JP2736554B2 - Resin sealing molding method and method of forming resin injection gate - Google Patents

Description

The present invention relates to a method for resin-molding an insert component such as an electronic component, and a method for forming a resin injection gate when the method is performed. It is about.

[Conventional technology]

For example, as a method of sealing and molding an electronic component with a resin material, a fixed upper mold, a movable lower mold opposed to the upper mold, and a pot disposed on one of the upper and lower molds,
A transfer molding method using a resin molding die provided with a plunger for pressing a resin material to be fitted into the pot is conventionally known, and sealing molding by this method is generally performed as follows. It is done.

First, both molds are opened, electronic components are set at predetermined positions on a PL (parting line) surface of the both molds, and mold clamping is performed. In addition, a resin tablet is supplied into the mold pot. .

Since the resin tablet supplied into the mold pot is heated and melted by the heaters provided in both molds, when the molten resin material is pressed with a plunger, the molten resin material is provided on the mold PL surface. The pressure is injected into the cavity through the transfer passage.

Then, after a required curing time, the two molds are opened again, and the cured resin in the passage and the resin molded body (that is, the mold package) in the cavity are ejected by an ejector pin and released.

After the mold release, by cutting and removing the unnecessary portion, it is possible to obtain a product in which the electronic component is sealed in a resin molded body corresponding to the shape of the mold cavity.

[Problems to be solved by the invention]

When the electronic component is molded with a resin, for example, as shown in FIGS. 10 and 11, when the upper and lower molds A (only the lower mold surface is shown) are clamped, one of the electronic components B is closed. There is a mode in which the end 1 (lead) on the side is sandwiched between the PL surfaces of both molds, and the sealed portion 2 on the other side is fitted and set in the cavity 3. Further, the above cavity 3 and mold pot, communicates via a transfer path 4 for the molten resin material consisting of a runner 4 ₁ and gate 4 _2, and the gate 4 ₂ of the transfer path one end of the cavity It is connected to the corner.

Accordingly, the resin material heated and melted in the pot flows through the passage 4 by the pressure of the plunger to form the cavity 3.
Will be injected and filled.

However, in this case, there are the following problems due to the setting mode of the electronic component B and the configuration of the mold described above.

That is, since the sealed portion 2 is fitted and supported in the cavity 3 in a cantilever state, the lead (1) supporting the sealed portion 2 is pressurized and injected from the transfer passage 4. Therefore, in this case, the set position of the sealed portion 2 is shifted, and the resin sealing on the tip end side is defective. There is a disadvantage.

In particular, in the case where there is a setting condition say that resin-seal-molding the peripheral surface 2 ₁ a thin (t) like in the distal portion,
If the tip portion side which is displaced to one side as shown in FIG. 11 can not be resin-seal-molding the portion to a predetermined thin-walled, or the peripheral surface 2 ₁ of the tip portion to the outside There are molding and quality problems such as molding in the exposed state.

Further, when there is a setting condition said that molded while exposing only the distal end surface 2 ₂ the sealed portions 2 described above to the outside, as shown by chain lines in FIG. 10, the distal end surface 2 ₂ may be set is joined to the wall surface 3 ₁ of the cavity, but the molten resin material to the front end face 2 ₂ and walls 3 ₁ of accuracy that since there is a variation in the respective dimensions, injected filled into the cavity 3 some of turns from entering between the front end face 2 ₂ and the wall surface 3 _1, therefore, there is a problem that say a flash adheres to the tip face 2 _2.

When a space (t) for thin resin encapsulation as described above is formed in the cavity, particularly on the air vent side, the space is filled with the molten resin material 5 at the latest. In combination with the above, there is a problem that the resin is easily unfilled in the space.

Further, when a conventional projection mechanism using an ejector pin is provided in the cavity portion, the pin mark remains on the surface of the molded resin body, which impairs the appearance of the product. There is a risk that the surface of the resin molded product may be damaged when it is released from the mold. In particular, when the thickness of the resin molded product is small, a part of the resin molded product is lost and the moisture resistance of the product is reduced.
There are molding and quality problems such as impairing the sealing function.

The present invention, as described above, clamps the mold and clamps one end of the insert part with the mold surface,
In the case where the part to be sealed on the other side is fitted and set in the cavity of the mold, and in this state, the cavity is injected and filled with a molten resin material to form the part to be sealed with resin. In the above, an object of the present invention is to provide a method capable of efficiently and reliably preventing a curved deformation of one end (lead) of a portion to be sealed when a molten resin material is injected into a cavity under pressure. Is what you do.

Another object of the present invention is to provide a method capable of forming a resin-encapsulated portion at a predetermined thickness without exposing the peripheral surface of the tip portion of the portion to be sealed to the outside. It is.

Another object of the present invention is to provide a method capable of forming and processing only the tip end surface of the sealed portion after the resin sealing and molding of the sealed portion as described above. Things.

Another object of the present invention is to provide a method capable of releasing the above-mentioned sealed portion of the resin molded article without damaging the resin molded article.

Further, the present invention provides a method for forming a gate for injecting a molten resin material capable of resin-molding the above-described sealed portion to a predetermined thin-walled shape without exposing the peripheral surface of the distal end portion to the outside. The purpose is to provide.

[Means for solving the problem]

In the resin sealing molding method according to the present invention, the mold is clamped so that one end of the insert part is sandwiched between the mold surfaces, and the other part to be sealed is the mold. A cavity, and in this state, a molten resin material is injected and filled into the cavity, and the sealed portion is molded with a resin. Fitting the leading end of the portion to be sealed in the insert part into the communicating part, and forming a gate for injecting the molten resin material between the peripheral surface of the leading end and the inner surface of the communicating part, It is characterized in that the front end surface of the sealed portion of the insert part is arranged facing the boundary surface between the communication part and the passage for transferring the molten resin material.

Further, the resin sealing molding method according to the present invention is characterized in that the above-mentioned communication part forms a part of a mold cavity.

Further, the resin sealing molding method according to the present invention is characterized in that, after the resin sealing molding of the portion to be sealed in the insert component, one end of the insert component sandwiched by the mold surface and a transfer passage of the molten resin material. By projecting the cured resin in the mold, the resin molded article in the mold cavity is released.

Further, the resin sealing molding method according to the present invention, after the resin sealing molding of the part to be sealed in the insert part, by cutting and separating the cured resin at a location that matches the tip end surface of the part to be sealed, The tip surface of the sealed portion is exposed to the outside.

In addition, the method for forming a resin injection gate according to the present invention is configured such that a cavity for resin molding communicates with a passage for transferring a molten resin material, and at least a part of a part to be sealed is fitted in the communicating portion, and A gate for injecting a molten resin material is provided between a part of a peripheral surface and an inner surface of the communication portion.

(Operation)

According to the present invention, the distal end of the portion to be sealed in the insert component is fitted to the communicating portion between the cavity and the passage for transferring the molten resin material, and the peripheral surface of the distal end portion and the inner surface of the communicating portion. Between them, a gate for injecting the molten resin material which also functions as a part of the cavity is formed. The thin portion can be efficiently and reliably formed.

That is, the molten resin material is injected under pressure into the cavity through the injection gate provided between the above-described peripheral surface of the distal end portion and the inner surface of the communicating portion. And the resin injection into the cavity is efficiently and smoothly performed through the gate, so that the curved deformation of the lead in the sealed portion can be prevented beforehand and surely. The fitting set state (position accuracy) in the cavity can be appropriately maintained.

Further, according to the present invention, the distal end surface of the sealed portion in the insert part is aligned with the boundary between the communication portion and the transfer passage in the communication portion between the cavity and the transfer passage for the molten resin material. After the resin-sealing molding of the portion to be sealed, the cured resin is cut and separated at a position corresponding to the tip surface of the portion to be sealed, so that the tip surface is exposed to the outside. It can be exposed.

Further, according to the present invention, after the resin sealing molding of the portion to be sealed in the insert component, the one side end of the insert component sandwiched between the mold surfaces and the cured resin in the transfer passage of the molten resin material. Since the resin sealing molded body in the mold cavity is protruded and released, the external force applied to the resin sealing molded body at the time of mold release can be significantly reduced and the damage can be reliably prevented. is there.

〔Example〕

 Next, the present invention will be described with reference to an embodiment diagram.

FIG. 1 shows a mold open state of a mold 10 for carrying out the present invention, FIG. 2 shows a mold clamped state in which an electronic component 11 is fitted and set at a predetermined position of the mold, and FIG. FIG. 4 shows the main portion of the mold, FIG. 4 shows the passage portion for transferring the molten resin material, FIG. 5 shows the main portion of the lower mold, and FIGS. 9 shows an example of a cutting step of the cured resin, and FIG. 9 shows a molded product.

This mold has a fixed upper die 12
And a movable lower mold 13 mounted on a lower movable board side opposed to the upper fixed board.

A resin material supply pot (not shown) is provided on one of the upper and lower molds (12 and 13).

In addition, on the PL surfaces of both types, the sealed portion 1 of the electronic component 11 is provided.
1 ₁ a cavity 14 for molding the resin sealing are oppositely arranged, with the cavity and the pot main runner 15 ₁ provided on the PL surface of the upper mold 12, the main runner 15 ₁
It is communicated with each other via the transfer path 15 of the molten resin material composed of oppositely arranged sub runner 15 ₂ which in PL surface of the communicating and the two mold.

Further, the electronic component 11 is provided on the PL surface of the cavity 14 part.
End of one side (lead) 11 ₂ groove 16 for setting a predetermined position of the PL surfaces are oppositely arranged in.

Further, a predetermined position in the set grooves 16 and flume 15, ejector for causing one release a cured resin of the side edge portions 11 ₂ and the transport for the passage of the electronic components fitted into the groove portion Pins 17 and 18 are slidably fitted respectively. Furthermore, the working tip surface of the ejector pin 17 in the groove 16 the same as the groove portion 16, or the formed groove portion 17 ₁ is provided such that the稍広width than the width further to the ejector pin 17 , for example, by interposing an appropriate rotation preventing means, these grooves 16, 17 ₁ is configured so as to always communicate. In addition, the PL surface of the lower die 13 to be an extension of the groove 16, the guide member provided with the inclined guide surface 19 ₁ for reliably fitted to the one side end portion 11 ₂ of the groove portion 16 of the electronic component 19 are arranged.

Further, as described above, have been communicated to the upper and lower both the cavity 14 and the transfer path 15, this is the communication unit 14 ₁ is fitted tip of the sealing portion 11 ₁ in the electronic component, and, In this state, resin sealing molding of the peripheral surface of the tip portion is performed. Accordingly, the communicating portion, together with the cavity 14 and forms a part of a cavity for molding a resin sealing the sealed portion 11 _1.

That is, in order to set the electronic components 11 at the predetermined positions of both the molds, an attaching / detaching tool 20 as shown schematically or schematically may be used. The electronic component attachment / detachment tool 20 includes electronic component engaging means (not shown) provided corresponding to the arrangement position and the number of each cavity in the mold. The electronic components are provided so as to be simultaneously detachable from the grooves 16 on the PL surfaces of both molds.

Further, each electronic component 11 is connected to the both
Guided to a predetermined position on the surface, and in this state both types (12 and 13)
If you make a mold clamping, respective electronic components 11, as shown in FIG. 2, the one side of the end portion (lead) 11 ₂ groove portion 16
Fitted within, and its object the sealing portion 11 ₁ will be fitted into the upper and lower cavity 14.

Further, at this time, the object to be sealed portion 11 ₁ of the front end portion upper and lower cavities 14 and with is fitted into the communicating portion 14 in _one of the transfer path 15, the peripheral surface of the tip portion and the communicating portion 14 ₁ (Gap 1) is formed as a gate for injecting and filling the molten resin material transferred through the transfer passage 15 into the two cavities 14. The tip surface 11 ₃ of each tip is fitted into the communicating portion 14 in _1,
As shown in FIG. 4, it is set to be positioned to face the boundary between the communicating portion and the transfer path (sub-runner 15 _2).

The numerical value of the gap 1 provided between the peripheral surface of the distal end portion and the inner surface of the communication portion coincides with the numerical value of the thickness (see the symbol t in FIG. 10) when the peripheral surface of the distal end portion is molded with resin. Is set to The tool 20 is fitted and supported between the PL surfaces of both dies at the time of clamping of the dies, or via a required support mechanism 21 as shown in FIG. It is provided in.

 Next, the operation of this embodiment will be described.

The electronic component 11 in the mold clamping state shown in FIG.
・ Received by the required mold clamping pressure according to 13), it is securely fitted and set at its predetermined position.

In this state, the heating and melting the resin material fed to the mold pot and pressurized it at the plunger, the sub-runner 15 the molten resin material through the main runner 15 ₁ and the sub runner 15 _{2 2} and respective cavity 1 from the gate that is configured to the communication unit 14 ₁ between cavities 14
4 will be sequentially filled.

That is, the molten resin material pressure fed to sub-runner 15 _2, each cavity through the gap l between the sealing portion 11 ₁ of the front end portion peripheral surface is fitted to the inner surface and the communicating portion of the communicating portion 14 ₁ 14 will be injected and filled respectively. Therefore,
The molten resin material injected under pressure into each cavity 14 is efficiently and smoothly injected and filled into each cavity 14 through the gate constituted by the gap 1 under substantially equal conditions. From, at the time of injection filling of the molten resin material, the injection pressure of the molten resin material, or
The flow pressure is one that the adverse effects of such forcibly displaced the fitted set position of the sealing portion 11 ₁ in the electronic component can be reliably prevented.

When the required curing time has elapsed, the molten resin material is cured in the transfer passage 15 and the cavity 14, so that the two dies (12 and 13) are opened again and the cured resin in the transfer passage is removed. demolded resin molded article in the cavity, thereafter, by cutting removing the unnecessary portion, a resin to be sealed portion 11 ₁ of the electronic component in the resin molded body corresponding to the shape of the both cavity 14 A sealed molded product can be obtained.

However, the release of the cured resin and the resin molded body described above is performed by the setting groove 16 and the ejector pins 17 and 18 provided in the transfer passage 15, and the one-side end 11 of the electronic component fitted into the groove 16. ₂ and by simultaneously ejecting the cured resin in the transfer passage. Therefore, at this time, since the release pressure by the ejector pins is not directly applied to the resin molded body in the cavity 14, it is possible to prevent the resin molded body from being damaged by the release pressure. Things.

The tip surface 11 ₃ of the sealing portion that is fitted into the communicating portion 14 in ₁ Yes disposed so as to face the boundary surface between the communicating portion 14 ₁ and the sub runner 15 _2, i.e., the boundary since the position is consistent with the front end surface 11 ₃ of the surface and the sealed portion, the tip surface 11 ₃
And by cutting and separating the cured resin and the resin molded body at the point of the matching as shown in FIG. 9, to obtain a molded article while exposing the tip end face 11 ₃ of該被sealing portion to the outside Can be. Since the distal end portion peripheral surface of the sealing portion 11 ₁ is seal-molded by thin (t) like resin corresponding to the gap l described above, cured at the location that matches the distal end surface 11 ₃ that the resin There is an advantage that the cutting and separation between the resin and the resin molded body can be easily and reliably performed.

Mold configuration shown in FIGS. 6 and 7 is between the previous embodiment, but the configuration is basically the same, the communicating portion 14 ₁ and the transfer path 15 in the configuration of the previous embodiment, the in that the transfer path 15 side narrower and the communicating portion 14 ₁ side is restricted gate 14 ₂ is formed to be thick was constructed interposed is different, also the mold shown in FIGS. 6 and 7 structure the difference between the sub-runner 15 ₂ and ejector pins 18 and either the limit gate 14 ₂ is disposed on the upper and lower one side of both types, or, in terms of either disposing them both. In addition, the above restriction gate 14 ₂
When both the upper and lower molds are provided, the restriction gate may have a configuration that is equal in both the upper and lower parts, or may have a non-uniform configuration in the upper and lower parts.

According to the mold configuration shown in FIGS. 6 and 7, there is an advantage that the gate balance becomes easy.

For example, each restriction gate 1 to be communicated with the sub-runner 15 ₂
4 If the _second configuration form is constant, the injection filling start time and the sub-runner of the molten resin material is compared with the cavity of the farther the cavity opposite position close to the mold pot
15 ₂ degree or the like of the pressure loss is different for the molten resin material in the fluid. Therefore, it is impossible to simultaneously inject and fill the molten resin material into each cavity 14 and apply a predetermined resin pressure to the filled resin material in each cavity 14. There is an adverse effect that poor quality of the molded article occurs. Therefore, for example, sequentially reduced toward the position far the cross-sectional area of the sub-runner 15 ₂ from a position close to the pot, conversely, sequentially toward the position far the throttle angle limit gate 14 ₂ from a position close to the pot By adopting a configuration such as increasing the size, it is possible to equalize the above-mentioned molding conditions and eliminate such a bad effect.

In addition, instead of such a configuration, a configuration in which the mold pot and each cavity communicate with each other via, for example, only the gate, or a resin passage having a uniform length including a relatively short runner and the gate is used. May be adopted.

Further, according to the mold configuration shown in FIGS. 6 and 7, the distal end face 11 ₃ of the sealing portion that is fitted into the communicating portion 14 in _1,
Since it would be disposed to face the boundary surface between the communicating portion 14 ₁ and the restriction gate 14 _2, as shown in FIG. 8, the tip surface
11 ₃ and by cutting and separating the cured resin 22 and the resin molded body 23 limits the gate 14 in ₂ matches, also, as shown in FIG. 9, the distal end surface 11 ₃ of該被sealing portion to the outside A molded article in an exposed state can be obtained. Incidentally, the distal end portion peripheral surface of the sealing portion 11 ₁ is as in the previous embodiment, since it is seal-molded the curing resin 22 and the resin molded by thin (t) like resin corresponding to the gap l There is an advantage that the cutting and separation from the body 23 can be easily and reliably performed. However, as shown in FIG. 8, first, as shown in FIG. Then, in this state, the cured resin 22 side may be bent to cut and separate the two. Further, before or after the cutting and separating step of the cured resin 22 and the resin molded body 23, a cutting and separating step of the cured resin 22 in the restriction gate and the cured resin 25 in the runner may be added. .

The present invention is not limited to the above-described embodiment drawings, and can be arbitrarily and appropriately changed / selected as needed and adopted without departing from the spirit of the present invention. .

For example, although resin sealing molding of an electronic component has been described in the embodiments, it is possible to cope with resin sealing molding of other insert components without departing from the spirit of the present invention.

〔The invention's effect〕

According to the present invention, the mold is clamped to clamp one end (lead) of the insert part on the mold surface,
In the case where the part to be sealed on the other side is fitted and set in the cavity of the mold, and in this state, the cavity is injected and filled with a molten resin material to form the part to be sealed with resin. In the method, it is possible to efficiently and surely prevent a curved deformation of one end of the sealed portion when the molten resin material is injected under pressure into the cavity. Such a conventional harmful effect can be effectively and surely prevented, and has an excellent practical effect.

Further, according to the present invention, it is possible to form the portion to be sealed with a resin into a predetermined thin shape without exposing the peripheral surface of the tip portion of the portion to be sealed to the outside, and to form After the resin sealing molding, the molding can be performed with only the tip end surface of the sealed portion exposed to the outside, and the resin sealing of the sealed portion can be performed without damaging the resin sealed molded body. It has excellent practical effects such as the ability to release the molded article.

Further, according to the present invention, there is provided a gate for injecting a molten resin material, which can be molded into a predetermined thin-walled resin without exposing the peripheral surface of the distal end portion of the sealed portion to the outside. It has an excellent practical effect that it can be configured.

[Brief description of the drawings]

FIG. 1 is a partially cutaway longitudinal sectional view showing a main part of a mold for carrying out the method of the present invention, and shows a mold open state of the mold. FIG. 2 is a partially cutaway longitudinal sectional view showing a mold clamping state of the mold corresponding to FIG. FIG. 3 is a plan view showing the main part of the lower die. FIG. 4 is a partially cut-away enlarged perspective view showing a passage portion for transferring the molten resin material. FIG. 5 is a partially cut-away enlarged perspective view showing the main part of the lower die. FIG. 6 is a partially cutaway vertical sectional view showing another example of a mold configuration, and shows a mold clamping state of the mold. FIG. 7 is a partially cutaway longitudinal sectional view showing another example of a mold configuration, and shows a mold clamping state of the mold. FIG. 8 is a partially cutaway longitudinal sectional view of a product formed by the mold shown in FIG. FIG. 9 is a partially cutaway vertical sectional view of the product. 10 and 11 are explanatory views of a conventional resin sealing molding method for an electronic component, and FIG. 10 is a plan view of a main part of a mold showing a state where the electronic component is fitted in a resin molding die. FIG. 11 is a plan view of a main part of a mold for explaining the resin sealing molding operation. [Explanation of Symbols] 10 Mold 11 Electronic component 11 ₁ Sealed portion 11 ₂ One end 11 ₃ Tip surface 12 Fixed upper die 13 Movable lower die 14 ...... cavity 14 ₁ ...... communicating portion 14 ₂ ...... restricted gate 15 ...... flume 15 ₁ ...... main runner 15 ₂ ...... sub-runner 16 ...... groove 17 ...... ejector pin 17 ₁ ...... groove 18 ...... Ejector pin 19 Guide member 19 ₁ Guide surface 20 Removable tool 21 Supporting mechanism 22 Cured resin 23 Resin molded body 24 Holding mechanism 25 Cured resin l Gap t … Thick

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI // B29K 105: 22 B29L 31:34

Claims (5)

(57) [Claims] 1. A mold is clamped so that one end of an insert part is clamped by the mold surface, and the other part to be sealed is set in a cavity of the mold. In this state, a molten resin material is injected and filled into the cavity, and the sealed portion is resin-sealed and molded. The insert part is provided in a communicating portion between the cavity and a passage for transferring the molten resin material. And a gate for injection of a molten resin material is formed between the peripheral surface of the distal end portion and the inner surface of the communication portion, and further, the sealed portion of the insert part is sealed. A resin sealing molding method, wherein a front end surface of the portion is arranged so as to face a boundary surface between the communication portion and a passage for transferring a molten resin material. 2. The resin sealing molding method according to claim 1, wherein the communicating portion forms a part of a mold cavity. 3. After the resin-sealing molding of the portion to be sealed of the insert component, one end of the insert component sandwiched by the mold surface and the cured resin in the passage for transferring the molten resin material are projected. The resin sealing molding method according to claim 1, wherein the resin sealing molded body in the mold cavity is released. 4. After the resin-sealing molding of the portion to be sealed of the insert part, the cured resin is cut and separated at a position corresponding to the tip surface of the portion to be sealed, so that the tip surface of the portion to be sealed is cut. The resin sealing molding method according to claim 1, wherein the resin sealing molding method is exposed outside. 5. A resin molding cavity and a molten resin material transfer passage are communicated with each other, at least a part of a part to be sealed is fitted in the communication part, and a peripheral surface of the part is communicated with the communication surface. A method for forming a resin injection gate, characterized in that a gate for injection of a molten resin material is provided between the resin injection gate and the inner surface of the portion.