JP2531448B2 - Semiconductor device mounting equipment - Google Patents
Semiconductor device mounting equipmentInfo
- Publication number
- JP2531448B2 JP2531448B2 JP5224859A JP22485993A JP2531448B2 JP 2531448 B2 JP2531448 B2 JP 2531448B2 JP 5224859 A JP5224859 A JP 5224859A JP 22485993 A JP22485993 A JP 22485993A JP 2531448 B2 JP2531448 B2 JP 2531448B2
- Authority
- JP
- Japan
- Prior art keywords
- arm
- semiconductor element
- voice coil
- pressure
- coil motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Die Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板に半導体素子を搭
載する半導体素子実装装置に関し、特に加圧力を高精度
で半導体素子に加える半導体素子実装装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounting apparatus for mounting a semiconductor element on a substrate, and more particularly to a semiconductor element mounting apparatus for applying a pressing force to a semiconductor element with high accuracy.
【０００２】[0002]
【従来の技術】従来の技術としては、例えば、実開平３
−３７３８号公報に記載されたチップ吸着装置がある。
従来の半導体素子実装装置は、図４に示すように、半導
体素子１を真空吸着し基板２に搭載加圧するアーム３
と、加圧方向に移動するアーム３を案内するころがり案
内１０と、アーム３に加圧力を与えるエアシリンダ１１
と、エアシリンダ１１にアーム３に規定の加圧力が加わ
るようにエアを供給する圧力制御機構１２とで構成され
る。2. Description of the Related Art As a conventional technique, for example, an actual Kaihei 3
There is a chip suction device described in Japanese Patent No. 3738.
As shown in FIG. 4, a conventional semiconductor element mounting apparatus has an arm 3 that vacuum-sucks a semiconductor element 1 and mounts and presses it on a substrate 2.
A rolling guide 10 for guiding the arm 3 moving in the pressurizing direction, and an air cylinder 11 for applying a pressing force to the arm 3.
And a pressure control mechanism 12 for supplying air to the air cylinder 11 so that a prescribed pressure is applied to the arm 3.
【０００３】続いて、この従来の半導体素子実装装置の
機能および動作について説明する。半導体素子１を真空
吸着したアーム３は、ころがり案内１０により案内され
て下向きに移動して半導体素子１を基板２上に加圧す
る。加圧力はエアシリンダ１１によって与え、規定の加
圧力が加わるようにエアシリンダ１１に供給するエア圧
力を圧力制御機構１２で調整する。これにより任意の圧
力で半導体素子１を加圧することができる。Next, the function and operation of this conventional semiconductor device mounting apparatus will be described. The arm 3 vacuum-sucking the semiconductor element 1 is guided by the rolling guide 10 and moves downward to press the semiconductor element 1 onto the substrate 2. The pressure is applied by the air cylinder 11, and the air pressure supplied to the air cylinder 11 is adjusted by the pressure control mechanism 12 so that the specified pressure is applied. Thereby, the semiconductor element 1 can be pressed with an arbitrary pressure.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の半導体
素子実装装置は、ころがり案内に案内されてアームが移
動しエアシリンダで加圧力を与えるため、ころがり案内
とエアシリンダで発生する摩擦抵抗、摩擦抵抗の変動、
潤滑剤の粘性の影響により加圧力の誤差が発生するとい
う欠点があり、さらに摩擦抵抗により小さい加圧力が加
えられないという欠点があった。In the conventional semiconductor device mounting apparatus described above, the arm moves under the guidance of the rolling guide and the pressure is applied by the air cylinder, so that the friction resistance and the friction generated by the rolling guide and the air cylinder are applied. Change in resistance,
There is a drawback that an error in the applied pressure occurs due to the influence of the viscosity of the lubricant, and there is a further disadvantage that a smaller applied pressure cannot be applied to the friction resistance.
【０００５】[0005]
【課題を解決するための手段】本発明の半導体素子実装
装置は、半導体素子を真空吸着するアームと、前記アー
ムに加圧力を与えるボイスコイルモータと、前記アーム
を前記ボイスコイルモータの加圧力の方向に案内する平
行板ばねで構成された弾性案内と、前記ボイスコイルモ
ータのコイルに前記アームに規定の加圧力が加わるよう
に電流を流す電流調節器とを含んで構成される。A semiconductor element mounting apparatus according to the present invention includes an arm for vacuum-sucking a semiconductor element, a voice coil motor for applying pressure to the arm, and an arm for applying pressure to the voice coil motor. An elastic guide constituted by parallel leaf springs for guiding in a direction, and a current regulator for supplying a current to the arm of the voice coil motor so that a prescribed pressure is applied to the arm.
【０００６】また、前記アームの加圧方向の変位を測定
する測長器、あるいは、前記弾性案内の平行板ばねのひ
ずみを測定するために平行板ばねに取り付けたひずみゲ
ージを追加した構成としてもよい。Also, a length measuring device for measuring the displacement of the arm in the pressing direction or a strain gauge attached to the parallel leaf spring for measuring the strain of the parallel leaf spring of the elastic guide may be added. Good.
【０００７】[0007]
【実施例】次に、本発明について図面を参照して詳細に
説明する。The present invention will be described in detail with reference to the drawings.
【０００８】図１は、本発明の一実施例を示す構成図で
ある。図１に示す半導体素子実装装置は、半導体素子１
を真空吸着するアーム３と、それぞれにおいて後端が固
定で先端がアーム３に固定された平行板ばねからなり、
アーム３が上下方向に移動するように案内する弾性案内
４と、アーム３に加圧力を与えるボイスコイルモータ５
と、ボイスコイルモータ５のコイルに規定の加圧力が生
じるように電流を流す電流調節器６とで構成される。FIG. 1 is a block diagram showing an embodiment of the present invention. The semiconductor element mounting apparatus shown in FIG.
And a parallel leaf spring having a rear end fixed and a front end fixed to the arm 3,
An elastic guide 4 for guiding the arm 3 to move in the vertical direction, and a voice coil motor 5 for applying a pressing force to the arm 3.
And a current controller 6 which supplies a current so that a predetermined pressure is applied to the coil of the voice coil motor 5.
【０００９】半導体素子１を真空吸着したアーム３は、
ボイスコイルモータ５によって加圧力を与えられ、弾性
案内４により案内されて加圧方向に移動する。規定の加
圧力が加わるようにボイスコイル５に流れる電流を電流
調整器６で調整する。これにより任意の圧力で半導体素
子１を基板２上に加圧することができ、加圧力の誤差を
弾性案内４の平行板ばねのバネ定数とアーム３の移動量
との積で算出できる圧力の範囲内に納めることができ
る。The arm 3 that vacuum-sucks the semiconductor element 1 is
The voice coil motor 5 applies a pressing force, and the elastic guide 4 guides the pressing force to move in the pressing direction. The current flowing through the voice coil 5 is adjusted by the current adjuster 6 so that the specified pressing force is applied. As a result, the semiconductor element 1 can be pressed onto the substrate 2 with an arbitrary pressure, and the pressure range in which the pressure error can be calculated by the product of the spring constant of the parallel leaf spring of the elastic guide 4 and the movement amount of the arm 3 can be calculated. Can be housed within.
【００１０】図２は、本発明の他の実施例を示す構成図
である。図２に示す半導体素子実装装置は、半導体素子
１を真空吸着し基板２に搭載加圧するアーム３と、アー
ム３を加圧方向に案内する平行板ばねで構成した弾性案
内４と、アーム３に加圧力を与えるボイスコイルモータ
５とアーム３に加圧力が加わるようにボイスコイルモー
タ５のコイルに規定の電流を流す電流調節器６と、アー
ム３の加圧方向の変位を測定する測長器７とで構成され
る。FIG. 2 is a block diagram showing another embodiment of the present invention. The semiconductor element mounting apparatus shown in FIG. 2 includes an arm 3 for vacuum-sucking the semiconductor element 1 mounted on the substrate 2 and pressing it, an elastic guide 4 constituted by a parallel leaf spring for guiding the arm 3 in the pressing direction, and an arm 3. A current controller 6 that applies a specified current to the coil of the voice coil motor 5 so that a pressure is applied to the voice coil motor 5 and the arm 3, and a length measuring device that measures the displacement of the arm 3 in the pressing direction. 7 and 7.
【００１１】半導体素子１を真空吸着したアーム３は、
弾性案内４により案内され加圧力をボイスコイルモータ
５によって与えられて移動する。測長器７で測定したア
ーム３の移動量から弾性案内４に生じる力を換算し、電
流調整器６によりコイルに流す電流の補正をする。これ
によりアーム３の位置によらず任意の一定圧力で高精度
で半導体素子１を基板２に加圧できる。The arm 3 that vacuum-sucks the semiconductor element 1 is
Guided by the elastic guide 4, the pressing force is given by the voice coil motor 5 to move. The force generated in the elastic guide 4 is converted from the movement amount of the arm 3 measured by the length measuring device 7, and the current flowing in the coil is corrected by the current regulator 6. As a result, the semiconductor element 1 can be pressed onto the substrate 2 with high accuracy at an arbitrary constant pressure regardless of the position of the arm 3.
【００１２】図３は、本発明のさらに他の実施例を示す
構成図である。図３に示す半導体素子実装装置は、アー
ム３と、弾性案内４と、ボイスコイルモータ５と、電流
調節器６のほかに弾性案内４の平行板ばねのひずみを測
定するために平行板ばねに取り付けたひずみゲージ８及
びひずみゲージ８に接続されるひずみゲージアンプ９と
で構成される。ひずみゲージ８で測定した平行板ばねの
ひずみから弾性案内４に生じる力を換算し、電流調整器
６によりコイルに流す電流の補正をする。これによりア
ーム３の位置によらず任意の一定圧力で高精度で半導体
素子１を基板２に加圧できる。FIG. 3 is a block diagram showing another embodiment of the present invention. The semiconductor device mounting apparatus shown in FIG. 3 includes a parallel leaf spring for measuring the strain of the parallel leaf spring of the elastic guide 4 in addition to the arm 3, the elastic guide 4, the voice coil motor 5, and the current regulator 6. It is composed of the attached strain gauge 8 and a strain gauge amplifier 9 connected to the strain gauge 8. The force generated in the elastic guide 4 is converted from the strain of the parallel leaf spring measured by the strain gauge 8, and the current flowing in the coil is corrected by the current regulator 6. As a result, the semiconductor element 1 can be pressed onto the substrate 2 with high accuracy at an arbitrary constant pressure regardless of the position of the arm 3.
【００１３】[0013]
【発明の効果】本発明の半導体素子実装装置は、弾性案
内でアームが移動しボイスコイルモータで加圧力を与え
るため、摩擦抵抗が無くなり、微小な加圧力も加えられ
るという効果がある。さらに、アームの移動により弾性
案内に発生する力を測長器の測定値や、ひずみゲージの
測定値から換算しボイスコイルに流す電流を補正するこ
とにより、アームの位置によらず任意の一定圧力で高精
度で加圧できるという効果がある。According to the semiconductor element mounting apparatus of the present invention, since the arm is moved by the elastic guide and the pressing force is applied by the voice coil motor, there is an effect that friction resistance is eliminated and a minute pressing force is applied. Furthermore, the force generated in the elastic guide due to the movement of the arm is converted from the measurement value of the length measuring device or the measurement value of the strain gauge to correct the current flowing in the voice coil, so that the pressure can be adjusted to a certain constant pressure regardless of the arm position. There is an effect that the pressure can be applied with high accuracy.
【図１】本発明の一実施例を示す構成図である。FIG. 1 is a configuration diagram showing an embodiment of the present invention.
【図２】本発明の他の実施例を示す構成図である。FIG. 2 is a configuration diagram showing another embodiment of the present invention.
【図３】本発明のさらに他の実施例を示す構成図であ
る。FIG. 3 is a configuration diagram showing still another embodiment of the present invention.
【図４】従来の半導体素子実装装置を示す構成図であ
る。FIG. 4 is a configuration diagram showing a conventional semiconductor device mounting apparatus.
１ 半導体素子 ２ 基板 ３ アーム ４ 弾性案内 ５ ボイスコイルモータ ６ 電流調節器 ７ 測長器 ８ ひずみゲージ ９ ひずみゲージアンプ １０ ころがり案内 １１ エアシリンダ １２ 圧力制御機構 1 semiconductor element 2 substrate 3 arm 4 elastic guide 5 voice coil motor 6 current regulator 7 length measuring machine 8 strain gauge 9 strain gauge amplifier 10 rolling guide 11 air cylinder 12 pressure control mechanism
Claims (3)
記アームに加圧力を与えるボイスコイルモータと、前記
アームを前記ボイスコイルモータの加圧力の方向に案内
する平行板ばねで構成された弾性案内と、前記ボイスコ
イルモータのコイルに前記アームに規定の加圧力が加わ
るように電流を流す電流調節器とを含むことを特徴とす
る半導体素子実装装置。1. An elastic guide including an arm for vacuum-sucking a semiconductor element, a voice coil motor for applying a pressing force to the arm, and a parallel leaf spring for guiding the arm in the direction of the pressing force of the voice coil motor. And a current regulator that causes a current to flow so that a prescribed pressure is applied to the arm of the voice coil motor coil.
測長器を含む請求項１記載の半導体素子実装装置。2. The semiconductor device mounting apparatus according to claim 1, further comprising a length measuring device that measures a displacement of the arm in a pressing direction.
定するために前記平行板ばねに取り付けたひずみゲージ
を含む請求項１記載の半導体素子実装装置。3. The semiconductor device mounting apparatus according to claim 1, further comprising a strain gauge attached to the parallel leaf spring for measuring the strain of the elastic guide parallel leaf spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5224859A JP2531448B2 (en) | 1993-09-10 | 1993-09-10 | Semiconductor device mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5224859A JP2531448B2 (en) | 1993-09-10 | 1993-09-10 | Semiconductor device mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0786317A JPH0786317A (en) | 1995-03-31 |
| JP2531448B2 true JP2531448B2 (en) | 1996-09-04 |
Family
ID=16820291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5224859A Expired - Lifetime JP2531448B2 (en) | 1993-09-10 | 1993-09-10 | Semiconductor device mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531448B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5284683B2 (en) * | 2008-05-08 | 2013-09-11 | アズビル株式会社 | Precision positioning device |
| JP5355122B2 (en) * | 2009-02-05 | 2013-11-27 | アズビル株式会社 | Parameter estimation device |
-
1993
- 1993-09-10 JP JP5224859A patent/JP2531448B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0786317A (en) | 1995-03-31 |
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