JP2580458Y2 - Foam solder supply material - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foam solder supply material for accurately supplying a foam solder to an automatic feeding device.

[0002]

2. Description of the Related Art As a method of soldering an electronic component to a printed circuit board, there are a soldering method, a flow method, and a reflow method.

[0003] The ironing method is a method of performing soldering while melting wire solder with a soldering iron. An operator holds a wire solder in one hand and a soldering iron in the other hand.
Since soldering is performed for each soldering portion, productivity is extremely low. Therefore, today, this ironing method is used for post-mounting for soldering an electronic component having no heat resistance to a printed circuit board soldered by a flow method or a reflow method, which will be described later, or for replacing the electronic component.

The flow method is a method in which an electronic component is mounted on a printed board, and the printed board is brought into contact with molten solder to solder the electronic component and the printed board. This method is extremely excellent in productivity because all the soldered portions of the printed circuit board can be soldered in one operation, and is used for soldering many printed circuit boards today. However, the flow method cannot be used for a soldered portion having irregularities because it is brought into contact with the molten solder.

[0005] The reflow method means that solder is placed in advance on a soldering portion of a printed circuit board, electronic components are mounted thereon, and the reflow furnace, an infrared irradiation device, a laser irradiation device, a hot air device, a high-temperature steam, The soldering is performed by melting the solder by heating with a heating device such as a device. Since the reflow method is also excellent in productivity,
It is used not only for soldering printed circuit boards and electronic components, but also for producing electronic components such as ICs.

As the solder used in the reflow method, there are a solder paste obtained by mixing a powder solder and a flux, and a foam solder formed into a washer, a pellet or the like.

[0007] Since the solder paste is applied to the soldering portion by screen printing or dispensing by a dispenser, only those having a flat soldering portion can be used. In addition, since the solder paste is a mixture of powder solder that is easily oxidized and an active flux,
If a long period of time elapses, the powder solder is eroded by the flux and oxidized or a reaction product is formed, which causes a temporal change. Solder paste that has changed over time not only results in high viscosity, making screen printing and dispenser discharge impossible, but also results in poor soldering, such as the formation of unsolder and small solder balls that do not adhere to the solder during soldering. Becomes

On the other hand, since the foam solder can be placed on the soldering portion regardless of the unevenness of the soldering portion, it is used for general purposes. Also, if foam solder is stored in a place without moisture, it will not oxidize or produce reaction products even after a considerable period of time, and solder paste that does not cause poor soldering due to them will not occur. There are no excellent features. Accordingly, foam solders are increasingly used today.

Conventionally, when a form solder is supplied to a soldering portion, an operator conventionally holds the solder piece one by one with a pair of tweezers. Therefore, it is very poor productivity to supply one by one by an operator. Therefore, recently, a device for automatically supplying a form solder has been considered. This automatic feeding device sucks a foam solder with air tweezers, carries it to a scattered soldering part according to instructions from a computer, and places the foam solder there.

[0010]

However, when the foam solder is supplied to the automatic supply device, accurate suction cannot be performed even if an attempt is made to suction with air tweezers if the foam solder is placed in a mess. That is, if the air tweezers hit the end of the foam solder, the foam solder cannot be sucked, or two foam solders will be sucked together.

Further, if air tweezers do not hit a predetermined position of the foam solder, for example, the center of the foam solder, when the foam solder is sucked by the air tweezers and placed on the soldering part, the foam solder and the soldering part are separated. Even if the foam solder is melted, the solder may adhere to unnecessary places.

Further, the foam solder is an alloy of lead, and since lead has the property of diffusing into solids only by being placed on top of one another, a large number of foam solders are used in plastic boxes, polyethylene bags, etc. If you put it in
Form solders adhere to each other, and when suction is performed with air tweezers, a plurality of foam solders may be suctioned.

According to the present invention, a foam solder supply material that can always supply one piece of foam solder to an automatic supply device and that can apply air tweezers of the automatic supply device to a predetermined position of the foam solder is provided. To provide.

[0014]

Means for Solving the Problems The present inventors have proposed that if the foam solder can be sent one by one to the automatic feeding device, the air tweezers can be applied to a predetermined position and the foam solder can be prevented from overlapping. The present invention was completed by paying attention to the fact that foam solders do not adhere to each other.

In the present invention, a plurality of holes are formed in the center of a long strip at predetermined intervals in the longitudinal direction, and an adhesive tape is stuck on the back surface of the strip, and the strip is provided with a plurality of holes. Foam solder is provided on a surface thereof, and the foam solder is adhered with an adhesive tape through the hole.

[0016]

[Function] Because the foam solder is placed in holes drilled at regular intervals in the strip, if the strip is sent at regular intervals, the foam solder will always be at a fixed position, and the tweezers of the automatic feeding device will be foamed. It can be applied to a predetermined position of the solder. Further, since the sheets are placed one by one on the belt-shaped material, the plurality of foam solders do not overlap, and the form solders do not adhere to each other.

[0017]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG.
2 is a front sectional view of the foam solder supply material of the present invention, FIG.
FIG. 3 is a plan view of the same, and FIG. 3 is a perspective view in which the form solder of the present invention is wound.

The foam solder supply material 1 is a strip material 2,
It comprises an adhesive tape 3 and a foam solder 4. The long strip 2 is made of paper, resin, or the like, and has a back surface on which a release treatment for easily peeling off the adhesive tape has been performed. A plurality of holes 5 are formed in the strip 2 at regular intervals in the longitudinal direction. The hole is oblong with respect to the longitudinal direction. A plurality of sprocket holes 6 are also formed at both sides of the strip 2 at regular intervals.

An adhesive tape 3 having an adhesive applied to one side is attached to the back surface of the strip 2, that is, the surface on which the release treatment has been performed. The adhesive tape 3 is narrower than the horizontal width of the horizontal hole 5. As shown in FIG. 1, the adhesive tape 3 is stuck to the strip 2 in the horizontally elongated hole 5, as shown in FIG. 1, so that the adhesive surface is substantially flush with the surface of the strip 2. Has become.

A square pellet-shaped foam solder 4 is placed on the hole 5 at a central position with respect to the hole 5, and the lower surface of the foam solder is adhered by the adhesive surface of the adhesive tape 3. The foam solder supply material to which a large number of foam solders are adhered is wound as shown in FIG.

Next, the use state of the foam solder supply material of the present invention will be described. A sprocket (not shown) is engaged with the sprocket holes 6, and the wound foam solder supply material is fed in one direction at a constant speed while being rewound (arrow A). Then, when the form solder arrives at a predetermined position, the adhesive tape 3 is peeled off from the strip 2 (arrow B). Then, the adhesive tape 3 that has entered the back of the hole 5 of the strip 2 and has adhered the foam solder 4 with the adhesive surface is peeled off from the strip 2 and also from the foam solder 4. Therefore, the foam solder is free and remains on the strip 2. The air solder tweezers 7 of the automatic supply device is applied to the foam solder in the free state and sucked (arrow C), carried to a predetermined position on a printed board (not shown), and placed there.

Electronic components are further placed on the printed circuit board on which the form solder is placed, and thereafter, the printed circuit board and the electronic components are soldered by heating with a suitable heating device. If flux is required during soldering, apply the flux before placing the foam solder. In the case of soldering without using a flux, for example, when using an active gas such as hydrogen gas or formic acid gas, soldering can be performed only by mounting a foam solder and an electronic component.

[0023]

As described above, in the foam solder supply material of the present invention, since the foam solder is adhered to the strip at regular intervals, the foam solder is always at a fixed position. Therefore, when the foam solder peeled from the adhesive tape is sucked by the air tweezers of the automatic supply device, the air tweezers can be always applied to a certain position of the foam solder, and the foam solder carried by the automatic supply device is printed on the printed circuit board. It is placed in a predetermined position, and there is no defect due to the displacement of the solder. In addition, the foam solder supply material of the present invention has foam solder attached to the strip one by one, so that the foam solder does not overlap and adhere to each other, and the supply to the soldering part must be one by one. Thus, the present invention has excellent effects in reliability.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a foam solder supply material of the present invention.

FIG. 2 is a plan view of the foam solder supply material of the present invention.

FIG. 3 is a perspective view of a state in which the foam solder of the present invention is wound.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Foam solder supply material 2 Strip material 3 Adhesive tape 4 Foam solder 5 Horizontal hole 6 Sprocket hole 7 Air tweezers

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B23K 3/06 B23K 35/14

Claims (2)

(57) [Scope of request for utility model registration] 1. A plurality of holes are formed in the center of a long strip at predetermined intervals in a longitudinal direction, and an adhesive tape is attached to a back surface of the strip, and a front surface of the strip is formed. A foam solder supply material, wherein a foam solder is placed, and the foam solder is adhered with an adhesive tape through the hole. 2. The foam solder supply material according to claim 1, wherein a number of feed holes are formed on both sides of the band-shaped material.