JP2693694B2 - Capping method for semiconductor device housing package - Google Patents
Capping method for semiconductor device housing packageInfo
- Publication number
- JP2693694B2 JP2693694B2 JP4299846A JP29984692A JP2693694B2 JP 2693694 B2 JP2693694 B2 JP 2693694B2 JP 4299846 A JP4299846 A JP 4299846A JP 29984692 A JP29984692 A JP 29984692A JP 2693694 B2 JP2693694 B2 JP 2693694B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- cap
- sealing
- sealing material
- sealing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 22
- 239000003566 sealing material Substances 0.000 claims description 56
- 238000007789 sealing Methods 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 238000004891 communication Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、内部に半導体チップ等
の半導体素子を収納する半導体素子収納用パッケージに
キャップを気密に封止する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for hermetically sealing a cap in a semiconductor element housing package that houses a semiconductor element such as a semiconductor chip.
【０００２】[0002]
【従来の技術】従来、内部に半導体チップ等の半導体素
子を収納する半導体素子収納用パッケージを気密に封止
する方法として、半導体素子収納用パッケージとキャッ
プとの間に枠状の有機樹脂よりなる封止材を介してキャ
ップをパッケージ上にセットし、この状態で加熱して封
止材を固化させて、キャップを半導体収納用パッケージ
に気密に封止していた。しかしながら、上述した封止方
法では、有機樹脂からなる封止材を加熱して固化する必
要があるため、有機樹脂からガスが発生して、半導体素
子収納用パッケージの内部にガスが溜まり、内部と外部
との気圧差が生じて問題となることがあった。2. Description of the Related Art Conventionally, as a method for hermetically sealing a semiconductor element housing package which houses a semiconductor element such as a semiconductor chip, a frame-shaped organic resin is used between a semiconductor element housing package and a cap. The cap is set on the package via the encapsulating material and heated in this state to solidify the encapsulating material, and the cap is hermetically sealed in the semiconductor housing package. However, in the above-described sealing method, since it is necessary to heat and solidify the sealing material made of an organic resin, gas is generated from the organic resin, and the gas accumulates inside the semiconductor element housing package. There was a problem that a pressure difference with the outside occurred.
【０００３】この問題を解消するため、例えば実開平３
−１０５４１号公報において、封止材の一部に切り欠き
部を設け、有機樹脂からなる封止材が熱により溶融する
までは発生するガスを切り欠き部を通ってパッケージの
外部へ排出可能とするとともに、溶融後の冷却中に封止
材が切り欠き部を塞ぎ、封止材が固化した時点ではキャ
ップをパッケージに気密に封止することができるパッケ
ージが開示されている。図５に上述した実開平３−１０
５４１号公報におけるパッケージの加熱前の状態の一例
を示す。図５において、２１は例えば透明のガラス等か
らなるキャップ、２２はセラミックス等からなる半導体
素子収納用パッケージ、２３は有機樹脂からなる封止
材、２４は封止材２３に設けた切り欠き部である。In order to solve this problem, for example, an actual Kaihei 3
No. 10541, a cutout is provided in a part of the sealing material, and generated gas can be discharged to the outside of the package through the cutout until the sealing material made of an organic resin is melted by heat. In addition, a package is disclosed in which the sealing material closes the notch during cooling after melting and the cap can be hermetically sealed in the package when the sealing material solidifies. Actual Kaihei 3-10 described above with reference to FIG.
An example of the state before heating of the package in Japanese Patent No. 541 is shown. In FIG. 5, reference numeral 21 is a cap made of, for example, transparent glass, 22 is a semiconductor element storage package made of ceramics, 23 is a sealing material made of an organic resin, and 24 is a notch provided in the sealing material 23. is there.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述し
た実開平３−１０５４１号公報に開示されたパッケージ
では、切り欠き部２４には封止材２３が完全に存在して
いないため、溶融後の冷却中溶融した封止材２３が切り
欠き部２４を塞ぐ際、溶融した有機樹脂からなる封止材
がセラミックスからなるパッケージ２２上を拡がること
となるため、セラミックスと溶融した有機樹脂とは濡れ
性が悪いことから、封止材２３の濡れ拡がり不足によっ
て切り欠き部２４が未封止の状態となる問題があった。However, in the package disclosed in Japanese Utility Model Laid-Open No. 3-10541 mentioned above, since the sealing material 23 is not completely present in the cutout portion 24, cooling after melting is performed. Since the sealing material 23 made of molten organic resin spreads over the package 22 made of ceramics when the notched portion 24 is closed by the molten sealing material 23, the ceramics and the molten organic resin have a wettability. Since it is bad, there is a problem that the cutout portion 24 is in an unsealed state due to insufficient wetting and spreading of the sealing material 23.
【０００５】本発明の目的は上述した課題を解消して、
ガス抜きは好適に実施できパッケージ内外部の気圧差を
なくすことができるとともに、未封止部分の存在するこ
とのない半導体素子収納用パッケージのキャップ封止方
法を提供しようとするものである。An object of the present invention is to solve the above-mentioned problems,
It is an object of the present invention to provide a method of capping a package for accommodating a semiconductor device, which can suitably perform degassing, can eliminate a pressure difference between the inside and outside of the package, and does not have an unsealed portion.
【０００６】[0006]
【課題を解決するための手段】本発明の半導体収納用パ
ッケージのキャップ封止方法は、内部に半導体を収納す
るパッケージにキャップを封止する方法において、パッ
ケージの封止面および／またはキャップの封止面の全体
に有機樹脂からなる封止材を塗布し、封止材の少なくと
も一部にパッケージ内部と外部とを連通する連通孔を形
成するようにして、キャップを封止材を介してパッケー
ジに載置し、その後加熱してキャップをパッケージに気
密に封止するにあたり、（１）前記連通孔を、前記パッ
ケージの封止面および／またはキャップの封止面の全体
に塗布した封止材と、該封止材の上に設けた、一部に切
り欠き部を有する封止材との二層構造にすることにより
形成したこと、および／または、（２）前記連通孔を、
前記パッケージの封止面／および／またはキャップの封
止面の一部に凹部を設けることにより形成したことを特
徴とするものである。SUMMARY OF THE INVENTION A method of sealing a cap of a package for storing a semiconductor according to the present invention is a method of sealing a cap in a package for storing a semiconductor inside, wherein a sealing surface of the package and / or a cap is sealed. The cap is packaged through the encapsulant by applying an encapsulant made of an organic resin to the entire stop surface and forming a communication hole in at least a part of the encapsulant that connects the inside and the outside of the package. (1) The sealing material applied to the entire sealing surface of the package and / or the sealing surface of the cap when the cap is hermetically sealed in the package by heating. And / or (2) the communication hole, which is formed by forming a two-layer structure of a sealing material provided on the sealing material and partially having a cutout portion, and / or
It is characterized by being formed by providing a recess in a part of the sealing surface of the package and / or the sealing surface of the cap.
【０００７】[0007]
【作用】上述した構成において、少なくともパッケージ
の封止面またはキャップの封止面の全体に枠状の封止材
を塗布して設けているため、キャップを封止する際の加
熱により溶融した後の冷却中、溶融した有機樹脂からな
る封止材が連通孔を塞ぐ時少なくともパッケージ側また
はキャップ側の一方に封止材が存在するため、溶融した
有機樹脂からなる封止材の流動性が良くなり、固化後の
未封止部分をなくすことができる。また、封止材中に連
通孔を設けているため、従来と同様に加熱して有機樹脂
からなる封止材が溶融するまでの間は、有機樹脂から発
生するガスをこの連通孔を通して外部に排出することが
でき、パッケージの内部と外部との気圧の差をなくすこ
とができる。In the above structure, since the frame-shaped sealing material is applied to at least the entire sealing surface of the package or the sealing surface of the cap, it is melted by heating when sealing the cap. When the sealing material made of the molten organic resin closes the communication hole during cooling, the sealing material made of the molten organic resin has good fluidity because the sealing material exists on at least one of the package side and the cap side. Therefore, the unsealed portion after solidification can be eliminated. Further, since the communication hole is provided in the encapsulating material, the gas generated from the organic resin is discharged to the outside through the communication hole until the encapsulating material made of the organic resin is melted by heating as in the conventional case. It can be discharged, and the difference in atmospheric pressure between the inside and the outside of the package can be eliminated.
【０００８】パッケージの封止面またはキャップの封止
面の全体に封止材を塗布した状態で連通孔を封止材に設
けるには、この封止材の上に一部に切り欠き部を有する
封止材を設けた二層構造にする方法、またはパッケージ
の封止面および／またはキャップの封止面の一部に凹部
設ける方法を利用すると、簡単に連通孔を設けることが
できるため好ましい。In order to provide a communication hole in the sealing material in a state where the sealing material is applied to the entire sealing surface of the package or the sealing surface of the cap, a cutout portion is partially formed on the sealing material. It is preferable to use a method of forming a two-layer structure in which the sealing material is provided, or a method of forming a recess in a part of the sealing surface of the package and / or the sealing surface of the cap because the communication hole can be easily provided. .
【０００９】[0009]
【実施例】図１（ａ）〜（ｄ）は本発明の半導体素子収
納用パッケージのキャップ封止方法の一例を工程順に示
す側面図であり、図２（ａ）〜（ｂ）は各工程に対応す
る平面図である。図１に従って本発明のキャップ封止方
法を説明すると、まず図１（ａ）および図２（ａ）に示
すように、キャップ１の封止面に有機樹脂よりなる封止
材２を枠状に印刷塗布して設ける。次に、図１（ｂ）及
び図２（ｂ）に示すように、封止材２の上に、封止材２
と同じく枠状で二箇所に切り欠き部３を有する有機樹脂
よりなる封止材４を印刷塗布して設ける。次に、図１
（ｃ）に示すように、例えばセラミックス製の半導体素
子収納用の内部空間５を有するパッケージ６上に、封止
材２、４を形成したキャップ１をセットする。最後に、
これを封止材２、４として使用した有機樹脂の溶融温度
以上の温度に加熱して冷却することにより固化して、キ
ャップ１を封止材２、４を介してパッケージ６に気密に
封止する。1 (a) to 1 (d) are side views showing an example of a method of cap-sealing a package for housing a semiconductor device according to the present invention in the order of steps, and FIGS. 2 (a) to 2 (b) are each step. It is a top view corresponding to. The cap sealing method of the present invention will be described with reference to FIG. 1. First, as shown in FIGS. 1A and 2A, a sealing material 2 made of an organic resin is formed into a frame shape on the sealing surface of the cap 1. It is provided by printing. Next, as shown in FIGS. 1B and 2B, the sealing material 2 is formed on the sealing material 2.
Similarly to the above, a sealing material 4 made of an organic resin having a frame shape and two cutout portions 3 is applied by printing. Next, FIG.
As shown in (c), the cap 1 having the sealing materials 2 and 4 is set on a package 6 having an internal space 5 for housing a semiconductor element, which is made of, for example, ceramics. Finally,
This is solidified by heating to a temperature equal to or higher than the melting temperature of the organic resin used as the sealing materials 2 and 4 and cooling, and the cap 1 is hermetically sealed in the package 6 via the sealing materials 2 and 4. To do.
【００１０】上述した本発明のキャップ封止方法によれ
ば、加熱して封止材２、４を溶融させると、溶融した封
止材２、４が切り欠き部３を塞ぐように流動するが、そ
の際封止材２が存在するため溶融した封止材４は濡れ性
の良好な封止材２に沿って流動することとなる。そのた
め、封止材４の流動が良好で、固化後の切り欠き部３の
未封止を皆無にすることができる。また、切り欠き部３
が連通孔を形成するため、加熱時に発生するガスは切り
欠き部３が完全に塞がれるまでの間この連通孔を通して
外部へ排出され、パッケージの内部と外部の気圧差をな
くすことができる。なお、上述した例では二層構造の封
止材２、４をキャップ１側に設けたが、この二層構造の
封止材２、４をパッケージ６側に設けても、さらには上
述した例においてさらにパッケージ６の封止面の全体に
枠上の封止材を設けて封止材４を封止材で挟むようにし
ても、同様あるいはそれ以上の効果が得られることは明
かである。According to the above-described cap sealing method of the present invention, when the sealing materials 2 and 4 are melted by heating, the molten sealing materials 2 and 4 flow so as to close the notch 3. At that time, since the sealing material 2 exists, the molten sealing material 4 flows along the sealing material 2 having good wettability. Therefore, the flow of the sealing material 4 is good, and the notch 3 after solidification can be completely unsealed. Also, the cutout 3
Since the communication hole is formed, the gas generated at the time of heating is discharged to the outside through the communication hole until the cutout portion 3 is completely closed, and the pressure difference between the inside and outside of the package can be eliminated. Although the two-layer structure sealing materials 2 and 4 are provided on the cap 1 side in the above-described example, the two-layer structure sealing materials 2 and 4 may be provided on the package 6 side as well. In addition, even if the sealing material on the frame is provided on the entire sealing surface of the package 6 and the sealing material 4 is sandwiched between the sealing materials, it is apparent that the same or higher effect can be obtained.
【００１１】図３（ａ）〜（ｄ）は本発明の半導体素子
収納用パッケージのキャップ封止方法の他の例を工程順
に示す図である。図３に従って説明すると、まず図３
（ａ）に示すように、キャップ１の封止面に有機樹脂よ
りなる封止材２を枠状に印刷塗布して設ける。次に、図
３（ｂ）に示すように、封止面に切り欠き部３を設けた
半導体素子収納用の内部空間５を有するパッケージ６を
準備する。次に、図３（ｃ）に示すように、パッケージ
６上に封止材２を塗布形成したキャップ１をセットす
る。最後に、これを封止材２として使用した有機樹脂の
溶融温度以上の温度に加熱して冷却することにより固化
して、キャップ１を封止２を介してパッケージ６に気密
に封止する。FIGS. 3A to 3D are views showing another example of the method of cap-sealing a package for housing a semiconductor device according to the present invention in the order of steps. Referring to FIG. 3, first, referring to FIG.
As shown in (a), the sealing material 2 made of an organic resin is applied by printing in a frame shape on the sealing surface of the cap 1. Next, as shown in FIG. 3B, a package 6 having an internal space 5 for accommodating semiconductor elements, in which a notch 3 is provided on the sealing surface, is prepared. Next, as shown in FIG. 3C, the cap 1 on which the sealing material 2 is applied and formed on the package 6 is set. Finally, it is solidified by heating and cooling it to a temperature equal to or higher than the melting temperature of the organic resin used as the sealing material 2, and the cap 1 is hermetically sealed in the package 6 via the sealing 2.
【００１２】この実施例においても、図１及び図２に示
した例と同様、封止材２の良好な流動を達成することが
でき未封止部分を皆無にできるとともに、切り欠き部３
が連通孔として作用するためガスを排出できパッケージ
の内部と外部の気圧差をなくすことができる。なお、図
３に示す例では、切り欠き部３をパッケージ６の封止面
に形成したが、図４に示すように、切り欠き部３をキャ
ップ１の封止面に設け、図３に示す例と同様にキャップ
を封止しても、同様に本発明を達成することができる。Also in this embodiment, as in the example shown in FIGS. 1 and 2, good flow of the sealing material 2 can be achieved, unsealed portions can be eliminated, and the cutout portion 3 can be eliminated.
Acts as a communication hole, so that gas can be discharged and the pressure difference between the inside and outside of the package can be eliminated. In addition, in the example shown in FIG. 3, the notch 3 is formed on the sealing surface of the package 6, but as shown in FIG. 4, the notch 3 is provided on the sealing surface of the cap 1 and shown in FIG. The present invention can be similarly achieved by sealing the cap as in the example.
【００１３】以下、実際の例について説明する。実施例 上述した図１および図２に示す工程に従って、以下の表
１に示すように第１層の封止材２と第２層の封止材４の
厚さを種々変化させるとともに表１に示す切り欠き部の
幅でキャップをパッケージに封止した本発明例試料No.1
〜4 と、切り欠き部を設けずにキャップをパッケージに
封止した比較例試料No.1と、図４に示す工程に従って表
１に示す切り欠き部の幅でキャップをパッケージに封止
した比較例No.2とを準備し、それぞれの外観評価として
切り欠き部が未封止のものおよびブローホール跡のある
ものの割合を求めるとともに、気密性の割合およびパッ
ケージの反り量を求めた。Hereinafter, an actual example will be described. Example According to the steps shown in FIGS. 1 and 2 described above, the thicknesses of the first layer sealing material 2 and the second layer sealing material 4 were changed variously as shown in Table 1 below, and Inventive Example Sample No. 1 in which the cap is sealed in the package with the width of the cutout portion shown.
~ 4, a comparative example sample No. 1 in which the cap is sealed in the package without providing the notch, and a comparison in which the cap is sealed in the package with the width of the notch shown in Table 1 according to the process shown in FIG. Example Nos. 2 and 3 were prepared, and as the respective appearance evaluations, the proportions of the notch not sealed and those having blowhole marks were determined, and the airtightness ratio and the warp amount of the package were calculated.
【００１４】なお、いずれの実施例においても、キャッ
プとしては１２×１１ｍｍの形状で厚さ０．８ｍｍのＣ
ＣＤイメージセンサ用透明ガラスを使用し、パッケージ
としては９×９．５ｍｍの形状の内部空間を有するアル
ミナセラミックパッケージを使用するとともに、封止材
としてはエポキシ樹脂を使用した。結果を表１に示す。In any of the examples, the cap has a shape of 12 × 11 mm and a thickness of 0.8 mm.
A transparent glass for a CD image sensor was used, an alumina ceramic package having an internal space of 9 × 9.5 mm was used as a package, and an epoxy resin was used as a sealing material. Table 1 shows the results.
【００１５】[0015]
【表１】 [Table 1]
【００１６】表１の結果から、本発明に従って得た本発
明例は比較例に比べて、切り欠き部に未封止部およびブ
ローホールが存在しないとともに、気密性も良好であ
る。From the results shown in Table 1, the inventive examples obtained according to the present invention have no unsealed portions and blow holes in the cutout portions and have good airtightness as compared with the comparative examples.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、本発明
によれば、少なくともパッケージの封止面またはキャッ
プの封止面の全体に枠状の封止材を塗布して設けている
ため、キャップを封止する際の加熱により溶融した後の
冷却中、溶融した有機樹脂からなる封止材が連通孔を塞
ぐ時少なくともパッケージ側またはキャップ側の一方に
に封止材が存在するため、溶融した有機樹脂からなる封
止材の流動性が良くなり、固化後の未封止部分をなくす
ことができ、さらに封止材が溶融して連通孔を塞ぐまで
は従来と同様に有機樹脂から発生するガスを外部へ排出
することができる。As apparent from the above description, according to the present invention, at least the entire sealing surface of the package or the sealing surface of the cap is coated with the frame-shaped sealing material, During the cooling after melting by heating when sealing the cap, when the sealing material made of the molten organic resin closes the communication hole, the sealing material exists on at least one of the package side or the cap side, so the melting The flowability of the encapsulant made of the organic resin is improved, the unsealed part after solidification can be eliminated, and the organic resin is generated as before until the encapsulant melts and closes the communication hole. The generated gas can be discharged to the outside.
【図１】本発明の半導体素子収納用パッケージのキャッ
プ封止方法の一例を工程順に示す図である。FIG. 1 is a diagram showing an example of a method of cap-sealing a semiconductor element housing package of the present invention in the order of steps.
【図２】図１に示す各工程を補足的に示す図である。FIG. 2 is a diagram that complementarily shows each step shown in FIG.
【図３】本発明の半導体素子収納用パッケージのキャッ
プ封止方法の他の例を工程順に示す図である。FIG. 3 is a diagram showing another example of a cap sealing method for a package for housing a semiconductor device of the present invention in the order of steps.
【図４】本発明の半導体素子収納用パッケージのキャッ
プ封止方法のさらに他の例を工程順に示す図である。FIG. 4 is a diagram showing still another example of the method of cap-sealing a package for housing a semiconductor device of the present invention in the order of steps.
【図５】従来の半導体素子収納用パッケージのキャップ
封止方法の一例を示す図である。FIG. 5 is a diagram showing an example of a conventional cap sealing method for a semiconductor element housing package.
１ キャップ ２、４ 封止材 ３ 切り欠き部 ５ 内部空間 ６ パッケージ 1 Cap 2, 4 Sealant 3 Notch 5 Internal space 6 Package
Claims (2)
ップを封止する方法において、パッケージの封止面およ
び／またはキャップの封止面の全体に有機樹脂からなる
封止材を塗布し、封止材の少なくとも一部にパッケージ
内部と外部とを連通する連通孔を形成するようにして、
キャップを封止材を介してパッケージに載置し、その後
加熱してキャップをパッケージに気密に封止するにあた
り、前記連通孔を、前記パッケージの封止面および／ま
たはキャップの封止面の全体に塗布した封止材と、該封
止材の上に設けた、一部に切り欠き部を有する封止材と
の二層構造にすることにより形成したことを特徴とする
半導体素子収納用パッケージのキャップ封止方法。1. A method of sealing a cap in a package containing a semiconductor inside, wherein a sealing material made of an organic resin is applied to the entire sealing surface of the package and / or the sealing surface of the cap to seal the package. A communication hole that communicates the inside and the outside of the package is formed in at least a part of the material,
When the cap is placed on the package via the encapsulating material and then heated to hermetically seal the cap to the package, the communication hole is formed on the entire sealing surface of the package and / or the sealing surface of the cap. A package for storing a semiconductor element, which is formed by forming a two-layer structure of a sealing material applied on the sealing material and a sealing material provided on the sealing material and partially having a cutout portion. Cap sealing method.
ップを封止する方法において、パッケージの封止面およ
び／またはキャップの封止面の全体に有機樹脂からなる
封止材を塗布し、封止材の少なくとも一部にパッケージ
内部と外部とを連通する連通孔を形成するようにして、
キャップを封止材を介してパッケージに載置し、その後
加熱してキャップをパッケージに気密に封止するにあた
り、前記連通孔を、前記パッケージの封止面および／ま
たはキャップの封止面の一部に凹部を設けることにより
形成したことを特徴とする半導体素子収納用パッケージ
のキャップ封止方法。2. A method of sealing a cap in a package containing a semiconductor inside, wherein a sealing material made of an organic resin is applied to the entire sealing surface of the package and / or the sealing surface of the cap to seal the package. A communication hole that communicates the inside and the outside of the package is formed in at least a part of the material,
When the cap is placed on the package via the encapsulating material and then heated to hermetically seal the cap to the package, the communication hole is formed on the sealing surface of the package and / or the sealing surface of the cap. A method for cap-sealing a package for accommodating a semiconductor element, which is characterized in that it is formed by providing a recessed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4299846A JP2693694B2 (en) | 1992-11-10 | 1992-11-10 | Capping method for semiconductor device housing package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4299846A JP2693694B2 (en) | 1992-11-10 | 1992-11-10 | Capping method for semiconductor device housing package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06151620A JPH06151620A (en) | 1994-05-31 |
| JP2693694B2 true JP2693694B2 (en) | 1997-12-24 |
Family
ID=17877645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4299846A Expired - Lifetime JP2693694B2 (en) | 1992-11-10 | 1992-11-10 | Capping method for semiconductor device housing package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2693694B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349178A (en) | 1999-06-08 | 2000-12-15 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
| JP2009302556A (en) * | 2009-08-31 | 2009-12-24 | Renesas Technology Corp | Semiconductor device |
| JP2012034086A (en) * | 2010-07-29 | 2012-02-16 | Nippon Dempa Kogyo Co Ltd | Method of manufacturing piezoelectric device and piezoelectric device |
| JP5747691B2 (en) * | 2011-07-04 | 2015-07-15 | セイコーエプソン株式会社 | Manufacturing method of electronic device package, electronic device and electronic apparatus |
| JP6063111B2 (en) * | 2011-07-04 | 2017-01-18 | セイコーエプソン株式会社 | Electronic device package manufacturing method and electronic device manufacturing method |
| JP5786546B2 (en) * | 2011-08-15 | 2015-09-30 | セイコーエプソン株式会社 | Gas cell manufacturing method and magnetometer |
| JP5982972B2 (en) * | 2012-04-10 | 2016-08-31 | 日本電気株式会社 | Vacuum package, sensor, and manufacturing method of vacuum package |
| JP6102148B2 (en) * | 2012-09-26 | 2017-03-29 | 日本電気株式会社 | Hermetically sealed package and manufacturing method thereof |
| JP6175760B2 (en) * | 2012-11-26 | 2017-08-09 | セイコーエプソン株式会社 | Electronic device package manufacturing method, electronic device manufacturing method, electronic device manufacturing method, and moving body manufacturing method |
| CN103837145B (en) * | 2012-11-26 | 2018-12-28 | 精工爱普生株式会社 | Electronic device and its manufacturing method, lid, electronic equipment and moving body |
| JP6450612B2 (en) * | 2015-03-11 | 2019-01-09 | 日本特殊陶業株式会社 | Electronic component device and manufacturing method thereof |
| JP6112138B2 (en) * | 2015-05-12 | 2017-04-12 | セイコーエプソン株式会社 | Manufacturing method of electronic device |
| CN115732340B (en) * | 2023-01-13 | 2023-05-09 | 江苏长电科技股份有限公司 | Packaging method and packaging structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63275147A (en) * | 1987-05-07 | 1988-11-11 | Nec Corp | Manufacture of hermetically sealed type semiconductor device |
| JP2823063B2 (en) * | 1991-08-09 | 1998-11-11 | 富士通 株式会社 | Method for manufacturing semiconductor device |
-
1992
- 1992-11-10 JP JP4299846A patent/JP2693694B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06151620A (en) | 1994-05-31 |
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