JP2581367B2 - Electronic equipment unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bringing a semiconductor module of an electronic device to be cooled into contact with a cooling module in which a refrigerant is circulated.
The present invention relates to an electronic device unit formed to be closed .

2. Description of the Related Art In recent years, semiconductor devices widely used in electronic devices have been increased in speed and density, and the amount of heat generated by the semiconductor devices has tended to increase. Therefore, an electronic device unit is formed by superposing an electronic device formed by mounting a large number of semiconductor elements on a printed circuit board on a cooling module in which a coolant is circulated, and the semiconductor elements are arranged in such a cooling module. It is formed so as to be in contact with the surface of the semiconductor element on the printed circuit board.

Accordingly, the semiconductor device is forcibly cooled by circulating a coolant through the cooling module.

[0004]

2. Description of the Related Art Conventionally, a cooling module 1 in which a coolant 3 supplied from a coolant supply device 10 is circulated as shown in FIG. The electronic device 2 formed by mounting the semiconductor element 2B on the substrate 2A is in close contact with the power supply PW for operating the semiconductor element 2B from the power supply control unit 11.

In the cooling module 1, cooling elements 1B are arranged on a plate 1A, each cooling element 1B is formed so as to correspond to a mounting position of a semiconductor element 2B, and a refrigerant supply device 10 is connected to a plate 12A through a pipe 12A. Refrigerant returned from 1A
And a heat exchanger for cooling the refrigerant 3 discharged from the tank 10A through the pipe 12B to a predetermined temperature.
10B and a pump for supplying the refrigerant 3 flowing out of the heat exchanger 10B through the pipe 12C to the plate 1A via the pipe 12D.
10C.

Therefore, the coolant 3 cooled to a predetermined temperature by driving the pump 10C circulates through the plate 1A, and the semiconductor element 2B operated by the power supply PW supplied from the power supply control unit 11 is cooled.

In such a configuration, usually, water at room temperature (about 10 ° C. to 40 ° C.) is used as the coolant 3 and the semiconductor element 2B
The junction temperature of the semiconductor device is 80 ° C. to 90 ° C. or less, so that the reliability of the semiconductor element is kept high.

[0008]

However, cooling of the semiconductor element 2B by circulating the coolant 1 cooled to a predetermined temperature by the driving of the pump 10C through the plate 1A does not allow the flow rate of the coolant 3 due to an obstacle or the like. If the temperature decreases extremely or the refrigerant 3 stops circulating, the junction temperature of the semiconductor element 2B may exceed the guaranteed temperature (80 ° C to 90 ° C), and even exceed the dangerous temperature of 120 ° C, which is the destruction risk of the semiconductor element. become.

Therefore, the refrigerant 3 is not circulated,
Alternatively, a decrease in the flow rate has a risk that many semiconductor elements 2B mounted on the printed circuit board 2A may be broken or burnt.

Therefore, an object of the present invention is to form a semiconductor element mounted on an electronic device so that the semiconductor element will not be broken or burnt even if the circulation of the refrigerant is stopped.

[0011]

FIG. 1 is a diagram illustrating the principle of the first invention, FIG. 2 is a diagram illustrating the principle of the second invention, and FIG.
FIG. 7 is an explanatory view of the principle of the third invention.

As shown in FIG. 1, a cooling module 1 in which a refrigerant 3 is circulated, and a plate of the cooling module 1
An electronic device that contacts the cooling element; and a power supply control unit 5A that controls a power supply PW supplied to the electronic device.
An electronic device unit in which a cooled element of the electronic device 2 is cooled by circulation of the cooling module 1.
Is fixed to the plate, when the plate <br/> of the cooling module 1 reaches a predetermined temperature, the output signal S to the power supply control unit 5A
A temperature sensor 4 is provided to the cooling module 1 so that the supply of the power supply PW is cut off when the output signal S is transmitted, and as shown in FIG. The element to be cooled is attached to the plate of the cooling module 1.
The electronic device 2 includes: an electronic device 2 that contacts the electronic device 2; and a power control unit 5B that controls a power supply PW supplied to the electronic device 2. The cooling device 3 cools an element to be cooled by the circulation of the refrigerant 3. a device unit, the cooling module 1 flop
A first temperature sensor 4A which is fixed at a rate and sends out temperature information D1 of the plate of the cooling module 1;
Receiving the temperature information D1 according to the heat capacity of the plate.
Compared to the set temperature to be replaced Te, and a detection unit 6A for temperature by the temperature information D1 sends out a disconnect command M reaches the preset temperature to the power control unit 5B provided, the cutting command M is sent as the supply of the power source PW is cut by, or, as shown in FIG. 3, the cooling module 1 in which the refrigerant 3 is circulated, the cooling element to the plate of the cooling module 1
And a power supply control unit 5B for controlling a power supply PW supplied to the electronic device 2. The circulation of the refrigerant 3 cools the element to be cooled of the electronic device 2. an electronic device unit, the cooling module 1
It is secured to the plate, a first temperature sensor 4A for sending <br/> temperature information D1 of the plate of the cooling module 1, the refrigerant
3 is fixed to the supply-side flow passage, and the temperature information D2 of the refrigerant 3
A second temperature sensor 4B for sending, a first temperature sensor
Based on the temperature information D1 and D2 of the second temperature sensor, the relative temperature difference between the plate of the cooling module 1 and the refrigerant 3 is set.
By sending a cutting command M to the power supply control unit 5B when the temperature reaches the temperature, a cutting command changed according to the temperature of the refrigerant.
And a detection unit 6B for setting the temperature of the power supply PW, and the supply of the power PW is cut off when the disconnection command M is transmitted.

The above-mentioned configuration solves the above-mentioned problem.

[0014]

According to the first invention, when the cooling module 1 reaches a predetermined temperature, the temperature sensor 4 for outputting the output signal S is fixed and the output signal S is received by the power supply control unit 5A. Thus, the power supply control unit 5A cuts off the power supply PW supplied to the electronic device 2.

Therefore, when the circulation of the refrigerant 3 is stopped by setting the temperature sensor 4 to a predetermined temperature, the supply of the power PW is cut off due to the rise in the temperature of the cooling module 1. In the case of the second invention, the first temperature sensor 4A that outputs the temperature information D1 to the cooling module 1
And the temperature information D1 is received by the detection unit 6A,
The detecting unit 6A always uses the cooling module 1 based on the temperature information D1.
The temperature of the cooling module 1 is monitored, and when the temperature of the cooling module 1 exceeds a predetermined temperature, a disconnection command M is sent to the power supply control unit 5B, and the power supply PW supplied to the electronic device 2 is disconnected.

Accordingly, the cooling module is connected to the detecting section 6A .
By setting the temperature to be cut off according to the heat capacity of the plate, when the circulation of the refrigerant 3 is stopped, the supply of the power supply PW is cut off due to a rise in the temperature of the cooling module.

Further, in the case of the third invention, the first temperature sensor 4A for outputting the temperature information D1 is fixed to the cooling module 1 and the refrigerant supplied to the cooling module 1 is fixed.
The second temperature sensor 4B that outputs the temperature information D2 of
3 and the temperature information D
1, D2 is received by the detection unit 6B, and the cooling module 1
Monitor the relative temperature difference with the electronic device 2 when the temperature difference exceeds a predetermined value.
The power supply PW supplied to the power supply is cut off.

Therefore, when the circulation of the refrigerant 3 is stopped by setting a predetermined temperature difference to be cut in the detecting unit 6B, the supply of the power PW is cut off due to the rise in the temperature of the cooling module 1. .

In this case, the cutting temperature is changed based on the temperature of the refrigerant 3 supplied to the cooling module 1. In the case of the first and second inventions described above,
In normal operation, it is necessary to set based on the highest refrigerant temperature so that the power supply PW is not accidentally turned off.If the refrigerant temperature is actually low when circulation stops, the timing of detecting an abnormality is delayed. However, in the third case, since the abnormality is defined and detected based on the temperature of the refrigerant actually supplied when the circulation is stopped, the timing of detecting the abnormality becomes more accurate, and the reliability is improved. Can be improved.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to FIGS. 4A and 4B are explanatory diagrams of an embodiment according to the first invention, wherein FIG. 4A is a configuration diagram, FIG. 4B is a graph of a temperature change between the plate and the semiconductor element when the power is turned on when the refrigerant is stopped,
FIGS. 5A and 5B are explanatory diagrams of one embodiment according to the second invention, in which FIG. 5A is a configuration diagram, and FIG. 6 is an explanatory view of an embodiment according to the third invention, (a) is a configuration diagram, and (b) is a graph of a temperature change between a plate and a semiconductor element. Throughout the drawings, the same reference numerals indicate the same objects.

As shown in FIG. 4A, the cooling module
The temperature sensor 4 is fixed to the plate 1A where the circulation of the refrigerant 3 forming 1 is performed. Semiconductor device mounted on printed circuit board 2A
2B is cut off.

In such a configuration, when the refrigerant 3 supplied by the pipe 12D stops due to a failure, the semiconductor element
2B, the temperature once rises to 100 ° C. as shown by the curve d in FIG. 4 (b), and the temperature further rises after the refrigerant 3 remaining on the plate 1A boils as shown in part E. As shown in the curve c, the temperature of the plate 1A having a large heat capacity rises more gradually than the curve d.

When the temperature of the temperature sensor 4 reaches 100 ° C., the temperature of the semiconductor element 2B already exceeds the critical temperature for element destruction. However, for example, the heat capacity of the plate 1A is 1600
0J / deg or less, the apparent heat capacity of the semiconductor element 2B is 20deg.
As described above, if the heat generation from the semiconductor element 2B is 20W and the total heat generation of the cooling module 1 is about 2KW, the coolant can be set by setting the temperature of the plate 1A to 50 ° C and outputting the output signal S. An abnormality can be detected in a state where the temperature of the semiconductor element 2B is about 100 ° C. in about 150 seconds or less after the supply of 3 is stopped.

Therefore, as the temperature sensor 4, 50 ° C.
By using a thermostat or the like that is set to output the output signal S, it is possible to prevent the semiconductor element 2B from exceeding the element breakdown critical temperature when the refrigerant 3 is stopped.

In the case of FIG. 5 (a), a first temperature sensor 4A for outputting temperature information D1 is fixed to the plate 1A, and the temperature information D1 is received by the detection unit 6A and set in the detection unit 6A. The disconnection command is sent from the detector 6A to the power controller 5B according to the set value.
M is transmitted, and the power supply control unit 5B is configured to cut off the power PW supplied from the power supply device as shown by the arrow A to the semiconductor element 2B mounted on the printed circuit board 2A.

With this configuration, as shown in FIG. 5B, when the heat capacity of the plate 1A is 16000 J / deg and the total heat generation of the cooling module 1 is about 2 KW,
The temperature rise of 1A is as shown by curve c, but when the heat capacity of plate 1A becomes smaller than 16000 J / deg, the temperature rise becomes
A curve c1 shown by a dotted line that has a sharp rise more than c.
Becomes

Therefore, at the point P2 where the temperature of the plate 1A reaches 50 ° C. according to the temperature information D1, the semiconductor element 2B still has a sufficient margin for the element destruction dangerous temperature. In the temperature range of refrigerant 3
It is necessary that the set temperature can be changed according to the heat capacity of the plate 1A.

Therefore, by setting the set temperature at which the cutting command M is sent from the detection unit 6A in accordance with the heat capacity of the plate 1A, the temperature of the plate 1A rises as shown by the curve c1. F higher than 50 ℃ reaching P3 point
In ° C., the cutting command M can be output from the detection unit 6A, and the set temperature at which the cutting command M is output according to the heat capacity of the plate 1A can be corrected.

Further, in the case of FIG. 6A, a first temperature sensor 4A for outputting temperature information D1 is fixed to the plate 1A, and a second temperature sensor D2 for outputting temperature information D2 of the supplied refrigerant 3 is provided. A temperature sensor 4B is provided in the pipe 12D, and the temperature information D1 and D2 are received by the detection unit 6B. When the temperature difference between the temperature information D1 and D2 reaches the value set in the detection unit 6B, the detection unit 6B The disconnection command M is sent to the power control unit 5B, and the power control unit 5B
The power supply PW supplied from the power supply device as shown by the arrow A is cut off to the semiconductor element 2B mounted on the printed circuit board 2A.

With this configuration, as shown in FIG. 6 (b), the temperature of the refrigerant 3 supplied to the plate 1A is normally 30 ° C. of G, but actually, G 2 10 ℃ ~
G1 is supplied in the range of 40 ° C, so the temperature of refrigerant 3 is 10 ° C
In the case of, the temperature rise of the plate 1A becomes the curve c12,
When the temperature is 40 ° C., the curve becomes c11. For example, when the temperature based on the temperature information D1 is 50 ° C.
When the temperature reaches 0 ° C., the time from when the cutting command M is transmitted to when the power supply PW is cut off differs depending on whether the temperature of the refrigerant 3 is 10 ° C., 30 ° C., or 40 ° C. In the case of 10 ° C., the time until an abnormality is detected becomes longer, and thus the semiconductor element 2B exceeds the allowable junction temperature.

Then, when the difference between the temperature information D1 and D2, that is, the temperature difference between the supplied refrigerant 3 and the plate 1A reaches T ° C. at which it can be determined that the state is sufficiently abnormal, a cutting command M is transmitted. In this way, what is cut at point P12
This can be performed at the point P14, so that the semiconductor element 2B does not exceed the element breakdown critical temperature.

Since the temperature of the refrigerant 3 circulating in the plate 1A actually rises in the range of 3 to 8 ° C. on the supply side and the return side, a cutting command M from the detection unit 6B is transmitted. The temperature difference T needs to be set to 10 to 15 ° C. For example, if the temperature difference T is set to 10 ° C, the temperature of the refrigerant 3 becomes 30 ° C.
If the temperature of the refrigerant 3 is 40 ° C., the disconnection command M will be sent out at the point P11, so that the power supply PW can be surely cut off, and the supplied refrigerant 3
Even if there is a variation in the temperature, the power supply PW can be reliably cut off without breaking or burning the semiconductor element 2B.

[0033]

As described above, according to the present invention,
By fixing the temperature sensor to the plate forming the cooling module, when the temperature of the plate reaches a predetermined temperature,
The power supplied to the electronic device can be cut off to prevent the semiconductor element mounted on the electronic device from being broken or burnt.

Therefore, even if the refrigerant circulated through the cooling module stops due to an obstacle or the like, it is possible to prevent damage to a large number of semiconductor elements from being destroyed or burnt, and the practical effect is large.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating the principle of the first invention;

FIG. 2 is a diagram illustrating the principle of the second invention.

FIG. 3 is a diagram illustrating the principle of the third invention.

FIG. 4 is an explanatory view of one embodiment according to the first invention.

FIG. 5 is an explanatory view of one embodiment according to the second invention.

FIG. 6 is an explanatory diagram of one embodiment according to the third invention.

FIG. 7 is a conventional configuration diagram.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Cooling module 2 Electronic device 3 Refrigerant 4 Temperature sensor 4A 1st temperature sensor 4B 2nd temperature sensor 5A, 5B Power supply control part 6A, 6B detection part

Claims (3)

(57) [Claims] A cooling module in which a refrigerant is circulated; an electronic device for bringing a cooled element into contact with a plate of the cooling module; and a power control unit for controlling a power supplied to the electronic device. Cooling of the electronic equipment by circulation of refrigerant
An electronic device unit for cooling a cooling element, comprising a temperature sensor fixed to a plate of the cooling module , and sending an output signal to the power supply control unit when the plate of the cooling module reaches a predetermined temperature. An electronic device unit wherein the supply of the power is cut off by sending the output signal. 2. A cooling module in which a refrigerant is circulated, an electronic device for bringing a cooled element into contact with a plate of the cooling module, and a power control unit for controlling a power supplied to the electronic device. Cooling of the electronic equipment by circulation of refrigerant
An electronic device unit cooling却素Ko is performed, is fixed to the plate of the cooling module, a first temperature sensor for sending temperature information of the plate of the cooling module, receives the temperature information, the temperature information The plate
Compared to the set temperature to be replaced depending on the heat capacity, that the temperature according to the temperature information provided a detector for sending a disconnect command to reach the set temperature to the power control unit, the cutting command is sent An electronic device unit, wherein the power supply is cut off. 3. A cooling module in which a refrigerant is circulated, an electronic device for bringing a cooled element into contact with a plate of the cooling module, and a power supply control unit for controlling a power supplied to the electronic device. Cooling of the electronic equipment by circulation of refrigerant
An electronic device unit cooling却素Ko is performed, is fixed to the plate of the cooling module, a first temperature sensor for sending temperature information of the plate of the cooling module, the flow channel of the supply side of the refrigerant A second temperature sensor that is fixed and sends temperature information of the refrigerant, and a first temperature sensor
Receiving the temperature information of the sensor and the second temperature sensor , and calculating the relative temperature difference between the plate of the cooling module and the refrigerant by the set temperature.
To send a disconnection command to the power control unit when
Therefore, the temperature of the cutting command changed according to the temperature of the refrigerant
An electronic device unit comprising: a detection unit for setting ; and the supply of the power is cut off when the disconnection command is transmitted.