JP2576347Y2 - IC socket - Google Patents

Description

[Detailed description of the invention]

[0001]

The present invention relates to an IC carrier for carrying an IC package having an L-shaped lead, and mounting the carrier, and connecting the IC package lead to an external circuit such as a printed circuit board. The present invention relates to a structure of an IC socket connected to the IC socket.

FIG. 10 shows a practical application 3 proposed by the present applicant.
FIG. 10 is a cross-sectional view of an IC carrier for an IC package 11 having an L-shaped lead as shown in FIG. 9 described in -107091 (Japanese Utility Model Laid-Open No. 5-55556) .

An IC package 11 having an L-shaped lead 12 is mounted on a carrier body 1, and a cover 2 pivotally attached to the carrier body 1 by a hinge 3 is attached to the carrier body 1.
When the lead 12 is closed, the lead 12 comes into close contact with the support portion 1d, and at the same time, the tip 12a of the lead is exposed as shown in FIG. 10, and is mounted in an IC socket as shown in FIG. 11 or FIG. Being used.

In the IC socket shown in FIG. 11, the IC carrier is inserted vertically, and the cover 14 of the IC socket is closed to close the contact portion 5a of the contact pin implanted in the IC socket at the tip 12a of the lead. Press
The electrical connection between the lead 12 and the contact pin 5 is enabled.

However, in the case of the above IC socket, the IC
The cover 14 of the IC socket must be opened and closed when the carrier is attached and detached, and it is very difficult to completely automatically attach and detach the IC carrier to and from the IC socket by a machine.

FIG. 12 shows a so-called open-top type IC socket. By moving the frame-shaped cover 9 up and down, the contact pin 5 is moved in the direction of arrow A, and at the same time, the IC carrier by the latch 6 is moved. Is fixed and released.

In the case of the IC socket shown in FIG. 12, when mounting the IC carrier, the upper surface 2a (FIG. 8) of the cover is absorbed by a handler and transported to the upper part of the IC socket. Press down and latch 6
And the contact pins 5 are moved to a position where the IC carrier can be mounted on the IC socket, and the handler mounts the IC carrier on the IC socket, and the frame type cover 9 is released from being depressed.
Fix the carrier to the IC socket, and
By pressing the lead 12, the contact pin 5 and the lead 12 are in an electrically connectable state.

[0008]

However, in the case of an IC socket as shown in FIG. 12, the width of the IC socket is inevitably increased in order to place the IC carrier horizontally, and a printed circuit board or the like connected to the IC socket is required. IC on
The space occupied by the sockets is required widely, and a large number of IC sockets cannot be mounted on a single printed circuit board or the like.

In view of such circumstances, the present invention is an open-top type IC socket as shown in FIG.
Provided are an IC socket in which the width of the IC socket is reduced by vertically mounting the C carrier as in the IC socket shown in FIG. 11, and an IC package carrier having an L-shaped lead that can be mounted in the IC socket. The purpose is to:

[0010]

According to the present invention, there is provided a carrier for an IC package having an L-shaped lead comprising a carrier body provided with a tapered surface on a side facing a support portion of the lead and a cover, and the carrier is vertically arranged. The above-mentioned problem is solved by an open-top type IC socket having a pair of latches for clamping and fixing in an inserted state.

[0011]

According to the present invention, an IC having an L-shaped lead is provided.
The package is mounted on a carrier body having a tapered surface on the side facing the support portion of the lead, and a cover having a tapered surface is closed in the same manner as the carrier body.

Next, the frame-shaped cover of the IC socket is pushed down to move the pair of latches to a position where the IC carrier can be inserted into the IC socket, so that the leads of the IC carrier carrying the IC package are on the lower side. When the frame cover of the IC socket is returned to the original position, the latch also attempts to return to the original position, thereby pressing the tapered surface of the IC carrier and moving the IC carrier downward. Then, the leads are pressed against the contact portions of the contact pins, and then the IC carrier is fixed to the IC socket by clamping the lower surface of the carrier body and the upper surface of the cover from both sides with a pair of latches.

[0013]

FIG. 1 is a perspective view of an IC carrier for carrying an IC package 11 having an L-shaped lead 12 shown in FIG. 9 according to the present invention. Conventionally, as shown in FIG. 10, except that tapered surfaces 1b and 2b are provided on the side of the carrier body 1 and the cover 2 opposite to the support portion 1d of the lead, and a suction surface 2c is provided at the tip of the tapered surface 2b of the cover 2. Has the same structure as that of the IC carrier.

FIG. 2 shows an IC socket according to the present invention, and FIG.
And FIG. 3 is a front vertical sectional view showing a state where the IC carrier shown in FIG. Reference numeral 4 denotes a socket body in which a large number of contact pins 5 are implanted, and reference numeral 6 denotes a central portion pivotally connected to the socket main body 4 by a shaft 7 so as to be rotatably mounted on the suction surface 2c of the IC carrier. A pair of latches facing each other, 8 is a coil spring attached to the shaft 7 to urge the latch 6 to the inside of the socket body 4, and 9 is a frame mounted to be movable up and down with respect to the socket body 4. The cover 10 is a cam attached to the latch 6, and is a pressing portion 9a of the frame cover.
Is associated with.

Next, the IC carrier shown in FIG.
The operation when the device is mounted on the IC socket shown in FIG. First, when the frame-shaped cover 9 is pressed downward, the pressing portion 9a of the frame-shaped cover presses the cam portion 10 to rotate the latches 6 facing each other to the outside of the socket body 4 as shown in FIG. .

Next, the suction surface 2a of the IC carrier is sucked by a handler, and inserted into the mounting opening 9b of the frame-shaped cover of the IC socket.
a is placed on the contact portion 5a of the contact pin. Then, when the force pressing the frame-shaped cover 9 is removed, the latch 6 tries to return to the original position by the force of the coil spring 8, and as shown in FIG. When the surfaces 1b and 2b are pressed, the tapered surface 1
2b move downward while rubbing the sliding portion 6a of the latch to deform the spring portion 5b of the contact pin.
As shown in (1), the IC carrier is mounted in the IC socket, and the lower surface 1a of the carrier body and the upper surface 2a of the cover are pressed by the pair of latches 6, thereby fixing the IC carrier to the IC socket.

When the IC carrier is taken out of the IC socket, the handler is inserted through the mounting opening 9b of the frame cover.
Insert into the C socket and insert I through the notch 6a of the latch.
After the suction surface 2c of the C carrier is suctioned and the frame 6 is pressed again to bring the latch 6 into the state shown in FIG. 4, the handler is pulled out of the IC socket and the IC carrier is taken out.

In the case of the IC carrier shown in FIG. 1, the suction surface 2c is provided on the cover 2 side.
It may be provided on the side. In addition, when a handler that suctions a surface is not used, it is not necessary to provide the suction surface 2c.

The shape of the contact pins of the IC socket is not limited to those shown in FIGS. 2, 4, and 5. For example, when the contact portion 5a moves up and down as shown in FIG. A contact pin 5 with little movement in the direction of arrow B of 5a may be used. In the case where the lead 12 of the IC package is short, if the contact pin 5 as shown in FIG. 6 is used, the connection between the lead 12 and the contact pin 5 is performed smoothly.

An IC package 11 in which legs 13 are provided at both ends of a row of L-shaped leads 12 as shown in FIG.
In this case, as shown in FIG. 8, an IC carrier having the support portion 1e of the foot portion 13 on both sides of the support portion 1d of the lead may be used.

[0021]

As described above, if the IC socket and the IC carrier of the present invention are used, an I-shaped lead having an L-shaped lead can be obtained.
The attachment and detachment of the IC carrier carrying the C package to and from the IC socket can be easily automated, and the width of the IC socket can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an IC carrier according to the present invention.

FIG. 2 shows an I according to the present invention equipped with the above IC carrier.
FIG. 3 is a longitudinal sectional view of the side of the C socket.

FIG. 3 is a front vertical sectional view of the IC socket according to the present invention.

FIG. 4 is a side vertical sectional view showing a state in which the frame-shaped cover of the IC socket according to the present invention is pressed down.

FIG. 5 shows the IC socket shown in FIG.
FIG. 7 is a side vertical view showing a state in which a C carrier is being mounted.

FIG. 6 is a plan view showing another example of the contact pins implanted in the IC socket according to the present invention.

FIG. 7 is a perspective view showing an example of an IC package having L-shaped leads.

FIG. 8 is a cross-sectional view illustrating a second embodiment of the IC carrier according to the present invention in which the IC package is mounted.

FIG. 9 is a perspective view showing another example of an IC package having L-shaped leads.

FIG. 10 is a cross-sectional view showing a state where the IC package shown in FIG. 8 is mounted on a conventional IC carrier.

11 is a side longitudinal sectional view showing an example of a conventional IC socket to which the IC carrier shown in FIG. 10 is mounted.

12 is a side partial longitudinal sectional view showing another example of the conventional IC socket to which the IC carrier shown in FIG. 10 is mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier main body 2 Cover 3 Hinge 4 Socket main body 5 Contact pin 6 Latch 7 Axis 8 Coil spring 9 Frame type cover 10 Cam part 11 IC package 12 Lead 13 Foot part 14 IC socket cover

Claims (1)

(57) [Scope of request for utility model registration] 1. A carrier body, a carrier cover that closes to the carrier body, a support part that can be in close contact with an L-shaped lead of an IC package housed in the carrier, and an opening that exposes at least a tip part of the lead. And both the carrier body and the carrier cover,
An IC carrier provided with a tapered surface on the side opposite to the support portion is mounted on the socket body, and the cover provided on the socket body is moved up and down by a latch pivotally supported by the socket body. In an IC socket in which a carrier is fixed to and released from the socket main body to connect and disconnect a lead and a contact pin, the carrier can be vertically inserted into the cover.
An IC socket having a mounting opening , and a pair of latches having a substantially inverted L-shaped cross-sectional shape pivotally supported by the socket body so as to face each other so as to be able to clamp and press.