JP2610620B2 - Resin composition with excellent heat and solvent resistance - Google Patents

Description

The present invention relates to a novel resin composition having excellent heat resistance, moldability, and solvent resistance. More specifically, the present invention relates to (A) polyphenylene ether. Modifier selected from organic compounds having (a) an ethylenic double bond and (b) a carboxyl group or an acid anhydride group in the molecule, which is obtained by modification in the presence or absence of a radical initiator. The present invention relates to a resin composition comprising a modified polyphenylene ether, (B) polyphenylene sulfide, and (C) an organic compound having at least two epoxy groups in a molecule, and having excellent heat resistance and solvent resistance.

[Conventional technology]

Polyphenylene ether is a resin excellent in heat resistance, rigidity, electrical characteristics, and the like, and is a polymer material useful as an engineering plastic. However, it is well known that polyphenylene ether has a major drawback of poor solvent resistance and poor moldability.

On the other hand, polyphenylene sulfide is known as a resin having excellent heat resistance, solvent resistance, electrical properties, mechanical strength, dimensional stability, flame retardancy, and the like, and has been receiving attention in recent years. In particular, polyphenylene sulfide can improve the above performance by compounding with a fibrous reinforcing material such as glass fiber and carbon fiber, and an inorganic filler such as talc, clay and silica. Used for parts, etc. However, polyphenylene sulfide has disadvantages such as a low degree of polymerization, difficulty in molding, lacking toughness and brittleness, and polyphenylene sulfide reinforced with glass fiber, which tends to cause warpage in molded articles.

As a technique for improving the processability of polyphenylene ether, for example, Japanese Patent Publication No. 56-34032 discloses blending polyphenylene sulfide. However, although the effect of improving the moldability is observed, the compatibility between polyphenylene ether and polyphenylene sulfide is poor, so that there have been problems such as poor appearance and reduced mechanical properties.

Further, as a technique for improving the compatibility between polyphenylene ether and polyphenylene sulfide, the use of an epoxy resin is disclosed in JP-B-60-11063. However, although the effect of improving the compatibility is seen to some extent, it is not sufficient, and the mechanical properties, solvent resistance and the like are not satisfactory.

[Problems to be solved by the present invention]

The problems to be solved by the present invention are as follows: when blending polyphenylene ether and polyphenylene sulfide, the mechanical properties, the solvent resistance, the heat resistance properties, etc. of the material caused by the intrinsic poor compatibility between the two. The purpose is to prevent reduction.

By solving this point, it becomes possible to create a material excellent in solvent resistance, mechanical performance, heat resistance, and moldability, which cannot be found in the prior art.

[Means for solving the problem]

That is, the present invention relates to (A) a polyphenylene ether, which is a modifier selected from organic compounds having (a) an ethylenic double bond and (b) a carboxyl group or an acid anhydride group in a molecule; A modified polyphenylene ether obtained by modification in the presence or absence,
A novel resin composition comprising (B) polyphenylene sulfide and (C) an organic compound having at least two epoxy groups in a molecule and having excellent solvent resistance and heat resistance.

The polyphenylene ether used in the resin composition of the present invention is a polyphenylene ether obtained by polycondensing one or more monocyclic phenols represented by the general formula (I); (Here, R ₁ is a lower alkyl group having 1 to 3 carbon atoms, R ₂ and R ₃ are a hydrogen atom or a lower alkyl group having 1 to 3 carbon atoms, and at least one of the hydroxyl groups has a lower alkyl group at the ortho position. Substituents must be present.) Includes graft copolymers having polyphenylene ether at the base obtained by graft polymerization of a vinyl aromatic compound to a len ether. The polyphenylene ether may be a homopolymer or a copolymer.

Examples of the monocyclic phenol represented by the general formula (I) include, for example, 2,6-dimethylphenol, 2,6-diethylphenol, 2,6-dipropylphenol, 2-methyl-6-ethylphenol, -Methyl-6-propylphenol, 2-ethyl-6-propylphenol, m-
Cresol, 2,3-dimethylphenol, 2,3-diethylphenol, 2,3-dipropylphenol, 2-methyl-3-ethylphenol, 2-methyl-3-propylphenol, 2-ethyl-3-methylphenol 2-ethyl-3-propylphenol, 2-propyl-3-methylphenol, 2-propyl-3-ethylphenol, 2,3,6-trimethylphenol, 2,3,6-triethylphenol, 2,3, 6-tripropylphenol, 2,6-dimethyl-3-ethyl-phenol, 2,6-dimethyl-3
-Propyl phenol and the like. Examples of polyphenylene ethers obtained by polycondensation of one or more of these phenols include poly (2,6-dimethyl-1,4-phenylene) ether and poly (2,6-diethyl-1,4 -Phenylene) ether, poly (2,6-dipropyl-1,4-phenylene) ether, poly (2-methyl-
6-ethyl-1,4-phenylene) ether, poly (2-
Methyl-6-propyl-1,4-phenylene) ether,
Poly (2-ethyl-6-propyl-1,4-phenylene)
Ether, 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer, 2,6-dimethylphenol / 2,3,
6-triethylphenol copolymer, 2,6-diethylphenol / 2,3,6-trimethylphenol copolymer, 2,6-
Dipropylphenol / 2,3,6-trimethylphenol copolymer, poly (2,6-dimethyl-1,4-phenylene) ether, graft copolymer of styrene,
A graft copolymer obtained by graft-polymerizing styrene to a 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer is exemplified. In particular, poly (2,6-dimethyl-1,4
-Phenylene) ether, 2,6-dimethylphenol / 2,
3,6-trimethylphenol copolymer and the like are preferable as the polyphenylene ether used in the present invention, and in particular, 2,6
-Dimethylphenol / 2,3,6-trimethylphenol copolymer is most preferred.

Next, the "denaturing agent" of polyphenylene ether includes (a) an ethylenic double bond and (b) a carboxyl group in the molecule.
Or an organic compound having an acid anhydride group, specifically, an α, β-unsaturated dicarboxylic acid exemplified by maleic acid, chloromaleic acid, citraconic acid, itaconic acid and the like;
Unsaturated monocarboxylic acids exemplified by acrylic acid, branic acid, crotonic acid, vinyl acetic acid, methacrylic acid, pentenoic acid, angelic acid and the like; acid anhydrides of these α, β-unsaturated dicarboxylic acids and unsaturated monocarboxylic acids Things can be mentioned. Among these, preferred are maleic acid, acrylic acid, methacrylic acid, and maleic anhydride, and more preferred is maleic anhydride.

The modified polyphenylene ether used in the present invention is prepared by the following method, but is not particularly limited thereto. For example, the modified polyphenylene ether is prepared by mixing the polyphenylene ether and the modifier with a roll mill, a Banbury mixer, an extruder, or the like.
Melt-kneading at a temperature of ~ 350 ° C, prepared by reacting, also prepared by heating and reacting polyphenylene ether and a modifier in a solvent exemplified by benzene, toluene, xylene, etc. You may. In order to facilitate the denaturation reaction, an organic peroxide such as benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, t-butyl peroxybenzoate, or azobisisobutyro is used in the reaction system. It is effective to have a radical initiator represented by an azo compound exemplified by nitrile, azobisisovaleronitrile and the like. A more practical modification method is a method of melt-kneading in the presence of a radical initiator.

The polyphenylene sulfide of the present invention has the general formula At least 70 mol%, more preferably
It is a polymer containing 90 mol% or more, and if the repeating unit is less than 70 mol%, it is difficult to obtain a composition having specific properties. As a polymerization method for obtaining this polymer, various known methods can be adopted, and sodium sulfide and p-dichlorobenzene are mixed with an amide solvent such as N-methylpyrrolidone and dimethylacetamide or a sulfone solvent such as sulfolane. Is preferred. At this time, it is preferable to add an alkali metal carboxylate such as sodium acetate or lithium acetate in order to adjust the degree of polymerization. Less than 30 mol% as a copolymer component, and a meta bond within a range that does not affect the crystallinity of the polymer. Ether bond Sulfone bond Biphenyl bond Substituted phenyl sulfide bond Where R represents an alkyl, nitro, phenyl or alkoxy group) trifunctional phenyl sulfide bond And the like, but the copolymer component is preferably less than 10 mol%.

Further, the organic compound having at least two epoxy groups in the molecule, which is the component (C), used in the resin composition of the present invention, is defined as having two or more epoxy groups directly on an aliphatic or aromatic group, or , Esters, and compounds linked by amino groups and the like.

Typical examples of this compound include glycidyl alcohol,
Condensates of glycidyl compounds such as epichlorohydrin with polyhydric alcohols, polyphenols, bisphenols, polycarboxylic acids, isocyanuric acids or amines, as well as polymers such as glycidyl methacrylate.

Specific examples of the condensate of a glycidyl compound and a polyhydric alcohol include ethylene glycol diglycidyl ether,
Propylene glycol diglycidyl ether, butanediol diglycidyl ether, pentanediol diglycidyl ether, hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, trimethylpropane polyglycidyl ether, pentaerythritol polyglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene Glycol diglycidyl ether, polytetramethylene glycol diglycidyl ether, etc .; specific examples of condensates of glycidyl compounds and polyvalent phenols include resorcin diglycidyl ether, pyrogallol polyglycidyl ether, etc .; condensates of epichlorohydrin and bisphenols Examples of bisphenol A diglycidyl ether, bisphenol Diglycidyl ether, bisphenol F diglycidyl ether, and epoxy resins, which are polymers thereof; specific examples of condensates of glycidyl compounds and polycarboxylic acids include phthalic acid diglycidyl ester and terephthalic acid Diglycidyl ester, diglycidyl isophthalate, naphthalene-1,4-dicarboxylic acid diglycidyl ester, naphthalene-1,5-dicarboxylic acid diglycidyl ester, naphthalene-2,6-dicarboxylic acid diglycidyl ester, diglycidyl succinate Esters, diglycidyl adipate, diglycidyl succinate and the like; specific examples of condensates of glycidyl compounds and amines include N, N-
Diglycidylbenzylamine, N, N'-diglycidylmethaxylenediamine, N, N, N ', N'-tetraglycidylmethaxylenediamine, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, etc. Specific examples of the condensate of the glycidyl compound and isocyanuric acid include triglycidyl tris (2-hydroxyethyl) isocyanurate. These glycidyl ethers, esters and amines can be obtained by using allyl alcohol, allyl chloride or the like instead of the glycidyl compound, and further oxidizing the double bond with peracetic acid or the like. Further, in addition to the above-mentioned bisphenol-type epoxy resin, an ethoxyphenol novolak resin, an epoxy cresol novolak resin, and the like can also be mentioned as specific examples.

Among these, a condensate of a glycidyl compound and a polyhydric alcohol, a condensate of a glycidyl compound and a polyhydric phenol, a condensate of a glycidyl compound and a polycarboxylic acid, a condensate of a glycidyl compound and an amine, and a glycidyl compound It is a condensate of isocyanuric acid. More preferred is a condensate of a glycidyl compound and a polyvalent phenol,
A condensate of a glycidyl compound and a polycarboxylic acid, a condensate of a glycidyl compound and an amine, and a condensate of a glycidyl compound and isocyanuric acid, the most preferable of which are those having an aromatic ring in the molecule, resorcinol Diglycidyl ether, diglycidyl phthalate, N, N, N ', N'-tetraglycidyl metaxylenediamine and the like.

Further, in the present invention, one or more organic compounds of the component (C) may be used as a mixture.

The above components (A), (B), and (C) of the present invention are compounded in the modified polyphenylene ether 5 as the component (A).
(C) with respect to 100 parts by weight of a composition comprising -95% by weight, preferably 20-80% by weight, and 5-95% by weight, preferably 20-80% by weight, of polyphenylene sulfide as the component (B). Organic compound having at least two or more epoxy groups in the molecule as a component 0.01 to 10 parts by weight, preferably 0.1 to 10 parts by weight.
Add 5 to 5 parts by weight.

The resin composition of the present invention contains tri-n-butylamine, triphenylamine, benzylmethylamine, tris (dimethylamino) in order to promote the reaction between the components.
Tertiary amines such as methylphenol; quaternary ammonium salts such as triethylbenzylammonium chloride and tetramethylammonium chloride; and catalysts represented by imidazole compounds such as 2-methyl-4-ethylimidazole and 2-methyl-imidazole are added. be able to.

Further, aromatic polycarboxylic acid compounds such as terephthalic acid and isophthalic acid; aliphatic polycarboxylic acid compounds such as oxalic acid, succinic acid, and adipine; acid anhydrides of these aromatic or aliphatic polycarboxylic acids; ethylene glycol Propylene glycol, butane-1,4-diol and the like; aliphatic polyol compounds such as hydroquinone, resorcinol and bisphenol A; aliphatic polyamine compounds such as ethylenediamine and hexamethylenediamine; m-phenylenediamine Aromatic polyamine compounds such as, p-phenylenediamine, m-xylylenediamine, p-xylylenediamine; aminobenzoic acids;
Hydroxybenzoic acids, mercaptobenzoic acids, amino alcohols, hydroxyaniline and the like can be added as a binder between the components.

The method of blending each component constituting the resin composition of the present invention is not particularly limited. For example, a method of blending and melt-kneading each component at once; melting a modified polyphenylene ether and polyphenylene sulfide in advance After kneading, a method of adding an organic compound as the component (C) and melt-kneading the mixture; melt-kneading the polyphenylene sulfide and the organic compound as the component (C), blending the modified polyphenylene ether, and then mixing again. A method of kneading and the like can be mentioned.

The temperature of melt mixing is 150-370 ° C, preferably 250-350 ° C
The melt mixing method can be performed by an extruder, a kneader, a Banbury mixer, a roll, or the like.

The resin composition of the present invention may contain, if desired, other resins;
Elastomer; various additives such as a flame retardant, a flame retardant auxiliary, a stabilizer, an ultraviolet absorber, a plasticizer, and a lubricant; a pigment, a filler, and other components can be appropriately compounded.

Examples of other resins include, for example, polystyrene resin, polycarbonate, polyester, polyamide, polysulfone, and the like.

The elastomer component is an elastomer in a general sense, for example, “Properties and
Structures of Polymers "(John Wiley & Sons, Inc.,
1960) The definition adopted on pages 71 to 78 can be cited. Elastomer has a Young's modulus at room temperature of 10 ⁵ to 10 ⁹ dynes /
cm ² (0.1 to 1020 kg / cm ³ ). Specific examples of the elastomer include an ABA ′ type elastomeric block copolymer, an ABA ′ type elastomeric block copolymer in which a double bond of a polybutadiene portion is hydrogenated, polybutadiene, polyisoprene, and the like. Copolymer of diene compound and vinyl aromatic compound, nitrile rubber, ethylene-propylene copolymer, ethylene-propylene-
Examples include diene copolymer (EPDM), thiocol rubber, polysulfide rubber, acrylic rubber, polyurethane rubber, grafted product of butyl rubber and polyethylene, polyester elastomer, polyamide elastomer and the like. In particular, an ABA 'type elastomeric block copolymer is desirable. Terminal block A of this block copolymer
And A ′ are polymerized vinyl aromatic hydrocarbon blocks, B is a polymerized conjugated diene block or a conjugated diene block in which most of the double bonds are hydrogenated, and the molecular weight of the B block is A and Desirably, it is greater than the combined molecular weight of the A 'blocks. The terminal blocks A and A 'may be the same or different, and the blocks are thermoplastic homopolymers or copolymers derived from vinylaromatic compounds whose aromatic moieties may be monocyclic or polycyclic. Examples of such vinyl aromatic compounds include:
Styrene, α-methylstyrene, vinyltoluene, vinylxylene, ethylvinylxylene, vinylnaphthalene and mixtures thereof. Central block B
Are conjugated diene-based hydrocarbons such as 1,3-butadiene, 2,3-dimethylbutadiene, isoprene and 1,3-
It is an elastomeric polymer derived from pentadiene and mixtures thereof. The molecular weight of each end block A and A 'preferably ranges from about 2,000 to about 100,000;
On the other hand, the molecular weight of the central block B is preferably about 25,000 to about
In the range of 1,000,000.

Examples of the various additives include, as examples of the flame retardant, triphenyl phosphate, tricresyl phosphate, phosphate obtained from a mixture of isopropyl phenol and phenol, bifunctional such as benzohydroquinone or bisphenol A. Phosphates, such as phosphates, derived from a hydrophobic phenol and other alcohols or phenols; decabromobiphenyl,
Brominated compounds represented by pentabromotoluene, decabromobiphenyl ether, hexabromobenzene, brominated polystyrene, and the like; nitrogen-containing compounds such as melamine derivatives; Flame retardant aids may be used, examples of which include compounds of antimony, boron, zinc or iron. Further additives include stabilizers such as sterically hindered phenols and phosphite compounds; ultraviolet absorbers exemplified by oxalic acid diamide compounds and sterically hindered amine compounds; exemplified by polyethylene wax, polypropylene wax and paraffin. Lubricants and the like. Further, pigments exemplified by titanium oxide, zinc sulfide, and zinc oxide; glass fiber, milled fiber, glass beads, asbestos, wollastonite, mica, talc, clay, charcoal, magnesium hydroxide, silica, potassium titanate Mineral fillers exemplified by fibers, diatomaceous earth, rock wool; inorganic fillers represented by aluminum or zinc flakes, or fibers of metals such as brass, aluminum zinc; organic fillers represented by carbon fibers Can be mentioned.

〔The invention's effect〕

As described above, the resin composition of the present invention has improved compatibility, excellent mechanical strength, excellent heat resistance, and extremely excellent solvent resistance. Since the heat resistance is surprisingly improved and the solvent resistance is extremely excellent, it is useful for applications such as mechanical structural materials, electric and electronic parts.

〔Example〕

Hereinafter, the polyphenylene ether-based resin composition of the present invention will be described with reference to Reference Examples, Examples, and Comparative Examples.

Reference Example 1 The limiting viscosity measured in chloroform at 25 ° C. was 0.47.
90 g of maleic anhydride was added to 3 kg of (dl / g) 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer (the ratio of 2,3,6-trimethylphenol was 5 mol%). After mixing with a Hensiel mixer, the mixture was melt-kneaded at a temperature of 300 to 320 ° C. with a twin-screw extruder to form pellets.

After dissolving 2 g of the obtained pellet in 50 ml of chloroform, 500 ml of methanol was added to this solution to precipitate a polymer. The obtained polymer was separated and dried (under reduced pressure, 80 ° C., 10 hours). The obtained sample was subjected to infrared absorption analysis, and the weight% of maleic anhydride bound to polyphenylene ether was determined using a calibration curve prepared in advance from polyphenylene ether and maleic anhydride. It was calculated and defined as the amount of maleic anhydride bonded. The amount of binding
It was 1.1% by weight.

Example 1 Maleic anhydride-modified polyphenylene ether pellets obtained in Reference Example 1 (40 parts by weight) and polyphenylene sulfide pellets [Toplen Co., Ltd.
(T-4P, melt viscosity: 2800 poise (300 ° C.)) 1 part by weight of resorcin diglycidyl ether was added to 60 parts by weight, and the mixture was melt-kneaded at 290 to 320 ° C. by a twin-screw extruder to pelletize. The obtained pellets were injection molded to obtain a 1 / 8-inch thick dumbbell piece for tensile test and a 1 / 4-inch thick test piece for measuring thermal deformation temperature. Using these test pieces, the tensile strength and the heat distortion temperature at a load of 18.6 kg were measured. Also, 4 g of the obtained pellet was subjected to Soxhlet extraction with chloroform for 16 hours. The extraction residue was vacuum dried at 80 ° C. for 24 hours to determine the ratio of the extraction residue. Further, the dumbbell pieces for a tensile test were immersed in heptane at 25 ° C. for 60 minutes, and then the presence or absence of cracks was observed.

 The above results are shown in Table 1.

In addition, a sample for scanning electron microscope observation was cut out from the test piece for heat deformation temperature measurement, the observation surface was polished, surface-treated with toluene, and then microscopically examined with a scanning electron microscope. Was. FIG. 1 shows a scanning electron microscope photograph.

Comparative Example 1 Intrinsic viscosity measured in chloroform at 25 ° C. is 0.47 dl
/ g unmodified 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer (2,3,6-trimethylphenol occupies 5 mol%) powder 40 parts by weight and polyphenylene Sulfide pellets [manufactured by Topren Co., Ltd.
Toprene T-4P, melt viscosity 2800poise (300 ℃)]
60 parts by weight and the same operation as in Example 1 was performed except that resorcin diglycidyl ether was not used.

The results are shown in Table 1. FIG. 2 shows a scanning electron micrograph, and the dispersion of each component was coarse.

Comparative Example 2 Intrinsic viscosity measured in chloroform at 25 ° C is 0.47dl
/ g unmodified 2,6-dimethylphenol / 2,3,6-trimethylphenol copolymer (2,3,6-trimethylphenol occupies 5 mol%) powder 40 parts by weight and polyphenylene Sulfide pellets [manufactured by Topren Co., Ltd.
Toprene T-4P, melt viscosity 2800poise (300 ℃)]
1 part by weight of resorcinol diglycidyl ether was added to 60 parts by weight, and after mixing, the same operation as in Example 1 was performed.

 The results are shown in Table 1.

Examples 2 to 4 The same operation as in Example 1 was carried out using the modified polyphenylene ether, polyphenylene sulfide and resorcin diglycidyl ether of Example 1 with the composition shown in Table 1.

 The results are shown in Table 1.

Comparative Examples 3 to 5 The same operation as in Example 1 was performed using the unmodified polyphenylene ether and polyphenylene sulfide of Comparative Example 1 with the compositions shown in Table 1.

 The results are shown in Table 1.

Reference Example 2 The same operation as in Reference Example 1 was performed by changing the polyphenylene ether of Reference Example 1 to a 2,6-dimethylphenol polymer having an intrinsic viscosity of 0.47 dl / g measured in chloroform at 25 ° C. Was. The binding amount of maleic anhydride was 0.8% by weight.

Example 5 50 parts by weight of maleic anhydride-modified polyphenylene ether pellets and polyphenylene sulfide pellets obtained in Reference Example 2 [Toprene Co., Ltd.
T-4P, melt viscosity 2800 poise (300 ° C.)] 1 part by weight of resorcinol diglycidyl ether was added to 50 parts by weight and mixed, and the same operation as in Example 1 was performed.

 The results are shown in Table 2.

Comparative Example 6 Intrinsic viscosity measured in chloroform at 25 ° C. is 0.47 dl
/ g of unmodified 2,6-dimethylphenol polymer powder 50
Parts by weight and pellets of polyphenylene sulfide [Co., Ltd.
Made by Toprene, Toprene T-4P, melt viscosity 2800pois
e (300 ° C.)], and the same operation as in Example 1 was carried out, except that resorcin diglycidyl ether was not used.

 The results are shown in Table 2.

Example 6 Example 1 was repeated, except that 1 part by weight of the resorcinol diglycidyl ether of Example 1 was replaced with 0.5 part by weight of N, N, N ', N'-tetraglycidylmetaxylenediamine.

 The results are shown in Table 3.

Example 7 Example 1 was repeated, except that 1 part by weight of resorcinol diglycidyl ether of Example 1 was replaced with 0.5 part by weight of triglycidyl tris (2-hydroxyethyl) isocyanurate.

 The results are shown in Table 3.

Examples 8 to 11 Maleic anhydride-modified polyphenylene ether, polyphenylene sulfide, resorcin diglycidyl ether and glass fiber of Example 1 (Asahi Fiberglass Co., Ltd.)
And CS03MA404) were mixed in the proportions shown in Table 4, and the same operation as in Example 1 was performed. The results are shown in Table 4.

Comparative Example 7 An unmodified 2,6-dimethylphenol copolymer having an intrinsic viscosity of 0.47 dl / g measured in chloroform at 25 ° C. instead of the maleic anhydride-modified polyphenylene ether of Example 8 (2, The same operation as in Example 8 was carried out except that 3,6-trimethylphenol occupied 5 mol%) and resorcin diglycidyl ether was not used.

 The results are shown in Table 4.

Comparative Example 8 Same as Example 1 except that the polyphenylene sulfide of Example 1 was changed to polypropylene (made by Idemitsu Petrochemical Co., Ltd., (trade name) Idemitsu Polypro E-2500; melt index: 1.0 g / 10 minutes). Was performed. Table 5 shows the results.

Comparative Example 9 Same as Example 1 except that the polyphenylene sulfide of Comparative Example 2 was changed to polypropylene (made by Idemitsu Petrochemical Co., Ltd., (trade name) Idemitsu Polypro E-2500; melt index: 1.0 g / 10 minutes). Was performed. Table 5 shows the results.

Comparative Example 10 The polyphenylene sulfide of Example 1 was replaced with polybutylene terephthalate [manufactured by Mitsubishi Rayon Co., Ltd. (trade name)
N-1000; melting point by DSC measurement: 250 ° C.], and the same operation as in Example 1 was performed. The results are shown in Table 6.

Comparative Example 11 The polyphenylene sulfide of Comparative Example 2 was replaced with polybutylene terephthalate [manufactured by Mitsubishi Rayon Co., Ltd., (trade name)
N-1000; melting point by DSC measurement: 250 ° C.], and the same operation as in Example 1 was performed. The results are shown in Table 6.

[Brief description of the drawings]

FIG. 1 is a scanning electron micrograph of the surface of the resin composition prepared in Example 1 and shows a dispersion state of resin component particles. FIG. 2 is a scanning electron micrograph of the surface of the resin composition prepared in Comparative Example 1, showing the dispersed state of the resin component particles.

 ──────────────────────────────────────────────────続 き Continuing on the front page Judge Yasuo Yoshimura Judge Yoshio Kakizaki Judge Takashi Kojima (56) References JP-A-63-88549 (JP, A) US Patent 4,508,594 (US, A) Chemical Abstract, 105 , Vol. 25, col. 225793 X Chemical Abstract, 105, Vol. 18, col. 153706 W

Claims (1)

(57) [Claims] 1. A modifying agent selected from (A) polyphenylene ether, which is selected from an organic compound having (a) an ethylenic double bond and (b) a carboxyl group or an acid anhydride group in a molecule. An organic compound having 5 to 95% by weight of a modified polyphenylene ether obtained by modification in the presence or absence thereof, (B) 95 to 5% by weight of polyphenylene sulfide, and (C) an organic compound having at least two epoxy groups in a molecule ( A resin composition having excellent heat and solvent resistance, comprising 0.01 to 10 parts by weight based on 100 parts by weight of the total amount of A) and (B).