JP2596647B2 - Cleaning device for conductive paste transfer pin or semiconductor chip collet pin - Google Patents

Abstract

PURPOSE:To clean up the ends of transfer pins 7 for coating liquid crystal displaying element, etc., with a conductive paste or the ends of collet pins 33 for shifting and feeding semiconductor chips to leading frame, etc., by wiping-off step. CONSTITUTION:The ends of said transfer pins 7 or said collet pins 33 are shifted in the axial directions thereof by the forward movement of the holding members 29, 30 with thier ends thereof held between right and left sides through the intermediary of the first cleaning tape 11 and the second cleaning tape 14 while the both cleaning tapes 11, 14 are wound up by a proper length.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for mounting a plurality of external terminals on one side edge of a liquid crystal display element or a printed circuit board, for example. In the case of a transfer pin in which a conductive paste is applied to the upper surface of one side edge or a collet pin in which a semiconductor chip is transferred and supplied to a lead, the transfer pin or the collet pin is used. The present invention relates to an apparatus for cleaning a tip.

In general, for example, when a plurality of external terminals are mounted on one side edge of a liquid crystal display element or a printed circuit board, prior to this, a plurality of external terminals are mounted on the upper surface of one side edge of the liquid crystal display element or the printed circuit board. When applying the conductive paste, the liquid crystal display element or the printed board is reciprocated in a horizontal direction between the conductive paste applying means, and a portion of the liquid crystal display element or the printed board and the conductive paste are applied. A transfer pin is implanted in a head member that moves up and down at the location of the means, and the head member is moved downward toward the conductive paste applying means, so that a conductive paste is applied to the tip end surface of the transfer pin. And then
The head member moves upward, moves to above the liquid crystal display element or the printed board, and then moves down, and the tip of the transfer pin contacts the liquid crystal display element or the printed board, thereby The conductive paste adhered to the tip surface of the transfer pin is applied to the liquid crystal display element or the printed circuit board.

In transferring and supplying semiconductor chips one by one to a predetermined location in a lead frame,
A lead frame, a place where semiconductor chips are aligned, and a conductive paste application means are arranged side by side, and a head member is arranged above the head so as to reciprocate horizontally between them and then move up and down. A collet pin is implanted in the head member, and the head member is moved downward toward the conductive paste applying means, so that a conductive paste is attached to a tip end surface of the collet pin, Then, by moving above the alignment means and moving downward, the tip of the collet pin is attached to the conductive paste with the semiconductor chip, and after moving above the lead frame, By moving down toward the lead frame, the semiconductor chip at the tip of the collet pin is supplied to the lead frame.

Since the conductive paste is repeatedly adhered to the end surfaces of the transfer pins or collet pins, the amount of the conductive paste adhered to the end portions of the transfer pins or collet pins gradually increases. Therefore, in the case of the transfer pin, a problem that the amount of the conductive paste applied to the liquid crystal display element or the printed circuit board becomes excessive occurs, and in the case of the collet pin, the tip surface When the semiconductor chip attached via the conductive paste is moved upward after pressing the lead frame, the semiconductor chip is lifted together with the semiconductor chip attached to the collet pin side, or the conductive paste is attached to the side of the semiconductor chip. Problems such as dripping occur.

[0005] Therefore, the tip of the transfer pin or the collet pin becomes excessive after adhering the conductive paste to the tip surface of the transfer pin or the collet pin a plurality of times. Cleaning has to be performed so as to remove the conductive paste of the related art. Conventionally, the tip of the transfer pin or the collet pin contacts the rotating brush roller, thereby causing the excess to adhere to the tip. The conductive paste is removed.

[0006]

However, as described above,
The cleaning device, in which the transfer pin or the collet pin is brought into contact with the rotating brush roller, causes the conductive paste to form fine mist from the rotating brush roller and scatter around, thereby reducing the environment in the clean room. In addition to the deterioration, there is a problem that fine mist of the conductive paste adheres to the surface of the liquid crystal display element, the printed circuit board, or the lead frame. It is a technical object of the present invention to provide an apparatus that cleans the tip of the transfer pin or the collet pin by wiping the tip of the pin with a tape without scattering the mist of the conductive paste. It is.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above technical object, the present invention provides a first cleaning tape which is wound sequentially from one reel to the other, and a first cleaning tape which is wound from one reel to the other. A second cleaning tape which is sequentially wound is disposed on both left and right sides of a transfer pin or a collet pin which reciprocates in the axial direction, and is disposed between both reels of the first cleaning tape and the second cleaning tape. Between the two reels of the tape, a pinching member is provided so that the two cleaning tapes are moved forward so as to approach each other and then retracted.

In this configuration, the tip of the transfer pin or the collet pin is inserted between the first cleaning tape and the second cleaning tape by the axial movement of the transfer pin or the collet pin. Then, the two cleaning tapes approach each other due to the forward movement of the sandwiching member and are pressed against the tips of the transfer pins or the collet pins.In other words, the transfer pins or the collet pins are In this state, the transfer pin or the collet pin is retracted in the axial direction so that the transfer pin or the collet pin adheres to the tip of the transfer pin or the collet pin. Surplus conductive paste,
The two cleaning tapes can be wiped off, and when this is completed, each of the two cleaning tapes is repeatedly wound up from one reel to the other reel at an appropriate pitch.

[0009]

According to the present invention, the tip of the transfer pin or the collet pin is cleaned by wiping it with both cleaning tapes as described above.
Since fine mist of the conductive paste is not scattered as in the conventional case, cleaning at the tip of the transfer pin or the collet pin may deteriorate the environment in a clean room, or may cause a liquid crystal display element or a printed circuit board or a lead. There is an effect that the operation can be performed reliably without the fine mist of the conductive paste adhering to the frame.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an embodiment of the present invention applied to simultaneous application of a conductive paste to a plurality of portions of a liquid crystal display element using a plurality of transfer pins. 5) A description will be given. In this figure, reference numeral 1 denotes a support on which the liquid crystal display element 2 is mounted, and a first carriage 4 is indicated by an arrow A on the front surface of a machine 3 disposed beside the support 1. Is mounted so as to be able to reciprocate in the front-rear direction toward the support table 1. The front surface of the first carriage 4 is capable of reciprocating up and down as shown by the arrow B in the second carriage 5. It is attached to. In addition, the first carriage 4 is driven by a motor (not shown) provided on the machine base 3 and the second carriage 4.
The carriage 5 is configured to reciprocate by a motor or the like provided on the first carriage 4. Reference numeral 6 denotes a head member formed in the shape of a bar having a regular polygonal cross section. The head member 6 is positioned on the support table 1 with respect to the second carriage 5 so that the axis 6a of the head member 6 is aligned with the liquid crystal display on the support table 1. Element 2
In a state parallel to one side edge thereof and its axis 6
a so as to be rotatable about a.
The transfer pins 7 are planted in a row at appropriate pitch intervals along the direction of the axis 6a on each side surface of the. In this case, the pitch between the transfer pins 7 on each side of the head member 6 is set to a different pitch for each side. Therefore, when the pitch interval of the conductive paste applied to the surface of the liquid crystal display element 2 is changed, the head member 6 is moved along its axis 6a.
, The transfer pins 7 set at the pitch intervals corresponding to the changed pitch intervals may be turned downward.

Reference numeral 8 denotes a means for applying a conductive paste disposed on the upper surface of the machine base 1.
Consists of an application roller 8a having a plurality of elongated grooves 8b extending in the axial direction on the outer peripheral surface, and a conductive paste tank 8c pressed against the outer peripheral surface of the Tosu roller 8a. By rotating intermittently at intervals of the long grooves 8b in the direction, the conductive paste 9 put in the conductive paste tank 8c is filled in each of the long grooves 8b.

Reference numeral 10 denotes a cleaning device disposed on the upper surface of the machine base 1. The cleaning device 10 includes a first cleaning tape 11 having both ends wound around two reels 12, 13, and a cleaning device 10 having both ends. Cleaning tape 14 wound around two reels 15 and 16
The two cleaning tapes 11 and 14 are disposed so as to be aligned in parallel with the axis 6 a of the head member 6.
Small diameter feed rollers 17, 18 and small diameter guide roller 1
The guides 9 and 20 are configured to guide in a parallel state. Further, the first cleaning tape 11 transmits the rotation of the take-up motor 21 to the drive roller 17 and one of the reels 12 via belts 22 and 23, respectively, and transmits the rotation of the one reel 12 to the other reel. 13 is transmitted in the opposite direction via a crossing belt 24 so that the reel 13 is wound up sequentially from the other reel 13 to the one reel 12, while the second cleaning tape 14 is also wound in the same manner as described above. The rotation of the take-up motor 25 is transmitted to the drive roller 18 and one of the reels 15 via belts 26 and 27, respectively.
Is transmitted in the opposite direction to the other reel 16 via the crossing belt 28 so that the other reel 16
From one to the other reel 15.
Further, a sandwiching member 2 having soft elastic bodies 31 and 32 such as rubber stretched on the inner surface thereof is provided between the two reels 12, 13, 15 and 16 of the cleaning tapes 11 and 14.
9 and 30 are disposed respectively, and the sandwiching members 29 and 3 are provided.
0 is configured to retreat after approaching each other by a mechanism (not shown). The cleaning tapes 11 and 14 are made of paper or a soft synthetic resin.

In this configuration, when the head member 6 is located at a position above the coating means 8, the head member 6 moves downwardly toward the coating means 8 and then moves upward, so that the head member 6 has a downwardly facing side surface. The conductive paste in the long groove 8b of the application roller 8a in the application means 8 is adhered to the tip end surface of each transfer pin 7 planted on the side surface indicated by. Next, after the head member 6 moves laterally to a position directly above the liquid crystal display element 2 on the support table 1, the head member 6 moves downward toward the liquid crystal display element 2, and the transfer pins 7 move.
Is in contact with the upper surface of the liquid crystal display element 2,
A conductive paste can be applied to the liquid crystal display element 2 at the same pitch as the pitch of the transfer pins 7. In this way, when repeating the application of the conductive paste to the liquid crystal display element 2 by each of the transfer pins 7 in the head member 6,
When the conductive paste is excessively attached to the tip of each of the transfer pins 7, the head member 6 is moved laterally to above the cleaning device 10 and then moved downward, so that each of the transfer pins is moved. When the pin 7 is inserted between the first cleaning tape 11 and the second cleaning tape 14, the pinching members 29 and 30 move forward so as to approach each other, and the two cleaning tapes 11 and 1 are moved.
4, the tips of the transfer pins 7 are simultaneously clamped. In this state, the head member 6 is moved upward to adhere to the tips of the transfer pins 7. Excessive conductive paste, dust, and the like are cleaned by wiping them with the cleaning tapes 11 and 14. When the cleaning is completed, each of the cleaning tapes 11 and 14 is removed by the winding motor 2.
The other reels 13 and 1 are driven by the rotation drive of the other reels 13 and 25.
The operation of winding the reels from No. 6 onto one of the reels 12 and 15 at an appropriate pitch is sequentially repeated.

FIG. 6 shows an embodiment applied to a collet pin. That is, the head member 34 provided with the collet pins 33 is moved downward as shown by the arrow C toward the application unit 35 (this application unit 35 is configured substantially similarly to the application unit 8 described above). Thereafter, as shown by an arrow D, the conductive paste is attached to the tip end surface of the collet pin 33 by moving upward. Next, the head member 34 is moved to a position above the aligning means 37 with respect to the semiconductor chip 36 as shown by an arrow E, and then, as shown by an arrow F,
, And by moving upward as shown by the arrow G, the leading end surface of the collet pin 33
When the semiconductor chip 36 is bonded via the conductive paste, the head member 34 moves laterally to above the lead frame 38 as shown by the arrow H, moves down as shown by the arrow I, and then moves by the arrow J. By moving upward as shown, the semiconductor chip 36 at the tip end surface of the collet pin 33 is supplied to the lead frame 38. When this is completed, the head member 34 is moved to the cleaning device 1 configured as described above, as indicated by an arrow K.
After moving laterally to above 0 and descending as shown by arrow L, by moving up as shown by arrow M, the tip of the collet pin 33 is cleaned in the same manner as described above. When the cleaning is completed, the head member 34 is moved to the
The operation of returning to above 5 is repeated. The cleaning is performed on the lead frame 3 of the semiconductor chip 36.
8 may be performed after the transfer and supply to 8 are repeated a plurality of times.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a plan view of the cleaning device in FIG. 1;

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG. 3;

FIG. 5 is an enlarged sectional view taken along line VV of FIG. 3;

FIG. 6 is a diagram showing another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Support stand 2 Liquid crystal display element 3 Machine stand 6 Head member 7 Transfer pin 8 Means for applying conductive paste 10 Cleaning device 11 First cleaning tape 14 Second cleaning tape 12, 15 One reel 13, 16 The other reel 21 , 25 Winding motor 29, 30 Nipping member 33 Collet pin 34 Head member 35 Conductive paste application means 36 Semiconductor chip 37 Alignment means 38 Lead frame

Claims (1)

(57) [Claims] A first cleaning tape, which is sequentially wound from one reel to the other reel, and a second cleaning tape, which is also sequentially wound from one reel to the other reel, are arranged in the axial direction. Arranged on both left and right sides of a reciprocating transfer pin or collet pin, the cleaning tapes are brought closer to each other between the reels of the first cleaning tape and between the reels of the second cleaning tape. A cleaning device for a pin for transferring a conductive paste or a pin for a collet of a semiconductor chip, comprising a pinching member that moves forward and then retracts.