JP2521282B2 - Electronic component mount - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting body, and more particularly to an electronic component mounting body including a component having an IC for inspecting an electronic component provided on a printed circuit board.

[Prior Art] Circuit integration using an electronic component mounting body such as a printed circuit board greatly contributes to reduction in size and weight of electronic devices. At present, a considerably high-density mounting is possible by a multi-layer board method, etc., but a circuit mounting method capable of higher-density mounting is desired in order to further reduce the size and weight of electronic devices. There is.

[Problems to be Solved by the Invention] Conventionally, in an electronic component mounting body such as a printed circuit board, an inspection circuit for adjusting and debugging the main circuit may be required, but at present, the mounting is limited. No. 54-24665, No. 61-125070
In many cases, some measures are taken such as providing terminals for connecting to the inspection circuit and jumper paths in unnecessary portions of the board as seen in No. However, in such a configuration, there is a problem that the work of connecting to the inspection circuit is required for the inspection, which rather reduces the efficiency of the manufacturing work.

[Means for Solving Problems] In order to solve the above problems, in the present invention, an electronic component provided on a printed circuit board, and an invalid part of the printed circuit board, further comprising: A component having an inspection IC is provided, and the electronic component and the component having the inspection IC are connected by a circuit pattern.

[Operation] According to the above configuration, by the component further provided in the invalid portion of the printed board and having the IC for inspection of the electronic component,
It is possible to inspect and adjust the electronic partial mounting body.
Since this component is provided in the ineffective portion, it can be separated after the work is completed.

[Examples] Hereinafter, the present invention will be described in detail based on examples shown in the drawings.

2 and 3 each show a conventional board configuration, where reference numeral 1 is a through hole for fixing the board to a device to be mounted, 2 is an effective portion where a main circuit is formed, and 3 to 5 are shown. Is an IC for a main circuit, a resistor, a capacitor, and other electronic parts, 6 is a circuit pattern formed by printing or etching for connecting the electronic parts 3 to 5, 10 is an effective part 2 and an ineffective part 7.
It is a perforation for separating.

Particularly in the case of a circuit board that requires high-density mounting, as shown in FIG. 2, when the board is formed into a non-quadrangular shape such as an L-shape in consideration of the components mounted outside the board, or as shown in FIG. In the case where the reference hole 11 for fixing to the mounter for mounting the surface mount component is required, the invalid portion 7 such as the shaded area in each figure is formed.

Therefore, in this embodiment, the inspection circuit 8 is incorporated by utilizing the invalid portion 7 as shown in FIG. As shown in FIG. 2, FIG. 1 shows a configuration in which the final substrate shape is L-shaped. The inspection circuit 8 is composed of circuit members according to each application such as inspection, measurement, debugging and adjustment, such as an IC, a resistor, a capacitor, a coil, a measuring terminal, and a jump pattern.

The main circuit on the effective portion 2 of the substrate constituted by the electronic components 3 to 5 and the circuit pattern 6 is connected to the inspection circuit 8 on the ineffective portion 7 by the circuit pattern 9. The circuit pattern 9 is preferably composed of an inner layer pattern of the substrate in order to prevent malfunction due to a circuit short circuit after completion, but when the substrate is a one-sided substrate or a double-sided substrate, it is provided on the substrate surface. Good.

According to the above configuration, after mounting the electronic components 3 to 5 constituting the main circuit and the components of the inspection circuit 8 on the substrate, the inspection circuit 8 is used to inspect, measure, debug, adjust, etc. the substrate circuit. Can be easily performed. At this time, no troublesome work such as wiring of jumper wires and connecting a measuring instrument to a jig for inspection is required.

The ineffective portion 7 provided with the inspection circuit 8 is a perforated line after completion.
It is cut off by breaking along 10 and the effective part 2
Only included in the set.

According to this embodiment, the invalid portion 7 provided with the inspection circuit 8 is provided.
Since it is not mounted in the set, this part can be configured to perform the inspection, measurement, debugging, adjustment, and other tasks most easily without prioritizing the packing density. Can be improved. On the contrary, since the main circuit mounted on the effective portion 2 does not include a test circuit at all, very high-density mounting is possible.

Furthermore, if the circuit pattern 9 for connecting the main circuit and the inspection circuit 8 is provided on the inner layer of the substrate as described above, an accident such as a short circuit due to the peeling of the pattern or the like occurs when the invalid portion 7 is broken off. Don't worry.

[Advantages of the Invention] As is apparent from the above, according to the present invention, a terminal for connecting to a testing circuit provided in an unnecessary portion of a substrate, which is conventionally required, and a connection between a jumper path and the testing circuit. It is possible to inspect and adjust the electronic component extremely easily by using the components that have ICs for inspecting electronic components, which are further provided in the invalid part of the printed circuit board, without the need for troublesome work. Also, since the above-mentioned constituent parts are provided in the ineffective part, it is possible to separate them after the work is completed, the electronic component mounting body can be made smaller and lighter, and further, the integration degree of the circuit can be improved by using the inspection IC, And so on.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a structure of a circuit board adopting the present invention, and FIGS. 2 and 3 are explanatory views showing different conventional board structures. 1 ... through hole, 2 ... effective part 3-5 ... electronic parts, 6, 9 ... circuit pattern 7 ... invalid part, 8 ... inspection circuit 10 ... perforation

Claims (3)

(57) [Claims] 1. An electronic component provided on a printed circuit board, and a component further provided on an ineffective portion of the printed circuit board and having an inspection IC for the electronic component, the electronic component and the inspection IC An electronic component package, characterized in that it is connected by a circuit pattern with a component having a. 2. The electronic component mounting body according to claim 1, wherein a circuit pattern for connecting the electronic component and a component having an inspection IC is provided on an inner layer of a substrate. 3. A portion provided with the electronic component and an invalid portion provided with a component having an inspection IC of the printed circuit board are configured to be separable from each other. Item or the electronic component package according to Item 2.