JP2658882B2 - Semiconductor cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device for cooling a semiconductor circuit having a relatively large heat generation such as a large computer.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 60-160150 discloses a technique for cooling an integrated circuit such as a semiconductor with a liquid refrigerant via a heat transfer plate. In the cooling device for an integrated circuit shown in FIG. 1, heat generated in a semiconductor element 11 is transferred to a heat transfer plate 1.
0, transmitted through the deformable heat transfer body 9 and the heat transfer plate 5,
The heat of the heat transfer plate 5 is cooled by the ejection of the liquid refrigerant from the nozzle 8.

[0003]

In such a conventional structure, since the nozzle for supplying the liquid refrigerant to the cooling surface is fixed, the flow path of the refrigerant is fixed. For this reason, not only the problem that the dead water area where the movement of the refrigerant does not occur and the part that is hardly cooled occurs, but also a part with a large cooling effect and a part with a small cooling effect occur, and the temperature of the surface to be cooled is not uniform. There's a problem.

[0004] It is an object of the present invention to provide a semiconductor cooling device having improved cooling performance.

Another object of the present invention is to provide a semiconductor cooling device which prevents formation of a dead water zone in which refrigerant does not move.

Another object of the present invention is to provide a semiconductor cooling device in which the temperature of a cooling surface is made more uniform.

[0007]

According to a first aspect of the present invention, there is provided a semiconductor cooling device comprising: a cold cooling device provided on an upper surface of an integrated circuit;
And bets, the holes refrigerant provided in the cold plates to cool the integrated circuit is filled, the provided in the bore
An ejection nozzle that rotates by the ejection power of the coolant ejected from the outside to the inside of the hole and ejects the coolant from the tip.

[0008] The second semiconductor cooling device of the present invention, the hole <br/> has a bottom surface, the jet nozzle has a vertical axis of rotation to the bottom surface.

[0009]

[0010]

[0011]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, a first embodiment of the present invention comprises a substrate 1, an integrated circuit 2 mounted on the substrate 1, a substrate frame 3 fixed to an outer peripheral portion of the substrate 1, and an integrated circuit 2. A compound 4 having a high thermal conductivity applied to the upper surface located on the opposite side to the substrate 1 and an outer peripheral edge thereof being in contact with the substrate frame 3 and thermally connected to a plurality of integrated circuits 2 via the compound 4; A heat transfer plate (hereinafter referred to as a “cold plate”) 6 having a hole 5 corresponding to the size of the circuit provided on the surface opposite to the heat connection surface with the integrated circuit 2, an inlet 8 for taking in a refrigerant 7, and A suction chamber 10 for sucking the refrigerant 7, a discharge nozzle 13 for discharging the refrigerant from the hole 5, a discharge chamber 11 for discharging the refrigerant discharged by the discharge nozzle 13, and an outlet for discharging the refrigerant from the discharge chamber 11 Cooling container 1 containing 9
4 and a feature of the first embodiment of the present invention;
A plurality of ejection nozzles 12 having a movable portion 15 having a shape bent from the bottom of the hole 0 toward the hole 5 and capable of rotating about a rotation axis perpendicular to the bottom surface of the hole 5 are provided.

The direction in which the refrigerant flows is indicated by arrows.

The movable portion 15 rotates in the direction shown by the arrow due to the ejection power of the refrigerant 7 supplied from the suction chamber 10 and ejected from the ejection nozzle 12. In this rotation, the refrigerant 7 flowing just below from the suction chamber 10 is applied to the side wall of the movable portion 15, and from that point, the refrigerant 7 moves in the horizontal direction and is applied to the other side wall of the movable portion 15. Already, the refrigerant 7 is ejected from the side wall to which the refrigerant 7 is applied to the front or the side, thereby realizing the rotation in the circular direction.

The refrigerant in the hole 5 is agitated by the rotating operation of the movable portion 15.

In the first embodiment of the present invention, the movable portion 15
By changing the location of the refrigerant 7 in the hole 5 and moving the refrigerant 7 by the rotation of
The temperature of the cooling surface can be made uniform. in this way,
The first embodiment of the present invention increases the momentum of the refrigerant 7,
The cooling performance can be improved by increasing the heat transport amount.

Next, a second embodiment of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, a second embodiment of the present invention is characterized in that a jet nozzle 212 for jetting the refrigerant 7 from the absorption chamber 10 to the hole 5, and a frame is provided outside the jet nozzle 212. A connecting rod 216 having a character-shaped or X-shaped frame fixed at one end at the intersection thereof;
Is provided with a propeller 215 fixed to the other end of the.

The refrigerant 7 is ejected from the absorption chamber 10 by a nozzle 212
And is stirred by the propeller 215 via the The agitation of the refrigerant 7 by the rotation of the propeller prevents the generation of dead water areas,
The temperature of the cooling surface can be made uniform. in this way,
The second embodiment of the present invention can improve the cooling performance by increasing the momentum of the refrigerant 7 and increasing the heat transport amount.

[0020]

According to the present invention, the dead water area can be reduced by stirring the refrigerant, and the temperature of the cooling surface can be made uniform. Further, the momentum of the refrigerant increases due to the stirring of the refrigerant, and the heat transport amount increases. These factors improve the cooling performance of the present invention.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Integrated circuit 3 Substrate frame 4 Compound 5 Hole 6 Cold plate 7 Refrigerant 8 Inlet 9 Outlet 10 Suction chamber 11 Discharge chamber 12, 212 Jet nozzle 13 Discharge nozzle 14 Cooling vessel 15 Cooling unit 15 Movable part 215 Propeller 216 Connecting rod

Claims (2)

(57) [Claims] 1. A cold pump provided on an upper surface of an integrated circuit.
Rotation rate and a hole for cooling said <br/> integrated circuit coolant is provided is charged to the cold plate, the ejection force of the refrigerant ejected from the exterior to the interior of the holes provided in the bore And a jet nozzle which moves and jets the refrigerant from the tip. Wherein said hole has a bottom surface, the jet nozzle is a semiconductor cooling device according to claim 1, wherein a rotational axis perpendicular to the bottom surface.