is Power was supplied to the active elements 2 _A and 2 _B in the central portion.

This is because it is convenient to supply the power from the power supply lead terminals 3 and the ground lead terminal 4 of the pair into a plurality of active devices 2 _A, 2 _B.

[Problems to be solved by the invention]

In this conventional hybrid integrated circuit device, since the ground wiring 6 is arranged on the outer peripheral portion of the insulating substrate 1 and the power supply wiring 5 is arranged on the central portion of the insulating substrate 1, when used in a strong electromagnetic wave, the magnetic field surface of the electromagnetic wave is reduced. When it is perpendicular to the insulating substrate 1, the power supply wiring 5, the active element
Interlink with 2 _A, 2 _B and chain flux loop formed by the ground line 6, thereby electromotive force is generated in the loop, to be rectified further nonlinear characteristic portion in the active element 2 _A, 2 _B However, there is a problem that an unnecessary voltage is generated and a malfunction occurs.

An object of the present invention is to provide a hybrid integrated circuit device which can prevent malfunction from occurring even when used in strong electromagnetic waves.

[Means for solving the problem]

A hybrid integrated circuit device according to the present invention includes an insulating substrate, an active element mounted on the insulating substrate, and a first device provided at a predetermined position on the insulating substrate for supplying external power to the active element. And a second power supply lead terminal, a first power supply line formed between the first power supply lead terminal formed on the first surface of the insulating substrate, and a first power supply terminal of the active element. A wire connecting the second power supply lead terminal and the second power supply terminal of the active element to the second surface of the insulating substrate, and connecting the first and second power supply lead terminals; , The first power supply wiring, and a second power supply wiring formed so that the area surrounding the first power supply wiring and the active element is minimized.

Further, a configuration is provided in which capacitors for connecting the first and second electrodes to the first and second power supply wirings at positions close to the first and second power supply lead terminals respectively are provided. .

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

 FIG. 1 is a plan view showing an embodiment of the present invention.

This embodiment includes an insulating substrate 1, and the mounting on the insulating substrate 1 has been active element 2 _A, 2 _B, respectively provided on one side of the periphery of the insulating substrate 1, from the outside to the active element 2 _A, 2 _B A first power supply lead terminal 3 and a second power supply lead terminal for supplying power to the power supply, and a first power supply lead terminal 3 formed on a first surface of the insulating substrate 1. _A first power supply line 5 for connecting the power supply terminals to the Vcc terminals 21 _A and 21 _B which are the first power supply terminals of the active elements 2 _A and 2 _B ;
Is connected to the ground lead terminal 4 and the GND terminals 22 _A and 22 _B , which are the second power terminals of the active elements 2 _A and 2 _B , and between the power lead terminal 3 and the ground lead terminal 4. , The power supply wiring 5 and the ground wiring 6 _A of the second power supply wiring formed so that the area surrounding the power supply wiring 5 and the active elements 2 _A and 2 _B is minimized in consideration of other electronic components and wirings. to 6 _D and the capacitor 8 connected to the first and second electrodes respectively corresponding to the ground line 6 _D provided near the close position and the power supply wiring and the power lead terminal 3 of the power supply lines 5 And a configuration having:

Power lead terminals 3 and a line connecting the grounding lead terminal 4, the power supply line 5, the active element 2 _A, 2 _B, and a ground line 6 _A to 6
Is the area enclosed is minimized by _D, and projected from one surface of the insulating substrate 1, when arranged to the ground wiring 6 _A and the power supply line 5 and the active elements 2 _A, 2 _B overlap However, it is not always possible to arrange them so as to overlap with each other depending on the arrangement state of other electronic components, wirings and the like. The area in this state to place the ground wire 6 _A to 6 _D so as to minimize. The ground wirings 6 _{B to} 6 _D are used to connect the active elements 2 _A and 2 _B mounted on the first surface of the insulating substrate 1 and predetermined terminals and electrodes of the capacitor 8. _A ~
Connected to ground wiring 6 _A by 7 _C.

By arranging the grounding wire 6 _A to 6 _D Thus, the magnetic flux of an electromagnetic wave passing through the portion of the area is the lowest, the power line 5, the ground wiring 6 _A to 6 _D, and active devices 2 _A, Since the electromotive force induced by 2 _B can be minimized, the super power induced by the capacitor 8 can be reduced, and the electromotive force and noise induced externally can be prevented from entering the inside. Even when used in a strong electromagnetic wave, the occurrence of malfunction can be prevented.

In this example, the induced super power could be reduced by 10 dB or more as compared with the conventional example.

〔The invention's effect〕

As described above, according to the present invention, the area surrounding the first and second power supply wirings with the line connecting the first and second power supply lead terminals, the first and second power supply wirings, and the active elements is reduced. The configuration is such that a capacitor is provided between the first and second power supply wires in the vicinity of the first and second power supply lead terminals so as to be used in strong electromagnetic waves. However, the electromotive force induced in the first and second power supply wirings can be minimized, and the electromotive force induced by the capacitor is reduced, and super power and noise from outside enter the inside. Therefore, there is an effect that occurrence of a malfunction can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a plan view showing an example of a conventional hybrid integrated circuit device. 1 ... insulating substrate, 2 _A , 2 _B ... active element, 3 ... lead terminal for power supply, 4 ... lead terminal for ground, 5 ... power supply wiring,
6,6 _{A to} 6 _D … Ground wiring, 7 _{A to} 7 _C … Through hole, 8…
... Capacitors, 21 _A , 21 _B ... Vcc terminals, 22 _A , 22 _B ... GND terminals.

Claims (2)

(57) [Claims] An insulated substrate, an active element mounted on the insulated substrate, and first and second devices provided at predetermined positions on the insulated substrate for supplying external power to the active elements. A power supply lead terminal, a first power supply wiring connecting the first power supply lead terminal formed on a first surface of the insulating substrate and a first power supply terminal of the active element, and the insulating substrate Connecting the second power supply lead terminal and the second power supply terminal of the active element to the second surface of
And a line connecting the second power supply lead terminals, the first power supply line, and a second power supply line formed so as to minimize the area surrounding the active element. Integrated circuit device. 2. A capacitor is provided for connecting the first and second electrodes at positions close to the first and second power supply lead terminals of the first and second power supply wirings, respectively. A hybrid integrated circuit device as described.