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JP2630314B2 - Liquid crystal device - Google Patents

Liquid crystal device

Info

Publication number
JP2630314B2
JP2630314B2 JP7315649A JP31564995A JP2630314B2 JP 2630314 B2 JP2630314 B2 JP 2630314B2 JP 7315649 A JP7315649 A JP 7315649A JP 31564995 A JP31564995 A JP 31564995A JP 2630314 B2 JP2630314 B2 JP 2630314B2
Authority
JP
Japan
Prior art keywords
terminal
liquid crystal
crystal device
flexible printed
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7315649A
Other languages
Japanese (ja)
Other versions
JPH08213721A (en
Inventor
誠 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP7315649A priority Critical patent/JP2630314B2/en
Publication of JPH08213721A publication Critical patent/JPH08213721A/en
Application granted granted Critical
Publication of JP2630314B2 publication Critical patent/JP2630314B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は特に高密度、多端子
のLCDパネル実装等に利用するフレキシブルプリント
基板(以下FPCと略す)及び液晶装置に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (hereinafter abbreviated as "FPC") and a liquid crystal device which are used for mounting a high-density, multi-terminal LCD panel.

【0002】[0002]

【従来の技術】従来、FPCの接続端子群は液晶パネル
の外部回路との接続用の端子取出部と相対向して形成さ
れ、電気的接続がなされていた。
2. Description of the Related Art Conventionally, a group of connection terminals of an FPC is formed so as to face a terminal extraction portion for connection to an external circuit of a liquid crystal panel, and electrical connection is made.

【0003】[0003]

【発明が解決しようとする課題】従来のFPCは全端子
が有効接続端子として使用されていたため、FPCのベ
ースフィルムと例えばガラス基板の熱膨張係数の違いに
よる応力が生じた場合、最外端の接続端子が断線を起こ
し、即座に欠陥を引き起こしてしまう欠点があった。そ
こで、本発明では応力等による断線を防止し、接続信頼
性の高いFPC及び液晶装置を得ることを目的としてい
る。
In the conventional FPC, all terminals are used as effective connection terminals. Therefore, when a stress is generated due to a difference in thermal expansion coefficient between the base film of the FPC and, for example, a glass substrate, the outermost end of the FPC is not used. There is a drawback that the connection terminal is disconnected and causes a defect immediately. Therefore, an object of the present invention is to prevent disconnection due to stress or the like and obtain an FPC and a liquid crystal device with high connection reliability.

【0004】[0004]

【課題を解決するための手段】本発明の液晶装置は、少
なくとも一方の面に、外部回路と接続するための端子取
出部を有する液晶パネル基板と、LSIチップが搭載さ
れ、前記端子取出部と電気的接するための端子部及び前
記端子部の外側に形成されたダミーパターンを具備し、
前記端子部及び前記ダミーパターンと前記端子取出部と
の間に異方性導電膜を介在させ、前記異方性導電膜を介
して前記端子部と前記端子取出部との電気的接続がなさ
れたフレキシブルプリント基板と、を有する液晶装置で
あって、前記フレキシブルプリント基板はその全体が前
記液晶パネル基板上に配置され、前記液晶パネル基板と
前記フレキシブルプリント基板とは複数箇所で前記異方
性導電膜を介しての前記端子部と前記端子取出部の電気
的接続がなされていることを特徴とする液晶装置。
The liquid crystal device of the present invention has a small
At least one side should have a terminal for connecting to an external circuit.
LCD panel substrate with protrusion and LSI chip mounted
And a terminal part for electrical contact with the terminal extraction part and a front part.
A dummy pattern formed outside the terminal portion;
The terminal portion and the dummy pattern and the terminal extraction portion
An anisotropic conductive film is interposed between the
Electrical connection between the terminal portion and the terminal extraction portion.
Liquid crystal device having a flexible printed circuit board
The flexible printed circuit board is entirely
The liquid crystal panel substrate is disposed on the liquid crystal panel substrate,
The flexible printed circuit board and the anisotropic
Of the terminal portion and the terminal take-out portion via the conductive film
A liquid crystal device, characterized in that the liquid crystal device is electrically connected.

【0005】[0005]

【0006】[0006]

【発明の実施の形態】〔実施例〕 図1は本発明の基本構成を示す図である。本実施例を図
面に基づいて説明すると図1はFPCベースフィルム側
からみたものであり、図2はその断面図である。1は液
晶パネルの端子取出部、2は異方性導電膜、3はベース
フィルム、4は有効接続端子、5はダミー端子である。
FIG. 1 is a diagram showing a basic configuration of the present invention. This embodiment will be described with reference to the drawings. FIG. 1 is a view from the FPC base film side, and FIG. 2 is a cross-sectional view thereof. 1 is liquid
Lead out terminals of the LCD panel, 2 anisotropic conductive film, the 3 base film, 4 is valid connection terminal, 5 is a dummy terminal.

【0007】このようにダミー端子5を設けた場合に
は、ベースフィルム3と液晶パネル端子取出部の熱膨張
係数の違いによりせん断応力が生じても、最外端のダミ
ー端子5に負荷がかかり内側の有効接続端子4には負荷
がかからない。また、補強部材であるダミー端子を有効
接続端子と同一材質としたことにより、工程を増やすこ
となく容易に補強ができる。その上、材質の違いによる
ストレスの影響を最小にできるという効果を有してい
る。
When the dummy terminals 5 are provided in this manner, even if a shear stress is generated due to a difference in the thermal expansion coefficient between the base film 3 and the liquid crystal panel terminal extraction portion, a load is applied to the outermost dummy terminals 5. No load is applied to the inner effective connection terminal 4. Further, since the dummy terminal as the reinforcing member is made of the same material as the effective connection terminal, the reinforcement can be easily performed without increasing the number of steps. In addition, it has the effect of minimizing the effect of stress due to differences in materials.

【0008】図3は図7及び図2における圧着時におけ
る効果を説明する図であり、図1は本発明の基本構成を
示す図であり、ヒーターヘッド6により熱圧着される状
態を示している。ヒーターヘッド6の平坦度が理論的平
面で平行に押された場合には、端部、中央部共に同一で
あると考えられるが、ヒーターヘッド6が熱変形で凹面
となる場合では端部端子に応力が集中して電気的安定接
続を難しくする。このような場合でもダミー端子5a、
5b、5cが存在すれば内部の有効接続端子部の外側両
端部も中心部と同じような接続が可能となり、有効接続
端子部の全面において圧着性が増大するという効果を有
する。
FIG . 3 is a view showing the state of crimping in FIGS. 7 and 2.
FIG. 1 is a diagram for explaining the effect of the present invention.
FIG. 3 is a diagram showing a state in which thermocompression bonding is performed by a heater head 6. When the flatness of the heater head 6 is pressed in parallel on the theoretical plane, it is considered that both ends and the center are the same. However, when the heater head 6 is concave due to thermal deformation, it is connected to the end terminal. Stress concentrates and makes electrical stable connection difficult. Even in such a case, the dummy terminal 5a,
If 5b and 5c are present, the outer both ends of the internal effective connection terminal can be connected in the same manner as the central portion, and the crimping property can be increased over the entire surface of the effective connection terminal.

【0009】図4はダミー端子5a,5b,5cの代わ
りにFPC上のレジスト材7で同様の機能を持たせたも
のである。
FIG. 4 shows a structure in which a resist material 7 on an FPC has a similar function in place of the dummy terminals 5a, 5b and 5c.

【0010】図5は図1〜3の構成を用い、LSIチッ
プをAn−Sn共晶等でFPCに接続し、有効接続端子
4と液晶パネル端子取り出し部1とを異方性導電膜2を
介して電気的接続を行った構造であり、本発明の参考例
である。
FIG . 5 shows an LSI chip using the configuration shown in FIGS.
Connected to the FPC with an An-Sn eutectic etc.
4 and the liquid crystal panel terminal take-out part 1
It is a structure in which electrical connection is made via
It is.

【0011】図6は本発明の実施例であって、液晶装置
を更に高密度実装した実施例を示す図である。LSIチ
ップ8を搭載したFPCベースフィルム3は、その全体
が端子取出部1内に収まるように配置され、異方性導電
膜2を介して端子取出部1と接続されている。図中3、
4及び5は上記実施例1と同様のものを指し、3はFP
Cベースフィルム、4は有効接続端子、5はダミー端子
である。図1は実施例1と同様に本実施例の液晶装置を
FPCベースフィルム3の上方側から見た図であり、図
2はその断面図、図3は本実施例における圧着時の効果
を示す図である。本実施例においては、図1及び図2か
らわかるように、有効接続端子4の外側にダミー端子5
が設けられている。
FIG . 6 shows an embodiment of the present invention.
FIG. 3 is a diagram showing an embodiment in which is further mounted at a high density. LSI chip
FPC base film 3 equipped with
Are arranged so as to fit within the terminal extraction section 1 and are anisotropically conductive.
It is connected to the terminal extraction unit 1 via the membrane 2. 3,
4 and 5 are the same as in the first embodiment, and 3 is FP
C base film, 4 is an effective connection terminal, 5 is a dummy terminal
It is. FIG. 1 shows the liquid crystal device of this embodiment as in the first embodiment.
FIG. 3 is a view seen from above the FPC base film 3,
2 is a cross-sectional view thereof, and FIG. 3 is an effect at the time of crimping in this embodiment.
FIG. In this embodiment, FIGS.
As can be seen, the dummy terminal 5 is located outside the effective connection terminal 4.
Is provided.

【0012】図5及び図6の実装構造においては、有効
接続端子4の外側に設けられたダミー端子5によって、
基板とFPCベースフィルムとの接続が補強される。多
端子、多チップを有する液晶装置の場合には、箇々の接
続を実施例1又は2に示した方法で行い安定させること
により、累乗的に歩留まりを向上させることができる。
In the mounting structure shown in FIGS.
By the dummy terminal 5 provided outside the connection terminal 4,
The connection between the substrate and the FPC base film is reinforced. Many
In the case of a liquid crystal device with terminals and multiple chips,
The connection is stabilized by the method described in Example 1 or 2.
Thereby, the yield can be improved in a power-wise manner.

【0013】[0013]

【発明の効果】本発明によれば、導電パターンに加えて
パネル端子部とフレキシブルプリント基板の端子部との
電気的接続に寄与しないダミーパターンが前記フレキシ
ブルプリント基板における前記導電パターンの外側に配
置されたことにより、端子部外側端部のストレス等によ
る断線を防止し、接続信頼性の高い電気的接続構造を有
する液晶装置が得られる。特に、本発明における実装構
造は、入力側と出力側の両方が形成される多端子となる
高密度な実装にも関わらず安定した電気的接続が得られ
る。さらには、フレキシブルプリント基板はその全体が
基板の端子取出部内に配置され基板とフレキシブルプリ
ント基板とは複数箇所で異方性導電膜を介して圧着がな
されているため、例えば、液晶駆動用回路素子の入力側
端子及び出力側端子の両方に対応する端子が形成された
フレキシブルプリント基板と、液晶駆動用回路素子の入
力側端子及び出力側端子の両方に対応する導電パターン
が形成された基板と、の電気的接続をする高密度実装を
非常に安定に行うことができる。
According to the present invention, in addition to the conductive pattern, a dummy pattern which does not contribute to the electrical connection between the panel terminal and the terminal of the flexible printed board is arranged outside the conductive pattern on the flexible printed board. As a result, disconnection due to stress or the like at the outer end of the terminal portion can be prevented, and a liquid crystal device having an electrical connection structure with high connection reliability can be obtained. In particular, in the mounting structure according to the present invention, stable electrical connection can be obtained despite high-density mounting in which multiple terminals are formed on both the input side and the output side. Furthermore, flexible printed circuit boards are
The board and the flexible printed circuit are placed in the terminal
Pressure bonding with a printed circuit board at multiple locations via an anisotropic conductive film.
For example, the input side of the liquid crystal drive circuit element
Terminals corresponding to both terminals and output terminals are formed
Including flexible printed circuit boards and circuit elements for driving liquid crystal
Conductive patterns for both input and output terminals
High-density mounting for electrical connection with the substrate on which
It can be performed very stably.

【0014】[0014]

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の基本構成を示す図。 FIG. 1 is a diagram showing a basic configuration of the present invention.

【図2】本発明の実施例の断面図。FIG. 2 is a sectional view of an embodiment of the present invention.

【図3】本発明に圧着工程図。FIG. 3 is a pressure bonding process diagram according to the present invention.

【図4】本発明のダミー端子5をレジスト材7に置き換
えた図。
FIG. 4 is a diagram in which a dummy terminal 5 of the present invention is replaced with a resist material 7;

【図5】本発明の参考例を示す図。 FIG. 5 is a diagram showing a reference example of the present invention.

【図6】本発明の実施例を示す図。 FIG. 6 is a diagram showing an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1.液晶パネル端子取出部 2.異方性導電膜 3.ベースフィルム 4.有効接続端子 5.ダミー端子 6.ヒーターヘッド 7.レジスト材 8.LSIチップ 1. LCD panel terminal extraction section 2. 2. Anisotropic conductive film Base film 4. Effective connection terminal 5. Dummy terminal 6. Heater head 7. Resist material 8. LSI chip

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】少なくとも一方の面に、外部回路と接続す
るための端子取出部を有する液晶パネル基板と、 LSIチップが搭載され、前記端子取出部と電気的接す
るための端子部及び前記端子部の外側に形成されたダミ
ーパターンを具備し、前記端子部及び前記ダミーパター
ンと前記端子取出部との間に異方性導電膜を介在させ、
前記異方性導電膜を介して前記端子部と前記端子取出部
との電気的接続がなされたフレキシブルプリント基板
と、を有する液晶装置であって、 前記フレキシブルプリント基板はその全体が前記液晶パ
ネル基板上に配置され、前記液晶パネル基板と前記フレ
キシブルプリント基板とは複数箇所で前記異方性導電膜
を介しての前記端子部と前記端子取出部の電気的接続が
なされていることを特徴とする液晶装置。
At least one surface is connected to an external circuit.
A liquid crystal panel substrate having a terminal extracting portion for mounting the same and an LSI chip , and electrically contacting the terminal extracting portion
Terminal formed on the outer side of the terminal portion
A terminal pattern and the dummy pattern
Anisotropic conductive film is interposed between the terminal and the terminal extraction portion,
The terminal portion and the terminal extraction portion via the anisotropic conductive film
Flexible printed circuit board with electrical connection to
When, a liquid crystal device having the flexible printed circuit board in its entirety the liquid path
The liquid crystal panel substrate and the frame.
The anisotropic conductive film at a plurality of locations
Electrical connection between the terminal portion and the terminal extraction portion through
A liquid crystal device characterized by being made.
JP7315649A 1995-12-04 1995-12-04 Liquid crystal device Expired - Lifetime JP2630314B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7315649A JP2630314B2 (en) 1995-12-04 1995-12-04 Liquid crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7315649A JP2630314B2 (en) 1995-12-04 1995-12-04 Liquid crystal device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4159443A Division JP2652107B2 (en) 1992-06-18 1992-06-18 Electrical connection structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP8266095A Division JP2845219B2 (en) 1996-10-07 1996-10-07 Electrical connection structure and liquid crystal device

Publications (2)

Publication Number Publication Date
JPH08213721A JPH08213721A (en) 1996-08-20
JP2630314B2 true JP2630314B2 (en) 1997-07-16

Family

ID=18067916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7315649A Expired - Lifetime JP2630314B2 (en) 1995-12-04 1995-12-04 Liquid crystal device

Country Status (1)

Country Link
JP (1) JP2630314B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007046428A1 (en) * 2007-09-28 2009-04-09 Siemens Home And Office Communication Devices Gmbh & Co. Kg Connection foil and electrical connection
JP5863106B2 (en) 2012-01-27 2016-02-16 ミネベア株式会社 Motor control device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536881A (en) * 1976-07-09 1978-01-21 Hitachi Ltd Flexible printed board having connecting terminal for connecting by multiple soldering connection method
JPS5822224U (en) * 1981-07-31 1983-02-10 遠州製作株式会社 Tool change arm safety device
JPS5834488A (en) * 1981-08-26 1983-02-28 株式会社リコー Liquid crystal display
JPS60170176A (en) * 1984-02-10 1985-09-03 ソニ−ケミカル株式会社 Connecting structure with transparent conductive film

Also Published As

Publication number Publication date
JPH08213721A (en) 1996-08-20

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