JP2669873B2 - Hybrid integrated circuit - Google Patents

Description

The present invention relates to a hybrid integrated circuit, and more particularly, to a lead terminal structure of a hybrid integrated circuit comprising two hybrid integrated circuit boards.

(B) Conventional technology As shown in FIG. 5, a conventional hybrid integrated circuit has a conductive path (not shown) of a desired shape formed on a substrate (21) made of ceramics or insulating metal, and a plurality of circuits are formed on the conductive path. The element (22) was fixed, and the circuit element (22) was hermetically sealed by the resin case (23). (24) is a metal lead terminal.

As the density of the hybrid integrated circuit is increased, the hybrid integrated circuit shown in FIG. 5 is replaced by a hybrid integrated circuit composed of two hybrid integrated circuit boards (31) (32) as shown in FIG. It has been filed by the present applicant and is known as a known technique. In FIG. 6, (31) and (32) are insulated metal substrates, and a plurality of circuit elements (33) (34) and lead terminals (35) (36) are provided on the respective substrates (31) (32). ) Is fixed,
Substrates (31) and (32) are fixed and integrated with the case member (37) so that the circuit elements (33) and (34) face each other.

Such a hybrid integrated circuit may be mounted on a mounting substrate or socket (not shown) on the lead terminals (35) (36).
Is inserted and connection with an external circuit is made.

(C) Problems to be Solved by the Invention When inserting the above-described hybrid integrated circuit into a socket or the like,
Since the socket is standardized to some extent, the vertical pitch between the lead terminals has to be adjusted to correspond to the pitch between the electrodes of the socket.

When the pitch l between the respective external lead terminals is set, the pitch l ′ must be lengthened in order to adjust the pitch l ′ of the lead terminals and shorten the pitch l. There was a problem that peeling of the fixed portion occurred.

Further, in the conventional hybrid integrated circuit, there is a problem that the lead terminal is bent when the socket is inserted and removed.

(D) Means for Solving the Problems The present invention has been made in view of the problems described above,
Two hybrid integrated circuit boards on which conductive paths having a desired shape are formed, a plurality of fixing pads extending from the conductive paths and provided in the vicinity of peripheral edges of the two hybrid integrated circuit boards, and the fixing A plurality of lead terminals that are fixed to the pad, extend in the vertical direction, and are bent at a substantially right angle in the horizontal direction, and a support member that is integrated with at least the horizontal portion of the lead terminals and supports the lead terminals. And a case member that fixes the two hybrid integrated circuit boards to each other with a space therebetween, to solve the above-mentioned problem.

(E) Operation As described above, according to the present invention, by integrating the support member for supporting the lead terminals with the lead terminals provided at the peripheral end portions of the two hybrid integrated circuit boards, The lead member is supported by the support member, bending of the lead terminal can be prevented by an external force, and the pitch between the lead terminals can be easily set.

(F) Embodiment A hybrid integrated circuit according to the present invention will be described in detail below with reference to the embodiments shown in FIGS. 1 and 2.

As shown in FIG. 1, the hybrid integrated circuit of the present invention has two hybrid integrated circuit boards (1) and (2) and two boards (1).
Lead terminals (3) and (4) fixed to the peripheral edge of (2)
And supporting members (5) and (6) for supporting the lead terminals (3) and (4), and a case member (7) for separating and fixing the two substrates (1) and (2).

The two hybrid integrated circuit boards (1) and (2) are formed in a rectangular shape by a predetermined means using a ceramic or insulating-treated metal substrate. In this embodiment, the substrate (1)
As (2), an insulating aluminum substrate is used (hereinafter referred to as substrate).

Conductive paths (8) and (9) having a desired shape are formed on the respective substrates (1) and (2) through an insulating resin layer (not shown). The conductive paths (8) and (9) are formed by etching a copper foil previously attached on the insulating resin layer.

Transistors, ICs, on the conductive paths (8) and (9),
A plurality of circuit elements (10) (11) such as an LSI, a chip resistor, and a chip capacitor are fixed, and bonding connection is made by a wire with a conductive path in the vicinity. Conductive path (8)
A plurality of lead terminal fixing pads (8 ') and (9') are formed near the peripheral edges of the substrates (1) and (2) on which (9) extends.

One end of the lead terminals (3) and (4) has a fixed pad (8 ')
It is soldered on (9 '), and the other end is led out by a predetermined length from the peripheral edges of the substrates (1) and (2). The vertical distance between the other ends of the lead terminals (3) and (4) is the lead terminal (3).
It can be set in correspondence with the mounting substrate to be inserted into (4) or the electrode terminals of the insertion member such as the socket (12). As is clear from FIGS. 1 and 2, the lead terminals (3) and (4) are fixed to the fixing pads (8 ') and (9') and extend in a substantially vertical direction so that the respective leads face each other. The lead terminals (3) and (4) are vertically bent so as to extend in the horizontal direction. It becomes possible to set the interval of to a predetermined interval.

In the present invention, since the lead terminals (3) and (4) are weak against external force, the support members (5) and (6) for preventing the lead terminals (3) and (4) from being adversely affected by the external force are integrated. Has been done.

The support members (5) and (6) are made of insulating resin, and the lead members (3) and (4) are fixed to the pad (8) by the support members (5) and (6) as shown in FIGS. 1 and 2. ′)
They are fixed and integrated at a pitch interval corresponding to the pitch interval of (9 '). The supporting members (5) and (6) are formed in an L shape, one side of which is integrated with the horizontal portions (3 ′) and (4 ′) of the lead terminals (3) and (4), and the other side thereof is connected to the lead terminals ( 3) Spaced from the vertical parts (3 ″) (4 ″) of (4),
Further, the lead terminals (3) and (4) are arranged so as to extend to the tip of the pads. Further, a step portion (12) for resin injection is provided on either one of the support members (5) and (6).
In this step portion (12), the substrate (1) (2) is attached to the case material (7).
When integrated with, the substrate and the step portion (12) form a window (not shown) for the resin injection hole.

A case material (7) for fixing the respective substrates (1) and (2) apart from each other is formed in a frame shape with an insulating resin.
(2) The circuit elements (10) and (11) fixed to the upper surface are arranged on the case member (7) so as to face each other and fixed and integrated with an adhesive such as an adhesive sheet.

At this time, the vertical portions (3 ″) of the lead terminals (3) and (4)
One ends of the support members (5) and (6) separated from (4 ″) come into contact with the substrates (1) and (2), and support the lead terminals (3) and (4) respectively. Further, the other end portions of the supporting members (5) and (6), which are integrated with the horizontal portions (3 ′) and (4 ′) of the lead terminals (3) and (4), are the substrates (1) and (2). Are arranged so as to be flush with the peripheral end face of the.

Substrate (1) to which lead terminals (3) and (4) are fixed
(2) A sealing resin is filled from a resin injection hole formed by the support member and the substrate between the spaces, thereby completing the hybrid integrated circuit.

Sockets (12) are inserted into the lead terminals (3) and (4) of such a hybrid integrated circuit for connection with an external circuit. Since the lead terminals (3) and (4) used in this embodiment have a certain thickness, the socket (12) does not come off.

3 and 4 are cross-sectional views showing another embodiment,
Fixing plates (13) and (14) are provided to fix the socket (12) from the supporting members (5) and (6), and the fixing plates (13) and (1) are provided.
If the socket (12) is fixed with 4), the fixing plates (13) (14)
Has a certain degree of elasticity, the socket (12) is held by the fixing plates (13) and (14) and is not detached.

(G) Effect of the Invention As described in detail above, according to the present invention, by integrating the support member with the lead terminals provided at the peripheral ends of the two hybrid integrated circuit boards, Since the lead terminals bent at substantially right angles are supported, the lead terminals can be prevented from bending.

Further, by providing the support member with the fixing plate for fixing the socket, it is possible to prevent the socket inserted into the hybrid integrated circuit from being detached.

Further, in the present invention, since the lead terminal is supported by the support member, the lead terminal does not bend even when the socket is inserted or removed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a hybrid integrated circuit of the present invention, FIG. 2 is a perspective view showing a supporting member used in FIG. 1, and FIGS. 3 and 4 are sectional views showing other embodiments. FIG. 5, FIG. 5 and FIG. 6 are sectional views showing a conventional example. (1) (2) ... hybrid integrated circuit board, (3) (4) ...
Lead terminal, (5) (6) ... Supporting member, (7) ... Case material.

 ───────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Chizumi Izumi 3-1 Shinchi, Fuchu-cho, Aki-gun, Hiroshima Prefecture Inside Mazda Co., Ltd. (72) Inventor Eternal Fujita 3-1 Shinchi, Fuchu-cho, Aki-gun, Hiroshima Matsu Da Co., Ltd. (56) References Actually opened Sho 57-198881 (JP, U) Actually opened 62-34481 (JP, U) Actually opened 63-180934 (JP, U)

Claims (6)

(57) [Claims] 1. A hybrid integrated circuit board having a conductive path of a desired shape, and a plurality of hybrid integrated circuit boards extending from the conductive path and provided in the vicinity of peripheral edges of the two hybrid integrated circuit boards. Fixing pads, a plurality of lead terminals fixed to the fixing pads, extending in the vertical direction and bent at a substantially right angle in the horizontal direction, and having a supporting member integrated with the horizontal portion; A hybrid integrated circuit, comprising: a case member for fixing the two hybrid integrated circuit substrates at a predetermined distance. 2. The hybrid integrated circuit according to claim 1, wherein the plurality of lead terminals are integrated by being separated by a predetermined distance by the supporting member. 3. The support member is L-shaped,
One side of the character is integrated with the horizontal portion of the lead terminal,
2. The hybrid integrated circuit according to claim 1, wherein the other side is separated from the vertical portion of the lead terminal, and the tip of the other side is in contact with the substrate. 4. The support member is disposed on a peripheral edge of each of the hybrid integrated circuit boards, and an injection hole for filling a resin is provided between at least one of the support members and the hybrid integrated circuit board. The hybrid integrated circuit according to claim 1, wherein the hybrid integrated circuit is provided. 5. A hybrid integrated circuit board having two conductive paths having a desired shape, and a plurality of hybrid integrated circuit boards extending from the conductive paths and provided in the vicinity of peripheral edges of the two hybrid integrated circuit boards. Fixing pads, a plurality of lead terminals fixed to the fixing pads, extending in the vertical direction and bent at a substantially right angle in the horizontal direction, and having a supporting member integrated with the horizontal portion; A hybrid integrated circuit comprising: a case member for fixing the two hybrid integrated circuit boards at a predetermined distance from each other, and a socket inserted into the lead terminal for connecting to an external circuit. 6. The hybrid integrated circuit according to claim 5, wherein said support member is provided with a fixing plate for fixing said socket.