JP2780577B2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JP2780577B2 JP2780577B2 JP20962592A JP20962592A JP2780577B2 JP 2780577 B2 JP2780577 B2 JP 2780577B2 JP 20962592 A JP20962592 A JP 20962592A JP 20962592 A JP20962592 A JP 20962592A JP 2780577 B2 JP2780577 B2 JP 2780577B2
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- multilayer printed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層印刷配線板に関
し、特にパッド内に非貫通スルーホールを有する多層印
刷配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board, and more particularly to a multilayer printed wiring board having a non-through hole in a pad.
【０００２】[0002]
【従来の技術】多層印刷配線板は、全てのスルーホール
が貫通スルーホールである構造のものに対して、一部の
スルーホールが非貫通スルーホールである構造のものが
増加している。2. Description of the Related Art Multilayer printed wiring boards having a structure in which all through-holes are through-holes are increasing, while a structure in which some through-holes are non-through-holes is increasing.
【０００３】更に高密度化へ対応するため、図３に示す
ように、多層印刷配線板１の部品実装用パッドの中に非
貫通スルーホール３を設けて積層時に樹脂を充填して銅
めっき６を行い、フラットな銅めっき面のパッド２を形
成していた。５は貫通スルーホールである。As shown in FIG. 3, a non-through through hole 3 is provided in a component mounting pad of a multilayer printed wiring board 1 so as to cope with a higher density, and a resin is filled during lamination to form a copper plating 6. To form the pad 2 having a flat copper plating surface. 5 is a through-hole.
【０００４】また、実開平２−１３７７１号のようにパ
ッドの外周面に段差部を形成した印刷配線板も考えられ
ていた。Further, a printed wiring board having a step formed on the outer peripheral surface of a pad as disclosed in Japanese Utility Model Laid-Open No. 2-13771 has been considered.
【０００５】[0005]
【発明が解決しようとする課題】従来のパッド内非貫通
スルーホールを有する多層印刷配線板では、パッド内の
非貫通スルーホール上に、フラットな銅めっきを形成し
ている。このため、実装部品が小さくなり、パッドも小
さくなると、部品実装時に供給される半田ペーストの量
も少量となり、部品の半田付け信頼性が劣化するという
問題点がある。In a conventional multilayer printed wiring board having a non-penetrating through hole in a pad, flat copper plating is formed on the non-penetrating through hole in a pad. For this reason, when the mounted component becomes smaller and the pad becomes smaller, the amount of the solder paste supplied at the time of mounting the component also becomes small, and there is a problem that the soldering reliability of the component is deteriorated.
【０００６】また、従来のパッドの外周に段差部を有す
る印刷配線板では、パッドの外周の段差を所定の寸法が
得られるようにするため、結果的にパッドの厚みを増す
必要があるので、パッドの金属量を増やし、パッドのめ
っきを厚くつけなければならないこと、パッド形成時に
パッド寸法の精度が悪化することや、また段差形成のた
めに製造工程が増える、などの問題点があった。Further, in the conventional printed wiring board having a step on the outer periphery of the pad, it is necessary to increase the thickness of the pad in order to obtain a predetermined step on the outer periphery of the pad. There are problems that the amount of metal of the pad must be increased and the plating of the pad must be made thicker, the precision of the pad dimension deteriorates when forming the pad, and the number of manufacturing steps increases due to the formation of steps.
【０００７】本発明の目的は、部品実装時の半田付け信
頼性が向上した多層印刷配線板を提供することにある。An object of the present invention is to provide a multilayer printed wiring board having improved soldering reliability during component mounting.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するた
め、本発明に係る多層印刷配線板は、貫通スルーホール
と非貫通スルーホールとが混在した多層印刷配線板であ
って、貫通スルーホールは、多層印刷配線板を上下に貫
通して設けられたものであり、非貫通スルーホールは、
内部に絶縁性樹脂が充填され、絶縁性樹脂は、その頭部
が多層印刷配線板の表面上に凸形状に隆起し、頭部上に
凸状のパッドを有するものである。In order to achieve the above object, a multilayer printed wiring board according to the present invention is a multilayer printed wiring board in which through-holes and non-through-holes are mixed, wherein the through-holes are , Is provided by vertically penetrating the multilayer printed wiring board, the non-penetrating through hole,
The inside is filled with an insulating resin, and the insulating resin has a head that protrudes in a convex shape on the surface of the multilayer printed wiring board and has a convex pad on the head.
【０００９】[0009]
【作用】非貫通スルーホールより突出した絶縁性樹脂の
頭部上に凸状のパッドを設けたため、パッドの表面積を
フラットの場合よりも拡大して半田供給量を増加し、確
実な半田付けを行なう。[Function] Since a convex pad is provided on the head of the insulating resin projecting from the non-through through hole, the surface area of the pad is enlarged as compared with the case of the flat case, so that the amount of supplied solder is increased, and reliable soldering is performed. Do.
【００１０】[0010]
【実施例】以下、本発明の実施例を図により説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.
【００１１】（実施例１）図１は、本発明の実施例１を
示す図である。(Embodiment 1) FIG. 1 is a diagram showing Embodiment 1 of the present invention.
【００１２】図において、多層印刷配線板１には、上下
に貫通する貫通スルーホール５と、配線板の表面側がパ
ッド２により閉塞される非貫通スルーホール３とが混在
して設けられる。In FIG. 1, a multilayer printed wiring board 1 is provided with a through-hole 5 penetrating vertically and a non-through-hole 3 in which the front side of the wiring board is closed by a pad 2.
【００１３】非貫通スルーホール３には、多層に積層さ
れる際に絶縁性樹脂３ａが充填されるものであり、この
絶縁性樹脂３ａの頂部が印刷配線板１の表面上から隆起
するように凸状部４として形成し、その凸状部４に沿っ
て銅めっき６を施こし、非貫通スルーホール３に対応し
て形成されるパッド２を凸状として構築してある。The non-penetrating through hole 3 is filled with an insulating resin 3a when being laminated in multiple layers, and the top of the insulating resin 3a is raised from above the surface of the printed wiring board 1. The protrusions 4 are formed, and copper plating 6 is applied along the protrusions 4 so that the pads 2 formed corresponding to the non-through-holes 3 are formed in a convex shape.
【００１４】また、凸状部４上の銅めっき６は、パッド
２と同時に行うので、パッド２の凸状部４以外の部分よ
り、銅めっき厚が厚くなることはない。Further, since the copper plating 6 on the convex portion 4 is performed simultaneously with the pad 2, the thickness of the copper plating does not become larger than that of the portion other than the convex portion 4 of the pad 2.
【００１５】本実施例によれば、パッド２が凸状に隆起
しているため、パッド２の表面積が増大し、半田の供給
量が増加し、これにより十分な半田量をもって半田付け
を確実に行うことが可能となる。According to the present embodiment, since the pad 2 is raised in a convex shape, the surface area of the pad 2 is increased, and the amount of supplied solder is increased, whereby the soldering is ensured with a sufficient amount of solder. It is possible to do.
【００１６】（実施例２）図２は、本発明の実施例２を
示す図である。(Embodiment 2) FIG. 2 is a view showing Embodiment 2 of the present invention.
【００１７】前記実施例では、パッドの表面積を拡大さ
せるために、凸状部４ａを弧状に隆起させたが、本実施
例では円柱状に隆起させて凸状部４ａを形成してパッド
の表面積を拡大したものである。In the above embodiment, in order to increase the surface area of the pad, the convex portion 4a is raised in an arc shape. However, in this embodiment, the convex portion 4a is formed in a cylindrical shape to form the convex portion 4a, and the surface area of the pad is increased. It is an expansion of.
【００１８】[0018]
【発明の効果】以上説明したように本発明は、パッド内
非貫通スルーホール上のパッドを凸状に形成したため、
パッド表面積が増大し、半田ペースト供給時にパッドの
凸部のまわりに半田が広がり、フラットな銅箔面のとき
より多くの半田がパッドに供給でき、部品の半田付け信
頼性が向上する効果がある。As described above, according to the present invention, the pad on the non-through hole in the pad is formed in a convex shape.
The surface area of the pad increases, the solder spreads around the convex part of the pad when supplying the solder paste, and more solder can be supplied to the pad than on the flat copper foil surface, which has the effect of improving the soldering reliability of components .
【００１９】また、パッド内の凸状部は、周囲と比べめ
っき厚の増加がなく、パッド形成時にパッド寸法の精度
が悪化しないこと、製造工程が増えないなどの効果があ
る。The convex portion in the pad does not increase the plating thickness as compared with the surroundings, and has the effects that the precision of the pad dimension does not deteriorate when the pad is formed and that the number of manufacturing steps does not increase.
【００２０】また、実施例２はパッドの凸状部が円柱状
であるため、搭載部品との接面部で位置安定性が増し、
部品搭載が容易にできる。In the second embodiment, since the convex portion of the pad is cylindrical, the positional stability at the contact surface with the mounted component is increased,
Components can be easily mounted.
【図１】本発明の実施例１に係る多層印刷配線板を示す
断面図である。FIG. 1 is a sectional view showing a multilayer printed wiring board according to Embodiment 1 of the present invention.
【図２】本発明の実施例２に係る多層印刷配線板を示す
断面図である。FIG. 2 is a cross-sectional view illustrating a multilayer printed wiring board according to Embodiment 2 of the present invention.
【図３】従来例に係る多層印刷配線板を示す断面図であ
る。FIG. 3 is a cross-sectional view illustrating a multilayer printed wiring board according to a conventional example.
１ 多層印刷配線板 ２ パッド ３ パッド内非貫通スルーホール ４ パッド内凸状部 ５ 貫通スルーホール ６ 銅めっき DESCRIPTION OF SYMBOLS 1 Multilayer printed wiring board 2 Pad 3 Non-through-hole in a pad 4 Convex part in a pad 5 Through-hole 6 Copper plating
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭59−210697（ＪＰ，Ａ) 特開 平４−94186（ＪＰ，Ａ) 特開 平４−37092（ＪＰ，Ａ) 特開 平３−289194（ＪＰ，Ａ) 特開 平３−112191（ＪＰ，Ａ) 特開 平３−246993（ＪＰ，Ａ) 特開 平４−199696（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/46 H05K 3/34 505──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-210697 (JP, A) JP-A-4-94186 (JP, A) JP-A-4-37092 (JP, A) JP-A-3-3 289194 (JP, A) JP-A-3-112191 (JP, A) JP-A-3-246993 (JP, A) JP-A-4-199696 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 3/46 H05K 3/34 505
Claims (1)
とが混在した多層印刷配線板であって、 貫通スルーホールは、多層印刷配線板を上下に貫通して
設けられたものであり、 非貫通スルーホールは、内部に絶縁性樹脂が充填され、 絶縁性樹脂は、その頭部が多層印刷配線板の表面上に凸
形状に隆起し、頭部上に凸状のパッドを有するものであ
ることを特徴とする多層印刷配線板。1. A multilayer printed wiring board in which through-holes and non-through-holes are mixed, wherein the through-holes are provided vertically through the multilayer printed-wiring board. The hole is filled with an insulating resin, and the insulating resin has a head raised in a convex shape on the surface of the multilayer printed wiring board and having a convex pad on the head. Characteristic multilayer printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20962592A JP2780577B2 (en) | 1992-07-14 | 1992-07-14 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20962592A JP2780577B2 (en) | 1992-07-14 | 1992-07-14 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0637456A JPH0637456A (en) | 1994-02-10 |
| JP2780577B2 true JP2780577B2 (en) | 1998-07-30 |
Family
ID=16575898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20962592A Expired - Fee Related JP2780577B2 (en) | 1992-07-14 | 1992-07-14 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2780577B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000036301A (en) * | 1999-11-17 | 2000-07-05 | 배영하 | Hole Pluging Land PCB and fabrcation method |
-
1992
- 1992-07-14 JP JP20962592A patent/JP2780577B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0637456A (en) | 1994-02-10 |
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