JP2540315Y2 - Sealed structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a sealing structure in which a substrate on which an electric component is mounted is mounted inside a case, and the substrate is sealed with a potting material.

[Conventional technology]

When it is necessary to apply moisture-proof treatment to electronic components and substrates inside the case, such as electronic equipment mounted in the engine room, or to protect the case from outside during handling, it is usually sealed with a potting material Is taken. FIG. 4 shows a conventional sealing structure in which a substrate 35 on which electronic components such as an electric component 32 and a connector 33 are mounted is mounted on a case 31.
And sealing is performed by pouring the potting material 36 in this state until all parts are hidden.
In FIG. 4, reference numeral 34 denotes a cord connected to the connector 33. According to such a sealing structure, since the substrate 35 and the electronic components are all concealed by the potting material 36, moisture proof and external force protection for the electronic components are performed, and the appearance is good.

[Problems to be solved by the invention]

However, in this conventional sealing structure, the amount of the potting material increases, so that the weight of the electronic device increases, and the material cost of the potting material also increases, resulting in an increase in cost.

Therefore, as shown in FIG. 5, when the amount of the potting material is reduced to reduce the weight, the tall electronic components are exposed from the potting material, so that an external force may be directly applied to the components and the components may be damaged. There was a problem that was bad.

SUMMARY OF THE INVENTION The present invention is intended to solve such a conventional problem, and it is an object of the present invention to provide a sealing structure capable of minimizing a potting material and reducing the weight, protecting external force on components and improving appearance.

[Means for solving the problem]

In order to solve the above problems, the present invention mounts a substrate on which an electric component is mounted inside a case, and forms a step on the inner side surface of the case in a sealing structure for sealing the substrate with a potting material. A lid having a plurality of fins having substantially the same size as the opening of the case and extending inwardly of the case at both ends is provided, and the potting material is poured to a position higher than the step portion, and the fins are An opening of the case is covered with the lid in a state of being immersed in the potting material while being locked to the step portion, and the lid is fixed by curing the potting material.

[Action]

Since the potting material has an adhesive property, the potting material is adhered to the fins immersed in the potting material to fix the lid. The lid covers the opening of the case to protect the components from external forces, and also makes the inside of the case invisible from the outside.

〔Example〕

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG.
The figure is a sectional view taken along the line BB. A large number of electrical components 8 and electronic components such as connectors 9 are mounted on the board 19 and are fixed inside the case 1. The case 1 is provided with positioning portions 11 and 12 for positioning the lid 2 and step portions 20 and 21 for stopper of the lid 2, and a cut-and-raised portion 17 for fixing the cord 10 of the connector 9 and a vehicle Attachment portions 13 and 14 for attachment to predetermined positions are formed. The mounting portions 13 and 14 have mounting holes 15 and 16 formed therein. The lid 2 is the opening 22 of the case 1
It has almost the same size as
The fins 3 and 4 extend in the direction of the inside and have a U-shaped cross section. A positioning portion formed on the case 1 is provided on the lid 2.
Notches 5, 6 for positioning to engage with 11, 12 and connector 9
A notch 7 for escape of the cord 10 is formed.

In the above configuration, when sealing is performed, first, the substrate 19 on which the electronic components such as the electric component 8 and the connector 9 are mounted is fixed to the case 1 and the potting material 18 is concealed by the substrate 19 and at least the lead terminals of the electronic component. Pour into it. That is,
Minimize the amount of potting. In this state, the first
As shown in the figure, the electronic component protrudes from the potting material 18. In this state, the lid 2 is dropped into the case 1 while positioning the lid 2 with the positioning portions 11 and 12 and the notch portions 5 and 6, and the fins 3 and 4 are potted until the fins 3 and 4 are locked with the steps 20 and 21. Immerse in 18. Thereafter, the potting material 18 is cured by heating to complete the sealing. This state is the second
This is shown in FIG. Since the electric component 8 projecting from the potting material 18 is covered by the lid 2, it can be protected from external force and cannot be seen from outside. Since the potting material 18 has an adhesive property, the potting material 18 is adhered to the fins 3 and 4 during the curing process, and the lid 2 is firmly fixed. That is,
Using the adhesive property of the potting material 18, the lid 2 can be fixed without using a fixture such as a screw. The electronic device, which has been completely sealed, has a mounting portion
3 and 14 are abutted and screwed into the mounting holes 15 and 16 with a mounting tool such as a screw to be fixed.

In the above embodiment, the fins are respectively provided on two sides of the lid. However, the present invention is not limited to this. For example, the fins may be provided on three sides excluding the side where the notch 7 is formed. Good.

[Effect of the invention]

As described in detail above, according to the present invention, it is possible to reduce the weight by minimizing the potting material and to fix the lid using the minimum potting material poured into the case. As a result, cost can be reduced. Further, since the electronic component is covered with the lid, it can be protected from external force during handling, and furthermore, the external appearance can be improved because the inside of the case cannot be seen from the outside.
In addition, by locking the fins at both ends of the lid to the step on the inner side surface of the case, the lid can be easily and securely fitted to a predetermined position of the case.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA in FIG. 1, FIG. 3 is a sectional view taken along the line BB in FIG. 1, FIG. FIG. 2 is a view showing a conventional sealing structure. In the figure, 1, 31 is a case, 2 is a lid, 3 and 4 are fins, 8 and 32 are electrical components, 18 and 36 are potting materials, and 19 and 35 are boards.

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model Showa 60-59564 (JP, U) Japanese Utility Model Showa 53-85549 (JP, U)

Claims (1)

(57) [Scope of request for utility model registration] 1. A sealing structure for mounting a substrate on which an electric component is mounted inside a case and sealing the substrate with a potting material, wherein a step is formed on an inner side surface of the case, and an opening of the case is formed. A lid having a plurality of fins having substantially the same size and extending inwardly of the case at both ends is provided, the potting material is poured to a position higher than the step, and the fins are locked with the step. A sealing structure, wherein the lid is fixed by covering the opening of the case with the lid while being immersed in the potting material, and curing the potting material.