JP2635847B2 - Large current circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-current circuit board used for a power supply circuit and the like.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional large current circuit board is composed of a pair of large current circuit conductors 2A, 2A,
This is a structure in which B is fixed with a necessary insulation interval. The large current circuit conductors 2A and 2B are relatively wide and thick, formed by punching from a copper plate or the like. The large current circuit conductors 2A, 2B are fixed to the insulating substrate 1 by bonding or soldering (a soldering copper foil pattern having the same pattern as the large current circuit conductor is integrally provided on the insulating substrate 1 in advance). Done. Reference numeral 3 denotes a through-hole on which components and the like are mounted. Although not shown, a small current circuit conductor for signals may be provided in addition to the through-hole.

[0003]

In a conventional large current circuit board, a pair of large current circuit conductors 2A and 2B are arranged at an interval, so that an alternating current or a direct current including an alternating current component is supplied thereto. When flowing, the inductance is large, and in an inverter circuit for driving a motor or the like, there is a case where an increase in impedance due to the inductance is a problem.

[0004]

SUMMARY OF THE INVENTION The present invention provides a high-current circuit board which solves the above-mentioned problems, and comprises a high-current circuit board having at least a pair of high-current circuit conductors on an insulating substrate. Large current circuit that forms a pair on a circuit board
Put the middle part of the conductor in the same pattern,
Formed in emissions, and the one of the large-current circuit conductors of paired large current circuit conductors directly fixed to the insulating substrate, the intermediate portion of the one large-current circuit conductor intermediate the other high-current circuit conductor And is fixed on the portion with an insulating layer interposed therebetween.

[0005]

In this manner, the two plate-like large current circuit conductors are vertically overlapped and the distance between the conductors is greatly reduced, so that the inductance can be reduced. It is desirable that the insulating layer be wider than the large current circuit conductor, and that both sides protrude from both side edges of the large current circuit conductor. In this way, the interval can be further reduced while ensuring insulation between the two large current circuit conductors.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. In this large current circuit board, the middle portions of the large current circuit conductors 2A and 2B forming a pair are formed in the same pattern, and both ends are formed in different patterns. 2A is fixed by the same manner as conventional means, the high current circuit conductors 2A
Insulating plate 4 on the intermediate portion is bonded and fixed, the intermediate portion of the other high-current circuit conductors 2B is a bonded structure thereon.

The insulating layer 4 is formed in substantially the same pattern as the middle portion of the large current circuit conductors 2A, 2B, but is wider than the large current circuit conductors 2A, 2B, and has both sides of the large current circuit conductors 2A, 2B. It is arranged so as to protrude from both side edges. By doing so, the creepage distance for insulation can be increased after the large current circuit conductors 2A and 2B are sufficiently close to each other, which is effective in reducing the inductance. It is preferable that both ends of the large current circuit conductor 2B on the upper side bend downward and be fixed to the insulating substrate 1 as shown in FIG.

[0008]

As described above, the large current circuit board according to the present invention has a structure in which the middle portions of the large current circuit conductors forming a pair are vertically stacked with an insulating plate interposed therebetween. Since the interval between the current circuit conductors can be made much smaller than in the past, and thus the inductance can be made smaller, the impedance when an AC current or a DC current including an AC component flows can be made smaller. In addition, large current circuit conductors on insulating substrates
Since the occupied area can be reduced, the circuit board can be downsized or
The degree of freedom in circuit pattern design can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view of a large current circuit board according to one embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along line AA of FIG.

FIG. 3 is an enlarged sectional view taken along line BB of FIG. 1;

FIG. 4 is a plan view of a conventional large current circuit board.

[Explanation of symbols]

1: Insulating substrate 2A, 2B: High current circuit conductor 3:
Through hole 4: Insulation layer

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masamichi Yajima 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd. (56) References JP-A-60-180186 (JP, A) JP-A Sho 60-257191 (JP, A) Hikaru 2-120861 (JP, U)

Claims (2)

(57) [Claims] 1. A large-current circuit board having at least a pair of high-current circuit conductor on an insulating substrate, a pair DAIDEN
The middle part of the flow circuit conductor has the same pattern and both ends are different
Was formed in a pattern, and wherein one of the large-current circuit conductors of paired large current circuit conductors directly fixed to the insulating substrate, the intermediate portion of the one large-current circuit conductor intermediate the other high-current circuit conductor large-current circuit board, characterized in that fixed overlapped via an insulating layer on parts. 2. The large current circuit board according to claim 1, wherein the insulating layer is wider than the large current circuit conductor, and both sides protrude from both side edges of the large current circuit conductor.