JP2722806B2 - Base plate for printed wiring - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a printed wiring base plate for fixing a printed wiring board by vacuum at the time of screen printing. More particularly, the present invention relates to a base plate having versatility for various printed wiring boards.

2. Description of the Related Art A printed wiring board of this type includes through-holes for electrically connecting both sides of the board, lead wire insertion holes into which leg portions of electronic components such as lead wires are inserted, and the like. The through hole has been opened.

Such a printed wiring board is placed on a printed wiring base plate at the time of printed wiring, and is vacuum-sucked by a plurality of substrate suction holes formed in the plate and fixed to the plate.

Conventionally, the printed wiring board is firmly adsorbed by negative pressure, and the conductive paste printed on the upper surface of the board is drawn into through holes such as through holes and lead wire insertion holes, or passes through the through holes to the bottom surface of the board. In order to prevent the substrate from getting round and contaminating the lower surface of the board, or the wiring printed near the through-hole being sucked into the through-hole and distorted or bleeding, the board suction holes of the printed wiring base plate Drilled in a position avoiding the through hole.

[Problems to be Solved by the Invention] However, since the positions of through holes and the like are different for each type of printed wiring board, the base plate is provided with a substrate suction hole at a position avoiding the through hole every time printing is performed. Need to be manufactured. This base plate requires not only accurate drilling but also an extremely smooth finish on the upper surface of the metal plate to improve the close contact with the lower surface of the substrate.

Conventionally, the base plate made every time a new type of substrate is printed is less frequently used except when remanufacturing the same type of substrate, especially if the base plate with through holes such as through holes in special positions is discarded, Or, even if it is stored, its management is not easy. For this reason, when manufacturing a new base plate, the manufacturing cost of the printed wiring board becomes expensive, and it is difficult to manufacture the printed wiring board in a short time because the manufacturing time of the base plate needs to be considered. was there.

An object of the present invention is that, even if the position of a through hole such as a through hole of a printed wiring board is changed, each time printing is performed, it is not necessary to make a substrate suction hole at a position avoiding the through hole, and it is inexpensive. An object of the present invention is to provide a printed wiring base plate capable of manufacturing a printed wiring board in a short time.

[Means for Solving the Problems] In order to achieve the above object, as shown in the drawings, the present invention mounts printed wiring boards 21 and 22 having a plurality of through holes 23 formed thereon, and Each of the plurality of substrate suction holes 19 is configured to be openable and closable in the printed wiring base plate 13 in which a plurality of substrate suction holes 19 for suctioning the substrates 21 and 22 by vacuum for printing and wiring the conductive paste 28 are formed. It is characterized by having.

As means for opening and closing each of the substrate suction holes 19, it is preferable that a female screw 19a is formed in the substrate suction hole 19 in the base plate 13, and a male screw 19b which can be screwed into the female screw 19a and attached. As another means, large-diameter portions 19c and 19d are formed at the hole edges of the substrate suction holes 19 on the side where the printed-wiring substrates 21 and 22 are sucked, and hole stoppers 19e that can be immersed in the large-diameter portions 19c and 19d. 19f, 19g
It is preferable to attach it detachably.

[Operation] After closing the substrate suction hole 19 of the plurality of substrate suction holes 19 near the through hole 23 with the male screw 19b and the hole stoppers 19e to 19g, the printed wiring substrates 21 and 22 are attached to the base plate 13. It is mounted, vacuum-sucked and fixed to the base plate 13.

Example Next, an example of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 and 2, a suction block 12 is disposed in a space 11a of a print table 11 of the printing apparatus 10.
The interior of the suction block 12 is hollow, and a printed wiring base plate 13 having a smooth surface is detachably placed on the upper portion thereof, and three suction holes 14 are provided on the bottom portion thereof. An intake pipe 17 is connected to these intake holes 14 via a connector 16, and the intake pipe 17 is connected to a vacuum pump (not shown) via a chamber 18.

The base plate 13 is 76.2 mm long and 7 mm wide in this example.
6.2mm, 10mm thick stainless steel plate,
At a predetermined position of the plate 13 on which the printed wiring board 21 (FIG. 2 (b)) or the printed wiring board 22 (FIG. 2 (d)) is placed, a substrate suction hole 19 having a diameter of 2.0 mm is formed at a constant pitch. 45 are burned. These substrates 21 and 22 are alumina substrates,
Six thick film substrates are integrally formed on one substrate 21 or 22, respectively. Three through holes 23 are formed in the substrate 21 for each thick film substrate, and the thick film substrate is formed on the substrate 22. Eight through holes 23 are drilled every time. After predetermined printed wiring is performed on the substrate 21 or 22, the substrate 21 or 22 is divided into six thick film substrates by dividing lines 24.

As shown in the enlarged view of FIG. 1, a female screw 19a is formed in each of the 45 substrate suction holes 19, and a male screw 19b which can be screwed into the female screw 19a to be immersed therein.
Is attached to the base plate 13. In this example, the total length of the male screw 19b is 8 mm, and the length of the screw portion is 5 mm.

Next, using the printing apparatus 10 having such a configuration, a conductive paste is printed and wired on the upper surface of the substrate 21 shown in FIG. 2 (b), and then the conductive paste is printed on the upper surface of the substrate 22 shown in FIG. 2 (d). A method of printing and wiring the paste will be described.

First, the base plate 13 and the substrate 21 are overlapped at a predetermined position. In this state, the substrate suction hole 19 close to the through hole 23
The female screw 19a is screwed into the male screw 19b using a tool so that the head of the male screw 19b does not protrude from the upper surface of the plate 13 as shown in the enlarged view of FIG. Of the substrate suction holes 19 in FIG. 2 (c), ten black holes are male screws.
19b is screwed hole, 35 holes indicated by broken lines are male screw 1
It is a hole that does not screw 9b.

Next, the base plate 13 is placed on the upper part of the suction block 12, and the printed wiring board 21 is placed at a predetermined position on the upper surface of the plate 13.
The inside of 12 is depressurized. As shown in FIG. 1, the substrate 21 is sucked on the upper surface of the plate 13 through the suction hole 19 in which the male screw 19b is not screwed. Here the suction hole close to through hole 23
Since 19 is closed by the male screw 19a, fresh air is not sucked into the block 12, so that the substrate 21 is firmly sucked without decreasing the negative pressure.

A screen mask 26 on which a predetermined pattern is formed is stretched above the substrate 21, and a squeegee 27 is
The conductive paste 28 is printed and wired on the upper surface of the substrate 21 in accordance with the above-mentioned pattern by running while being in contact with the upper surface of the substrate 21. Since the suction hole 19 near the through hole 23 is closed by the male screw 19a, the printed conductor paste 28 is not drawn into the through hole 23 and does not stain the lower surface of the substrate 21 near the through hole 23. When the printed wiring of the board 21 is completed, the inside of the block 12 is set to a positive pressure, and the printed board 21 is removed from the base plate 13.

Subsequently, when printed wiring of the substrate 22 shown in FIG. 2D is performed, the substrate 22 is superposed on the base plate 13 at a predetermined position in the same manner as the substrate 21, and in this state, the substrate suction holes 19 close to the through holes 23 are formed. Similarly, a male screw 19b is screwed into the female screw 19a using a tool, and the male screw 19b is removed from the board suction hole 19 at a position away from the through hole 23. Of the substrate suction holes 19 in FIG. 2 (e), 20 black holes are holes into which the male screw 19b is screwed, and 25 holes indicated by broken lines are holes into which the male screw 19b is not screwed.

Similarly to the substrate 21, in this state, the printed wiring substrate 22 is placed at a predetermined position on the upper surface of the base plate 13 and firmly sucked by vacuum, and then the conductive paste 28 is printed on the upper surface of the substrate 22.

Accordingly, the substrate suction holes 19 of the base plate 13 can be opened and closed with a small number of steps as needed, and the base plates dedicated to the substrates 21 and 22 are not required.

3 to 5 show another embodiment of the present invention. The feature of this example is that large diameter portions 19c and 19d are formed at the edges of the board suction holes 19 of the base plate 13 on the side where the printed wiring boards 21 and 22 are sucked, instead of the female screw of the above embodiment. The hole stoppers 19e, 19f, and 19g that can be immersed in the diameter portions 19c and 19d are detachably attached to the base plate 13. The diameter of the substrate suction hole 10 excluding the large-diameter portions 19c and 19d is 2.0 mm, which is the same as in the above embodiment.

The large diameter portion 19c shown in FIGS. 3 and 5 has a diameter of 3.0 mm and a depth of
It is formed to have a height difference of 3.5 mm from the suction hole 19. This large-diameter portion 19c has a disk 19e (2.5 mm in diameter and 2.0 mm in thickness) (third
Figure) or a disk with a knob of diameter 2.5mm and thickness 1.0mm 19
g (FIG. 3) is inserted.

The large-diameter portion 19d shown in FIG. 4 is tapered at the upper end corresponding to the edge of the substrate suction hole 19 with a diameter of 3.0 mm, and has a lower end with a diameter of 3.0 mm.
It follows the 2.0 mm suction hole 19. This large diameter part 19d has this large diameter part
A frusto-conical hole stopper 19f slightly smaller than 19d is inserted.

These hole stoppers 19e to 19g are inserted into the large-diameter portion 19c or 19d in order to close the board suction hole 19 at a position close to the through hole 23 of the sucked board, similarly to the male screw 19b described above,
When the substrate is fixed, the substrate is firmly sucked to the edge of the suction hole 19 by the negative pressure, and the suction hole 19 is closed. When the printed wiring is completed, the hole stoppers 19e to 19g are taken out with the upper surface of the base plate 13 facing downward.

The numerical values such as the number of holes and the size of the base plate shown in the above example are merely examples, and the present invention is not limited to these numerical values.

Further, the substrate suction hole is formed by a male screw shown in FIG.
Although an example of closing with a hole stopper shown in FIG. 5 is shown, the present invention is not limited to this. For example, a small plate slidable in the upper surface direction of a pace plate is provided near a substrate suction hole. The substrate suction holes may be individually opened / closed by sliding.

In addition, the hole stoppers 19e, 19f, and 19g are respectively formed of a magnetic material, and after the printed wiring is completed, the hole stoppers 19e are attached to the magnet.
~ 19g may be sucked and collected.

Furthermore, although the alumina substrate is exemplified as the substrate of the present invention, the present invention is not limited to this, and any other printed wiring substrate that can be screen printed, such as a paper phenol substrate or a glass epoxy substrate, can be used.

[Effects of the Invention] As described above, since the base plate of the present invention has a large number of substrate suction holes and each of the suction holes can be opened and closed, various positions in which the positions of the through holes such as through holes are different from each other. By closing unnecessary substrate suction holes in the printed wiring board with a small number of steps, even if the type of the board is changed, a base plate suitable for the board can be obtained.

As a result, it is not necessary to make a substrate suction hole at a position avoiding through holes and the like every time printing is performed on various printed wiring boards, so that a single base plate can be used repeatedly. The printed wiring board can be manufactured quickly and in a short time.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a printing apparatus including a printed wiring base plate according to an embodiment of the present invention. FIG. 2 is a plan view illustrating the usage of a base plate for two types of printed wiring boards. FIGS. 3, 4 and 5 are enlarged sectional views of a main part of a base plate according to another embodiment of the present invention. 10: Printing device, 13: Base plate for printed wiring, 19: Board suction hole, 19a: Female screw, 19b: Male screw, 19c, 19d: Large diameter part, 19e, 19f, 19g: Hole stopper, 21, 22: Printed wiring Substrate, 23: through hole, 28: conductive paste.

Claims (4)

(57) [Claims] 1. A printed wiring board (21, 22) having a plurality of through-holes (23) formed thereon, and a vacuum for printing and wiring a conductive paste (28) on the upper surface of the board (21, 22). Thereby, in the printed wiring base plate (13) having a plurality of substrate suction holes (19) for sucking the substrates (21, 22), each of the plurality of substrate suction holes (19) is configured to be openable and closable. A printed wiring base plate, characterized in that: 2. The printed wiring base plate according to claim 1, wherein a female screw (19a) is formed in the substrate suction hole (19), and a male screw (19b) that is screwed into the female screw (19a) and attached is provided. . 3. A large-diameter portion (19c, 19d) is formed at a hole edge of a substrate suction hole (19) on a side for adsorbing a printed wiring board (21, 22), and said large-diameter portion (19c, 19d). Hole stopper (19
2. The printed wiring base plate according to claim 1, wherein (e, 19f, 19g) is detachably mounted. 4. The printed wiring base plate according to claim 3, wherein the hole stoppers (19e, 19f, 19g) are formed of a magnetic material.