JP2760566B2 - Carrier tape component mounting device - Google Patents

Description

The present invention relates to a carrier tape component mounting apparatus for mounting a carrier tape component on a terminal portion of a liquid crystal substrate.

(Prior Art) For example, a carrier tape component in which an IC is incorporated in a tape is usually wound around a reel or the like. Then, the carrier tape component is unreeled from a reel, punched out by a die or the like, and then packed and stored in a tray or the like.

When mounting the carrier tape components on a liquid crystal substrate, an operator takes out the carrier tape components from the tray and mounts them one by one by hand.

In other words, with the miniaturization of liquid crystal display devices, a method of directly connecting outer leads of a carrier tape component to terminal portions of a liquid crystal substrate has been implemented. However, when it comes to an A4 size liquid crystal substrate, the number of carrier tape components connected to its terminals is as large as 12 and the terminal pitch is as narrow as 0.25 mm.
In the related art, temporary connection is performed by manually adjusting the positions one by one.

However, manual alignment is cumbersome and inefficient, and high-precision alignment is not possible.
Prone to poor connection.

As a method of aligning a carrier tape component with a terminal portion of a liquid crystal substrate, for example, Japanese Patent Application Laid-Open No. 63-27030 is known. This is done by inserting a pin with a thin tip into the positioning hole of the film carrier placed on the slide base, projecting the tip of the pin, and then pressing the surface of the film carrier with the film carrier holding plate. , The pin is further raised and positioned. Thereafter, the pins are lowered while the film carrier pressing plate is pressed, and after the pins have been lowered, the film carrier pressing plate is separated from the film carrier.

(Problems to be Solved by the Invention) However, as described above, when a carrier tape component incorporating an IC in a tape is punched in a separate process, the work of packing the punched carrier tape component into a tray or the like is performed. The work of carrying the package to the mounting process is required, and even if the carrier tape components are automatically supplied from the tray, the space of the apparatus is limited, so that the number that can be continuously supplied is limited.

Also, as a method of aligning the carrier tape component, a method of inserting a pin into a positioning hole and aligning the same, in order to align the electrode of the liquid crystal substrate with the electrode of the film carrier, use a stereoscopic microscope. It is necessary to finely adjust the slide base by moving the slide base in the horizontal direction while observing, and the position is manually adjusted. Therefore, it takes a lot of time to perform high-accuracy alignment, which causes a reduction in work efficiency.

The present invention has been made in view of the above circumstances, and its purpose is to supply a carrier tape component, align and mount electrodes of a liquid crystal substrate with electrodes of a carrier tape component without human intervention. An object of the present invention is to provide an apparatus for mounting a carrier tape component that can be automatically performed and can improve productivity.

[Constitution of the Invention] (Means and Actions for Solving the Problems) In order to achieve the above object, the present invention continuously supplies a carrier tape component together with a tape, and supplies the carrier tape component from the supply unit. Is punched into a predetermined shape by a punching mechanism having a die, the punched carrier tape component is held, and the carrier tape component is carried out to a take-out position.

On the other hand, holding the liquid crystal substrate on which the carrier tape component is mounted, providing a substrate mounting stage that is movable in the XY and θ directions in a horizontal plane, and between the substrate mounting stage and the take-out position of the punching mechanism, A temporary positioning stage provided with a positioning mechanism for temporarily positioning the carrier tape component is installed.

Then, the carrier tape component at the take-out position is suctioned by the transfer head and transferred to the temporary positioning stage, and the carrier tape component that has been temporarily positioned is sucked by the mounting head to mount the substrate mounting stage. Transport to Further, a pressing force from above in mounting by the mounting head is supported below the liquid crystal substrate by a backup mechanism, and a carrier tape component is mounted on the liquid crystal substrate.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The substrate mounting stage 1 shown in FIG. 1 and FIG.
It is composed of a table 2, a Y table 3, and a θ table 4. A jig 6 for holding a liquid crystal substrate 5 is provided on the θ table 4. Therefore, the liquid crystal substrate 5 is movable in the XY and θ directions by the substrate mounting stage 1, and the terminal portions 7 are held in a state of protruding laterally from the jig 6.

The substrate mounting stage 1 is provided at a front portion of a base 8 of a mounting apparatus, and at a rear portion thereof, a supply portion 9 for supplying a carrier tape component 10 on which an IC chip is mounted is provided. In this embodiment, the first carrier tape component supply unit 10a and the second carrier tape component supply unit 10b are of a double type in which they are arranged side by side and have the same structure. It is configured as shown in FIG. 11 is a supply reel, and 12 is a spacer tape take-up reel. The carrier tape component 10 is wound around the supply reel 11 together with the spacer tape 13 and is sequentially fed out. The supply reel 11 is provided with a rear sprocket 15 for regulating the position of the tension roller 14 and the carrier tape component 10 in the width direction, and is provided with a take-up reel 16 for winding a punched tape. Further, a front sprocket 17 for feeding the carrier tape component 10 by a certain length is provided on the base 8 at the same height position as the rear sprocket 15. Then, the spacer tape 13 is fed out from the supply reel 11 and wound on the spacer tape take-up reel 12. The carrier tape component 10 unwound from the supply reel 11 is wound in the order of a tension roller 14, a rear sprocket 15, and a front sprocket 17, and a punched tape punched by means described later is wound around a take-up reel 16. It has become.

A punching mechanism 19 for punching the carrier tape component 10 into a predetermined shape is installed in the carrier tape component running path 18 located between the rear sprocket 15 and the front sprocket 17. This punching mechanism 19 comprises an upper mold 20 and a lower mold 21 sandwiching the carrier tape component traveling path 18 up and down,
The upper mold 20 is moved up and down by the air cylinder 22 to punch the carrier tape component 10.

Further, as shown in FIG. 4, the lower mold 21 is placed on a moving table 23 orthogonal to the carrier tape component traveling path 18, and the lower mold 21 is moved between a punching position 24 and a takeout position 25. It is configured to reciprocate. The lower mold
A fixing portion 26 for fixing the punched carrier tape component 10 is provided on the upper surface of the 21, and sucks and holds the carrier tape component 10 by, for example, vacuum suction.

Therefore, in the case of a double type in which the first carrier tape component supply unit 10a and the second carrier tape component supply unit 10b are arranged side by side, the take-out position 25 is provided between both punching mechanisms 19, 19. Thus, different types of carrier tape components 10 can be supplied to the take-out position 25 from the first carrier tape component supply unit 10a and the second carrier tape component supply unit 10b. Moreover, since the lower mold 21 is placed on the moving table 23 and reciprocates between the punching position 24 and the take-out position 25, when one lower mold 21 is located at the punching position 24, The lower mold 21 is located at the take-out position 25, and the carrier tape component 10 can be alternately supplied to the take-out position 25 from the first carrier tape component supply portion 10a and the second carrier tape component supply portion 10b.

Further, the take-out position 25 and the substrate mounting stage 1
A temporary positioning stage 33 is provided between them. The temporary positioning stage 33 has a rotation axis 35 perpendicular to the base 8, as shown in FIGS.
A positioning table 36 is provided at the upper end of the rotating shaft 35. The positioning table 36 is rotatable by a pulse motor (not shown) directly connected to the rotating shaft 35,
A step 37 is provided on one side edge. The carrier tape component 10 is located on the upper surface of the positioning table 36.
A number of suction holes 38 for vacuum suction are formed, and communicate with a vacuum suction source (not shown). Also,
An L-shaped pusher lever 39 is provided at the step 37 of the positioning table 36, and is provided with an air cylinder.
The portion 40 is formed so as to be able to advance and retreat with respect to the step portion 37. And the pusher lever 39 is positioned on the positioning table.
A positioning mechanism 41 for temporarily positioning the carrier tape component 10 by pushing the edge of the carrier tape component 10 sucked and held on 36 is configured.

A transport mechanism 42 is provided above the supply section 9 and the temporary positioning table 33. A description will be given of the transport mechanism 42. Reference numeral 43 denotes a guide rail, which is provided between the take-out position 25 of the supply unit 9 and the mounting position 44 of the liquid crystal substrate 5 held on the substrate mounting stage 1. I have. A transfer robot 45 is movably provided on the guide rail 43, and a transfer head is provided on the transfer robot 45.
46 and a mounting head 47 are provided. This transfer head 46
The distance between the transfer head 46 and the mounting head 47 is equal to the distance between the take-out position 25 and the temporary positioning stage 33.
The mounting head 47 faces the temporary positioning stage 33 when faces the take-out position 25. Further, the transfer head 46
The mounting head 47 and the mounting head 47 have basically the same structure, have vacuum suction portions 46a and 47a on the lower surface, and are moved up and down by a cylinder 49 along a vertical guide 48.

A first camera 50 as an optical system for capturing an image of the terminal portion 7 of the liquid crystal substrate 5 is provided at an end of the guide rail 43 so as to face the mounting position 44. Also, the mounting position
A second camera 51 as an optical system for imaging a part of each of the terminal 5x of the liquid crystal substrate 5 and the terminal 10x of the carrier tape component 10 in the same field of view is provided at the lower part facing 44. Then, the first and second cameras 50 and 51 recognize the position shift amount of the terminal 5x of the liquid crystal substrate 5 and the terminal 10x of the carrier tape component 10 by image processing, and move the substrate mounting stage 1 to reduce the shift amount. Correct and align.

Further, a backup mechanism is provided below the mounting position 44.
52 are provided. This backup mechanism 52 is
A guide member 54 that can move up and down with respect to 53 is provided,
The guide member 54 has a holding table 55 that can move linearly in the lateral direction.
have. The holding table 55 is movable forward and backward with respect to the lower part of the mounting position 44, and holds the pressing force from above on the liquid crystal substrate 5 at the lower part.

Next, the operation of the carrier tape component mounting apparatus configured as described above will be described.

The liquid crystal substrate 5 is held on the jig 6 of the substrate mounting stage 1, and the terminal 7 is located at the mounting position 44. In this state, the first camera 50 controls the terminal portion 7 of the liquid crystal substrate 5.
Move the alignment marks at both ends in the longitudinal direction of
Position recognition is performed by image processing. On the other hand, the liquid crystal substrate 5
The carrier tape components 10 to be mounted on the first and second carrier tape component supply units 10a and 10b are alternately supplied to a take-out position 25. That is, the carrier tape component 10 fed from the supply reel 11 travels in the order of the tension roller 14, the rear sprocket 15, and the front sprocket 17. Since a punching mechanism 19 for punching the carrier tape component 10 into a predetermined shape is installed in the carrier tape component running path 18 located between the rear sprocket 15 and the front sprocket 17, the upper die 20 is air-tight. Cylinder 22
Lowered by the carrier tape part between the lower mold 21
Perform 10 punches. Punched carrier tape parts 10
Is fixed to the fixing part 26 of the lower mold 21, and the carrier tape component 10 moves to the take-out position 25 by the movement of the moving table 23.

That is, the first carrier tape component supply unit 10a and the second
Since the carrier tape component supply units 10b are arranged side by side, the carrier tape component 10 is supplied to the take-out position 25 alternately from both punching mechanisms 19, 19.

When the transport mechanism 42 operates, the transfer head 46 faces the take-out position 25, sucks the carrier tape component 10 by the vacuum suction part 46a, and places the carrier tape component 10 on the positioning table 36 of the temporary positioning stage 33. . When the carrier tape component 10 is placed on the positioning table 36,
The pusher lever 39 moves in the Y direction, and pushes one end surface of the carrier tape component 10 to perform positioning in the Y direction.
From this state, the transfer mechanism 42 operates again, and the transfer robot 45
Is moved rightward along the guide rail 43, the transfer head 46 faces the support table 32, and the mounting head 47 faces the positioning table 36 of the temporary positioning stage 33. When the transfer head 46 and the mounting head 47 are simultaneously lowered, the transfer head 46 sucks the carrier tape component 10 on the support table 32, and the mounting head 47 moves to the positioning table 36.
The carrier tape component 10 positioned above is sucked.

Next, after the transfer head 46 and the mounting head 47 simultaneously move up, when the transport robot 45 moves a predetermined distance to the left, the carrier tape component 10 adsorbed by the mounting head 47 faces the mounting position 44. Here, as shown in FIG.
The distance L between the terminal surface of the liquid crystal substrate 5 and the terminal surface of the carrier tape component 10 is maintained at 0.5 to 1.0 mm, and the terminal 5x of the terminal portion 7 of the liquid crystal substrate 5 and the carrier tape component 10 are controlled by the second camera 51.
Of each of the terminals 10x ... in the same field of view,
The relative positional deviation between the two terminals 5x and 10x is detected by image processing, and the substrate mounting stage 1 is moved in the XY and θ directions to perform positioning.

Next, when the backup mechanism 52 operates and the holding table 35 moves forward, the holding table 35 faces the lower surface of the terminal portion 7 of the liquid crystal substrate 5 and supports the pressing force from above the mounting head 47 from below. . Then, the carrier tape component 10 attracted to the mounting head 47 is mounted on the terminal portion 7 of the liquid crystal substrate 5 with the lowering of the mounting head 47. At this time, as shown in FIG. ACF (Amistropic Conduc
tive film, anisotropic conductive film)
The temporary connection is performed by pressing with a load of about 20 kg.

When the temporary connection of the carrier tape component 10 to the liquid crystal substrate 5 is completed, the vacuum suction force of the mounting head 47 is released, the mounting head 47 rises, and then moves rightward with the transfer head 46 by the transport mechanism 42. . Then, the carrier tape component 10 is sucked, and the mounting head 47 sucks the carrier tape component 10 temporarily positioned on the temporary positioning stage 33. Then, by repeating the above operation again, the mounting of the carrier tape component 10 on the liquid crystal substrate 5 can be automatically performed.

In the above-described embodiment, the case where the carrier tape component 10 is temporarily connected to the liquid crystal substrate 5 has been described. However, by mounting the heater chip on the mounting head 47, the temporary connection is performed by applying pressure while heating. It is possible.

Further, by extending the stroke of the X table 2 of the substrate mounting stage 1 and holding the plurality of liquid crystal substrates 5 in one row, a carrier tape component for the plurality of liquid crystal substrates 5 is provided.
10 implementations can be performed continuously.

Further, the first carrier tape component supply unit 10a and the second
And the carrier tape component supply unit 10b is arranged in a two-line system so that different carrier tape components 10 can be supplied alternately, but the present invention is not limited to this.

[Effects of the Invention] As described above, according to the present invention, a carrier tape component can be continuously and automatically supplied, and can be punched into a predetermined shape by a punching mechanism. In addition, the temporary positioning and mounting of the carrier tape component can be continuously and automatically performed, and there is an effect that productivity can be improved.

[Brief description of the drawings]

The drawings show an embodiment of the present invention, FIG. 1 is a perspective view of a carrier tape component mounting apparatus, FIG. 2 is a side view of the same, FIG. 3 is a schematic side view of a carrier tape component supply unit, FIG. 4 is a schematic side view showing a relationship between a punching mechanism and a take-out position, FIG. 5 is a perspective view of a temporary positioning table,
FIG. 6 is a perspective view showing a state in which a carrier tape component is temporarily connected to a liquid crystal substrate, and FIG. 7 is an explanatory view showing a screen in a state where terminals are aligned with each other. 1 ... substrate mounting stage, 5 ... liquid crystal substrate, 7 ... terminal section, 9 ... supply section, 10 ... carrier tape parts, 13 ...
Temporary positioning stage, 19: punching mechanism, 42: transport mechanism, 44: mounting position, 46: transfer head, 47: mounting head, 52: backup mechanism.

Continuation of front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 21/60 311

Claims (1)

(57) [Claims] 1. A supply unit for continuously supplying a carrier tape component together with a tape, a carrier tape component supplied from the supply unit is punched into a predetermined shape, and the punched carrier tape component is held. A punching mechanism having a die for transporting a carrier tape component to a take-out position, a substrate mounting stage holding a liquid crystal substrate on which the carrier tape component is mounted, and being movable in XY and θ directions in a horizontal plane; A temporary positioning stage that is provided between a mounting stage and a take-out position of the punching mechanism and has a positioning mechanism for temporarily positioning the carrier tape component, and a carrier tape component at the take-out position is sucked to the temporary positioning stage. A vertically movable transfer head to be transferred; and A vertically movable mounting head for transporting to a mounting position of a liquid crystal substrate mounted on a plate mounting stage, and a transport mechanism for transporting the transfer head and the mounting head,
A mounting device for a carrier tape component, comprising: a back-up mechanism capable of moving back and forth below the mounting position and supporting a pressing force from above in mounting by the mounting head below the liquid crystal substrate.