JP2520850Y2 - Caps for sealing electronic components - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cap for sealing electronic parts mounted on a board.

[0002]

2. Description of the Related Art An electronic component sealing cap of this type is fixed to a substrate for mounting electronic components while covering the electronic components mounted on the substrate so that the electronic components on the substrate can be protected from external moisture and external moisture. It is used for the purpose of protecting it from impacts.

As a conventional cap for sealing electronic parts,
As seen in the ceramic cap 22 shown in FIG. 4, there is a cap 22 having a recess 23 formed therein. In this case, when the electronic component 27 on the substrate 21 is covered, the electronic component 27, the bonding wire 28 and the cap 22 do not come into contact with each other to cause a defect such as a disconnection or a short circuit. Also, as shown in FIG.
There is also the simplest flat plate-shaped cap 22, and in this case, it is used for the purpose of sealing the electronic component 27 by being bonded and fixed via the dam member 29 integrally bonded onto the substrate 21.

However, in these conventional ceramic caps 22, the cap itself is expensive. In addition, this product has a disadvantage that when integrated with the substrate 21 made of an organic resin material after bonding, the cap 22 and the substrate 21 have a large difference in coefficient of linear expansion, so that they are easily separated due to thermal history. Was there. Further, in the case of the flat plate-shaped cap 22, the cap 22 is the electronic component 2
In order to avoid direct contact with the substrate 7, the dam member 29 has to be attached to the substrate 21, which has a drawback that the structure of the substrate becomes complicated and the cost increases.

[0005]

An object of the present invention is to solve the above-mentioned problems, and to sufficiently provide the electronic component sealing cap itself with the corrosion resistance and impact resistance, and to seal the electronic component. The aim is to provide a cap for encapsulating electronic parts, which is inexpensive and has high mounting efficiency, as well as improving reliability afterwards.

[0006]

The present invention is a cap for sealing electronic components mounted on a substrate, wherein the base material of the cap is made of an aluminum plate having anodic oxide coatings on both sides. ， The anodized film on the surface side of this cap has a sealing surface structure that is subjected to organic substance sealing treatment with resin or paint, or after being dyed and then subjected to hydration sealing treatment or metal sealing treatment, and this cap is The electronic component sealing cap is characterized in that a convex portion is formed in a portion corresponding to the electronic component.

[0007]

[Operation and effect] First, in this cap 2, since the convex portion 3 is provided in the portion corresponding to the electronic component mounting portion of the substrate 1, the electronic component 7 mounted on the substrate 1 is attached to the cap 2. There is no contact. In other words, this cap 2
It does not interfere with the electronic component 7 on the substrate 1. Further, by using aluminum as the base material 10 of the cap, the cap 2 is easy to process and inexpensive. In addition, since the convex portion 3 is provided, the substrate 1
In the case where the cap 2 is fixedly attached, it is not necessary to fix the dam member 9 in advance.

Further, since the cap 2 is processed by using an aluminum plate, its adhesive surface can be freely taken. In the present invention, the method of coloring and sealing on the surface side is organic material sealing with resin or paint, or other sealing after dyeing (for example, hydration sealing or hydration sealing). Since the metal sealing process is performed to form the electronic component sealing cap,
It is possible to obtain a cap having sufficient corrosion resistance and impact resistance required for this kind of electronic component sealing cap itself. Also, the cap 2 is the electronic component mounting substrate 1
Since the back surface side, which is the bonding surface with the anodic oxide coating 11, is left as it is, the adhesive layer 6 with a uniform thickness is formed directly on the anodic oxide coating 11 by forming the adhesive layer 6 directly on the anodic oxide coating 11. Good, and the mounting efficiency can be improved.

Incidentally, only the anodized film 11 on the front surface side of the cap 2 is colored and sealed, and the anodized film 1 on the back surface which is not colored and sealed is processed.
Adhesive layer 6 made of organic resin material on a part of 1 or the front surface
By forming the with a substantially uniform thickness, it is possible to finish the appearance beautifully.

As described above, according to the present invention, a cap for encapsulating an electronic component, which has sufficient resistance to touch and impact, enhances reliability after encapsulation of an electronic component, and is inexpensive and highly effective. Can be provided.

[0011]

Embodiment 1 Next, an embodiment of the present invention will be described in more detail with reference to FIGS. 1 to 3 and 6. FIG. 1 shows a state in which a cap 2 for sealing an electronic component according to the present invention is adhesively fixed to a substrate 1 for mounting an electronic component. Further, FIG. 3 shows a sectional view corresponding to FIG.

That is, the cap 2 has a convex portion 3 formed by, for example, drawing at a portion corresponding to the electronic component mounting portion of the substrate 1, and the periphery of the convex portion 3 is on the bonding surface of the electronic component mounting substrate 1. It has a planar fixing portion 4 extending in the direction of, and covers the electronic component 7 mounted on the substrate 1 and is adhesively fixed. Cap 2 for which the present invention is applicable
Has the shape shown in FIG. That is, the shape is such that it has the above-mentioned convex portion 3 and the plane fixing portion 4, and integrally has the fitting portion 5 that can be fitted to the side surface of the electronic component mounting substrate 1.

The adhesive surface of the cap 2 to the electronic component mounting substrate 1 is as shown in FIG. That is, the anodic oxide coating 1 is formed on both surfaces of the electronic component sealing cap 2.
An insulating layer 1 is formed, and the anodized film 1 on the surface side
1 is provided with an electronic component sealing cap which is subjected to an organic substance sealing treatment with a resin or a paint, or after being dyed and then subjected to a hydration sealing treatment or a metal sealing treatment.

On the other hand, the anodic oxide coating 11 on the back side is not subjected to any treatment, and the adhesive layer 6 for bonding with the substrate 1 is directly formed on the anodic oxide coating 11 on the back side. . Then, when the cap 2 is adhesively fixed to the electronic component mounting substrate 1, the adhesive layer 6 also penetrates into the fine holes 12 of the anodic oxide coating 11 of the cap 2 to form a strong adhesive state. It can be formed.

Embodiment 2 Next, a concrete example of the present invention will be described with respect to the cap shown in Embodiment 1 above. First, an aluminum plate was used as the base material 10 for the cap, and the aluminum plate was subjected to a drawing process to form the convex portion 3. This board 1
0 was subjected to sulfuric acid alumite treatment to form an anodized film 11 on both sides. Then, after attaching a masking tape (not shown) for anti-sealing treatment to the adhesive surface (rear surface) of the base material 10 with the electronic component mounting substrate 1, the substrate 10 is placed in an aqueous solution in which a black dye is dissolved. It was dipped and the anodic oxide coating 11 on the surface was dyed.

After that, the substrate 10 was immersed in an aqueous solution of a metal salt containing nickel acetate as a main component to seal the surface of the anodized film 11 and then the masking tape was peeled off. Then, an adhesive material (which will become the adhesive layer 6) is applied to the back surface with a uniform thickness and dried or in a B-stage state, and then the cap 2 is attached to the electronic component mounting substrate 1 as shown in FIG. Adhesively fixed.

Example 3 An aluminum plate was used as the base material 10 of the cap 2, and the convex portion 3 was formed by subjecting the central portion of the aluminum plate to drawing. Furthermore, electronic component mounting board 1
Bent processing was performed according to the shape of the above to form a fitting portion 5 that can fit with the electronic component mounting substrate 1 to obtain the shape of the electronic component sealing cap 2 shown in FIG. This base material 10 was treated with alumite sulfate to form an anodized film 11 on both surfaces.

Then, the black paint 13 was applied only to the front surface side of the base material 10 and dried to carry out an organic substance sealing treatment. Then, an adhesive material (becomes the adhesive layer 6) was applied to the adhesive surface (rear surface side) with the electronic component mounting substrate 1 with a uniform thickness, and dried or brought into a B-stage state. The cap 2 was adhesively fixed to the electronic component mounting substrate 1 as shown in FIG. As shown in the above embodiment, in the cap 2, since the convex portion 3 is formed in the portion corresponding to the electronic component, the cap 2 can be directly fixed to the substrate 1 and has a simple structure. A semiconductor device can be provided.

Further, coloring and sealing treatment (organic substance sealing treatment) is applied only to the anodized film 11 on the front surface side of the cap 2, and the anodization on the rear surface side not subjected to this coloring and sealing treatment. The adhesive layer 6 is formed on the coating film 11 with a substantially uniform thickness. Therefore, the surface side of the cap 2 has an aesthetic appearance, is not easily scratched or soiled, and is excellent in corrosion resistance and impact resistance. Further, in this example, since the color tone is black, the heat dissipation is also excellent due to the black body radiation.

Further, on the back side of the cap 2,
By utilizing the base of the anodized film 11,
The adhesion with the electronic component mounting substrate 1 can be maintained.
Moreover, the maintainability of the adhesive layer 6 can be improved, and the adhesive fixing to the electronic component mounting substrate 1 can be made stronger and more durable. Also,
In the case where the adhesive layer 6 is previously formed on the back surface side of the electronic component cap 2, the workability in the actual adhesive fixing can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component sealing cap according to the present invention.

FIG. 2 is a perspective view of an electronic component sealing cap according to the present invention.

FIG. 3 is a sectional view corresponding to FIG.

FIG. 4 is a sectional view showing a conventional electronic component sealing cap.

FIG. 5 is a sectional view showing a conventional electronic component sealing cap.

FIG. 6 is an enlarged cross-sectional view showing a state in which an electronic component sealing cap is adhesively fixed to an electronic component mounting substrate.

[Explanation of symbols]

 1. . . Substrate for mounting electronic components, 2. . . Electronic component sealing cap, 3. . . Convex portion, 4. . . Plane fixed part, 5. . . Fitting part, 6. . . Adhesive layer, 7. . . Electronic components, 8. . . Bonding wire, 10. . . Base material, 11. . . Anodized film, 12. . . Micropores, 29. . . Weir member,

Claims (1)

(57) [Scope of utility model registration request] 1. A cap for sealing electronic components mounted on a substrate, wherein a base material of the cap is composed of an aluminum plate having anodized films formed on both surfaces thereof, and a surface of the cap. The anodic oxide coating on the side has a sealing surface structure that is subjected to an organic substance sealing treatment with a resin or a paint, or after being dyed, and then subjected to a hydration sealing treatment or a metal sealing treatment, and this cap is applied to the electronic component. A cap for encapsulating an electronic component, characterized in that a convex portion is formed in a corresponding portion.