JP2731476B2 - Thin coil holding substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a thin coil holding substrate applicable to, for example, a surface facing type motor.

[0002]

2. Description of the Related Art A slice coil may be used as a drive coil in order to reduce the thickness of a surface-facing motor or the like. Japanese Patent Application Laid-Open No. 61-73552 is an example of such a case, in which a conductive plate is wound in a cylindrical shape to form a winding body, a plurality of such winding bodies are arranged in a ring shape, and these are molded with an insulating resin. The molded product is sliced so as to cross the wound body to obtain a drive coil.

A single slice coil is obtained by slicing a conductive plate in a direction transverse to a winding formed by winding the conductive plate in a cylindrical shape, and the single slice coil is connected to a coil frame having a plurality of coil insertion portions. In some cases, a drive coil is formed by fitting into each of the coil insertion portions of the body.

[0004]

SUMMARY OF THE INVENTION Japanese Patent Application Laid-Open No. 61-7355
According to the thin coil formed by arranging a plurality of winding bodies in an annular shape, molding them with an insulating resin, and slicing the molded product as in the publication described in Japanese Patent Publication No. 2 And the characteristics are degraded due to variations in the resistance value of each coil. Further, according to the thin coil in which a single slice coil is fitted into the coil insertion portion of the coil frame, there is a problem that electrical connection between each coil and the substrate becomes complicated.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem of the prior art, and the cost can be reduced by using a thin coil in which the coil is inserted into a coil insertion portion of a coil frame. It is an object of the present invention to provide a thin coil holding substrate which facilitates electrical connection between each coil and a substrate, enables thinning, and has high reliability of coil insulation.

[0006]

Means for Solving the Problems The present invention relates to a coil shape
Coil having a plurality of coil insertion portions of resin
The frame must be insert-molded together with the metal pattern plate that has been processed into a connection pattern by removing a part of the metal plate.
A holding substrate for a thin coil, comprising:
Shall be so that only one side is exposed, and
Insert molding on the other side of the coil insertion part of the
Is, the bottom surface of the coil former on one face surface and the surface and the same surface of the metal pattern plate, and an insulating layer made of resin-coated or insulating sheet material is formed.

[0007]

The coil is inserted and arranged in each coil insertion portion of the coil frame made of resin. The winding start and end of each coil are connected to the connection pattern of the metal pattern plate integrally formed with the coil frame by soldering or the like, and the coil is connected to an external circuit by connecting the connection pattern to the wiring pattern of the board. Can be connected. One of the metal pattern plate
Square surface only are both insert molded and coil former, metal
The other side of the pattern board and the above
Is resin coating or insulating sheet material on the bottom of the
Since the insulating layer is formed , the thickness including the coil frame can be reduced. The metal pattern plate exposed from the coil frame is insulated by the insulating layer formed on the coil frame.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a thin coil holding substrate according to the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a part of a square metal plate by using a method such as pressing or etching.
By removing the metal pattern on which the connection pattern 2 is formed,
4 shows a turn plate . In this case, if the connection pattern 2 is finally removed so that the complete connection pattern 2 is required, a part of the connection pattern 2 is separated from the metal pattern plate 1. Therefore, the connection pattern 2 is not a final pattern. And an incomplete pattern in which the pattern holding portions 4 and 5 are left in place between the main body portion of the metal pattern plate 1 and the connection pattern 2, and the main body portion of the metal pattern plate 1 and the connection pattern 2 The holding parts 4 and 5 are integrally connected. A substantially ring-shaped connection pattern 12 is provided on the inner peripheral side of the connection pattern 2.
The connection pattern 2 and the connection pattern 12 are integrally connected by a terminal portion 8 extending radially from the terminal 2 and a pattern holding portion 5 following the terminal portion 8.

[0010] Thus, on one side of the connection pattern 2 of the metal pattern plate 1 formed with the wiring pattern 2 and 12, as shown in FIG. 2, the insert is injected an insulating resin
The coil frame 3 integrated with the connection pattern 2 is formed by sheet molding . The coil frame 3 also covers the substantially ring-shaped connection pattern 12 of the metal pattern plate 1. At the time of resin molding, in order to facilitate coil arrangement in a later step, a substantially trapezoidal coil insertion portion 10 conforming to the planar shape of the coil is provided at regular intervals in the circumferential direction of the coil frame 3.
Are formed at a plurality of locations according to the number of coils.

FIG. 3 is a cross-sectional view of one of the metal pattern plates 1 integrally formed with the coil frame 3 made of resin as described above. As shown in FIG. 3, the connection pattern 2 of the metal pattern plate and the substantially ring-shaped connection pattern 12 on the inner peripheral side are covered with the molding resin of the coil frame 3 on the upper surface and both side surfaces. 12 is on the same plane as the bottom surface of the coil frame 3,
It is exposed from.

As shown in FIG. 1, a large number of projections 11 are provided on a part of the metal pattern plate 1 integrally formed with the coil frame 3, particularly on the connection pattern 2. The protrusions 11 are formed on both sides of the connection pattern 2. Accordingly, when the coil frame 3 integrated with the connection pattern 2 is formed by injecting the resin as described above, the molding resin surrounds the periphery of the protrusion 11 and the connection pattern 2 of the metal pattern plate 1 and the coil frame 3 are formed. The adhesion strength with No. 3 is increased. However, if the surface of the connection pattern 2 is roughened, the adhesion strength between the connection pattern 2 and the coil frame 3 can be increased without providing the projections 11.

After the coil frame 3 is formed of resin as described above, the pattern holding portions 4, 5 of the metal pattern plate 1 are formed.
Is separated by a press punch, and the coil frame 3 is separated from the metal pattern plate 1. The coil frame 3 is a metal pattern plate 1
In order to insert-mold the portions of the connection patterns 2 and 12 described above, the connection pattern 2 is integrally held by the coil frame 3. Thus, the holding substrate for the thin coil is completed.

In the holding substrate for the thin coil, the coil frame 3 is integrally formed of resin only on one side of the metal pattern plate 1, and as shown in FIG. The other surfaces of the connection patterns 2 and 12 constituting the position of the pattern plate 1 are exposed. Coil frame 3
The bottom side is fixed to a substrate such as a motor, and the connection pattern 2 is connected to the wiring pattern formed on the substrate. Therefore, the connection patterns 2 and 1 are formed on the bottom surface of the coil frame 3.
If the wiring pattern 2 is exposed, there is a possibility that the connection patterns 2 and 12 and the wiring pattern of the substrate are short-circuited. Therefore, as shown in FIG. 3, an insulating layer 20 is formed on the bottom surface side of the coil frame 3 so as to cover the surfaces of the connection patterns 2 and 12 exposed from the bottom surface side of the coil frame 3, and It is insulated from the substrate. The insulating layer 20 may be formed by applying a resin coat by printing, or may be formed by attaching an insulating sheet material. The insulating layer 20
It is sufficient if the thickness is as thin as 0.1 mm or less.

The holding substrate for the thin coil is formed by bending a terminal portion 8 in the coil insertion portion 10 which comes into contact with the beginning of each coil and a terminal portion 9 in the coil insertion portion 10 which comes into contact with the end of each coil. Forming so that is easy to implement. A coil wound in a predetermined shape is inserted and arranged in each of the coil insertion portions 10. At this time, the insulating coating at the beginning and end of the coil is peeled off, and then reflow soldering is performed. Is wound on the terminal portion 8 and the end of the coil is soldered on the terminal portion 9 to complete the connection of the coil. Incidentally, in the illustrated example, each coil is connected in a three-phase Y-shape. Each coil is substantially integrated with the coil frame 3 by connecting each coil to the connection patterns 2 and 12 by reflow soldering, but each coil is more firmly integrated with the coil frame 3. Each coil may be adhered to the coil frame 3 in order to achieve the above.

The coil applied to the present invention is inserted and arranged in the coil insertion portion 10 of the coil frame 3.
The manufacturing method is not particularly limited as long as it is wound in a flat space in a flat space, but it can be obtained by winding a copper foil around a core with an insulating layer interposed and then cutting the foil. It is desirable to use coils. FIG. 4 shows an example of a manufacturing process of such a coil. As shown in FIG. 4A, an insulating coating is applied to a copper foil 16 as a material, and this one side edge is fixed to a core 15. And copper foil 1
6 is coated with an adhesive, wound around the core 15 a predetermined number of times to form a tube, and after the copper foil 16 is completely bonded between layers, the core 15 is removed. Then, as shown in FIG. A large number of coils 17 are obtained by cutting the copper foil 16 wound into a shape into a predetermined thickness.

The thin coils 17 are inserted and arranged in the respective coil insertion portions 10 of the holding substrate formed by insert-molding the connection patterns 2 and 12 on the coil frame 3, and the winding start and end of each coil 17 are determined by the terminal portion 8. , 9 by reflow soldering to complete a thin coil. The thin coil thus obtained is mounted on, for example, a stator substrate of a motor and arranged to face a flat rotor magnet. The connection pattern 2 is connected to the wiring pattern of the stator substrate by soldering or the like, whereby each coil is connected to an external circuit. As described above, the coil frame 3
The insulating layer 20 insulates between the coil holding substrate made of the above and the stator substrate. By switching the energization to each coil in accordance with the rotational position of the rotor magnet, the rotor including the rotor magnet can be driven to rotate.

While the thickness of the entire coil including the coil frame 3 is made as small as possible to reduce the thickness of the coil, the coil insertion formed on the coil frame 3 is required to increase the space factor of the coil as much as possible. The thickness dimension of the bottom of the part 10 is made as small as possible, for example, about 0.15 to 0.3 mm. The thickness of the connection patterns 2 and 12 is 0.05
About 0.1 mm.

According to the embodiment described above, only one side of the metal pattern plate 1 processed into a connection pattern is connected to the coil frame 3 having a plurality of coil-shaped coil insertion portions 10 and made of resin. Since the coil is integrally formed, the thickness of the coil insertion portion 10 of the coil frame 3 can be reduced, and when the coil is applied to a motor, the thickness of the motor can be reduced. Further, the connection pattern 2 can be arranged at the same time as the molding of the coil frame 3, and the end of each coil is connected to the connection pattern 2, and the connection pattern 2 is connected to the wiring pattern of the substrate. Connection is completed,
There is also an advantage that connection of the coil is simplified.

On the other hand, if only one surface of the metal pattern plate 1 is integrally formed with the coil frame 3 as described above to reduce the thickness of the coil, the other surface of the metal pattern plate 1 is exposed from the coil frame 3. That is, since the insulating layer 20 is formed on the coil frame 3 so as to cover the surface of the metal pattern plate 1 exposed from the coil frame 3, the insulation between the coil substrate and the motor substrate and the like to which the coil substrate is mounted is provided. And the insulating layer 20 is sufficiently thin, so that the formation of the insulating layer 20 does not increase the thickness of the coil substrate.

The holding substrate for a thin coil according to the present invention can be applied not only to a driving coil of a motor but also to a holding substrate of a coil of various other devices.

[0022]

According to the present invention, a plurality of coil shapes are provided.
A coil frame body having a coil insertion portion and made of resin,
Metal plate thin co ing part is insert-molded together with the metal pattern plate which is processed into a connection pattern in the removal of
The metal pattern plate,
So that only one side is exposed, and
An insulating layer made of a resin coat or an insulating sheet material is formed on one surface of the metal pattern plate and the bottom surface of the coil frame on the same surface as this surface by insert molding on the other surface of the coil insertion portion. Printed wiring
Insulating substrate such as a board or flexible printed wiring board
Is different from using a wiring pattern formed on
Using a metal pattern plate made entirely of conductive material.
In the file holding substrate, the thickness can be reduced.
You. That is, the whole metal pattern plate is made of conductive material
Therefore, it is necessary to insulate both sides, but the present invention,
Exposing only one side of the metal pattern plate and coiling the other side
Insulation was achieved by insert molding with
On one side, an insulating layer is formed along with the bottom of the coil
Rimmed. However, the metal pattern plate and the coil frame
When using insert molding,
Where the coil plate is located in the thickness direction of the coil frame.
The other side of the metal pattern plate is a coil
The coil insertion part of the frame may be exposed.
Coil and metal pattern plate inserted into the coil insertion part
May be short-circuited. According to the present invention,
Metal pattern insert-molded with the coil frame
If one side of the metal plate is exposed from the coil frame,
The other side of the pattern board is covered with the resin that forms the coil frame
Although the thickness of the resin required for insulation is sufficiently secured
It can be determined that. As in the present invention,
Exposing only one side of the turn plate with the coil frame
In the case of insert molding, the metal pattern plate
Positioning is easy, and the safety
Since it is not necessary to set the overall rate so high,
The resin covering the other side of the turn plate should be so thick
It is not necessary to set
The thickness of the file holding substrate can be reduced. Book
According to the invention, the metal pattern plate and the coil frame are combined.
Into a coil holding substrate by insert molding
Therefore, the rigidity of the metal pattern plate can be increased and the rigidity of the entire coil holding substrate can be increased while the thickness is reduced as described above . Further, connection pattern is to be able to place simultaneously with the molding of the coil former, the ends of each coil is connected to the connection pattern is connected to the coil by simply connecting the wiring pattern on the wiring pattern of the substrate is completed Therefore, an effect that connection of the coils can be simplified.

Furthermore, only one surface of the metal pattern plate by molding the coil frame and the insert on which attained thinner coil, the other surface and the surface and the same surface of the metal pattern plate
For forming the insulating layer on the bottom surface of the coil former in, to the insulation between the substrate such as a motor attached coil holding substrate and this can be secured, an insulating layer, resin-coated or insulated
Because there because even Do that very thin from the sheet material, the thickness of the coil board is not increased by forming the insulating layer.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a metal pattern plate applicable to the present invention.

FIG. 2 is a plan view showing a state in which the coil frame is integrally formed with the metal pattern plate.

FIG. 3 is a cross-sectional view showing a state in which a coil frame is integrally formed on a metal pattern plate.

FIG. 4 is a perspective view showing an example of a manufacturing process of a coil applicable to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal pattern board 2 Connection pattern 3 Coil frame 10 Coil insertion part 12 Connection pattern 20 Insulation layer

Claims (1)

(57) [Claims] A plurality of coil insertion portions each having a coil shape;
Coil former made of a resin have found some metal pattern plate together with which is processed into a wiring pattern remove the metal plate
Holding substrate der thin coil ing insert molded into
Thus, the metal pattern plate is exposed so that only one surface thereof is exposed.
And on the other side of the coil insertion portion of the coil frame
Insert molded on one face and the bottom face of the coil former in the surface and the same surface of the metal pattern plate, a thin coil, wherein an insulating layer made of resin-coated or insulating sheet material is formed Holding substrate.