JP2519059B2 - Jig for soldering - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a soldering jig used in a process of manufacturing an electronic component mounting board having conductor pins, which is a so-called pin grid array. It relates to a soldering jig that holds the electronic component mounting board in a predetermined arrangement and securely holds it, especially in a molten solder bath, and enables high quality and efficient soldering. is there.

(Prior Art) In the general dipping method used for soldering a printed circuit board, the printed circuit board is dipped in a molten solder bath in a predetermined amount to perform soldering on a portion to be soldered.

However, in many electronic component mounting boards that have been adopted in recent years, in order to achieve high-density mounting and downsizing, there are conductor pins driven into the board,
It has a shape that does not allow gripping of the substrate. For this reason, it is impossible to directly carry the printed board by the carrying conveyor for each board, and in order to make this possible, a soldering jig suitable for this is required.

The conventionally used soldering jigs are used not for electronic component mounting boards for achieving high-density mounting and miniaturization as described above, but for small boards.
Since the main purpose is transportation, even when using the conventionally used soldering jig, uniform soldering cannot be achieved, and high density mounting and miniaturization of electronic component mounting boards Not suitable for soldering.

Further, this type of jig is, of course, excellent in heat resistance because it is immersed in the molten solder in a state where the electronic component mounting substrate is placed,
It is necessary that the solder does not adhere easily. In addition, since a variety of electronic component mounting boards are produced in small quantities in recent years, a jig for supporting the electronic component mounting board must have a shape suitable for receiving the electronic component mounting board. Many kinds of jigs must be used. To this end, this type of jig must be made of a material that can be easily processed.

Under the above-mentioned conditions, the inventors of the present invention formed a glass epoxy resin as a material forming this type of jig as a material having a property of not getting wet with solder and having excellent heat resistance. I thought of a jig. However, if it is simply formed of such a material,
It has been found that it is not suitable as a jig for carrying the electronic component mounting substrate into the molten solder bath. In other words, the temperature difference between when the electronic component mounting board is simply transported and when it is immersed in the solder bath is very large, which may cause the jig to deform. Then, it was not always possible to reliably support the electronic component mounting board.

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances,
The problem to be solved is the difficulty in manufacturing a jig for soldering a high-density and miniaturized board for mounting electronic components, and deformation of the jig during use.

It is an object of the present invention that even a high-density and miniaturized electronic component mounting substrate can be reliably supported and transported without deformation when soldered to it. Needless to say, a soldering jig which is easy to manufacture and which can improve the quality of this kind of high-density and downsized electronic component mounting board and soldering efficiency can be provided. Especially.

(Means for Solving Problems) Means adopted by the present invention for solving the above problems will be described with reference to FIGS. 1 to 3 corresponding to the embodiment. In a jig for soldering to the conductor pins (31) of the substrate (30), a base (11) made of a material having a property of not getting wet with solder, and a substrate (30) formed on the base (11)
A plurality of openings (14) having a step (15) surrounding and surrounding the circumference of the base, and formed on the both sides of the opening (14) with the same material as that of the base (11). Positioned on the base (11) and solder is applied to the opening (1
4) Solder barrier (12) that prevents it from penetrating into, and the opening (1) where the solder barrier (12) is not provided.
4) A soldering jig (10) characterized in that the jig is provided with grips (13) provided on a part of the base (11) located on both sides of 4).

That is, the soldering jig (10) according to the present invention,
Glass-epoxy resin, etc. that does not get wet with solder, the main part of which is to carry a plurality of high-density and miniaturized electronic component mounting boards (30) in and before and after the solder bath (20). And the solder barrier (12) is attached to the base part (11) of the base plate (11) to securely transport the electronic component mounting board (30) to the electronic component mounting board (30). It is designed to perform the required high quality soldering.

(Operation of the Invention) The present invention adopts the above-mentioned means and has the following operation.

First, in the soldering jig (10) according to the present invention, the substrate (30) can be mounted extremely easily on the step (15) of the opening (14). In addition, the base (11) and the solder barrier (1
Since 2) is formed of a material such as glass epoxy resin having a property of not getting wet with solder, even if the soldering jig (10) is immersed in the solder bath (20),
No solder will adhere to this. Therefore, this soldering jig (10) can be reused if necessary.

When soldering to the conductor pins (31) of the electronic component mounting board (30) with this soldering jig (10),
The base (11) is shaken in the molten solder while being gripped by the handles (13). This soldering jig (1
When (0) is shaken, the base (11) is slightly inclined or the molten solder is slightly wavy, but the wave of this solder is blocked by each solder barrier (12) and the handle (13), and the molten solder is This prevents entry onto the product mounting board (30).

Since the openings (14) are individually formed to insert the boards (30), when the boards (30) are inserted into the openings (14), the boards (30) are inserted. Conductor pin (3
The arrangement interval of 1) becomes constant or nearly constant, and the soldering conditions for the plurality of boards (30) become constant.

Further, in the soldering jig (10) according to the present invention, since the pair of solder shielding walls (12) are erected and fixed on the upper side of the base (11), the solder shielding wall (12) This increases the rigidity of the base (11), that is, it is reinforced. Therefore, by holding this soldering jig (10) in a solder bath (20) in which a large amount of melted solder exists while supporting each electronic component mounting substrate (30), the base (11 Even if the base part (11) tries to bend due to a sudden temperature difference in the brackets, this bending force is blocked by each solder barrier (12) and the base part (11) itself does not deform. is there. Thereby, the soldering jig (10)
In the solder bath (20) and before and after the solder bath (20), each electronic component mounting substrate (30) is continuously supported in a constant and stable state.

Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.

(Example) The soldering jig (10) of the present invention is intended for a so-called pin grid array electronic component mounting substrate (30). ,
As shown in FIG. 4, a large number of conductor pins (31) are implanted. Each of these conductor pins (31) is very small because the substrate (30) in which it is implanted is small (diameter is about 0.5 mm, length is about several mm). Usually, the arrangement extends to the periphery of the substrate (30) in an array of 2.54 mm pitch, and there is almost no space for grasping the periphery of the substrate (30).

The soldering jig (10) in this embodiment surrounds the base (11) made of glass epoxy resin and the base (11) surrounding the substrate (30) and mounting the periphery thereof. Openings (14) and these openings (1
4) A solder barrier (12) which is provided upright around the periphery and is formed of the same material as the base (11), and the solder barrier (12).
It is composed of a handle (13) which is located on both sides of the opening (14) where no base is provided and which is erected on a part of the base (11). That is, this soldering jig (10) has a base (11) and a solder barrier (12) formed of a material having a property of not getting wet with solder, and is also used in this embodiment. Each handle (13) is also made of such a material. Therefore, even if the soldering jig (10) is immersed in the solder bath (20), the solder does not adhere to the surface thereof.

Also, each solder barrier (12) and handle (13) have a base (1
Although it may be formed integrally with 1), in the present embodiment, each of the solder shielding wall (12) and the grip (13) is formed by a screw or a heat-resistant adhesive on the base (11). It is stuck to. When using screws to fix each part, try to avoid the exposed parts of the screws as much as possible, and if there is an exposed part, cover it with a material that does not have solder wettability. Good.

The openings (14) individually formed in the base (11) of the soldering jig (10) support the electronic component mounting boards (30) and also mount the electronic component mounting boards (30).
Solder bath (20) with the conductor pin (31) of the
It is for exposing inside. That is, as shown in FIG. 1, a step (15) is formed around each opening (14).
Are continuously formed, and this step (15) is the substrate (30).
For supporting the ends of the. That is, the substrate (3
If the end of (0) is placed on the step (15), each substrate (30)
Is reliably supported by the soldering jig (10). Of course, the openings (14) formed in the soldering jig (10) are sized so as to independently support the substrate (30) shown in FIG.

(Effects of the Invention) As described in detail above, in the soldering jig according to the present invention, the "base (11) formed of a material having a property that does not wet the solder and the base (11) formed Being a board (3
A step (1) that surrounds the periphery of (0) and rests the periphery.
A plurality of openings (14) having 5) and the base (11)
A solder barrier wall (12) made of a material similar to that provided on the base (11) located on both sides of the opening (14) and preventing solder from entering the opening (14).
And a grip (13) provided on a part of the base (11) located on both sides of the opening (14) where the solder barrier (12) is not provided. " It has a structural feature that allows the substrate (30) to be attached to the step (15) of the opening (14) very easily.
Further, even if the electronic component mounting board has a high density and a small size, it can be transported while being surely supported without being deformed when it is soldered, and its manufacturing is easy. Moreover, since the solder is prevented from penetrating into the opening, it is possible to improve the quality of this kind of high-density and downsized electronic component mounting board and to improve the soldering, particularly the thickening efficiency. It is possible to provide a soldering jig.

In other words, the soldering jig (10) according to the present invention
Is a high-density and miniaturized electronic component mounting board, when the base (11) itself is immersed in a solder bath for soldering even if there is a large temperature difference. Of course, the electronic component mounting substrate (30) can be transported while being reliably supported without being deformed, and this type of high-density and miniaturized electronic component mounting substrate (30) is also possible. It is possible to improve the quality and soldering, especially the thickening efficiency.

Furthermore, since the base (11) is formed of a material having a property of not getting wet with solder such as glass epoxy resin, it is possible to prevent the solder from adhering, and of course, it can be easily machined and is inexpensive. It is possible to provide a soldering jig (10) that can be applied to electronic component mounting substrates (30) of various sizes.

[Brief description of drawings]

FIG. 1 is a perspective view of the soldering jig as viewed from above, and FIG. 2 is a vertical cross-sectional view taken along line II-II of FIG. 1 in which a plurality of electronic component mounting boards are mounted. FIG. 3 is a perspective view of the electronic component mounting board. Explanation of symbols 10 …… Soldering jig, 11 …… Base, 12 …… Solder barrier, 13 …… Grip, 14 …… Opening, 15 …… Step, 20 …… Solder tank, 30 …… Substrate for mounting electronic parts, 31 ... Conductor pin.

Claims (2)

(57) [Claims] 1. A jig for soldering to a conductor pin of an electronic component mounting board, a base formed of a material having a property of not getting wet with solder, and a base formed on the base and surrounding the periphery of the board. A plurality of openings having stepped portions for mounting the periphery, and provided on the base located on both sides of the opening formed of the same material as the base, so that solder may penetrate into the opening. A soldering jig comprising: a solder barrier for blocking and a handle provided on a part of the base on both sides of the opening where the solder barrier is not provided. . 2. The soldering jig according to claim 1, wherein a plurality of electronic component mounting boards are individually mounted in the opening of the jig. .