JP2606304B2 - Cream solder printing method - Google Patents
Cream solder printing methodInfo
- Publication number
- JP2606304B2 JP2606304B2 JP63182315A JP18231588A JP2606304B2 JP 2606304 B2 JP2606304 B2 JP 2606304B2 JP 63182315 A JP63182315 A JP 63182315A JP 18231588 A JP18231588 A JP 18231588A JP 2606304 B2 JP2606304 B2 JP 2606304B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cream solder
- wiring
- cream
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 68
- 239000006071 cream Substances 0.000 title claims description 39
- 238000000034 method Methods 0.000 title claims description 18
- 239000011888 foil Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 9
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はプリント配線板に設けた配線箔上に、表面実
装型部品を半田接続するために塗布されるクリーム半田
の印刷方法に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for printing cream solder applied on a wiring foil provided on a printed wiring board for solder connection of a surface mount component.
従来の技術 配線箔上にクリーム半田を印刷するための従来の代表
的な方法としては、メタルマスクを用いる方法がある。
この方法は、メタルマスクに配線箔とほぼ同形状のスリ
ットを設け、このスリット上面から半田を塗布して、ス
リットの形状に対応する半田を配線箔上に印刷するもの
である。なおこの印刷の厚さはスリットの深さつまりメ
タルマスクの厚さを変えることで所望の厚さを得てい
た。2. Description of the Related Art As a conventional representative method for printing cream solder on a wiring foil, there is a method using a metal mask.
In this method, a slit having substantially the same shape as the wiring foil is provided on a metal mask, solder is applied from the upper surface of the slit, and solder corresponding to the shape of the slit is printed on the wiring foil. The desired thickness was obtained by changing the depth of the slit, that is, the thickness of the metal mask.
発明が解決しようとする課題 しかし、表面実装型部品の小型化が進み電極間ピッチ
が狭くなると、それにともなってプリント基板上の配線
箔間のピッチも狭くなる。このように狭いピッチの配線
箔に上記の従来のクリーム半田印刷方法で半田を印刷し
た場合には、スリット上方からクリーム半田を塗布する
ために、半田がマスクと箔との間ににじみ、電極間を短
絡するように半田が広がってしまうおそれがある。Problems to be Solved by the Invention However, as the miniaturization of surface mount components progresses and the pitch between electrodes becomes narrower, the pitch between wiring foils on a printed circuit board also becomes narrower. When the solder is printed on the wiring foil having such a narrow pitch by the above-described conventional cream solder printing method, the solder bleeds between the mask and the foil to apply the cream solder from above the slit, and the gap between the electrodes is formed. May spread the solder so as to short-circuit.
半田による短絡を防止するために、配線箔の幅よりも
メタルマスクのスリットを十分狭くする場合、必要な半
田量を確保するためにメタルマスクの板厚を厚くし、半
田厚みを厚くしなければならない。ところが、一般的
に、メタルマスクの加工法には、エッチング加工法が用
いられているため、板厚が厚くなると良好な細い貫通穴
をあけることが困難であるという問題がある。If the metal mask slit is made sufficiently narrower than the width of the wiring foil to prevent short circuits due to solder, the thickness of the metal mask must be increased to secure the required amount of solder, and the solder thickness must be increased. No. However, in general, an etching method is used as a processing method of a metal mask, so that there is a problem that it is difficult to form a good thin through hole when the plate thickness is large.
本発明は、上記問題点に鑑み、比較的電極間ピッチが
狭い表面実装型部品を基板に接続のための配線箔に電極
間半田短絡を防止するようにクリーム半田を印刷できる
クリーム半田印刷方法を提供するものである。In view of the above problems, the present invention provides a cream solder printing method capable of printing cream solder so as to prevent a short circuit between electrodes on a wiring foil for connecting a surface-mounted component having a relatively narrow pitch between electrodes to a substrate. To provide.
課題を解決するための手段 上記目的を達成するために本発明のクリーム半田印刷
方法は、基板上の配線箔の幅より狭く、かつ長さの長い
スリットを有するメタルマスクを利用して、配線箔上に
配線箔の幅より狭く、かつ長さの長いクリーム半田を印
刷するものである。Means for Solving the Problems In order to achieve the above object, the cream solder printing method of the present invention uses a metal mask having a slit that is narrower than the width of the wiring foil on the substrate and has a long length. A cream solder that is narrower and longer than the width of the wiring foil is printed thereon.
作 用 上記半田印刷方法によって、電極ピッチが比較的狭い
電子部品の電極間に半田ブリッジが発生しない程度の幅
の半田印刷としても、幅を狭くすることによる半田の絶
対量の不足を、印刷長さを長くすることによって補なう
ことができる。By the above-mentioned solder printing method, even if the solder printing is such that the solder bridge does not occur between the electrodes of the electronic component whose electrode pitch is relatively narrow, the shortage of the absolute amount of the solder due to the narrow width is considered as the printing length. This can be compensated for by increasing the length.
実施例 以下、図面を参照しながら本発明の一実施例のクリー
ム半田印刷方法を説明する。Hereinafter, a cream solder printing method according to an embodiment of the present invention will be described with reference to the drawings.
第１図は、本発明の第一の実施例のクリーム半田印刷
方法で配線箔上に印刷されたクリーム半田と配線箔との
配置を表わす平面図である。第１図において、１はプリ
ント配線板上の配線箔、２は配線箔１は隣接する配線
箔、3aは配線箔１に印刷されたクリーム半田、4aは配線
箔１に隣接する配線箔２に印刷されたクリーム半田を示
す。第１図からも明らかなように、印刷されたクリーム
半田3aは配線箔１よりも長手方向は長く、短手方向は短
く印刷されている。クリーム半田3a,4aを印刷する場
合、配線板上の配線箔1,2に印刷するクリーム半田3,4の
幅ならびに長さに対応するスリット5a,5bを有するメタ
ルマスク５を位置合わせして配線板上に配置し、その上
からクリーム半田を印刷することで、所望のクリーム半
田の印刷が実現される。FIG. 1 is a plan view showing the arrangement of the cream solder printed on the wiring foil and the wiring foil by the cream solder printing method of the first embodiment of the present invention. In FIG. 1, 1 is a wiring foil on a printed wiring board, 2 is a wiring foil 1 adjacent to a wiring foil, 3a is cream solder printed on the wiring foil 1, and 4a is a wiring foil 2 adjacent to the wiring foil 1. Shows the printed cream solder. As is clear from FIG. 1, the printed cream solder 3a is longer than the wiring foil 1 in the longitudinal direction and shorter in the short direction. When printing the cream solders 3a and 4a, the metal mask 5 having slits 5a and 5b corresponding to the width and length of the cream solders 3 and 4 to be printed on the wiring foils 1 and 2 on the wiring board is aligned and wired. By arranging it on a board and printing cream solder on it, desired printing of cream solder is realized.
上述のようにクリーム半田3,4が印刷された配線箔1,2
に、第２図に示すように電子部品の電極６を配置し、加
熱処理を施す。加熱されたクリーム半田3,4は溶融し、
表面張力によって電極６ならびに配線箔1,2側に引き寄
せられ、第３図に示すように配線箔1,2と電極６との間
が半田７によって半田付けされる。Wiring foils 1, 2 on which cream solders 3, 4 are printed as described above
Next, as shown in FIG. 2, the electrodes 6 of the electronic component are arranged and subjected to a heat treatment. The heated cream solders 3 and 4 melt,
Due to the surface tension, it is attracted to the electrodes 6 and the wiring foils 1 and 2 side, and between the wiring foils 1 and 2 and the electrode 6 is soldered by the solder 7 as shown in FIG.
以上のように本実施例によれば、電子部品の電極間に
半田のブリッジが発生しないようなクリーム半田の印刷
幅としても、クリーム半田の印刷厚さを厚くすることな
く、十分な半田量を確保できる。As described above, according to the present embodiment, a sufficient solder amount can be obtained without increasing the print thickness of the cream solder, even if the print width of the cream solder is such that no solder bridge occurs between the electrodes of the electronic component. Can be secured.
第４図は、本発明の第二の実施例を示す配線箔上に印
刷されたクリーム半田と配線箔との配置を表わす平面図
である。第４図において、１はプリント配線板上の配線
箔、２は配線箔１に隣接する配線箔、３は配線箔１に印
刷されたクリーム半田、3aはそのクリーム半田３の一部
分に設けた切り欠き部分、４は配線箔１に隣接する配線
箔２に印刷されたクリーム半田、4aはそのクリーム半田
４の一部分に設けた切り欠き部分を示す。FIG. 4 is a plan view showing the arrangement of the cream solder printed on the wiring foil and the wiring foil according to the second embodiment of the present invention. In FIG. 4, 1 is a wiring foil on a printed wiring board, 2 is a wiring foil adjacent to the wiring foil 1, 3 is cream solder printed on the wiring foil 1, and 3a is a cut provided on a part of the cream solder 3. The notched portion, 4 denotes cream solder printed on the wiring foil 2 adjacent to the wiring foil 1, and 4a denotes a cutout portion provided in a part of the cream solder 4.
クリーム半田3,4の切り欠き部分3a,4aは、第１図に破
線にて示したメタルマスク５のスリット5a,5bを不連続
とすることで容易に形成できる。The notched portions 3a, 4a of the cream solders 3, 4 can be easily formed by making the slits 5a, 5b of the metal mask 5 shown by broken lines in FIG. 1 discontinuous.
クリーム半田の印刷パターンに不連続部分を形成する
切り欠き部3a,4aを形成し、この切り欠き部3a,4a上に電
極６の折曲部分を配置させる（第５図）。この状態で半
田溶融のために加熱すると、半田は電極６側に表面張力
で引き寄せられる。ただし、電極６の折曲部分の半田量
は他の部分より少なく塗布されているために、表面張力
によって電極６に吸い上げられる半田量が小さく抑えら
れる。その結果、電極６間の半田ブリッジが一層発生し
ないものとなる。Notches 3a and 4a forming discontinuous portions in the cream solder print pattern are formed, and the bent portions of the electrodes 6 are arranged on the notches 3a and 4a (FIG. 5). When the solder is heated in this state for melting the solder, the solder is attracted to the electrode 6 side by surface tension. However, since the amount of solder in the bent portion of the electrode 6 is smaller than that in the other portions, the amount of solder sucked up by the electrode 6 due to surface tension can be suppressed to a small value. As a result, the solder bridge between the electrodes 6 does not further occur.
発明の効果 本発明によれば、基板上に設けた配線箔に、半田接続
するために塗布されるクリーム半田を、配線箔より短手
方向の幅はせまく、長手方向は長く印刷する事により、
比較的電極間ピッチの狭い表面実装型部品接続のための
配線箔との、半田接続時の電極間半田ブリッジを防止す
る事が出来る。According to the present invention, according to the present invention, by applying a cream solder applied for solder connection to the wiring foil provided on the substrate, the width in the shorter direction is narrower than the wiring foil, and the longer length is printed longer.
It is possible to prevent a solder bridge between the electrodes at the time of solder connection with a wiring foil for connecting a surface mounting type component having a relatively narrow pitch between the electrodes.
第１図は本発明の第一の実施例におけるクリーム半田印
刷方法を説明するための平面図、第２図および第３図は
その半田接続方法を説明するための側面図、第４図は本
発明の他の実施例のクリーム半田印刷方法を説明するた
めの正面図、第５図はその半田接続方法を説明するため
の側面図である。 1,2……配線箔、3,4……クリーム半田、６……表面実装
型部品の電極。FIG. 1 is a plan view for explaining the cream solder printing method in the first embodiment of the present invention, FIGS. 2 and 3 are side views for explaining the solder connection method, and FIG. FIG. 5 is a front view for explaining a cream solder printing method according to another embodiment of the invention, and FIG. 5 is a side view for explaining the solder connection method. 1,2: Wiring foil, 3,4: Cream solder, 6: Electrodes for surface mount components.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐古田 素三 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭61−47697（ＪＰ，Ａ) 特開 昭62−163392（ＪＰ，Ａ) 特開 昭58−102533（ＪＰ，Ａ) 特開 昭58−132940（ＪＰ，Ａ) 特開 平１−283994（ＪＰ，Ａ) 実開 昭61−162365（ＪＰ，Ｕ) ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sozo Sakota 1006 Odakadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-61-47697 (JP, A) JP-A Sho 62-163392 (JP, A) JP-A-58-102533 (JP, A) JP-A-58-132940 (JP, A) JP-A-1-283994 (JP, A) U)
Claims (2)
に設けた配線箔に半田接続するために前記配線箔に印刷
されるクリーム半田を、配線箔の幅より狭く、かつ前記
配線箔の長さより長く印刷することを特徴とするクリー
ム半田印刷方法。1. A cream solder printed on a wiring foil for soldering a plurality of electrodes of a surface mount electronic component to a wiring foil provided on a substrate, the cream solder having a width smaller than the width of the wiring foil, and A cream solder printing method characterized by printing longer than the length of the solder paste.
半田を一部除去して印刷することを特徴とする請求項
（１）に記載のクリーム半田印刷方法。2. The cream solder printing method according to claim 1, wherein the cream solder is printed by partially removing the solder where the electrode rises.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63182315A JP2606304B2 (en) | 1988-07-21 | 1988-07-21 | Cream solder printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63182315A JP2606304B2 (en) | 1988-07-21 | 1988-07-21 | Cream solder printing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0232593A JPH0232593A (en) | 1990-02-02 |
| JP2606304B2 true JP2606304B2 (en) | 1997-04-30 |
Family
ID=16116157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63182315A Expired - Lifetime JP2606304B2 (en) | 1988-07-21 | 1988-07-21 | Cream solder printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2606304B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03284895A (en) * | 1990-03-30 | 1991-12-16 | Taiyo Yuden Co Ltd | Printing of pastelike solder |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742998A (en) * | 1980-08-22 | 1982-03-10 | Isato Nakao | Water repellent treatment of paper |
-
1988
- 1988-07-21 JP JP63182315A patent/JP2606304B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0232593A (en) | 1990-02-02 |
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