JP2755274B2 - Waveguide type light receiving module - Google Patents
Waveguide type light receiving moduleInfo
- Publication number
- JP2755274B2 JP2755274B2 JP3345126A JP34512691A JP2755274B2 JP 2755274 B2 JP2755274 B2 JP 2755274B2 JP 3345126 A JP3345126 A JP 3345126A JP 34512691 A JP34512691 A JP 34512691A JP 2755274 B2 JP2755274 B2 JP 2755274B2
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- waveguide
- receiving element
- substrate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 7
- 229910015363 Au—Sn Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000002457 bidirectional effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 239000012792 core layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
Landscapes
- Light Receiving Elements (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、導波路と受光素子とを
備えてなる光デバイスに係り、特に、導波路と受光素子
の固定構造に特徴を有する導波路型受光モジュールに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device having a waveguide and a light receiving element, and more particularly to a waveguide type light receiving module having a fixed structure of the waveguide and the light receiving element.
【0002】[0002]
【従来の技術】従来、導波路と受光素子とを備える光デ
バイスとしては、図3に示す構造の双方向伝送モジュー
ル用導波路型光合分波器(上塚他、1991信学会秋期
大会C201)や、図4に示す構造の石英形導波路型双
方向伝送モジュール(1991信学会秋期大会C15
7)がある。2. Description of the Related Art Conventionally, as an optical device having a waveguide and a light receiving element, a waveguide type optical multiplexer / demultiplexer for a bidirectional transmission module having the structure shown in FIG. 3 (Uesuka et al., 1991 IEICE Fall Meeting C201). And a quartz-type waveguide-type bidirectional transmission module having the structure shown in FIG.
7).
【0003】これらの図を参照すると、従来のモジュー
ルでは、受光素子と導波路とが互いに独立した状態で配
置されているのが一般的になっている。Referring to these drawings, in a conventional module, a light receiving element and a waveguide are generally arranged independently of each other.
【0004】例えば図3を参照すると、ステム9の内壁
にLD素子10を配し、非接触型の導波路型合分波器1
1から出射される光がLD素子10のほぼ中心に照射さ
れる構造を有している。この導波路型合分波器11への
光の入射は光ファイバ13により行われ、且つLD素子
10からの光は、PD素子12及び光ファイバ13を介
して外部に出射される。これら部品10〜13はパッケ
ージ14内に収容され、外部光を遮っている。For example, referring to FIG. 3, an LD element 10 is disposed on the inner wall of a stem 9 and a non-contact type waveguide type multiplexer / demultiplexer 1 is provided.
1 has a structure in which light emitted from the light source 1 is applied to almost the center of the LD element 10. Light enters the waveguide type multiplexer / demultiplexer 11 through an optical fiber 13, and light from the LD element 10 is emitted to the outside via the PD element 12 and the optical fiber 13. These components 10 to 13 are housed in a package 14 and block external light.
【0005】図4に示す石英形導波路型双方向伝送モジ
ュールもほぼ同様の構造を有する。即ち、LD素子15
と石英系導波路17とを一対のレンズ16を介して対向
させるとともに、導波路17の入射側にPD素子18を
配し、これら部品をパッケージ19内に収容している。The quartz waveguide type bidirectional transmission module shown in FIG. 4 has a substantially similar structure. That is, the LD element 15
And a quartz-based waveguide 17 are opposed to each other via a pair of lenses 16, a PD element 18 is arranged on the incident side of the waveguide 17, and these components are accommodated in a package 19.
【0006】[0006]
【発明が解決しようとする課題】このような従来の構造
では、いずれも導波路と受光素子とが互いに独立した構
造のため、両者の結合効率を最適にするためには相互の
位置関係を光軸を基準として精密に調整する必要があっ
た。そのため、自動化や大量生産ができず、コストが上
昇する問題があった。In such a conventional structure, the waveguide and the light receiving element are both independent of each other. Therefore, in order to optimize the coupling efficiency of the two, the mutual positional relationship must be determined. It had to be precisely adjusted based on the axis. For this reason, there has been a problem that automation and mass production cannot be performed, and costs increase.
【0007】本発明はかかる問題点に鑑みてなされたも
ので、その目的とするところは、自動化による大量生
産、コストダウンが可能となる構造の導波路型受光モジ
ュールを提供することにある。The present invention has been made in view of such a problem, and an object of the present invention is to provide a waveguide type light receiving module having a structure that enables mass production and cost reduction by automation.
【0008】[0008]
【課題を解決するための手段】本発明によれば、基板表
面上に形成された導波路の終端から出射される光の光軸
上に受光素子を配した構造の導波路型受光モジュールで
あって、前記導波路の側方に前記基板表面に沿って前記
導波路から光が出射されるように、前記導波路の終端面
を斜めに形成することにより前記導波路の終端面に設け
られた全反射面と、前記導波路の前記側方の前記基板表
面に設けられ、前記全反射面により反射された光が前記
導波路から出射する該導波路の出射面に前記受光素子の
受光面が位置するように前記受光素子を保持する溝と、
前記導波路の前記側方の前記基板表面に前記溝に隣接し
て設けられ、前記溝に保持された前記受光素子に電気的
に接続される導波路電極とを有することを特徴とする導
波路型受光モジュールが得られる。According to the present invention, there is provided a waveguide type light receiving module having a structure in which a light receiving element is arranged on an optical axis of light emitted from the end of a waveguide formed on a substrate surface. The end face of the waveguide was formed obliquely so that light was emitted from the waveguide along the surface of the substrate on the side of the waveguide, and the light guide was provided on the end face of the waveguide. A total reflection surface and a light receiving surface of the light receiving element are provided on the substrate surface on the side of the waveguide, and light reflected by the total reflection surface is emitted from the waveguide. A groove for holding the light receiving element so as to be located;
A waveguide electrode provided adjacent to the groove on the substrate surface on the side of the waveguide and electrically connected to the light receiving element held in the groove. A type light receiving module is obtained.
【0009】更に本発明によれば、前記基板への前記受
光素子の固定と、前記基板上の前記導波路電極と前記受
光素子の電気的接続は、該受光素子に形成したAu −S
n バンプを溶融させることにより行うことを特徴とする
導波路型受光モジュールが得られる。Further, according to the present invention, the fixing of the light receiving element to the substrate and the electrical connection between the waveguide electrode and the light receiving element on the substrate are performed by using an Au-S formed on the light receiving element.
n The waveguide type light receiving module is obtained by melting the bumps.
【0010】[0010]
【実施例】以下、図面を参照して本発明の実施例を説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【0011】図1は本発明の一実施例に係る導波路型受
光モジュールの構造斜視図であり、1はSi基板、2は
クラッド層、3はコア層、4は受光素子、5はガイド
溝、6は導波路電極を示す。FIG. 1 is a perspective view showing the structure of a waveguide type light receiving module according to an embodiment of the present invention, wherein 1 is a Si substrate, 2 is a cladding layer, 3 is a core layer, 4 is a light receiving element, and 5 is a guide groove. , 6 indicate waveguide electrodes.
【0012】導波路は、Si基板1上にSiO2 をクラ
ッド層2、TiO2-SiO2 をコア層3として形成され
ている。The waveguide is formed on a Si substrate 1 with a cladding layer 2 of SiO 2 and a core layer 3 of TiO 2 -SiO 2.
【0013】導波路の終端は、図1に示すように、斜め
にカットされた全反射面となっており、図示を省略した
光ファイバ等を介して伝送されてきた光はこの全反射面
で反射され、導波路の側方から出射される。As shown in FIG. 1, the end of the waveguide is a diagonally cut total reflection surface, and light transmitted via an optical fiber or the like (not shown) reflects the total reflection surface. The light is reflected and emitted from the side of the waveguide.
【0014】光の出射方向の導波路側方のSi基板1上
には、受光素子4を固定するためのガイド溝5と電極6
とが設けられている。このガイド溝5は、受光素子4の
外形より僅かに大きな内径寸法の溝であり、例えば反応
性イオンエッチングによって加工される。ガイド溝5の
深さや位置は、受光素子4を挿入固定したときに導波路
からの出射光が受光面7の中心に入射されるように設定
されている。On the Si substrate 1 on the side of the waveguide in the light emission direction, a guide groove 5 for fixing the light receiving element 4 and an electrode 6
Are provided. The guide groove 5 is a groove having an inner diameter slightly larger than the outer shape of the light receiving element 4, and is processed by, for example, reactive ion etching. The depth and position of the guide groove 5 are set such that the light emitted from the waveguide enters the center of the light receiving surface 7 when the light receiving element 4 is inserted and fixed.
【0015】図2は本実施例に係る受光モジュールの受
光素子4と導波路電極6との接続過程説明図であり、
(a)は接続前、(b)は接続後の状態を示す。FIG. 2 is a diagram for explaining a connection process between the light receiving element 4 and the waveguide electrode 6 of the light receiving module according to the present embodiment.
(A) shows the state before connection, and (b) shows the state after connection.
【0016】これらの図において、斜線で図示した部分
は導体部分であり、また、8は受光素子4に形成したA
u-Sn バンプである。In these figures, the hatched portion is a conductor portion, and 8 is an A formed on the light receiving element 4.
u-Sn bumps.
【0017】Si基板1での受光素子4の固定と、導波
路電極6と受光素子4との電気的接続は、図2(a)の
状態のAu-Sn バンプ8を、リフロー工程により図2
(b)に示すように溶融することにより行う。The fixing of the light receiving element 4 on the Si substrate 1 and the electrical connection between the waveguide electrode 6 and the light receiving element 4 are performed by reflowing the Au-Sn bump 8 in the state of FIG.
This is performed by melting as shown in (b).
【0018】[0018]
【発明の効果】以上説明したように、本発明の導波路型
受光モジュールでは、導波路から光が出射される位置に
受光素子が配置されるように基板上にガイド溝を設け、
このガイド溝に機械的に受光素子を挿入する構造とした
ので、別途光軸調整をすることなく、効率の高い結合を
簡易に実現できる効果がある。As described above, in the waveguide type light receiving module of the present invention, the guide groove is provided on the substrate so that the light receiving element is arranged at the position where the light is emitted from the waveguide.
Since the light receiving element is mechanically inserted into the guide groove, an efficient coupling can be easily achieved without adjusting the optical axis separately.
【0019】また、受光素子の基板への固定及び導波路
電極と受光素子との電気的接続を行うときは、Au-Sn
バンプをリフロー工程で溶融するようにしたので、固定
及び接続作業が単純且つ簡略化される効果がある。した
がって、製造工程の自動化が容易となり、大量生産及び
これによるコストダウンが可能となる。When fixing the light receiving element to the substrate and electrically connecting the waveguide electrode and the light receiving element, Au-Sn
Since the bumps are melted in the reflow process, the fixing and connecting operations are simplified and simplified. Therefore, automation of the manufacturing process is facilitated, and mass production and the resulting cost reduction become possible.
【図1】本発明の一実施例に係る導波路型受光モジュー
ルの構造斜視図である。FIG. 1 is a structural perspective view of a waveguide type light receiving module according to one embodiment of the present invention.
【図2】本実施例に係る受光モジュールの受光素子と導
波路電極との接続過程説明図であり、(a)は接続前、
(b)は接続後の状態を示す。FIG. 2 is a diagram illustrating a connection process between a light-receiving element and a waveguide electrode of the light-receiving module according to the present embodiment.
(B) shows the state after connection.
【図3】従来例となる双方向伝送モジュール用導波路型
光合分波器の構造図である。FIG. 3 is a structural view of a waveguide type optical multiplexer / demultiplexer for a bidirectional transmission module as a conventional example.
【図4】従来例となる石英形導波路型双方向伝送モジュ
ールの構造図である。FIG. 4 is a structural diagram of a quartz waveguide type bidirectional transmission module as a conventional example.
1 Si基板 2 クラッド層 3 コア層 4 受光素子 5 ガイド溝 6 電極 7 受光面 8 Au-Sn バンプ 9 ステム 10,15 LD素子 11 導波路型合分波器 12,18 PD素子 13 光ファイバ 14,19 パッケージ 16 レンズ 17 石英系導波路 Reference Signs List 1 Si substrate 2 Cladding layer 3 Core layer 4 Light receiving element 5 Guide groove 6 Electrode 7 Light receiving surface 8 Au-Sn bump 9 Stem 10, 15 LD element 11 Waveguide type multiplexer / demultiplexer 12, 18 PD element 13 Optical fiber 14, 19 Package 16 Lens 17 Quartz Waveguide
フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01L 31/02 H01L 31/10 G02B 6/10Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 31/02 H01L 31/10 G02B 6/10
Claims (2)
ら出射される光の光軸上に受光素子を配した構造の導波
路型受光モジュールであって、 前記導波路の側方に前記基板表面に沿って前記導波路か
ら光が出射されるように、前記導波路の終端面を斜めに
形成することにより前記導波路の終端面に設けられた全
反射面と、 前記導波路の前記側方の前記基板表面に設けられ、前記
全反射面により反射された光が前記導波路から出射する
該導波路の出射面に前記受光素子の受光面が位置するよ
うに前記受光素子を保持する溝と、 前記導波路の前記側方の前記基板表面に前記溝に隣接し
て設けられ、前記溝に保持された前記受光素子に電気的
に接続される導波路電極とを有することを特徴とする導
波路型受光モジュール。1. A waveguide type light receiving module having a structure in which a light receiving element is arranged on an optical axis of light emitted from a terminal end of a waveguide formed on a substrate surface, wherein the light receiving element is disposed on a side of the waveguide. As light is emitted from the waveguide along the surface of the substrate, the end face of the waveguide is formed obliquely by forming the end face of the waveguide obliquely, and the total reflection surface provided on the end face of the waveguide, The light receiving element is provided on the side surface of the substrate, and holds the light receiving element such that the light receiving surface of the light receiving element is positioned on the emission surface of the waveguide from which the light reflected by the total reflection surface exits from the waveguide. A groove, a waveguide electrode provided adjacent to the groove on the substrate surface on the side of the waveguide, and electrically connected to the light receiving element held in the groove. Waveguide type light receiving module.
記基板上の前記導波路電極と前記受光素子の電気的接続
は、該受光素子に形成したAu −Sn バンプを溶融させ
ることにより行うことを特徴とする請求項1に記載の導
波路型受光モジュール。2. The fixing of the light receiving element to the substrate and the electrical connection between the waveguide electrode on the substrate and the light receiving element are performed by melting an Au—Sn bump formed on the light receiving element. The waveguide type light receiving module according to claim 1, wherein:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3345126A JP2755274B2 (en) | 1991-12-26 | 1991-12-26 | Waveguide type light receiving module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3345126A JP2755274B2 (en) | 1991-12-26 | 1991-12-26 | Waveguide type light receiving module |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05175524A JPH05175524A (en) | 1993-07-13 |
JP2755274B2 true JP2755274B2 (en) | 1998-05-20 |
Family
ID=18374465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3345126A Expired - Lifetime JP2755274B2 (en) | 1991-12-26 | 1991-12-26 | Waveguide type light receiving module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2755274B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169989A (en) * | 1993-10-20 | 1995-07-04 | Japan Energy Corp | Semiconductor radiation detector and manufacturing method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55140238A (en) * | 1979-04-20 | 1980-11-01 | Hitachi Ltd | Tape carrier type semiconductor device |
JPS55165646A (en) * | 1979-06-13 | 1980-12-24 | Citizen Watch Co Ltd | Mounting method for ic |
JPS6027176A (en) * | 1983-07-25 | 1985-02-12 | Nec Corp | solid-state imaging device |
US4904036A (en) * | 1988-03-03 | 1990-02-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Subassemblies for optoelectronic hybrid integrated circuits |
JPH0255304A (en) * | 1988-08-22 | 1990-02-23 | Hitachi Cable Ltd | optical integrated circuit |
JPH039575A (en) * | 1989-06-06 | 1991-01-17 | Fujitsu Ltd | Cold aperture for photodetector |
-
1991
- 1991-12-26 JP JP3345126A patent/JP2755274B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH05175524A (en) | 1993-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5566262A (en) | Optical fiber array and a method of producing the same | |
EP0723171A2 (en) | Optical module | |
EP0689071A1 (en) | Optical fiber coupling | |
JPH07104146A (en) | Production of optical parts | |
JP2000089054A (en) | Method for manufacturing substrate for hybrid optical integrated circuit using SOI optical waveguide | |
JP2000019357A (en) | Optical array module and reflector array | |
JP2019502167A (en) | Optical coupling device and method | |
KR19980045943A (en) | Micro-mirror for hybrid optical integrated circuit, manufacturing method thereof, micro mirror-photodetector assembly and hybrid optical integrated circuit assembly for optical reception | |
JPH1039162A (en) | Optical semiconductor device, semiconductor photodetector, and formation of optical fiber | |
EP0846966A2 (en) | Optical waveguide | |
JP2755274B2 (en) | Waveguide type light receiving module | |
JPH02118607A (en) | Photocoupling circuit | |
JP2930178B2 (en) | Light receiving structure of waveguide type optical device | |
JP2773501B2 (en) | Fixed structure of waveguide and light receiving element | |
JP3202296B2 (en) | Optical coupling structure between semiconductor laser array and single mode fiber array | |
JP2865789B2 (en) | Optical transmission module | |
JP3295327B2 (en) | Bidirectional optical module | |
JPH0515316B2 (en) | ||
JPH0766089B2 (en) | Method for manufacturing substrate for optical surface mount circuit | |
JP4475841B2 (en) | Optical module | |
JPH0232307A (en) | Optical semiconductor element module | |
JP3266376B2 (en) | Optical package | |
JPH05210029A (en) | Bidirectional optical transmission module | |
JP2975499B2 (en) | End structure of optical waveguide substrate and method of manufacturing the same | |
JPS61279190A (en) | Semiconductor light emitting device with optical fiber |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980204 |