JP2656064B2 - Method for manufacturing thin-film magnetic head - Google Patents
Method for manufacturing thin-film magnetic headInfo
- Publication number
- JP2656064B2 JP2656064B2 JP9534088A JP9534088A JP2656064B2 JP 2656064 B2 JP2656064 B2 JP 2656064B2 JP 9534088 A JP9534088 A JP 9534088A JP 9534088 A JP9534088 A JP 9534088A JP 2656064 B2 JP2656064 B2 JP 2656064B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- magnetic
- plating
- pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 title description 7
- 239000010408 film Substances 0.000 claims description 178
- 238000007747 plating Methods 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 26
- 229920002120 photoresistant polymer Polymers 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 10
- 238000000206 photolithography Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 4
- 229910000889 permalloy Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は、面内記録再生に使用される薄膜磁気ヘッド
の製造方法に関し、上部磁性膜を形成する場合に、ポー
ル部において磁気ギャップ膜と基板との間に生じる段差
を埋めるレジスト膜を付与し、次にレジスト膜、磁気ギ
ャップ膜及び絶縁膜の表面で連続するようにメッキ下地
膜を形成し、その後、上部磁性膜のパターンニング化及
パターンメッキを行なうことにより、上部磁性膜のメッ
キ下地膜の断線個所をなくして、上部磁性膜のポール部
とヨーク部とのパターンメッキ組成を均一化し、狭トラ
ック化した場合でも、ウイグルの発生を防止できるよう
にしたものである。The present invention relates to a method of manufacturing a thin-film magnetic head used for in-plane recording / reproduction, and relates to a method for forming an upper magnetic film, in which a magnetic gap film is formed at a pole portion. A resist film that fills a step formed between the substrate and the substrate is provided, and then a plating base film is formed so as to be continuous on the surfaces of the resist film, the magnetic gap film, and the insulating film. By performing pattern plating, the disconnection of the plating base film of the upper magnetic film is eliminated, the pattern plating composition of the pole and yoke portions of the upper magnetic film is made uniform, and even if the track is narrowed, wiggles are generated. It is something that can be prevented.
＜従来の技術＞ 第３図は特開昭55−84019号等で従来よりよく知られ
た面内記録再生用の薄膜磁気ヘッドの要部における斜視
図で、１はAl2O3−TiC等のセラミック構造体でなる基
板、２はポールとなる下部磁性膜、21はそのポール部、
22は同じくヨーク部、３はアルミナ等でなる磁気ギャッ
プ膜、４は下部磁性膜２と略相似形で対向する上部磁性
膜、41はそのポール部、42は同じくそのヨーク部、５は
導体コイル膜、６はノボラック樹脂等の有機絶縁樹脂で
なる絶縁膜、７、８は引出リード部である。<Prior Art> FIG. 3 is a perspective view of essential parts of the well-known longitudinal recording thin film magnetic head for reproducing conventionally in JP 55-84019, etc., 1 Al 2 O 3 -TiC, etc. A substrate made of a ceramic structure, 2 is a lower magnetic film to be a pole, 21 is a pole portion thereof,
22 is a yoke part, 3 is a magnetic gap film made of alumina or the like, 4 is an upper magnetic film facing the lower magnetic film 2 in a substantially similar shape, 41 is its pole part, 42 is its yoke part, and 5 is a conductor coil. Reference numeral 6 denotes an insulating film made of an organic insulating resin such as novolak resin, and reference numerals 7 and 8 denote lead leads.
第４図は上記薄膜磁気ヘッドの要部構造を示す断面図
で、基板１の上に、メッキ下地膜９を介して、下部磁性
膜２を形成し、下部磁性膜２上に形成した磁気ギャップ
膜３の上に、導体コイル膜５及び絶縁膜61〜63を積層し
て形成し、導体コイル膜５の上に形成された絶縁膜63の
上に、メッキ下地膜10を介して、上部磁性膜４を形成
し、上部磁性膜４の上に保護膜11を設けた構造となって
いる。下部磁性膜２及び上部磁性膜４は、媒体対向面と
なるポール部21−41を、磁気ギャップ膜３による磁気ギ
ャップG1を介して対向させると共に、ヨーク部22−42を
後端部側で互いに磁気結合させ、この結合部のまわりに
渦巻状に導体コイル膜５を形成してある。FIG. 4 is a sectional view showing a main structure of the thin-film magnetic head, in which a lower magnetic film 2 is formed on a substrate 1 via a plating base film 9, and a magnetic gap formed on the lower magnetic film 2 is formed. The conductor coil film 5 and the insulating films 61 to 63 are laminated on the film 3 and formed on the insulating film 63 formed on the conductor coil film 5 via the plating base film 10 through the upper magnetic layer. The structure is such that the film 4 is formed, and the protective film 11 is provided on the upper magnetic film 4. Lower magnetic film 2 and the upper magnetic layer 4, the pole portions 21-41 as a medium facing surface, the is opposed via a magnetic gap G 1 by the magnetic gap film 3, the yoke portion 22-42 at the rear end The conductor coil films 5 are magnetically coupled to each other, and are formed in a spiral shape around the joint.
この種の薄膜磁気ヘッドは、フォトリソグラフィと称
される高精度パターン形成技術及び精密加工技術によっ
て製造される。このうち、ポールとなる下部磁性膜２及
び上部磁性膜４をメッキによって形成する場合、例えば
特開昭57−120675号公報等で公知のように、メッキ下地
膜の表面にフォトレジストによるポールパターンを形成
し、次にフォトレジストをマスクとして、パターンメッ
キを行なう行程がとられる。次にパターンメッキ工程の
概略について説明する。This type of thin-film magnetic head is manufactured by a high-precision pattern forming technique called photolithography and a precision processing technique. When the lower magnetic film 2 and the upper magnetic film 4 serving as poles are formed by plating, for example, as is known in JP-A-57-120675, a pole pattern made of a photoresist is formed on the surface of a plating base film. Then, pattern plating is performed using a photoresist as a mask. Next, the outline of the pattern plating process will be described.
まず、第５図（ａ）に示すように、基板１の上に接着
膜91及び下地膜92を積層して、メッキ下地膜９を形成す
る。接着膜91はチタン等で構成され、下地膜92はパーマ
ロイ等で構成される。First, as shown in FIG. 5A, an adhesive film 91 and a base film 92 are stacked on the substrate 1 to form a plating base film 9. The adhesive film 91 is made of titanium or the like, and the base film 92 is made of permalloy or the like.
次に第５図（ｂ）に示すように、下地膜92の上にフォ
トレジスト12を塗布した後、第５図（ｃ）に示すよう
に、フォトレジスト12の上にフォトマスク13を配置し、
露光、現像する。Next, as shown in FIG. 5 (b), a photoresist 12 is applied on the base film 92, and then a photomask 13 is disposed on the photoresist 12 as shown in FIG. 5 (c). ,
Exposure and development.
上述のフォトリソグラフィによるパターンニング化に
より、第５図（ｄ）に示すように、フォトレジストによ
るレジストフレーム12が形成される。レジストフレーム
12はその内側に形成されるパターンが、最終的に得よう
とする下部磁性膜２のパターンとなるように形成する。
下部磁性膜２のパターンは、第３図に示したように、狭
いポール部21の後方に広い扇形のヨーク部22を連設した
形状となるので、レジストフレーム12によって囲まれた
内側のパターンは、上述の下部磁性膜２のパターンに対
応して、狭い部分の後方に広い扇形の空間を連設した形
状となる。By the patterning by the photolithography described above, a resist frame 12 of a photoresist is formed as shown in FIG. 5 (d). Resist frame
12 is formed so that the pattern formed on the inside thereof becomes the pattern of the lower magnetic film 2 to be finally obtained.
As shown in FIG. 3, the pattern of the lower magnetic film 2 has a shape in which a wide fan-shaped yoke portion 22 is continuously provided behind a narrow pole portion 21, so that the inner pattern surrounded by the resist frame 12 is According to the pattern of the lower magnetic film 2, a wide fan-shaped space is continuously provided behind the narrow portion.
次に第５図（ｅ）に示すように、レジストフレーム12
をマスクとして、その内外にパターンメッキ14を施す。
このパターンメッキ14のうち、レジストフレーム12の内
側にあるパターンメッキ14は下部磁性膜２のパターンと
なるもので、パーマロイ等の磁性薄膜として形成され
る。Next, as shown in FIG.
Is used as a mask, pattern plating 14 is applied to the inside and outside thereof.
Among the pattern platings 14, the pattern plating 14 inside the resist frame 12 serves as a pattern of the lower magnetic film 2, and is formed as a magnetic thin film such as permalloy.
次に、第５図（ｆ）に示すように、レジストフレーム
12を除去して下地膜９を露出させた後、第５図（ｇ）に
示すように、レジスト除去跡121の内部で、露出してい
る下地膜92及びその下側にある接着膜91を除去する。Next, as shown in FIG.
After the base film 9 is exposed by removing 12, as shown in FIG. 5G, the exposed base film 92 and the adhesive film 91 thereunder are removed inside the resist removal mark 121. Remove.
次に第５図（ｈ）に示すように、レジストフレーム12
の除去跡121を満たし、除去跡121によって囲まれたパタ
ーンメッキ14を覆うように、レジスト15を付着させる。
この後、第５図（ｉ）に示すように、化学的エッチング
によって、レジスト15の外側のパターンメッキ14、下地
膜92及び接着膜91を除去する。次にレジスト15を除去し
て、第５図（ｊ）に示すような下部磁性膜２によるポー
ルパターンが得られる。Next, as shown in FIG.
Then, a resist 15 is attached so as to fill the removal trace 121 and cover the pattern plating 14 surrounded by the removal trace 121.
Thereafter, as shown in FIG. 5 (i), the pattern plating 14, the underlying film 92 and the adhesive film 91 outside the resist 15 are removed by chemical etching. Next, the resist 15 is removed to obtain a pole pattern of the lower magnetic film 2 as shown in FIG. 5 (j).
次に第５図（ｋ）に示すように、下部磁性膜２の上に
磁気ギャップ膜３、導体コイル膜５及び絶縁膜６をフォ
トリソグラフィによって形成した後、第５図（ｌ）及び
第６図（ａ）に示すように、磁気ギャップ膜３、最外側
にある絶縁膜63及び基板１の表面にメッキ下地膜10を設
ける。ポール部21では、第５図（ｌ）に示すように、磁
気ギャップ膜３の表面が、基板１の表面からメッキ下地
膜９、下部磁性膜２及び磁気ギャップ膜３の厚みの和h1
だけ高くなっているので、磁気ギャップ膜３の表面のメ
ッキ下地膜10と基板１上のメッキ下地膜10とは互いに離
れている。一方、絶縁膜63の表面に設けられたメッキ下
地膜10は、第７図に示すように、絶縁間63の外周縁が基
板１の表面に向って下降して基板１の表面に連続するの
で、基板１上のメッキ下地膜10に連続する。Next, as shown in FIG. 5 (k), after forming a magnetic gap film 3, a conductor coil film 5 and an insulating film 6 on the lower magnetic film 2 by photolithography, FIG. 5 (l) and FIG. As shown in FIG. 1A, a plating base film 10 is provided on the surface of the magnetic gap film 3, the outermost insulating film 63, and the substrate 1. In the pole portion 21, as shown in FIG. 5 (l), the surface of the magnetic gap film 3 is the sum h 1 of the thicknesses of the plating base film 9, the lower magnetic film 2, and the magnetic gap film 3 from the surface of the substrate 1.
Therefore, the plating base film 10 on the surface of the magnetic gap film 3 and the plating base film 10 on the substrate 1 are separated from each other. On the other hand, in the plating base film 10 provided on the surface of the insulating film 63, as shown in FIG. 7, since the outer peripheral edge of the insulating space 63 descends toward the surface of the substrate 1 and continues to the surface of the substrate 1, To the plating base film 10 on the substrate 1.
次に、第５図（ｍ）に示すように、メッキ下地膜10の
表面にフォトレジスト16を塗布した後、第５図（ｎ）に
示すように、フォトレジスト16の上にマスク17を位置決
めして配置し、露光し、現像する。Next, as shown in FIG. 5 (m), after applying a photoresist 16 on the surface of the plating base film 10, a mask 17 is positioned on the photoresist 16 as shown in FIG. 5 (n). And expose, develop.
このフォトリソグラフィによるパターンニング化によ
り、第５図（ｏ）及び第６図（ｂ）に示すように、フォ
トレジストによるレジストフレーム16が形成される。レ
ジストフレーム16はその内側に形成されるパターン161
が、最終的に得ようとする上部磁性膜４のポールパター
ンとなるように形成する。By this patterning by photolithography, a resist frame 16 of photoresist is formed as shown in FIGS. 5 (o) and 6 (b). The resist frame 16 has a pattern 161 formed therein.
Is formed so as to form a pole pattern of the upper magnetic film 4 to be finally obtained.
次に第５図（ｐ）、第６図（ｃ）に示すように、レジ
ストフレーム16をマスクとして、その内外にパターンメ
ッキ18を施す。このパターンメッキ18のうち、レジスト
フレーム16の内側にあるパターンメッキ18は上部磁性膜
４のパターンとなるもので、ポール部181及びヨーク部1
82（第６図（ｃ）参照）を有するパーマロイ等の磁性薄
膜として形成される。この後、下部磁性膜２の場合と同
様に、第５図（ｆ）〜（ｉ）の工程を通すことにより、
パターンメッキによる上部磁性膜４が得られる。Next, as shown in FIGS. 5 (p) and 6 (c), using the resist frame 16 as a mask, pattern plating 18 is applied inside and outside thereof. Of the pattern plating 18, the pattern plating 18 inside the resist frame 16 serves as a pattern of the upper magnetic film 4, and includes the pole portion 181 and the yoke portion 1.
82 (see FIG. 6 (c)) is formed as a magnetic thin film of permalloy or the like. Thereafter, as in the case of the lower magnetic film 2, by passing through the steps of FIGS.
The upper magnetic film 4 is obtained by pattern plating.
＜発明が解決しようとする問題点＞ ところが、従来の薄膜磁気ヘッドの製造方法では、磁
気ギャップ膜３、最外側にある絶縁膜63及び基板１の表
面にメッキ下地膜10を設けた場合、ポール部21では、第
５図（ｌ）に示すように、磁気ギャップ膜３の表面のメ
ッキ下地膜10が基板１上のメッキ下地膜10から高さh1だ
け離れているのに体し、絶縁膜63の表面に設けられたメ
ッキ下地膜10は、第７図に示すように、絶縁膜63の外周
縁が基板１の表面に向って下降して基板１の表面に連続
するので、基板１上のメッキ下地膜10に連続する。この
ため、磁気ギャップ膜３上に形成されるポール部181と
絶縁膜63上に形成されるヨーク部182とで、パターンメ
ッキ時に電位分布差が生じ、メッキ組成が不均一にな
る。このメッキ組成の不均一化は、ヘッド再生出力波形
に、第８図に示すようなウイグル（振動）を発生させる
主要因の１つになる。<Problems to be Solved by the Invention> However, in the conventional method of manufacturing a thin-film magnetic head, when the plating base film 10 is provided on the surface of the magnetic gap film 3, the outermost insulating film 63, and the substrate 1, the pole in section 21, as shown in FIG. 5 (l), Taishi for plating foundation film 10 on the surface of the magnetic gap film 3 are separated by a height h 1 from the plating foundation film 10 on the substrate 1, an insulating As shown in FIG. 7, the plating base film 10 provided on the surface of the film 63 has the outer peripheral edge of the insulating film 63 descending toward the surface of the substrate 1 and continuing on the surface of the substrate 1. It is continuous with the upper plating base film 10. Therefore, a potential distribution difference occurs between the pole portion 181 formed on the magnetic gap film 3 and the yoke portion 182 formed on the insulating film 63 during pattern plating, and the plating composition becomes non-uniform. This non-uniform plating composition is one of the main factors that cause a wiggle (vibration) as shown in FIG. 8 in the head reproduction output waveform.
しかも、メッキ組成の不均一化は、ポール幅が小さく
なればなる程、大きくなる傾向にある。コンピュータ外
部記憶装置等においては、記憶密度を増大させるため、
狭トラック化が進められており、狭トラック化が進めば
進む程、下部磁性膜２のポール幅及び上部磁性膜４のポ
ール幅を小さくしなければならない。このため、ウイグ
ルの問題がますます発生し易くなっている。Moreover, the nonuniform plating composition tends to increase as the pole width decreases. In a computer external storage device, etc., in order to increase the storage density,
As the track is being narrowed, the pole width of the lower magnetic film 2 and the pole width of the upper magnetic film 4 must be reduced as the track becomes narrower. This makes the problem of Uyghur more likely to occur.
＜問題点を解決するための手段＞ 上述する従来の問題点を解決するため、本発明に係る
薄膜磁気ヘッドの製造方法は、基板上にポール部とヨー
ク部とを有する下部磁性膜、磁気ギャップ膜、絶縁膜及
び導体コイル膜を積層した後、前記ポール部において前
記磁気ギャップ膜の表面と基板面との間に生じる段差を
埋めるようレジスト膜を付与し、次に前記レジスト膜、
磁気ギャップ膜及び絶縁膜の表面で連続するようメッキ
下地膜を形成し、次に前記メッキ下地膜の上にフォトレ
ジストを付着させ、前記フォトレジストをフォトリソグ
ラフィによってパターンニングン化し、次にパターンメ
ッキを行なって、前記下部磁性膜のポール部と前記磁気
ギャップ膜を介して対向するポール部及び前記下部磁性
膜のヨーク部と磁気結合されるヨーク部を有する上部磁
性膜を形成することを特徴とする。<Means for Solving the Problems> In order to solve the above-mentioned conventional problems, the method of manufacturing a thin-film magnetic head according to the present invention comprises a lower magnetic film having a pole portion and a yoke portion on a substrate; After laminating the film, the insulating film and the conductor coil film, a resist film is provided so as to fill a step generated between the surface of the magnetic gap film and the substrate surface at the pole portion, and then the resist film,
A plating base film is formed so as to be continuous on the surfaces of the magnetic gap film and the insulating film, and then a photoresist is deposited on the plating base film, and the photoresist is patterned by photolithography. Forming an upper magnetic film having a pole portion facing the pole portion of the lower magnetic film via the magnetic gap film and a yoke portion magnetically coupled to the yoke portion of the lower magnetic film. I do.
＜作用＞ 下部磁性膜、磁気ギャップ膜、絶縁膜及び導体コイル
膜を積層した後、ポール部において前記磁気ギャップ膜
と基板との間に生じる段差を埋めるレジスト膜を付与
し、次にレジスト膜、磁気ギャップ膜及び絶縁膜の表面
で連続するようメッキ下地膜を形成すると、磁気ギャッ
プ膜上のメッキ下地膜と、絶縁膜上のメッキ下地膜がレ
ジスト膜上で連続し、断線個所を生じることがない。こ
のため、メッキ下地膜上で、上部磁性膜のパターンニン
グ化及パターンメッキを行なった場合、上部磁性膜のポ
ール部とヨーク部のパターンメッキ組成が均一化され、
狭トラック化された場合でも、ウイグルが発生しにくく
なる。<Operation> After laminating the lower magnetic film, the magnetic gap film, the insulating film, and the conductor coil film, a resist film for filling a step formed between the magnetic gap film and the substrate at the pole portion is provided. If the plating base film is formed so as to be continuous on the surfaces of the magnetic gap film and the insulating film, the plating base film on the magnetic gap film and the plating base film on the insulating film may be continuous on the resist film, and a disconnection may occur. Absent. For this reason, when patterning and pattern plating of the upper magnetic film are performed on the plating base film, the pattern plating composition of the pole portion and the yoke portion of the upper magnetic film is uniformed,
Even when the track is narrowed, the wiggle is less likely to occur.
＜実施例＞ 第１図（ａ）〜（ｅ）及び第２図（ａ）、（ｂ）は本
発明に薄膜磁気ヘッドの製造方法における工程の要部を
示す図である。まず、従来と同様に、第５図（ａ）〜
（ｋ）の工程を通して、基板１の上にメッキ下地膜９、
下部磁性膜２、磁気ギャップ部膜３、導体コイル膜５及
び絶縁膜６を形成した後、上部磁性膜４をパターンメッ
キするためメッキ下地膜を形成する前に、第１図（ａ）
及び第２図（ａ）に示すように、下部磁性膜２のポール
部21において磁気ギャップ膜３の表面と基板１の面との
間に生じる段差を埋めるレジスト膜19を付与する。<Examples> FIGS. 1 (a) to 1 (e) and FIGS. 2 (a) and 2 (b) are views showing main parts of steps in a method of manufacturing a thin film magnetic head according to the present invention. First, as in the conventional case, FIG.
Through the process (k), a plating base film 9 is formed on the substrate 1.
After forming the lower magnetic film 2, the magnetic gap portion film 3, the conductor coil film 5, and the insulating film 6, before forming a plating base film for pattern plating the upper magnetic film 4, FIG.
Then, as shown in FIG. 2A, a resist film 19 for filling a step formed between the surface of the magnetic gap film 3 and the surface of the substrate 1 in the pole portion 21 of the lower magnetic film 2 is provided.
次に、第１図（ｂ）及び第２図（ｂ）に示すように、
レジスト膜19、磁気ギャップ膜３及び絶縁膜６の表面に
連続するメッキ下地膜10を形成する。磁気ギャップ膜３
と基板１との間に生じる段差はレジスト膜21によって埋
められているので、磁気ギャップ膜３の上のメッキ下地
膜10及び絶縁膜６上のメッキ下地膜10は、レジスト膜21
の上で連続し、断線を生じることがない。Next, as shown in FIG. 1 (b) and FIG. 2 (b),
A plating base film 10 is formed continuously on the surfaces of the resist film 19, the magnetic gap film 3 and the insulating film 6. Magnetic gap film 3
The step formed between the substrate 1 and the substrate 1 is filled with the resist film 21, so that the plating base film 10 on the magnetic gap film 3 and the plating base film 10 on the insulating film 6
And no breaks occur.
次に第１図（ｃ）に示すように、メッキ下地膜10の表
面にフォトレジスト16を塗布し、フォトレジスト16の上
にマスク17を位置決めして配置し、露光し、現像する。Next, as shown in FIG. 1 (c), a photoresist 16 is applied to the surface of the plating base film 10, a mask 17 is positioned and arranged on the photoresist 16, exposed, and developed.
このフォトリソグラフィによるパターンニング化によ
り、第１図（ｄ）に示すように、フォトレジストによる
レジストフレーム16が形成される。レジストフレーム16
は、従来と同様に、その内側に形成されるパターン161
が、最終的に得ようとする上部磁性膜４のポールパター
ンとなるように形成する。By this patterning by photolithography, a resist frame 16 of photoresist is formed as shown in FIG. Resist frame 16
Is a pattern 161 formed on the inside thereof, as in the prior art.
Is formed so as to form a pole pattern of the upper magnetic film 4 to be finally obtained.
次に第１図（ｅ）に示すように、レジストフレーム16
をマスクとして、その内外のメッキ下地膜10上にパター
ンメッキ18を施す。パターンメッキ18のうち、レジスト
フレーム16の内側に位置する部分が上部磁性膜４のパタ
ーンとなるもので、ポール部181及びヨーク部182を有す
るパーマロイ等の磁性薄膜として形成される。ここで、
ポール部181の形成される磁気ギャップ膜３上のメッキ
下地膜10及びヨーク部182の形成される絶縁膜６上のメ
ッキ下地膜10が、レジスト膜19の表面に形成されたメッ
キ下地膜10を介して連続し、断線を生じていない。この
ため、ポール部181及ヨーク部182のパターンメッキ組成
が均一化される。Next, as shown in FIG.
Is used as a mask to apply pattern plating 18 on the inner and outer plating base films 10. The portion of the pattern plating 18 located inside the resist frame 16 becomes the pattern of the upper magnetic film 4 and is formed as a magnetic thin film such as permalloy having a pole portion 181 and a yoke portion 182. here,
The plating base film 10 on the magnetic gap film 3 where the pole part 181 is formed and the plating base film 10 on the insulating film 6 where the yoke part 182 is formed are the same as the plating base film 10 formed on the surface of the resist film 19. And no disconnection has occurred. For this reason, the pattern plating composition of the pole portion 181 and the yoke portion 182 is made uniform.
この後、第４図（ｆ）〜（ｉ）と同様の工程を通すこ
とにより、パターンメッキによる上部磁性膜４が得られ
る。Thereafter, the upper magnetic film 4 is obtained by pattern plating by performing the same steps as in FIGS. 4 (f) to 4 (i).
＜発明の効果＞ 以上述べたように、本発明は、ポール部において磁気
ギャップ膜と基板との間に生じる段差を埋めるレジスト
膜を付与し、次にレジスト膜、磁気ギャップ膜及び絶縁
膜の表面にメッキ下地膜を形成し、その後、上部磁性膜
のパターンニング化及パターンメッキを行なうことによ
り、上部磁性膜のポール部及びヨーク部の組成を均一化
し、狭トラック化した場合でも、ウイグルの発生を防止
し得る薄膜磁気ヘッドを製造できる。<Effects of the Invention> As described above, the present invention provides a resist film that fills a step formed between a magnetic gap film and a substrate in a pole portion, and then provides a resist film, a magnetic gap film, and a surface of an insulating film. By forming a plating underlayer on the upper surface and then patterning and patterning the upper magnetic film, the composition of the pole and yoke portions of the upper magnetic film is made uniform, and even if the track is narrowed, wiggles are generated. Can be manufactured.
第１図（ａ）〜（ｅ）は媒体摺動面側である正面から見
た本発明に薄膜磁気ヘッドの製造方法における工程の要
部を示す図、第２図（ａ）、（ｂ）は同じく全体の部分
破断面図、第３図は従来より知られた面内記録再生用の
薄膜磁気ヘッドの要部における斜視図、第４図は薄膜磁
気ヘッドの要部構造を示す断面図、第５図（ａ）〜
（ｐ）は媒体摺動面側から見た従来の薄膜磁気ヘッドの
製造工程を示す図、第６図（ａ）〜（ｃ）は側面から見
た従来の薄膜磁気ヘッドの製造工程の要部における断面
図、第７図は同じく正面から見た全体の部分破断面図、
第８図は従来の問題点を示す図である。 １……基板、２……下部磁性膜 ３……磁気ギャップ膜 ４……上部磁性膜、５……導体コイル膜 ６……絶縁膜 ９、10……メッキ下地膜 12、16……フォトレジスト膜 19……レジスト膜 21……下部磁性膜のポール部 22……下部磁性膜のヨーク部 41……上部磁性膜のポール部 42……上部磁性膜のヨーク部FIGS. 1 (a) to 1 (e) are views showing a main part of a process in a method of manufacturing a thin film magnetic head according to the present invention as viewed from the front side which is a medium sliding surface side, and FIGS. 2 (a) and 2 (b). FIG. 3 is a partially cutaway view of the whole, FIG. 3 is a perspective view of a main part of a conventionally known thin-film magnetic head for in-plane recording and reproduction, FIG. 4 is a cross-sectional view showing a main part structure of the thin-film magnetic head, Fig. 5 (a)-
(P) is a view showing a manufacturing process of the conventional thin-film magnetic head viewed from the medium sliding surface side, and FIGS. 6 (a) to (c) are main parts of the manufacturing process of the conventional thin-film magnetic head viewed from the side. , FIG. 7 is a partially broken cross-sectional view of the same as viewed from the front,
FIG. 8 is a diagram showing a conventional problem. DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Lower magnetic film 3 ... Magnetic gap film 4 ... Upper magnetic film 5 ... Conductor coil film 6 ... Insulating film 9, 10 ... Plating base film 12, 16 ... Photoresist Film 19: Resist film 21: Pole portion of lower magnetic film 22: Yoke portion of lower magnetic film 41: Pole portion of upper magnetic film 42: Yoke portion of upper magnetic film
Claims (1)
部磁性膜、磁気ギャップ膜、絶縁膜及び導体コイル膜を
積層した後、前記ポール部において前記磁気ギャップ膜
の表面と基板面との間に生じる段差を埋めるようレジス
ト膜を付与し、次に前記レジスト膜、磁気ギャップ膜及
び絶縁膜の表面で連続するようメッキ下地膜を形成し、
次に前記メッキ下地膜の上にフォトレジストを付着さ
せ、前記フォトレジストをフォトリソグラフィによって
パターンニング化し、次にパターンメッキを行なって、
前記下部磁性膜のポール部と前記磁気ギャップ膜を介し
て対向するポール部及び前記下部磁性膜のヨーク部と磁
気結合されるヨーク部を有する上部磁性膜を形成するこ
とを特徴とする薄膜磁気ヘッドの製造方法。After laminating a lower magnetic film having a pole portion and a yoke portion on a substrate, a magnetic gap film, an insulating film, and a conductor coil film, the surface of the magnetic gap film and the substrate surface at the pole portion are stacked. A resist film is provided so as to fill a step generated therebetween, and then a plating base film is formed so as to be continuous on the surface of the resist film, the magnetic gap film and the insulating film,
Next, a photoresist is deposited on the plating base film, the photoresist is patterned by photolithography, and then pattern plating is performed.
A thin film magnetic head comprising an upper magnetic film having a pole portion facing the pole portion of the lower magnetic film via the magnetic gap film and a yoke portion magnetically coupled to a yoke portion of the lower magnetic film. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534088A JP2656064B2 (en) | 1988-04-18 | 1988-04-18 | Method for manufacturing thin-film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534088A JP2656064B2 (en) | 1988-04-18 | 1988-04-18 | Method for manufacturing thin-film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01267812A JPH01267812A (en) | 1989-10-25 |
| JP2656064B2 true JP2656064B2 (en) | 1997-09-24 |
Family
ID=14134968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9534088A Expired - Lifetime JP2656064B2 (en) | 1988-04-18 | 1988-04-18 | Method for manufacturing thin-film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2656064B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7199972B2 (en) | 2001-08-31 | 2007-04-03 | Hitachi Global Storage Technologies Netherlands, B.V. | Narrow write head pole tip fabricated by sidewall processing |
-
1988
- 1988-04-18 JP JP9534088A patent/JP2656064B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01267812A (en) | 1989-10-25 |
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