JP2658703B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an IC (semiconductor integrated circuit device), and more particularly to a socket used for a flat package IC such as an SOP and a QFP.

[0002]

2. Description of the Related Art In a flat package IC, external leads (hereinafter simply referred to as leads) are evenly arranged on two or four sides of the package and are formed so as to be easily connected to a printed circuit board or the like. In some cases, an IC socket is used as a means for connecting each of the leads of the IC to the wiring formed on a printed circuit board or the like.

FIG. 3A is a plan view showing a conventional socket of this kind in a state in which a cover is opened, and FIG. 3B is a sectional view taken along line AA. When an IC is mounted on the conventional example, the IC is placed on a positioning table 32 which is vertically movable and installed at the center of the main body 31 of the socket. The part is pushed down from above to realize electrical contact between the lead of the IC and the contact pin 35.

[0004]

In the conventional socket described above, the lead of the IC is not directly positioned,
In addition, since the non-fixed portion of the contact pin is made long, an error is likely to occur in the positioning between the IC lead and the contact pin.
When the size is reduced to less than mm, the relative positioning error between the lead and the contact pin becomes a value that cannot be ignored.

Further, since the contact pin has a shape in which the conductive path (line length) is relatively long, the inductance value tends to increase, and the stray capacitance value between the contact pins also tends to increase. 30MH
There is also a problem that high frequency signals of about z or more cannot be handled.

Another problem with the prior art is that even if the contact pins need to be replaced due to wear of the contact pins, etc.
It was a structure that could not be easily replaced.

[0007]

SUMMARY OF THE INVENTION An IC socket according to the present invention has a positioning portion for regulating the positions of both ends of a lead row of ICs, wherein a top portion is in contact with an IC lead and a lower portion is a conductor of a lower body. An upper body holding a first contact pin serving as a contact portion with the first contact pin;
Has a second contact pin that can be touched and led out
The lower body and the elasticity between the upper and lower bodies
A pressing member for pressing and pressing was IC lead on top of the first contact pins at the bottom of the first contact pin to the second contact pins, that are equipped with. In addition, the present invention
Another IC socket according to
It has a positioning part that regulates the position of the end, and the top part is an IC
Contact with the printed circuit board conductor at the bottom
Body that holds the contact pins
Contacts the IC leads against the resilience between the substrate
Press the top of the pin and lower the first contact pin
A pressing member that presses against the conductor of the printed circuit board.
ing.

[0008]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of the present invention. As shown in the figure, in the present embodiment, the socket main bodies are each formed integrally with the upper main body 11.
And the lower body 12 is divided into two parts.

At the center of the upper body 11, there is provided an IC mounting portion 11a surrounded by plate members on four sides, and a U-shaped cut is made in each side plate member. The side surface of the cut is the lead positioning surface 11b. A protrusion 1 formed on the lower body 12 is also provided at the center of the upper body.
A through hole 11c into which 2a is fitted is opened.

[0010] Around the IC mounting portion 11a, a contact pin 1 having a J-shaped top is formed as a contact portion with the IC lead, and a tip on the opposite side is fixed to the upper body 11.
3a are arranged. The tip of the contact pin 13a is embedded in the main body when the upper main body 11 is formed.
A stopper pin 14 is rotatably attached to a lower portion of the IC mounting portion 11a.

At the center of the lower body 12, a square projection 12 is provided.
a is formed, and a through hole 12b through which the stopper pin 14 is passed is formed on the outside thereof. Through hole 12
In the middle of b, a step portion that engages with the stopper pin is provided. The lower body 12 also has contact pins 13a.
The contact pin 13b is buried in a position where the contact pin 13b comes into contact. A spring 15 acting to separate the upper main body 11 from the lower main body is mounted on the projection 12a of the lower main body 12.

At the time of actual use, the IC 16 is mounted on the IC
a. At this time, the lead rows provided on the four side surfaces of the package are positioned by the leads at both ends contacting the lead positioning surfaces. The lead pressing portion 17 presses the lead against the contact pin 13a and presses the contact pin 13a to the contact pin 13a.
b.

In this embodiment, the lead of the IC 16 is
Since the positioning is performed by the one lead positioning surface 11b, the positional deviation between the lead and the contact pin 13a can be reduced. Since the contact pins are shortened as a whole, both the parasitic inductance and the parasitic capacitance can be reduced, and the high-frequency characteristics can be improved. Further, when the socket needs to be replaced due to wear of the contact pin 13a, etc.,
By rotating the stopper pin 14, the upper body can be easily removed from the lower body.

FIG. 2 is a sectional view showing a second embodiment of the present invention. In this embodiment, the main body 21 has substantially the same configuration as the upper main body 11 of the previous embodiment. That is, an IC mounting portion 21a is provided at a central portion of the integrally formed main body 21, and a cutout having a side surface serving as a lead positioning surface is formed in a plate-like body surrounding the IC mounting portion 21a. I have. A projection 21c is formed below the IC mounting portion 21a. The main body 21 is provided with a contact pin 23 and a stopper pin 24 as in the previous embodiment.

The main body is directly mounted on the printed circuit board 28. The printed circuit board 28 has contact pins 23
A hole into which the protrusion 21c of the main body 21 fits, and a through hole 28 through which the stopper pin 24 passes.
b is provided. When this socket is mounted on a printed circuit board, a spring 25 is inserted between the main body and the printed circuit board.

This embodiment has the same effect as the previous embodiment by the above configuration, but since the lower body is not used, the inductance and the parasitic capacitance due to the contact pins are further reduced, and the high frequency The properties are further improved. Further, since the structure is simpler than that of the previous embodiment, the socket can be provided at lower cost.

While the preferred embodiment has been described above,
The present invention is not limited to these examples, and some modifications are possible. For example, one or both of the stopper pin and the spring can be removed.

[0018]

As described above, the IC socket of the present invention has a body in which a J-shaped contact pin whose upper end is in contact with an IC lead and whose lower end is in contact with another conductor is incorporated. Since the IC lead positioning portion is provided, the following effects can be obtained.

Since the leads of the IC are positioned directly on the socket body, a relative error in the alignment between the leads of the IC and the contact pins can be reduced even when the IC has a large number of pins. Since the shape of the contact pin is close to a straight line and its size is also reduced, the parasitic inductance and the parasitic capacitance are reduced, and the high-frequency characteristics are improved.

Since the contact pins that contact the leads of the IC are not directly soldered to a printed circuit board or the like, the replacement operation is facilitated. Since the main body (or the upper main body) is formed as an integrally molded product, the structure is simplified and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a plan view and a cross-sectional view of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Upper main body 21 Main body 11a, 21a IC mounting part 11b, 21b Lead positioning surface 11c Through hole 21c Projection 12 Lower main body 12a Projection 12b Through hole 13a, 13b, 23 Contact pin 14, 24 Stopper pin 15, 25 Spring 16 IC 17 Lead presser 28 Printed circuit board 31 Main body 32 Positioning table 33 Lid 34 Lead presser 35 Contact pin

Claims (3)

(57) [Claims] 1. A positioning portion for regulating the positions of both ends of an IC lead row, wherein a top portion is in contact with an IC lead and a lower portion is a lower portion.
An upper body which holds the first contact pin part has a contact portion with the conductor of the body, external as well as contact with the first contact pins during pressing
A lower body having a derivable second contact pins, the upper body and the lower part of the pressing and the first contact pins of the IC lead against the repulsive force to the top of the first contact pin between the lower body second An IC socket comprising: a pressing member that presses against a contact pin . 2. Controlling the positions of both ends of a lead row of an IC.
It has a positioning part, with the top part contacting the IC lead and the bottom part
Contact pins that are in contact with conductors on the printed circuit board
And a lead for the IC against the resilience between the main body and the printed circuit board.
To the top of the contact pin and the first contact
A pressing member that presses the lower part of the pin against the conductor on the printed circuit board
And an IC socket comprising: 3. The method according to claim 1, wherein the upper body or the body is the lower part.
Be removable from the main body or the printed circuit board.
The IC socket according to claim 1 or 2, wherein: