JP2713621B2 - How to mount chip components - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting method for supplying a chip component from a component supply side to a component assembly side and surface mounting the chip component at a predetermined position on a printed circuit board.

[Conventional technology]

Conventionally, in order to transport chip components from the component supply side to the component assembly side, a taping method or a magazine method is generally used. A tape or a magazine having chip components continuously attached is sent to the component assembly side, and the component assembly is performed. The automatic machine is set to an automatic machine, and the automatic machine picks up a chip component by vacuum, for example, and mounts the chip component at a predetermined position on one surface of a printed circuit board.

[Problems to be solved by the invention]

However, every time the type of chip component changes, the magazine or tape must be reset in the automatic machine, which is not only difficult to work with, but also limits the mounting density of chip components mounted on a printed circuit board. .

An object of the present invention is to solve the conventional problems as described above, and an object of the present invention is to improve the workability of mounting a chip component on a printed circuit board as compared with the related art, and to mount the chip component. It is an object of the present invention to provide a method for mounting a chip component capable of greatly increasing the density.

[Means for solving the problem]

In order to solve the above-described problem, the present invention provides a component supply side, in which a predetermined chip component is stored in a predetermined hole of a pallet having a large number of holes partitioned in a grid, and After sandwiching both sides between a pair of component holding plates and fastening these component holding plates with supports to form a carrier, the carrier is supplied from the component supply side to the component assembly side, and the component assembly side After replacing at least one of the two component holding plates with a printed board coated with cream solder at a predetermined position, the cream solder is melted to surface mount the chip component at a predetermined position on the printed board.

[Action]

According to the present invention, on the component assembling side, one or both of the pair of component holding plates constituting the carrier are replaced with a printed circuit board coated with cream solder at a predetermined position, and passed through a reflow furnace in this state. This makes it possible to form an electric circuit by simultaneously mounting each chip component on a printed circuit board.
Since the printed circuit board can be mounted on the upper and lower sides through the chip components vertically set on the printed circuit board, the mounting area of the printed circuit board is substantially doubled.
The mounting density of chip components can be greatly improved as compared with the related art.

〔Example〕

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 to 4 illustrate a first embodiment of the present invention. FIG. 1 is a plan view of a pallet, FIG. 2 is a side view of a carrier, and FIGS. 3 (a) and 3 (b). FIG. 4 is a perspective view showing a step of mounting the chip component on the carrier side on the printed circuit board, and FIG. 4 is a cross-sectional view showing a state where the chip component is surface-mounted on the printed circuit board.

In FIG. 1, reference numeral 1 denotes a pallet.
Are provided with a large number of holes 3 partitioned in a lattice shape, and each hole 3 accommodates a chip component 2 such as a resistor or a capacitor. As shown in FIG. 2, after the chip component 2 is inserted into the hole 3 corresponding to a predetermined electric circuit forming position of the pallet 1, component holding plates 4a and 4b are stacked on the upper and lower surfaces of the pallet 1, and these components are laid. By tightening the holding plates 4a, 4b with the columns 5, a pair of component holding plates 4a, 4b are formed.
The carrier A integrated with the pallet 1 interposed therebetween is obtained.

Next, a method of mounting the chip component 2 on the printed circuit board 6 on the component assembly side will be described with reference to FIG.

First, in a first step, as shown in FIG. 3 (a), a carrier A on which chip components 2 constituting a predetermined electric circuit are arranged at a predetermined electric circuit forming position is moved from the component supply side to the component assembly side. Supply.

Next, in a second step, as shown in FIG. 3 (b), the upper component holding plate 4a is removed from the pallet 1, and the component holding plate 4a and the printed circuit board 6 coated with cream solder at a predetermined position. After the replacement, in this state, the cream solder is melted by passing through a reflow furnace, and the chip component 2 is surface-mounted on a predetermined portion of the printed circuit board 6 with the solder 7. After a while, the third
In the process, the lower part holding plate 4b and the pallet 1 are detached from the printed circuit board 6 so that the chip component 2 is planarly mounted on a predetermined position on the upper surface of the printed circuit board 6 as shown in FIG. Is formed.

FIGS. 5 and 6 illustrate a second embodiment of the present invention. FIGS. 5 (a), (b), (c) and (d) show the mounting of chip components on the carrier side on a printed circuit board. FIG. 6 is a cross-sectional view showing a state in which two printed boards are three-dimensionally mounted via chip components.

In the second embodiment, first, in the first step, FIG.
As shown in (1), a carrier A on which chip components 2 constituting a predetermined electric circuit are arranged at a predetermined electric circuit forming position is supplied from the component supply side to the component assembly side.

Next, in the second step, as shown in FIG. 5 (b), the upper component holding plate 4a is removed from the pallet 1, and the component holding plate 4a and the printed circuit board 6 coated with cream solder at a predetermined position. After the replacement, in this state, the cream solder is melted by passing through a reflow furnace, and an electrode on one end side of the chip component 2 is fixed to a predetermined portion of the printed board 6 with the solder 7 in an upright state.

Next, in the third step, as shown in FIG. 5 (c), the assembly in the state of FIG. 5 (b) is turned upside down so that the printed circuit board 6 is on the lower side. Then, the component holding plate 4b and the pallet 1 are removed from the printed circuit board 6, and instead, as shown in FIG. 5 (d), another printed circuit board 8 having cream solder applied to a predetermined position on the printed circuit board 6 is removed. At the same time, the component holding plate 4b is overlapped on the lower surface, and these are fastened with the support pillar 5. Thereafter, the assembly is passed through a reflow furnace to melt the cream solder, and the other end of the chip component 2 is fixed to the printed board 8 with the solder 9 in an upright state. Finally, in the fifth step, by removing the component holding plate 4b, as shown in FIG. 6, a predetermined electric circuit in which the printed boards 6, 8 are three-dimensionally mounted on the upper and lower surfaces via the chip component 2 is formed. It is formed.

As described above, according to the first embodiment of the present invention, the carrier A is supplied from the component supply side to the component assembly side in a state where the chip component 2 is temporarily fixed to the predetermined position by the component holding plates 4a and 4b, On the component assembling side, if one of the component holding plates 4a and the printed board 6 coated with the cream solder are replaced, the chip component 2 is placed at a predetermined position on the printed board 6 simply by melting the cream solder in a reflow furnace. Can be mounted on a surface, so that there is no need to use an automatic machine on the part assembling side, the workability is better than before, and the equipment cost is lower.

Further, according to the second embodiment of the present invention, on the part assembling side,
The two printed circuit boards 6, 8 can be assembled three-dimensionally via the chip component 2 by exchanging the printed circuit boards 6, 8 coated with cream solder by both the component holding plates 4a, 4b, The mounting density of the chip component 2 can be greatly increased.

〔The invention's effect〕

According to the present invention, a carrier in which chip components are temporarily fixed to a predetermined electric circuit forming position in advance by a holding plate is supplied from the component supply side to the component assembling side, and on the component assembling side, a printed board coated with cream solder is applied. By replacing the component holding plate and placing it in a reflow oven, chip components can be surface-mounted on a printed circuit board at a predetermined electrical circuit formation position, so workability is improved compared to the conventional mounting method using an automatic machine, and Is unnecessary, resulting in a reduction in equipment costs.

In addition, the printed circuit board can be arranged three-dimensionally via the chip components, and the mounting density of the chip components can be greatly improved as compared with the related art.

[Brief description of the drawings]

1 to 4 illustrate a first embodiment of the present invention. FIG. 1 is a plan view of a pallet, FIG. 2 is a side view of a carrier, and FIGS. 3 (a) and 3 (b). FIG. 4 is a perspective view showing a step of mounting chip components on the carrier side on a printed circuit board, FIG. 4 is a cross-sectional view showing a state where the chip components are surface-mounted on the printed circuit board, and FIGS. FIG. 5A, FIG. 5B, FIG. 5C, and FIG. 5D are perspective views showing a process of mounting chip components on a carrier body on a printed circuit board. The figure is a cross-sectional view showing a state where two printed boards are three-dimensionally mounted via chip components. 1 ... pallet, 2 ... chip parts, 3 ... holes, 4a, 4b
…… Parts holding plate, 5 …… Prop, A …… Carrier, 6,8…
… Printed circuit board, 7,9 …… Solder.

Claims (1)

(57) [Claims] 1. After a predetermined chip component is stored in a predetermined hole of a pallet having a large number of holes partitioned in a grid on the component supply side, upper and lower surfaces of the pallet are sandwiched between a pair of component holding plates, After these parts holding plates are fastened by a support to form a carrier, the carriers are supplied from the parts supply side to the parts assembly side, and at least one of the two parts holding plates is placed at a predetermined position on the parts assembly side. And mounting the chip component on a predetermined position of the printed circuit board by melting the cream solder after replacing the printed circuit board with a printed circuit board coated with cream solder.