JP2715538B2 - Electronic component suction nozzle rotation drive mechanism in the θ direction - Google Patents

Description

Description: BACKGROUND OF THE INVENTION (Field of Industrial Application) The present invention relates to a θ-direction rotation driving mechanism of a nozzle for sucking an electronic component, and in particular, for accurate position correction in a θ direction of an electronic component sucked by the nozzle. More particularly, the present invention relates to a means for precisely and minutely rotating a nozzle.

(Prior Art) Electronic components that are mounted on a substrate by being attracted to a nozzle of a transfer head of an electronic component mounting apparatus generally have a positional shift in the XYθ direction. Of these displacements, the displacement in the XY direction can be adjusted by adjusting the stroke of the transfer head in the XY direction, or
It is corrected by moving the table in the XY direction. The displacement in the θ direction (rotation direction) is corrected by rotating the nozzle that has sucked the electronic component in the θ direction about the axis thereof.

For this reason, as shown in FIG.
0 is equipped with a pulse motor 102 for rotating the nozzle 101 in the θ direction, and a pulse motor 10 for correcting a position shift in the θ direction detected by a camera (not shown).
After driving nozzle 2 to rotate nozzle 101, electronic component P
Is mounted on the substrate 103.

(Problems to be Solved by the Invention) The pulse motor rotates a small angle (for example, about 0.9 °) in one pulse, and therefore, a small displacement in the θ direction of 0.9 ° or less cannot be corrected by the pulse motor. Can not. As a countermeasure, a reduction means such as a gear, a pulley or the like may be interposed between the motor 102 and the nozzle 101. However, if a deceleration means is interposed, a large-capacity motor is required, and the speed is reduced due to deceleration.

FIG. 7 shows an electronic component (bare chip) P in which elements (hereinafter, referred to as dots) d such as a light receiving element and a light emitting element are juxtaposed by a transfer head 100 that cannot correct a minute angle as described above. Reading and writing substrate 103
Is shown. Reference numeral 104 denotes a pattern printed on the substrate 103, and a bare chip P
Are arranged in a row, and the pattern 104 is inclined by a small angle α (for example, about 0.3 °) due to a printing error.

However, as described above, since the transfer head 100 cannot finely adjust the angle of the nozzle 101, the bare chip P
Are mounted stepwise without angle correction. For this reason, adjacent dots d, d of adjacent bare chips P, P have
The displacement e has occurred. If the substrate 103 having such displacement e is incorporated in a printer or the like, a reading error or a writing error occurs.

In addition to the above-described printer substrate, electronic components such as a device having outer leads punched out from a film carrier may be used as a component requiring such precise θ-direction mounting accuracy. Outer lead bonding and the like, which are accurately aligned with and bonded to the above pattern.

Therefore, the present invention provides a method for controlling the θ of electronic components mounted on a substrate.
It is an object of the present invention to provide means capable of accurately and minutely rotating a nozzle in order to obtain positional accuracy in a direction.

(Means for Solving the Problems) For this purpose, the present invention provides a cam driven by a motor, a cam follower which is urged by a spring force of a spring material to contact the cam, and a predetermined length connected to the cam follower. And a rotating member having one end connected to the electronic component suction nozzle and the other end contacting the shaft, and driving the motor to rotate the cam to move the cam follower. Accordingly, the other end of the rotating member is pushed by the shaft to horizontally rotate the rotating member, and the electronic component suction nozzle is slightly rotated about its axis.

(Function) According to the above configuration, the cam follower moves when the motor is driven to rotate the cam, and in conjunction with this, the rotating member horizontally rotates around the nozzle, whereby the nozzle connected to the rotating member is rotated. Rotates about its axis. In this case, the rotation angle of the nozzle is determined by parameters such as the shape and size of the cam, the swing amount of the cam follower, and the length of the rotation member. Therefore, the rotation angle of the rotation member accompanying rotation of the cam becomes small. By setting the parameters as described above, the nozzle can be minutely rotated accurately.

(Example) Next, an example of the present invention will be described using an electronic component mounting apparatus for mounting a bare chip on a printer substrate as described above as an example.

FIG. 1 is a front view of an electronic component mounting apparatus, in which a bare chip P is provided below a driving device A such as a basic machine.
Supply device 1, substage 2, and substrate positioning
The XY direction moving device 3 and the bond supply device 4 are arranged side by side. The supply device 1 includes a wafer 5 and a wafer 5
A die ejector 12 that pushes up the bare chip P is provided, and a bond tray 6 is provided in the bond supply device 4.
The XY direction moving device 3 includes XY tables 17 and 18 and a substrate 11
Made of clamp material 19.

Reference numerals 7, 8, and 9 denote sub-transfer heads, transfer heads, and bond application heads provided in the driving device A. The sub-transfer head 7 transfers the bare chips P on the wafer 5 to the sub-stage 2 by sliding these three heads 7 to 9 together along the guide device 10 in the lateral direction. The mounting head 8 is a substage 2 for transferring and mounting the bare chip P, the position of which has been corrected by the position correcting claw, to the substrate 11 on the XY-direction moving device 3, and the bond applying head 9 applies the bond of the bond plate 6 to the substrate 11 I do. 21, 22, 23 are pressing elements for moving the nozzles 24, 25, 26 of each head 7-9 up and down, M 1, M 2, M 3
Is a motor for driving each of the pressers 21 to 23.

Reference numeral 13 denotes a driving unit which drives the die ejector 12 and causes the heads 7 to 9 to slide back and forth in the horizontal direction via the rod 14, the sliding member 15, the horizontal rod 16, and the like. 27,28
Denotes a camera for board recognition provided above the board 11 and a camera for dot recognition of the bare chip P.

2 to 4 show the θ of the transfer head 8 and the nozzle 25.
2 shows a detailed structure of the direction rotating mechanism 30. Numeral 31 denotes a main body case of the transfer head 8, and the nozzle 25 for sucking electronic components is provided upright through the case 31.
32 is a coupling 33 mounted on the upper part of the nozzle 25,
A coil spring is attached to a stop portion 34 protruding from the main body case 31, and urges the nozzle 25 in a direction to rotate the nozzle 25 counterclockwise in FIG. Note that a mechanism not directly related to the present invention, such as a vacuum suction unit for the nozzle 25, is omitted. Next, the θ-direction rotating mechanism 30 will be described.

Reference numeral 36 denotes a frame attached to the side of the main body case 31, on which a box 38 containing a pulse motor 37 is provided, and below the frame 36, the box 38 is driven by the motor 37 to rotate. A cam 39 is provided. 40
Is a cam follower that abuts the cam 39, and is mounted on the tip of a rotary lever 42 rotatably mounted on a rotary shaft 41 as a fulcrum that is suspended from the end of the frame 36. Reference numeral 43 denotes a coil spring as a spring member for urging the cam follower 40 in a direction of elastic contact with the cam 39, and reference numeral 44 denotes a shaft vertically suspended from the cam follower 40.

A cylindrical body 45 that rotates integrally with the nozzle 25 is attached to a lower part of the nozzle 25. Reference numeral 46 denotes a rod-shaped rotating member having one end connected to the cylindrical body 45 and extending toward the shaft 44, and a roller 47 abutting on the shaft 44 mounted at the other end. As described above, the nozzle 25 is urged in the above-described direction by the coil spring 32, and the roller 47 is elastically contacted with the shaft 44 by the spring force. When the presser 22 operates and the nozzle 25 moves up and down, the roller 47 moves up and down along the shaft 44.

Here, the shaft 44 has a predetermined length so that the roller 47 can move up and down along the shaft 44 as the nozzle 25 moves up and down.

The present apparatus has the above configuration, and the operation will be described next.

The transfer head 8, which has taken up the bare chip P transferred from the supply device 1 to the substage 2 by the sub transfer head 7, moves above the substrate 11, moves the nozzle 25 up and down, and transfers the bare chip P to the substrate. Before being mounted on the substrate 11, the camera 27 observes a positional shift of the pattern printed on the substrate 11 in the XYθ direction. The displacement in the XY direction is corrected by moving the XY tables 17 and 18. The correction of the displacement in the θ direction is performed as follows. That is, when the motor 37 is driven, the cam 39 rotates, and the cam follower 40 rotates about the rotation shaft 41 according to the cam curve of the cam 39. Then, the rotating member 46 becomes the nozzle 25
, And the nozzle 25 connected to the rotating member 46 slightly rotates in the same direction to perform θ correction.

Here, the ratio between the rotation angle of the motor 37 and the rotation angle of the nozzle 25 is a parameter such as the shape and size of the cam 39, the radius of rotation of the cam follower 40 about the rotation shaft 41, and the length of the rotation member 46. Therefore, by setting a parameter so that the rotation angle of the nozzle 25 is extremely small with respect to the rotation angle of the motor 37, the nozzle 25 can be rotated by a small angle.

FIG. 5 shows the bare chip P mounted on the pattern 50 of the substrate 11 by performing the above-described minute position correction in the θ direction. The pattern 50 is inclined by a small angle α (about 0.3 °) due to a printing error.
By detecting and correcting this error, the bare chip P is mounted straight along the pattern 50, and therefore, the adjacent dots of the adjacent bare chips P, P
d and d are arranged straight on the straight line N without deviation. Reference numeral 51 denotes a mark for detecting a displacement of the substrate 11.

The θ-direction rotating mechanism according to the present invention is not limited to the above electronic component mounting apparatus, and other electronic components such as an outer lead bonder for bonding an outer lead of a device punched from a carrier tape to a pattern of a substrate by bonding. The present invention is also applicable to a mounting device.

(Effects of the Invention) According to the present invention, with a very simple configuration, the nozzle can be accurately rotated by a small angle, and the electronic component can be precisely θ-corrected before being mounted on the board.

In addition, when the shaft is vertically attached to the cam follower and the electronic component suction nozzle moves up and down, the rotating member is moved up and down along the shaft, so that the electronic component suction nozzle performs the up and down operation. The θ correction of the electronic component can be performed by rotating the nozzle in parallel.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a front view of an electronic component mounting apparatus, FIG. 2 is a perspective view of a transfer head and a θ-direction rotating mechanism, and FIGS. FIG. 5 is a plan view of the substrate, FIG. 6 is a side view of a conventional transfer head, and FIG. 7 is a plan view of the substrate. 8 Transfer head 25 Nozzle 30 Rotating mechanism in θ direction 37 Motor 39 Cam 40 Cam follower 41 Support point 46 Rotating member P Electronic components

Claims (2)

(57) [Claims] 1. A cam driven by a motor, a cam follower urged by a spring force of a spring material to contact the cam, a shaft having a predetermined length connected to the cam follower, and an electronic component having one end side. A rotating member connected to the suction nozzle and having the other end portion in contact with the shaft, and driving the motor to rotate the cam to move the cam follower, whereby the other end of the rotating member is rotated by the shaft. A rotating part for rotating the rotating member horizontally by pressing a part side thereof, and minutely rotating the nozzle for sucking the electronic component around its axis. 2. The apparatus according to claim 1, wherein said shaft is vertically suspended from said cam follower, and said rotating member moves up and down along said shaft when said electronic component suction nozzle moves up and down. Item 4. A rotation drive mechanism for the electronic component suction nozzle in the θ direction according to Item 1.