JP2565835B2 - Case integrated connector and soldering method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a case-integrated connector used for electrically connecting a mating connector to a substrate through the connector and a soldering method thereof.

[0002]

2. Description of the Related Art Conventionally, a connector 51 shown in FIGS.
Has an insulator 52 and a plurality of conductive contacts 53 assembled to the insulator 52.

The insulator 52 has a large groove 55 for receiving and fitting a mating connector (not shown) on one surface.
And a pair of mounting blocks 57 provided so as to project from both end surfaces of the insulator 52. The mounting block 57 is a part that mounts the insulator 52 on a board 58 such as a printed circuit board and fixes the board 58 and the insulator 52 with screws or the like.

The contacts 53 are contact portions 53a which are arranged in parallel with each other in the groove portion 55, and each contact portion 53.
A holding portion 53b that penetrates the bottom wall of the groove 55 from one end of a and is held by the bottom wall at the penetrating portion, and a terminal formed by bending the holding portion 53b outside the insulator 52 at a right angle and forming the tip portion. And a portion 53c.

The terminal portions 53c are inserted in a plurality of through holes 59 formed in the substrate 58 in a one-to-one correspondence with the substrate 5.
It is connected to the conductive portion formed on the surface opposite to 8 by soldering 60.

Further, the connector 61 shown in FIG. 6 has an insulator 62 and a plurality of conductive contacts 63 attached to the insulator 62.

The insulator 62 has a large groove portion 68 on one surface for receiving and fitting a mating connector (not shown).
And a board mounting flange 65 provided on the outer bottom surface of the insulator 62. After the insulator 62 is brought into contact with the edge portion of the board 66, the board mounting flange 65 is a portion that is fixed to the board 66 with screws or the like.

The contacts 63 have contact portions 63a which are arranged in parallel in the groove portion 68 with a space therebetween, and each contact portion 63.
A holding portion 63b which penetrates the bottom wall of the groove portion 68 from one end of a and is held by the bottom wall at the penetrating portion, and a terminal portion 63c formed at the tip portion of the holding portion 63b bent at a right angle. have.

The terminal portions 63c are connected by soldering to the conductive portions formed on one surface of the substrate 66 facing the terminal portions 63c. The connector 61 is attached to the case 70 and includes the contacts 6
In this structure, the third connecting portion 63c is located inside the case 70.

The connector 51 shown in FIG. 5 employs each step shown in FIG. 7 in the soldering step and the assembly step. In FIG. 5, each process is shown in stages of 1-10. First, the adhesive 8 is applied to one surface B of the substrate 58.
After applying No. 1, a chip component 82 such as a semiconductor is attached to the adhesive 81 portion. Then, the adhesive 81 is cured by the ultraviolet irradiation source 83 or the infrared heating source to fix the chip component 82 on the one surface B of the substrate 58. After that, the front and back of the substrate 58 are reversed to apply the cream solder 8 on the opposite surface A.
4 is applied, another chip component 85 is mounted on the cream solder 84, and reflow soldering is performed by the infrared heating source 88.

Further, the connector 51 shown in FIG. 4 is mounted on the opposite surface A of the substrate 58, and the discrete component 90 is discretely inserted on the opposite surface A of the substrate 58. Next, after performing flow soldering 60 on one surface B of the substrate 58 in the flow tank 91, cleaning is performed in the cleaning tank 92 to remove residual flux, dust, and other adhering substances, and the soldered substrate 58 and connector 58. 51 is assembled in a case 93 which is separate from these.

[0012]

However, in the connector 51 shown in FIGS. 4 and 5, the number of steps is extremely large and, as a result, the manufacturing cost is high.

Further, in the configuration of the case 70 and the connector 61 shown in FIG. 6, since the board 66 is located inside the one end surface 72 of the case 70, heat generated in the flow soldering process on the one surface B of the board 66 is reduced. The terminal portion 63c, the insulator 62, and the like are adversely affected by the influence of the above.

The case 70 and connector 61 shown in FIG.
If the flow soldering is to be performed, the terminal portion 63c, the insulator 62 and the like are masked in advance. As a result, a masking step is additionally required, which further increases the number of manufacturing steps, which is one of the causes of cost increase.

Therefore, an object of the present invention is to improve the soldering process of the connector provided on the case through the soldering process, and to reduce the assembling process to the case. It is to provide a soldering method.

[0016]

According to the present invention, a connector main body, a case in which the connector main body is provided, and a substrate held in the case are included, and the connector main body is an insulator and is attached to the insulator. A conductive contact, the insulator has a fitting portion that projects outside the case and fits into a mating connector, and the contact includes a contact portion provided in the fitting portion and the insulator. In a case-integrated connector having a holding portion held in, and a terminal portion connected to the substrate,
The case has a frame part that integrally projects the insulator by protruding the fitting part to the outside, and the substrate is outside the frame part and at a predetermined interval on one end surface of the frame part. A connector integrated with a case is obtained, which is characterized in that the connector is held by a part.

Further, according to the present invention, the case has a board mounting flange that extends outside the one end surface of the frame portion and holds the board. A body connector is obtained.

Further, according to the present invention, the frame portion is cylindrical, and the one end surface and the other end surface of the frame portion are respectively provided with a packing material, and the one end surface and the other end surface are watertight. A case-integrated connector characterized by having an attached lid is obtained.

Further, according to the present invention, in the method for soldering a case-integrated connector in which the contacts of the case-integrated connector are connected to the substrate by soldering, the connector body is mounted on the substrate and the frame portion is attached to the frame portion. Holding the substrate, inserting the terminal portion into a through hole of the substrate, mounting discrete components on the substrate, and soldering the terminal portion to the substrate during a soldering process of the discrete components, A method for soldering a case-integrated connector is obtained.

[0020]

According to the present invention having the above-mentioned structure, the contact portion between the substrate and the contact is always positioned outside the one end surface of the frame portion, so that the solder flow tank can be transported and the contact terminal can be transported. The flow soldering process can be performed without masking the parts and insulators.

The case-integrated connector of the present invention is
Assembling can be done with less man-hours compared to a separate case.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the case-integrated connector and its soldering method according to the present invention will be described below with reference to the accompanying FIGS.

First, referring to FIGS. 1 and 2, the case-integrated connector 1 includes a connector body 2, a case 3 provided with the connector body 2, and a printed circuit board held by the case 3. A substrate 4 having a shape.

The connector body 2 includes an insulator 5 and
It has a conductive contact 6 such as a multi-pin contact mounted on the insulator 5. The insulator 5 has a fitting portion 8 on one surface of which a large groove portion 7 into which a mating connector (not shown) is fitted is formed.
The contact 6 includes a contact portion 6a provided in the fitting portion 8, a holding portion 6b extending to one side of the contact portion 6a and partially held by the bottom wall of the groove portion 7, and a terminal portion 6c connected to the substrate 4. And have. The holding portion 6b has a portion extending outside the insulator 5 bent at a right angle. The case 3 has a tubular frame portion 10 provided with the fitting portion 8 protruding outward. The substrate 4 is held outside the frame portion 10 and at one end surface (lower end surface in FIGS. 1 and 2) 10a of the frame portion 10 at a predetermined interval.

A plurality of board mounting flanges 11 for holding the board 4 are provided on one end surface 10a of the frame portion 10. The lower end of the board mounting flange 11 extends below the one end surface 10a of the frame portion 10. That is, the board 4 is fixedly held by the four board mounting flanges 11 provided at the four inner corners of the frame 10 with screws 13 so that the board 4 is located below the one end surface 10 a of the frame 10. . The frame 10 and the board mounting flange 11 are formed by mold-in molding or integral molding.

Further, the one end surface 10a of the frame portion 10 is screwed into the dish-shaped lower lid body 23 through the annular first waterproof packing material 12 so as to cover the opening on one side of the frame portion 10. It is installed watertight. The first packing material 12 is fitted into the groove 14 formed on the one end surface 10a of the frame portion 10.

Further, on the other end surface 10b of the frame portion 10, a flat plate-like upper lid body 16 is provided with a screw 18 so as to cover the opening on the other side of the frame portion 10 via a second annular packing material 15 for waterproofing. Watertightly installed by. The second packing material 15 has grooves 17 formed on the other end surface 10b.
Fit in.

The insulator 5 is attached so that the engaging portion 20 formed on the side opposite to the fitting portion 7 engages with the engaging hole 21 formed in one wall surface of the frame portion 3. The contact 6 is bent at a right angle and is inserted into the through hole of the substrate 4 located below the one end surface 10a of the frame portion 10. The board 4 and the terminal portion 6c always come out from the one end surface 10a of the frame portion 10.

As described above, since the terminal portion 6c of the contact 6 is located outside the one end surface 10a of the frame portion 10, the flow tank, which will be described later in the soldering process, should be located on the back surface side of the substrate 4. It is possible to perform flow soldering on the back surface side of the substrate 10 from which the tips of the contacts 6 project.

Next, an example of a process of soldering related parts and elements mounted in the case of the case-integrated connector of the present invention and assembling with the case will be described with reference to FIG.
In this embodiment, reflow soldering is also performed in order to compare with the conventional example, and the parts used in the same steps as those of the conventional example are denoted by the same reference numerals. Also,
1 step for each process in soldering process and assembly process
It is shown at the stage of ~ 9.

First, after the adhesive 81 is applied to the one surface B of the substrate 4, a chip component 82 such as a semiconductor is attached to the adhesive 81.
Attach. Then, the adhesive 81 is cured by the ultraviolet irradiation source 83 or the infrared heating source, and the chip component 82 is obtained.
Is fixed on one surface B of the substrate. After that, it is confirmed that the adhesive 81 is cured and the chip component 82 is fixed, and the front and back surfaces of the substrate 4 are reversed. Further, cream solder 84 is applied on the opposite surface A of the board 4 which is turned upside down, another chip component 85 is mounted on the cream solder 84, and reflow solder is applied to the one surface A of the board 4 by the infrared heating source 88. Make an attachment.

Needless to say, infrared heating is an example, and local heating such as hot air heating or laser heating may be used.

After that, the connector body 2 is attached to the board 4, the terminal portion 6c of the contact 6 is inserted into the through hole of the board 4, the discrete component 90 is discretely inserted, and then one surface B of the board 4 is flow-soldered. To do. This flow soldering part is one end surface 10 of the frame part 10.
Since it is located outside a, the flow tank 91 can be transported to the flow soldering portion. That is, flow soldering can be performed without masking the terminal portion 6c, the insulator 5, and the like.

It should be noted that in the above-described embodiment, the mounting is described on both surfaces of the substrate 4, but it goes without saying that one-sided surface mounting may also be used. In this case, the step of mounting the chip component on one surface is omitted.

Further, after the surface B of the substrate 4 is subjected to flow soldering, it is sent to a cleaning step for removing residual flux and the like from the portion to which the flow soldering has been applied, and is cleaned by a cleaning tank 92 to remove residual flux and dust. Remove deposits. Next, after cleaning, the upper lid 16 and the lower lid 23
Is attached to the frame portion 10, and the work is completed.

[0036]

As described above, according to the present invention,
Since the connection portion of the contact is located outside the one end surface of the frame portion, the flow soldering work can be performed without previously masking the terminal portion of the contact or the insulator.

This makes it possible to keep the case above the liquid surface of the flow solder in the flow soldering process, and the lower end face of the case is immersed in the high temperature solder liquid by the flow soldering process. No more damage to the case.

Further, when it is used as a waterproof connector, its curing is particularly remarkable.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a case integrated connector of the present invention.

FIG. 2 is a sectional view taken along line I-I of FIG.

FIG. 3 is a flowchart showing a soldering process in mounting components (both sides surface mounting) on a board according to the present invention.

FIG. 4 is an external perspective view showing an example of a conventional connector.

FIG. 5 is a sectional view of the connector of FIG. 4;

FIG. 6 is a cross-sectional view showing another conventional connector.

FIG. 7 is a flowchart showing an example of mounting components on a board in a conventional connector.

[Explanation of symbols]

 1 Case Integrated Connector 2 Connector Body 3 Case 4,66 Board 5,52 Insulator 6,53 Contact 6c, 53c Terminal 8 Fitting 10 Frame 10a One End 11 Board Mounting Flange 12 First Packing Material 15 Second packing material 16 Upper lid 17 Groove 21 Engagement portion 23 Lower lid 82, 85 Chip component 90 Discrete component 91 Flow tank 92 Cleaning tank

Claims (4)

(57) [Claims] 1. A connector main body, a case provided with the connector main body, and a substrate held in the case, the connector main body having an insulator and a conductive contact assembled to the insulator, The insulator has a fitting portion that protrudes out of the case and fits into a mating connector, and the contact includes a contact portion provided in the fitting portion, a holding portion held by the insulator, and the substrate. In a case-integrated connector having a terminal portion to be connected, the case has a frame portion that projects the fitting portion to the outside to integrally provide the insulator, and the substrate is the frame portion. A case-integrated connector, characterized in that the connector is held on the frame portion outside and at one end surface of the frame portion at a predetermined interval. 2. The case-integrated type according to claim 1, wherein the case has a board mounting flange that extends outside the one end surface of the frame portion and holds the board. connector. 3. The frame portion is tubular, and a cover body is watertightly attached to each of the one end surface and the other end surface of the frame portion with a packing material interposed therebetween. The case-integrated connector according to claim 1, wherein the connector has a case. 4. The method for soldering a case-integrated connector according to claim 1, wherein the contacts of the case-integrated connector are connected to the board by soldering. Hold, while inserting the terminal portion into the through hole of the substrate,
A method for soldering a case-integrated connector, comprising mounting a discrete component on the substrate and soldering the terminal portion to the substrate during a soldering process of the discrete component.