JP2582577Y2 - Radiation fin - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a radiation fin for lowering the temperature of a heating element represented by a semiconductor chip such as a power transistor.

[0002]

2. Description of the Related Art It is generally known that a semiconductor chip and other electronic components constituting a power transistor or the like generate a large amount of heat during use. Therefore, lowering the temperature of such a heating element is indispensable for enhancing the functions of a semiconductor chip and other electronic components. In order to lower the temperature, a method of arranging these heating elements adjacent to a metal plate is used.

This metal plate is called a radiation fin and has, for example, a structure shown in FIGS. That is, a plurality of heating elements 3 are vertically arranged on one surface 1A of the metal plate 1, and a large number of fins 5 are vertically formed on the other surface 1B. Then, the air heated by the heating element 1 moves upward along the fins 5, thereby generating a flow of air. The mechanism of this air flow allows the cooling to proceed and the temperature of the heating element 3 to be lowered.

[0004]

However, in the conventional configuration, since the flow of heated air flows from bottom to top, the upper heating element 3 is cooled by the air heated by the lower heating element 3. And the cooling effect of the upper heating element 3 is reduced. For this reason, there is a problem that the semiconductor chips, which are the heating elements 3, cannot be efficiently cooled under the condition that the semiconductor chips must be vertically arranged.

[0005] These problems are not limited to the case where the heating elements 3 are arranged in the vertical direction. Even when the heating elements 3 are arranged in the horizontal direction, for example, the cooling air is forcibly sent between many fins 5. Is a problem that occurs similarly.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a radiation fin capable of efficiently cooling a plurality of heating elements mounted on a metal plate. .

[0007]

Means for Solving the Problems In order to achieve the above object, the present invention provides a method in which a plurality of heating elements are mounted on one surface.
Fins extending in multiple rows on the other side of the
In addition, these fins are arranged so that the other heating element is not cooled by the cooling air that has cooled one of the heating elements .
It is characterized by being provided so as to cross obliquely to the surface .

[0008]

The air heated by one of the plurality of heating elements travels obliquely along the diagonally arranged fins and does not pass through the position where the other heating element is mounted. Therefore, the other heating element is not cooled by the air heated by one heating element, but is cooled by cold air from the other.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to FIGS.

1 to 4, reference numeral 3 denotes a heating element. The heating element 3 is, for example, a semiconductor chip constituting a power transistor or the like. The plurality of heating elements 3 are arranged on one surface of a metal plate 1 called a radiation fin.

According to this embodiment, the metal plate 1 is made of an extruded aluminum member. In this specification, the term “aluminum” includes aluminum alloys in addition to pure aluminum. Further, for the metal plate 1, it is also possible to use copper or the like having better thermal conductivity than aluminum.

The metal plate 1 is arranged vertically, and the air heated by the heating element 3 rises to generate an air flow.

A plurality of heating elements 3 are vertically arranged on one surface 1A of the metal plate 1. The arrangement in the vertical direction is determined in advance by, for example, the arrangement conditions inside the electronic device having the semiconductor chip. However, the present invention is effective even if not all of the heating elements are vertically arranged, even if some of the heating elements are vertically arranged.

On the other surface 1B of the metal plate 1, fins 5 extending in multiple rows are formed integrally during extrusion molding. The fins 5 are inclined at a predetermined angle θ with respect to the vertical direction in which the heating elements 3 are arranged. This inclination angle θ
Is desirably set to a sufficiently large angle within a range that does not hinder the flow of air.

The operation of the embodiment will be described. The air taken in from the lower side of the metal plate 1 is
After being cooled, it rises obliquely along the inclined fins 5. Since it rises obliquely, the air once heated when cooling the lower heating element 3 hardly passes through the position where the upper heating element 3 is attached.

The air taken in from the left side of the metal plate 1 passes through the upper heating element 3 along the inclined fins 5. Thereby, the cold air not heated by the lower heating element 3 directly cools the upper heating element 3.

According to this structure, the other heating element 3 is not cooled by the cooling air that has cooled one of the heating elements 3, and the other heating element 3 is always cooled by cold air. Good cooling is provided.

In the above embodiment, two heat generating elements 3 are arranged. However, three or more heat generating elements may be arranged. Cooled by.

In the above embodiment, the metal plate 1
When manufacturing the fins 5, the fins 5 are integrally formed by aluminum extrusion, but the metal plate 1 is formed in a flat plate shape, and the fins 5 are welded to the other surface 1B by cutting a groove or the like. May be formed diagonally.

In particular, an extruded aluminum member having a plurality of ridges formed on one surface, a fin 5 is formed obliquely by applying a scalpel blade obliquely to one surface thereof and shaving the surface. May be.

Further, in the above embodiments, the heating element 3 has been described as being a semiconductor chip. However, in other embodiments, an electronic component such as a capacitor other than the semiconductor chip may be used.

[0022]

[Effects of the Invention] As described above, according to the present invention,
Since the flow of air becomes oblique due to the action of the fins provided inclining with respect to the direction in which the heating elements are arranged, the air heated by one of the heating elements does not cool the other heating element. Since each heating element is cooled by cold air flowing obliquely, a high cooling effect can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a front view of FIG.

FIG. 3 is a side view of FIG. 2;

FIG. 4 is a bottom view of FIG. 2;

FIG. 5 is a front view showing a conventional example.

FIG. 6 is a side view of FIG. 5;

FIG. 7 is a bottom view of FIG. 5;

[Explanation of symbols]

 1 Metal plate 3 Heating element 5 Fin

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 7/20

Claims (1)

(57) [Scope of request for utility model registration] A plurality of heating elements are mounted on one surface.
Fins extending in multiple rows on the other side of
In addition, these fins are arranged so that the other heating element is not cooled by the cooling air that has cooled one of the heating elements .
A heat radiation fin characterized by being provided so as to cross obliquely with respect to a surface .