JP2584741Y2 - IC carrier - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an IC for accommodating an IC package for use in transportation or mounting on an IC socket.
Regarding C carrier.

[0002]

2. Description of the Related Art FIG. 6 is a plan view of a conventional IC carrier, and FIG. 7 is a cross-sectional view of the IC carrier shown in FIG.
The torsion bars 8 are arranged at the four corners of the carrier body 1, and the latch arms 4 are raised from the respective torsion bars 8,
An engagement claw 5 is provided at the tip of the latch arm 4.

When the IC package is mounted on the IC carrier, the lower portion 4a of the latch arm shown in FIG.
By twisting the torsion bar 8 upward,
By rotating the latch arm 4 outward of the carrier body 1 and moving the engaging claw 5 out of the portion where the IC package body 6 is mounted, the IC package is moved to the carrier body 1.
By releasing the lower portion 4a of the latch arm from being pushed up and returning the engaging claw 5 to its original position by the elastic restoring force of the torsion bar 8, the IC package is The four corners of the main body 6 are pressed obliquely from above to fix the IC package to the IC carrier.

When the IC package is removed from the IC carrier, the lower part 4 of the latch arm shown in FIG.
By pushing a upward, the torsion bar 8 is twisted, the engaging claw 5 is moved out of the portion where the IC package body 6 is mounted, and the IC package is removed from the carrier body 1.

[0005]

[Problems to be solved by the invention]
There is a trend toward miniaturization. Therefore, miniaturization of the IC carrier mounted on the IC socket is also required. In the case of the above IC carrier, the torsion bar 8 is
Is provided outside the carrier body 1 with respect to
Inevitably, the carrier body 1 becomes large. According to the present invention, the size of the IC carrier can be reduced by providing an elastically deformable portion of the elastic member for enabling the engagement claw 5 to be movable, inside the carrier body 1 from the engagement claw 5. With the goal.

[0006]

According to the present invention, a plurality of cantilever members having elasticity are respectively extended from a lower portion of a portion of an IC carrier on which an IC package body is mounted toward the outside of the carrier body. The above-mentioned problem is solved by raising the latch arms in the middle of the step and providing engaging claws at the tips of the latch arms for pressing the corners of the IC package body.

[0007]

When the end of the member having elasticity is pressed downward, the member is bent, the latch arm is inclined in the outward direction of the carrier body, and the engaging claw is out of the portion where the IC package body is mounted. Moving. Then, when the IC package is mounted on the IC carrier and the end of the cantilever is released from the pressure, the bending of the cantilever returns to the original state due to the elastic restoring force of the cantilever, and the engaging claw is moved to the IC package body. Is pressed diagonally from above to fix the IC package to the IC carrier.

In the case of the IC carrier according to the present invention, the elastically deformable portion of the cantilever member is located below the portion where the IC package body is mounted. Will be. Therefore, the size can be reduced as compared with the conventional IC carrier.

[0009]

FIG. 1 is a plan view of an IC carrier according to the present invention, FIG. 2 is a plan view of the IC carrier shown in FIG. 1 when an IC package is mounted, and FIG. FIG. 4 is a partially enlarged cross-sectional view showing the periphery of the rod-shaped member when the rod-shaped member as the cantilever of the IC carrier shown in FIG. 1 is deformed. In the drawing, 1 is a carrier body, 2 is a mounting portion for mounting an IC package body provided on the carrier body 1, and 3 is an elasticity extending from the mounting portion 2 to the outside of the carrier body 1. The cantilevered rod-like member 4 having a latch arm 4 rising upward from the middle of the rod-like member 3, an engaging claw provided at the tip of the latch arm 4, and a latching arm 6 on the mounting portion 2. Is an IC package body placed on the IC package.

When the IC package is mounted on the IC carrier, the end 3a of the bar is pressed in the direction of arrow B shown in FIG. Then, the engaging claw 5 is moved outward of the carrier main body 1, and the IC package main body 6 is placed on the mounting portion 2.
The engaging claw 5 presses the four corners of the IC package main body 6 obliquely upward by the elastic restoring force of the rod-shaped member 3 by releasing the rod-shaped member 3 from being pressed against the end 3a of the rod-shaped member. Then, the IC package is fixed to the IC carrier.

In the case of the above-described IC carrier, the elastically deformable portion for moving the engaging claw 5 is provided below the portion where the IC package body 6 is mounted. It has become possible.

FIG. 5 shows a second embodiment of the present invention. In the second embodiment, a hole 7 is formed in a portion of the rod-shaped member 3 just below the engaging claw 5 so that the protruding portion of the engaging claw 5 from the latch arm 4 can pass therethrough. Is provided. By providing the holes 7, when the IC carrier is formed by molding, when the molded IC carrier is taken out of the mold, the portion of the engaging claw 5 can be easily taken out.

[0013]

As described above, the IC carrier of the present invention can be downsized compared to the conventional IC carrier. The downsizing has advantages such as a reduction in material costs and a reduction in the size of a mold when an IC carrier is formed by molding.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of an IC carrier according to the present invention.

FIG. 2 is a plan view showing a state where an IC package is mounted on the IC carrier shown in FIG. 1;

FIG. 3 is a sectional view of the IC carrier shown in FIG. 2, taken along the line AA.

FIG. 4 is a partially enlarged cross-sectional view showing a state where a rod-shaped member of the IC carrier shown in FIG. 1 is deformed.

FIG. 5 is a partially enlarged perspective view showing a second embodiment of the IC carrier according to the present invention.

FIG. 6 is a plan view showing an example of a conventional IC carrier.

7 is a cross-sectional view of the IC carrier shown in FIG. 6, taken along line CC.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier main body 2 Mounting part 3 Bar-shaped member 4 Latch arm 5 Engagement claw 6 IC package main body 7 hole

Claims (1)

(57) [Scope of request for utility model registration] An IC package is accommodated, a latch arm is raised from each of a plurality of elastic members provided on a carrier body, and a corner of the IC package body is formed by an engagement claw provided at a tip of the latch arm. Fixing the IC package to the carrier body by resiliently contacting the portion
In the C carrier, the elastic member extends outwardly of the carrier main body from a lower portion of a portion where the IC package main body is accommodated, one end of the elastic member in the outer direction is a free end, and the other end is a fixed end. An IC carrier, wherein the latch arm is raised between both ends, and the engaging claw is provided at a tip of the latch arm.