JP2531268B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor in which a terminal conductor connected to an electrode of a semiconductor element body supported on a bottom plate of a container is pulled out through a container upper lid to form an external terminal. Regarding the device.

[Conventional technology]

A method of urging a semiconductor device in which a semiconductor element body is protected by directly fixing a semiconductor element body on a bottom plate of a container formed of a metal bottom plate, a resin side wall and a resin top cover or through an insulating plate and injecting resin into the container is described. , Especially, it is widely used because it can be applied even when there are a plurality of elementary bodies. In this case, the semiconductor element body and the external circuit are connected by an external terminal formed by pulling out a band-shaped terminal conductor connected to the electrode of the semiconductor element body inside the container through the container upper lid. Since the ends of such terminal conductors are brazed in place on the bottom plate of the container,
The parallelism of the plate surface of the terminal conductor with the side wall of the container and the positional accuracy become problems. FIG. 2 shows a conventional terminal conductor positioning method. 2 (a) is a vertical sectional view, and FIG. 2 (b) is a lateral sectional view taken along the line BB of FIG. 2 (a). The terminal conductor 1 is
Upper lid 2 and side wall 3 made of resin, bottom plate 4 made of metal
The upper lid 2 of the container formed by the above, the end 12 is soldered to the upper surface of the insulating substrate 5 fixed to the bottom plate 4,
The electrodes of the semiconductor chip (not shown) on the insulating substrate 5 are connected by conducting wires. The portion of the terminal conductor 1 outside the container forms the external terminal 11. Sawtooth-shaped small projections 13 are formed on the sides of the terminal conductor 1 through the upper lid 2 of the container, and the external terminals of the terminal conductor 1 are fixed to the upper lid by press fitting. In addition, the upper lid 2 is formed with a concave projection 21 protruding toward the inner surface, and the terminal conductor is positioned by inserting the terminal conductor 1 into the concave portion. The container 6 is filled with the resin 6 through the injection port 61.

[Problems to be Solved by the Invention]

In addition to securely connecting the electrodes of the semiconductor chip and the external terminals 11, the terminal conductor 1 is made parallel to the upper lid 2 and the bottom plate 4 by penetrating the upper lid 2 and contacting the bottom surface of the concave projection 21 of the upper lid. It has a role to maintain the degree. However, in the semiconductor device shown in FIG. 2, since the terminal conductor 1 is easily removed from the inside of the concave protrusion 21, the soldering position of the end 12 of the terminal conductor 1 to the insulating substrate 5 is displaced, and There is a problem that defects such as incomplete parallelism of the container bottom plate 4 are likely to occur.

An object of the present invention is to solve the above problems and to provide a semiconductor device in which an end portion of a terminal conductor is accurately fixed at a predetermined position, and the terminal conductor surely maintains parallelism between a container top lid and a bottom plate. To provide.

[Means for solving the problem]

To achieve the above object, the present invention provides a semiconductor device in which a terminal conductor connected to an electrode of a semiconductor element body supported on a bottom plate of a container is drawn out through a container top lid to form an external terminal. The conductor has a portion that rises vertically from the bottom plate of the container, and a portion that is parallel to the container upper lid, and extends in a portion that is parallel to the container upper lid at a right angle to its lengthwise direction and is serrated on both sides. It is assumed that a protrusion having a small protrusion is formed and that the protrusion is press-fitted and fixed in the recess of the surface of the upper lid facing the inside of the container.

[Action]

By press-fitting and fixing the protrusion formed on the portion of the terminal conductor parallel to the container top lid into the recess formed on the surface facing the inside of the container, the terminal conductor is prevented from coming off from the top cover, and the container at the end of the terminal conductor is removed. The accuracy of the fixing position on the bottom plate becomes high, and the parallelism between the container top lid and the bottom plate via the terminal conductor is surely maintained, and the occurrence of defects during the semiconductor device manufacturing is reduced.

〔Example〕

1 (a) and 1 (b) show an embodiment of the present invention,
(A) is a vertical cross-sectional view, (b) is a cross-sectional view taken along the line AA of (a), and the same reference numerals are given to the same parts as in FIG. 2. In the figure, a projecting portion 7 is formed in a portion parallel to the upper lid 2 of the terminal conductor 1 whose end 12 is soldered to the insulating substrate 5 fixed to the container bottom plate 4. This protrusion 7
On both sides of, the height is 0.
Small sawtooth-shaped projections 71 of about 2 mm are formed. The terminal conductor 1 is fixed by fixing the protruding portion 7 to the groove-shaped recess 22 formed in the upper lid 2.
It is done by press-fitting into. Since the tip of the small protrusion 71 is engaged with the inner wall of the recess 22 during press-fitting, the terminal conductor 1 is firmly fixed to the upper lid 2 and does not come off.

FIG. 4 shows another embodiment of the present invention for a semiconductor module, and the same parts as those in FIGS. 1 and 2 are designated by the same reference numerals. Although not shown, semiconductor chips are fixed on the insulating substrate 5 on the container bottom plate 4, and the respective electrodes are connected in parallel by being connected to the ends 12 of one terminal conductor 1. In this case, since the length of the terminal conductor 1 in the direction parallel to the bottom plate 4 is long, the protrusion 7 is
Positioning of the terminal conductor 1 is ensured by providing the parts at the respective positions and press-fitting them into the recesses 22 of the upper lid 2.

〔The invention's effect〕

According to the present invention, the protrusion of the terminal conductor inside the container, which extends at right angles to the length direction in the portion parallel to the container upper lid, is press-fitted into the recess of the container upper lid, and at this time, the side of the protrusion is The position of the terminal conductor with respect to the container is secured by preventing it from coming off from the recess by the action of the serrated small protrusions provided on the terminal conductor, and there is no misalignment during the manufacturing process. Since the parallelism between them is maintained, a semiconductor device which can be manufactured with good workability was obtained.

[Brief description of drawings]

1 (a) and 1 (b) show a semiconductor device according to an embodiment of the present invention, (a) is a longitudinal sectional view, (b) is a sectional view taken along the line AA of (a), and FIG. 1 (a) and 1 (b) show a conventional semiconductor device, (a) is a longitudinal sectional view, (b) is a lateral sectional view taken along the line BB of (a), and FIG. 3 is shown in FIG. FIG. 4 is an enlarged view of the vicinity of the protruding portion of the terminal conductor, and FIG. 4 is a vertical sectional view of a semiconductor device according to another embodiment of the present invention. 1: Terminal conductor, 11: External terminal, 2: Container top lid, 22: Recess, 3: Container side wall, 4: Container bottom plate, 7: Projection part, 71: Small protrusion.

Claims (1)

(57) [Claims] 1. A terminal conductor that is connected to an electrode of a semiconductor element body supported on a bottom plate of a container and is drawn out through a container top lid to form an external terminal, wherein the terminal conductor is perpendicular to the bottom plate of the container. And a portion parallel to the upper lid of the container, and a portion parallel to the upper lid of the container extending at right angles to the length direction thereof and having small serrated projections on both sides is formed. The semiconductor device is characterized in that the protruding portion is press-fitted and fixed in a concave portion of a surface of the upper lid facing the inside of the container.