JP2808645B2 - Thermosetting resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION a. Industrial Field of the Invention The present invention relates to moldability, mechanical strength, impact resistance, weather resistance,
Excellent electrical insulation properties and heat resistance, for electrical and electronic parts,
The present invention relates to a thermosetting resin composition suitable for automotive parts and the like.

b. Conventional technology In general, thermosetting resins, especially phenolic resins and epoxy resins, have been widely used for various molding materials and adhesives since ancient times due to their excellent adhesiveness, insulation and heat resistance. Even under the rapid growth of the automobile industry and the electric and electronic industries in recent years, the demand has been growing mainly for various parts applications by utilizing its characteristics.

However, a cured product of a phenol resin or an epoxy resin is a high-strength material, but has a weak point of being brittle. As a countermeasure against this, conventionally, it has been studied to blend a polar rubber or a modified rubber, or to use a rubber-modified resin in which a phenol resin or an epoxy resin is previously reacted with the rubber.

However, many of the conventionally used rubber materials have the problem that, when they are added to a phenolic resin or an epoxy resin, heat resistance is reduced and electric insulation is reduced as compared with the case where they are not added. I was

In other words, acrylonitrile-butadiene rubber (hereinafter referred to as NBR), which has relatively good compatibility with each resin, has been used for a long time to improve the brittleness of phenolic and epoxy resins. As shown in JP-B-55-33732 and JP-B-57-30133, NBR having introduced various functional groups such as a carboxyl group which can be expected to react with a thermosetting resin has been used. However, the addition of these polar rubbers deteriorates the properties inherent in thermosetting resins, such as heat resistance, weather resistance, and electrical insulation.

c. Problems to be Solved by the Invention Rapid technological progress in recent years, mainly in the electronics industry and the information industry, requires thermosetting resin materials having more excellent properties. Conventionally, as described above, to the thermosetting resin, a relatively compatible polar rubber was added as a modifier,
In this method, the impact resistance is improved, but the electrical insulation is reduced.

Therefore, a material that has a small decrease in electrical insulation and has an excellent effect of improving impact resistance has been required.

d. Means for Solving the Problems In view of such circumstances, the present inventors have developed a thermosetting resin having excellent moldability, mechanical strength, impact resistance, weather resistance, and excellent heat resistance and electrical insulation. As a result of intensive studies on the composition, the present invention has been achieved.

The present invention relates to (a) 100 parts by weight of a thermosetting resin, (b) having one or more polymer blocks A, B, and C in the molecule, respectively, wherein A is a vinyl aromatic compound. 90% by weight or more of a polymer block mainly composed of a vinyl aromatic compound, B is a polybutadiene polymer block having 1,2-vinyl bonds of 30 to 70%, and C is a polybutadiene polymer having 1,2 vinyl bonds of less than 30%. The block copolymer has a content of the polymer block A of 10 to 50% by weight, a content of the polymer block B of 30 to 80% by weight, and a content of the polymer block C of 5 to 30% by weight. Or the block copolymer unit is bonded to a polymer unit comprising at least one polymer block of the above A, B or C via a coupling agent residue, and the polymer molecular chain is linear or branched. Block copolymer. Number average molecular weight of 40,000 to 70 obtained by hydrogenating at least 80% or more of olefinically unsaturated bonds in
0.1 to 400 parts by weight of a hydrogenated block copolymer of 000, and (c) a functional group-containing compound having at least one functional group selected from an amino group, a hydroxyl group, an epoxy group, a carboxyl group and an acid anhydride group. , (B) ingredient 10
A thermosetting resin composition characterized by containing 0 to 20 parts by weight per 0 parts by weight.

Examples of the thermosetting resin as the component (A) of the present invention include phenolic resins, epoxy resins, melamine resins, unsaturated polyester resins, alkyd resins, and the like. Saturated polyester resins are preferable, and phenol resins and epoxy resins are more preferable.

The hydrogenated block copolymer of the component (b) of the present invention comprises a vinyl aromatic compound and a conjugated diene monomer. Examples of the vinyl aromatic compound include styrene, paramethylstyrene, and α-methylstyrene. The conjugated diene monomer includes butadiene.

The hydrogenated block copolymer, the block copolymer before hydrogenation, the following polymer block A in the molecule,
B and C (where A is a polymer block mainly composed of a vinyl aromatic compound in which the vinyl aromatic compound is 90% by weight or more, B is a polybutadiene polymer block having a 1,2-vinyl bond of 30 to 70%, C Is a polybutadiene polymer block having less than 30% of 1,2 vinyl bonds.) Having a polymer block A content of 10 to 50% by weight and a polymer block B content of 30 to 80% by weight. % By weight, a block copolymer having a content of the polymer block C of 5 to 30% by weight, or a weight of at least one of the above A, B or C via a coupling agent residue. The polymer block is a block copolymer having a linear or branched chain, and at least 80% or more of the olefinically unsaturated bonds of the block copolymer thus obtained are combined with a polymer unit comprising a united block. Hydrogenate The number average molecular weight of 40,000 to that
700,000 hydrogenated block copolymers.

The block copolymer before hydrogenation contains at least one of the above polymer blocks A, B, and C as essential components, and the simplest block copolymer has a structure of (ABC) It has. In addition to this basic arrangement, a block copolymer in which one or more of the above three types of polymer blocks are regularly or irregularly arranged may be used.

In the block copolymer before hydrogenation, the above-mentioned block copolymer unit has another 1 to 3 via a coupling agent residue.
It may be one in which a polymer molecular chain is extended or branched by bonding to individual polymer blocks. The polymer block to be bonded is composed of at least one polymer block of A, B or C. A, B,
A block copolymer composed of C is bonded via a coupling agent residue, for example, a block copolymer having a structure of (ABC) _n X (where n = 2 to 4) is described below.
After performing the block copolymerization, diethyl adipate,
It can be easily obtained by adding a coupling agent such as divinylbenzene, silicon tetrachloride, tin tetrachloride, dimethyldichlorosilicon, 12-dibromoethane and 1,4-chloromethylbenzene. However, if A, B, and C are contained in one block copolymer, the other polymer blocks do not need to contain all three components. For example, (A-B-
C) A structure such as X (AB) may be used.

Polymer block A constituting the block copolymer of the present invention is styrene, α-methylstyrene, vinyl toluene,
a polymer of one or more aromatic vinyl compounds selected from aromatic vinyl compounds such as p-tert-butylstyrene, or 1,3-butadiene having an aromatic vinyl compound content of 90% by weight or more; 80% or more of the copolymer is a hydrogenated polymer.

If the content of the aromatic vinyl compound in the polymer block A is less than 90% by weight, the moldability of the obtained thermosetting resin composition deteriorates, which is not preferable. The content of the polymer block A in the block copolymer before hydrogenation is 10 to 50% by weight, preferably 15 to 50% by weight.
At 45% by weight, the number average molecular weight of the polymer block A is 5,000
~ 70,000. If it is less than 10% by weight, mixing with the resin becomes difficult, and the effect of improvement is insufficient. If it exceeds 50% by weight, the effect of improving impact resistance decreases.

The content of the polymer block B constituting the block copolymer of the present invention is 30 to 80% by weight, preferably 35 to 70% by weight.
The polymer block B has a 1,2-vinyl bond of 30 to 70%, preferably 40 to 60%, and a number average molecular weight of 30,000 to 300,000,
At least 80% or more of the polybutadiene is a hydrogenated polymer.

By polymerizing the polymer block B 100%, ethylene and butene-1 are randomly copolymerized.

Of polybutadiene before hydrogenation to become polymer block B
If the 1,2-vinyl bond content is less than 30%, polyethylene chains are formed when hydrogenated, and the rubbery properties are lost. On the other hand, if it exceeds 70%, the glass transition temperature becomes high when hydrogenated, and the rubbery properties are lost, which is not preferable. If the content of the polymer block B in the block copolymer before hydrogenation is less than 30% by weight, the effect of improving impact resistance is lost, and if it exceeds 80% by weight, heat resistance is reduced.

The content of the aggregate block C constituting the block copolymer of the present invention is 5 to 30% by weight, preferably 5 to 25% by weight.
Wherein the 1,2 vinyl bond of the polymer block C is less than 30%, preferably 3 to 20%, and has a number average molecular weight of 10,000 to 300,000,
Polybutadiene is a polymer that is hydrogenated at least 80% or more.

Polybutadiene 1,1, before hydrogenation in polymer block C
(2) When the bond content exceeds 30%, the moldability of the obtained thermosetting resin composition is reduced. Also, 3% of 1,2 vinyl bonds
Polybutadiene less than is difficult to manufacture. If the content of the polymer block C in the block copolymer before hydrogenation is less than 5% by weight, the dispersibility in the resin is poor and the improvement effect is insufficient, and if the content exceeds 30% by weight, the impact resistance is increased. Is inferior in the effect of improvement.

Number average molecular weight of the hydrogenated block copolymer of the present invention,
40,000-700,000. Within this range, impact resistance and moldability are highly balanced.

It is important that the hydrogenated block copolymer (b) has at least 80%, preferably at least 90%, hydrogenated olefinically unsaturated bonds. If it is less than 80%, it is unfavorable in terms of weather resistance and heat resistance. It is enough.

The hydrogenated block copolymer (b) can be obtained by the method disclosed in Japanese Patent Application No. 63-285774.

Examples of the functional group-containing compound of the component (c) of the present invention include a monomer containing an amino group, a hydroxyl group, an epoxy group, a carboxyl group or an acid anhydride group or a polymer thereof.

Specific examples of the monomer having an amino group include diethylaminoethyl (meth) acrylate, dimethylaminomethyl (meth) acrylate, and vinylpyridine.

Examples of the monomer having a hydroxyl group include hydroxypropyl (meth) acrylate, hydroxyethyl (meth) acrylate, and the like.

Examples of the monomer containing an epoxy group include glycidyl (meth) acrylate, allyl glycidyl ether, and vinyl glycidyl ether.

Further, a polymer having at least one functional group having addition reactivity with the component (b) and having at least one amino group, hydroxyl group, epoxy group, and carboxyl group, for example, is generally called an achromer. Those can also be mentioned as examples of the component (c).

Further, as a monomer containing a carboxyl group or an acid anhydride group, acrylic acid, methacrylic acid, ethacrylic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid, itaconic anhydride, hymic acid, hymic acid anhydride Α, β-unsaturated carboxylic acids or acid anhydrides thereof.

Among these, a monomer compound containing a carboxyl group or an acid anhydride group is preferable from the viewpoint of easy operation of addition reaction of the component (b) to the hydrogenated block copolymer. A monomer compound (acid anhydride) containing is particularly preferred. Acid anhydrides are widely used as curing agents for thermosetting resins, mainly for epoxy resin applications.
Even if it remains as an unreacted monomer, it is more preferable because it does not adversely affect the thermosetting resin.

The amount of the functional group-containing compound (c) used is
(B) 0 per 100 parts by weight of the hydrogenated block copolymer of the component
To 20 parts by weight, preferably 0.01 to 20 parts by weight, more preferably 0.2 to 10 parts by weight. If it is used in an amount of 0.01 part by weight or more, a more excellent effect of improving impact resistance by introducing a functional group can be obtained. On the other hand, when the amount exceeds 20 parts by weight, the characteristics such as electric characteristics and moisture resistance are lowered.

The mixing ratio of the thermosetting resin (A) to the hydrogenated block copolymer (B) varies depending on the purpose, but the component (B) is 0.1 to 400 parts by weight per 100 parts by weight of the thermosetting resin. Parts by weight, preferably 0.1 to 100 parts by weight, more preferably 1 to 30 parts by weight.

If the component (b) is less than 0.1 part by weight, the effect of improving impact resistance is poor, and if it exceeds 400 parts by weight, it is not possible to maintain the high strength inherent in the thermosetting resin.

The method of mixing the composition comprising the component (a), the component (b) and the component (c) of the present invention is not particularly limited, but preferred methods include: (a) and (b) in the presence of the component (c). B) Method of mixing components: A method of adding all or part of component (c) in advance to component (b) and mixing these with component (a):

In the above method, it is preferable to heat knead.

In the above method, the addition reaction of the monomer containing various functional groups to the component (b) is described in JP-B-39-6384.
The method described in the item can be used. That is, instead of the olefin rubber described in the publication,
The component (b) can be reacted by mixing and heating various monomers in a solid state using the component. The heating method may be either a method using a closed kneader or a method in which a continuous heating reaction is performed using an extruder or the like. At this time, a peroxide may be partially used to promote the reaction. If necessary, a rubber stabilizer may be used. By using the above-mentioned method, a more excellent composition aimed at by the present invention can be obtained.

For mixing, a closed mixer such as a Banbury mixer, a roll, an extruder, or the like can be used depending on the purpose.

Further, the composition of the present invention, if necessary, an antioxidant,
Stabilizers, plasticizers, softeners, various inorganic or organic fillers, reinforcing agents, cross-linking agents and the like can be blended and used.

The composition of the present invention can be widely used for coating materials, casting agents, molding materials, adhesives, paints and the like mainly for electric / electronic parts and automobiles.

e. Examples Next, the present invention will be described in more detail with reference to Examples.
The present invention is not limited to these. Hereinafter, the ratio (parts by weight) to 100 parts by weight of the polymer is shown in PHR units.

 In addition, various physical properties were measured by the following methods.

The weight-average molecular weight (Mw) and number-average molecular weight (Mn) were measured as follows according to "Takeuchi, Gel Permeation Chromatograph, published by Maruzen Co., Ltd."

Standard polystyrene of known molecular weight (manufactured by Tosoh Corporation)
Monodisperse polystyrene) using molecular weight M and its GPC
(Gel Permeation Chromatograph) measure the count,
A calibration curve for a correlation diagram between a molecular weight M and an EV (Elution Volume) is drawn. The concentration at this time is 0.02% by weight.

The calibration curve with the standard polystyrene is corrected to the calibration curve by the universal method.

The GPC pattern of the sample is obtained by the GPC measurement method, and the molecular weight M is known from the above. The sample preparation conditions and GPC measurement conditions at that time are as follows.

Sample Preparation Conditions (a) 0.08% by weight of 2,6-di-t-butyl-p-cresol as an antioxidant was added to an o-dichlorobenzene solvent.
Add and dissolve.

(B) Dispense the sample into an Erlenmeyer flask together with the o-dichlorobenzene solvent so as to have a concentration of 0.1% by weight.

(C) Heat the Erlenmeyer flask to 120 ° C, stir for about 60 minutes, and dissolve.

(D) Apply the solution to GPC. In addition, it is automatically filtered through a sintered filter having a pore size of 0.5 μm in a GPC apparatus.

GPC measurement conditions (a) Apparatus: Waters, Inc., 150C type (b) Column: Tosoh Corporation, H type (c) Sample amount: 500μ (d) Temperature: 135 ° C (e) Flow rate: 1 μm / min ( f) Total theoretical number of columns: 10 × 10 ⁴ to 2 × 10 ⁴ (measured value with acetone) Mw / Mn was calculated from the above results.

Styrene content The styrene content was determined by infrared analysis using a calibration curve for the absorption based on the phenyl group at 699 cm ^-1 .

1,2-vinyl bond content of polybutadiene Calculated by Morero method using infrared analysis.

First, samples 1 to 6 relating to the hydrogenated block copolymer (b) component were prepared by the following method.

Sample 1 (1) After 500 g of degassed and dehydrated cyclohexane and 350 g of 1,3-butadiene were charged into 5 autoclaves, 0.50 g of n-butyllithium was added, and isothermal polymerization was performed at a polymerization temperature of 50 ° C. After the conversion reached 31%, 12.5 g of tetrahydrofuran was added, and the temperature was raised from 50 ° C to 80 ° C.

After the conversion reached almost 100%, 150 g of styrene was added and polymerization was carried out for 15 minutes. Table 1 shows the molecular characteristics of the obtained ABC triblock copolymer.

(2) Then in a separate container 1.95 g of titanocene dichloride
Was dispersed in 30 ml of cyclohexane, and reacted with 2.68 g of triethylaluminum at room temperature.

The obtained dark blue apparently uniform solution was added to the polymer solution obtained in (1), and a hydrogenation reaction was carried out at 50 ° C. under a hydrogen pressure of 5.0 kgf / cm ² for 2 hours.

Then, the solvent was removed with methanol / hydrochloric acid and 2,6-di-ter
t-Butyl catechol was added thereto and dried under reduced pressure. Table 1 shows the molecular characteristics of the obtained hydrogenated ABC triblock copolymer.

Sample 2 (1) Cyclohexane 25
00 g, 1,3-butadiene 350 g, tetrahydrofuran 0.25 g
After adding 0.50 g of n-butyllithium, 5
Isothermal polymerization was performed at 0 ° C.

After a conversion of 11%, tetrahydrofuran 12.2
5 g was added, and the temperature was raised from 50 ° C to 80 ° C. After the conversion reached almost 100%, 150 g of styrene was added and polymerization was carried out for 15 minutes. Table 1 shows the molecular characteristics of the obtained ABC triblock copolymer.

(2) The ABC triblock copolymer obtained in (1) was hydrogenated in the same manner as in Sample 1.

Table 1 shows the molecular characteristics of the obtained hydrogenated ABC triblock copolymer.

Sample 3 (1) Using the same apparatus as in Sample 1, increasing the amount of n-butyllithium and decreasing the amount of tetrahydrofuran from Sample 1 to obtain an ABC triblock copolymer shown in Table 1. .

(2) The copolymer of (1) was subjected to a hydrogenation reaction in the same manner as in Sample 1. Table 1 shows the molecular characteristics of the obtained hydrogenated ABC triblock copolymer.

Sample 4 (1) An ABC triblock copolymer similar to that of Sample 1 was synthesized using the same apparatus as that of Sample 1, except that the amount of n-butyllithium was increased.

To this ABC triblock copolymer, dimethyldichlorosilane was added in an amount of 0.5 molar equivalent to n-butyllithium, and a coupling reaction was performed.

The obtained (CBA) _2- X type block polymer has a vinyl content of the C block of 13% and a number average molecular weight of 13%.
The B block had a vinyl content of 51% and a number average molecular weight of 32,000. The A block had a styrene content of 100% by weight and a number average molecular weight of 18,000.

(2) The (CBA) ₂ -X type block polymer obtained in (1) was subjected to a hydrogenation reaction in the same manner as in Sample 1. The hydrogenation rate of the butadiene unit was 96%, and the hydrogenation rate of the styrene unit was 1% or less.

Sample 5 (1) Cyclohexane 25
After charging 00 g and 350 g of 1,3-butadiene, 12.5 g of tetrahydrofuran and 0.50 g of n-butyllithium were added, and the temperature was raised from 50 ° C. to 80 ° C. by polymerization. After the conversion reached almost 100%, 150 g of styrene was added and polymerization was carried out for 15 minutes.
The analysis values of the obtained polymer are shown in Table 1.

(2) Next, the AB block copolymer obtained in (1) was subjected to a hydrogenation reaction in the same manner as in Sample 1. Table 1 shows the molecular characteristics of the obtained hydrogenated copolymer.

Sample 6 (1) Using the same apparatus as in Sample 1, increase the amount of n-butyllithium to 0.75 g from Sample 1, and when the conversion reaches 30%, add 12.5 g of tetrahydrofuran, and add 50 to 80 ° C.
The polymerization was performed until the temperature rose. After confirming that the conversion reached almost 100%, dimethyldichlorosilane was added in an amount of 0.5 molar equivalent (0.76 g) to n-butyllithium, and a coupling reaction was performed. The obtained (CB) ₂ -X type block polymer has a vinyl content of the C block.
The number average molecular weight was 18,000 at 12%, the vinyl content of the B block was 51%, and the number average molecular weight was 42,000.

(2) The (CB) ₂ -X type block polymer obtained in (1) was subjected to a hydrogenation reaction under the same conditions as in Sample 1. The hydrogenation rate of the butadiene unit was 97%, and the hydrogenation rate of the styrene unit was 1% or less.

Next, using the sample 1 shown in Table 1, graft polymerization was carried out according to the following procedure to obtain a modified hydrogenated block copolymer.

That is, 1 part by weight of the hydrogenated block copolymer was added to 1 part.
Closed small kneader adjusted to 90 ° C (HAAKE BUCKLER,
HAAKE RHEOCORD SYSTM 40 RHEOMIX MIXER600), and after 2 minutes, 2.5 parts of maleic anhydride were added and mixed, and then an organic peroxide [2,5-dimethyl-2,5-di (t-butylperoxy) hexane] was used. Nippon Oil & Fats Co., Ltd.
25B], and kneading was further continued for 5 minutes to obtain a maleic anhydride-grafted hydrogenated block copolymer sample (A).

Hereinafter, the modified hydrogenated block copolymers (B) to (G) obtained by the same procedure are summarized in Table-2.

Example-1 A thermosetting resin composition (epoxy resin composition) was obtained from the above sample (A) according to the following procedure.

Cresol novolak type epoxy resin (Epoxy equivalent
220) 100 parts by weight Phenol resin (Novolak type) 50 硬化 Hardener (2-methylimidazole) 5 〃 Sample (A) 10 〃 Knead them at about 80 ° C using a closed mixer,
Press molding was performed at 0 ° C., and the obtained molded plate was processed with a milling machine to prepare a sample for evaluating physical properties. The evaluation results are shown in Table-3.

Examples 2 and 3 An epoxy resin composition was obtained under the same conditions as in Example 1, except that the mixing amount of the sample (A) was 2 parts and 30 parts.

Examples-4 to 7 Instead of the sample- (A) used in Example-1, samples (B) to (E) shown in Table 2 were used and in the same manner as in Example-1. An epoxy resin composition was obtained.

Comparative Example-1 In Example-1, instead of the modified hydrogenated block copolymer sample (A), Nippon Synthetic Rubber Co., Ltd. styrene-butadiene rubber 1031N (40.0% of bound styrene, Mooney viscosity ML _{1 + 4} ( (100 ° C.) = 60) to obtain an epoxy resin composition.

Comparative Example-2 A hydrogenated block copolymer sample in Example-1
An epoxy resin composition was obtained using the block copolymer 1 (described in Table 1) before the hydrogenation.

Comparative Example-3 An epoxy resin composition was obtained in Example 1, using Sample (F) (described in Table 2) instead of Sample (A).

Comparative Example-4 An epoxy resin composition was obtained in Example 1, using Sample (G) (described in Table 2) instead of Sample (A).

Comparative Example-5 Instead of sample (A), liquid carboxy NBR (CTBN: trade name), which has been widely studied in the past for modifying epoxy resin
An epoxy resin composition was obtained in the same manner as in Example 1 using Hycar CTBN1300 × 8).

Comparative Example-6 An epoxy resin composition was prepared in the same manner as in Example 1, except that acrylonitrile-butadiene rubber (JSRN220S: bound acrylonitrile amount 41%, Mooney viscosity 56, manufactured by Nippon Synthetic Rubber Co., Ltd.) was used instead of sample (A). I got something.

Comparative Example-7 An epoxy resin composition was obtained in the same manner as in Example 1, except that the sample (A) was not used.

 The results are shown in Table-3.

As is clear from the comparison between Examples 1 to 7 and Comparative Examples 1 to 7 shown in Table 3, the epoxy resin composition according to the present invention comprises:
It can be seen that the material has good mechanical strength, excellent heat resistance and electrical properties, and has high fluidity and excellent moldability.

Example-8 A phenol resin composition was obtained by the following procedure using the modified hydrogenated block copolymer sample (A) used in Example-1.

Phenol resin (novolak type) 100 parts by weight Modified hydrogenated block copolymer sample (A) 10 parts by weight Hexamethylenetetramine 10 に 従 っ て According to the above recipe, knead the mixture with an electric heating roll at 130 ° C. for 5 minutes, and then pulverize. Press molding was performed at 10 ° C. for 10 minutes to obtain a molded plate having a thickness of 4 mm. This was processed with a milling machine according to JIS K6911 to produce a test piece.
The test results are summarized in Table-4.

Examples 9 and 10 Instead of the sample (A) of Example-8, the sample (B) or (C) shown in Table 2 was used to obtain an example-8.
A phenol resin composition was obtained in the same manner as described above.

Comparative Example-8 A phenol resin composition was obtained in the same manner as in Example-8, using the unhydrogenated block copolymer (Table-1, Sample-1) used in Comparative Example-2.

Comparative Example-9 A phenol resin composition was obtained in the same manner as in Example-8, using the acrylonitrile-butadiene rubber used in Comparative Example-6.

Comparative Example-10 A phenol resin composition was obtained in the same manner as in Example-8 except that the sample (A) was not used.

 The results are shown in Table-4.

As is clear from the results shown in Table 4, the phenolic resin composition of the present invention is excellent in impact resistance, electric insulation, and heat resistance.

f. Effects of the Invention The thermosetting resin composition of the present invention using a hydrogenated block copolymer having a specific block structure has a more electrical insulation than the conventional thermosetting resin composition to which a modifier is added. The coating material, mainly for electric and electronic parts, automobile parts, and construction, has excellent moldability, mechanical strength, impact resistance, weather resistance, and heat resistance. , Molding materials, adhesives, paints, etc.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ identification code FI C08L 101: 02) (58) Investigated field (Int.Cl. ⁶ , DB name) C08L 101/00-101/14 C08L 53 / 00-53/02 C08K 5/00-5/59

Claims (1)

(57) [Claims] (A) 100 parts by weight of a thermosetting resin, (B) having at least one polymer block A, B and C in the molecule (where A is a vinyl aromatic compound) 90
B is a polymer block mainly composed of a vinyl aromatic compound in an amount of at least 30% by weight, B is a polybutadiene polymer block having 1,2-vinyl bonds of 30 to 70%, and C is a polybutadiene polymer block having 1,2 vinyl bonds of less than 30%. It is. A) a block copolymer wherein the content of the polymer block A is 10 to 50% by weight, the content of the polymer block B is 30 to 80% by weight, and the content of the polymer block C is 5 to 30% by weight; A block copolymer unit is bonded to a polymer unit comprising at least one polymer block of the above A, B or C via a coupling agent residue, and the polymer molecular chain is a linear or branched block. The copolymer is obtained by hydrogenating at least 80% or more of the olefinically unsaturated bonds in the block copolymer.
0.1 to 400 parts by weight of a hydrogenated block copolymer of 000, and (c) a functional group-containing compound having at least one functional group selected from an amino group, a hydroxyl group, an epoxy group, a carboxyl group and an acid anhydride group. , (B) ingredient 10
A thermosetting resin composition containing 0 to 20 parts by weight per 0 parts by weight.